Vacuum pump cabinet for semiconductor photoetching equipment

Abstract

The utility model relates to a vacuum pump cabinet for semiconductor photoetching equipment, which comprises a cabinet body, first vent holes which are tightly distributed are formed in the side wall or / and the bottom wall of the cabinet body; the first exhaust fan is mounted on the top wall of the cabinet body; the air collecting cover is arranged above the first exhaust fan in a covering manner, the lower side of the air collecting cover is connected to the top of the cabinet body, and an air outlet communicated with an external exhaust pipeline is formed in the upper side of the air collecting cover; the vacuum pump is located in the cabinet body, and the vacuum pump is provided with an extraction opening and an exhaust opening; and one end of the exhaust pipeline is connected with the exhaust port, and the other end of the exhaust pipeline penetrates through the cabinet body and is fixed in the air collecting cover. According to the vacuum pump cabinet for the semiconductor photoetching equipment, the vacuum pump is separated from the external environment, so that the heat of the vacuum pump is prevented from being directly transferred to the external environment, and the influence on the operation of the semiconductor photoetching equipment is avoided; and meanwhile, through cooperation of the first exhaust fan and the exhaust pipeline, rapid heat dissipation of the vacuum pump is achieved, and the service life of the external exhaust pipeline is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor photolithography, in particular to a vacuum pump cabinet for semiconductor photolithography equipment. Background Art

[0002] In existing semiconductor lithography equipment, when the adsorption platform where the lithography workpiece is placed is working, a vacuum pump is required to continuously evacuate the suction cup to obtain and maintain a certain negative pressure state, thereby adsorbing the lithography workpiece, achieving the grasping of the lithography workpiece, and ensuring the position accuracy of the workpiece during the lithography process.

[0003] Since vacuum pumps generate heat continuously during operation, placing them directly in the work environment will affect the ambient temperature. Furthermore, vacuum pumps produce a large amount of high-temperature exhaust gas after extracting gas. The temperature of this high-temperature exhaust gas is approximately 80°C to 90°C. If this high-temperature exhaust gas is discharged directly into the work environment, the ambient temperature will rise rapidly, affecting the operating status of semiconductor lithography equipment. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a vacuum pump cabinet for semiconductor photolithography equipment.

[0005] To achieve the above-mentioned objectives, the utility model provides a vacuum pump cabinet for semiconductor lithography equipment, comprising: a cabinet body, wherein the side walls and / or bottom walls of the cabinet body are provided with closely arranged first air vents; a first exhaust fan is installed on the top wall of the cabinet body; an air collecting hood is provided above the first exhaust fan, the lower side of the hood is connected to the top of the cabinet body, and the upper side is provided with an air outlet connected to an external exhaust duct; a vacuum pump is located inside the cabinet body, and the vacuum pump has an air suction port and an exhaust port; an exhaust pipeline, wherein one end of the exhaust pipeline is connected to the exhaust port, and the other end passes through the cabinet body and is fixed in the air collecting hood.

[0006] As a further improvement of the present invention, the exhaust pipeline includes a high-temperature resistant hose connected to the exhaust port and a hard pipe connected to the high-temperature resistant hose and fixed to the top of the cabinet.

[0007] As a further improvement of the present invention, the first exhaust fan is located on a side of the top wall close to the exhaust port, and an end of the hard tube away from the hose is arranged in an exhaust path of the first exhaust fan.

[0008] As a further improvement of the present invention, the high temperature resistant hose is a silicone hose, and the hard tube is a metal tube.

[0009] As a further improvement of the present invention, at least one partition is provided in the cabinet body, and the partition divides the interior of the cabinet body into multiple layers of storage space. The multiple layers of storage space include a first storage space located on the top layer and at least one second storage space located below the first storage space. The first storage space is used to place at least one vacuum pump and / or electrical equipment, and the second storage space is used to place electrical equipment.

[0010] As a further improvement of the present invention, the exhaust port of each vacuum pump is connected to the corresponding exhaust pipeline.

[0011] As a further improvement of the present invention, each of the partitions is provided with a second ventilation hole, and the second ventilation hole is used to connect the storage spaces of two adjacent layers.

[0012] As a further improvement of the present invention, each of the partitions is provided with at least one second exhaust fan.

[0013] As a further improvement of the present invention, a partition is provided in the cabinet body, and the interior of the cabinet body is divided into a first storage space and a second storage space arranged up and down by the partition body, and the first ventilation hole is arranged on the bottom wall of the cabinet body and on the two opposite side walls of the second storage space.

[0014] As a further improvement of the present invention, the air collecting cover is made of metal.

[0015] The vacuum pump cabinet of the utility model is used for semiconductor lithography equipment, which separates the vacuum pump from the external environment, avoids the heat of the vacuum pump from being directly transferred to the external environment, and avoids affecting the operation of the semiconductor lithography equipment; at the same time, through the cooperation of the first exhaust fan and the exhaust pipeline, the gas in the cabinet of the vacuum pump cabinet and the high-temperature exhaust gas discharged from the exhaust pipeline are mixed in the wind collecting hood and then discharged into the external exhaust pipeline, which not only realizes the rapid heat dissipation of the vacuum pump, but also improves the service life of the external exhaust pipeline. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of a vacuum pump cabinet in a specific embodiment of the present invention;

[0017] Figure 2 yes Figure 1 Schematic diagram of the structure inside the cabinet of the vacuum pump cabinet;

[0018] Figure 3 yes Figure 1 Schematic diagram of the structure inside the cabinet and the air collecting hood of the medium vacuum pump cabinet;

[0019] Figure 4 This is a schematic diagram of the structure of the interior of the vacuum pump cabinet and the interior of the air collecting hood from another perspective.

[0020] Reference numerals:

[0021] 1. Cabinet; 2. First air vent; 3. First exhaust fan; 4. Air hood; 41. Air outlet; 5. Vacuum pump; 6. Exhaust pipe; 61. High-temperature resistant hose; 62. Hard pipe; 7. Partition; 8. Second air vent; 9. Electrical equipment; 10. Second exhaust fan; 11. First storage space; 12. Second storage space; 13. Door. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described below through specific embodiments shown in the accompanying drawings.

[0023] See Figures 1 to 4 As shown, a vacuum pump cabinet for semiconductor lithography equipment includes a cabinet body 1. Specifically, the cabinet body 1 is composed of a frame and a mounting plate arranged on the frame. The side walls and / or bottom wall of the cabinet body 1 are provided with closely arranged first vent holes 2. The first vent holes 2 connect the gas inside the cabinet body 1 with the gas outside. The top of the cabinet body 1 is provided with a first exhaust fan 3 and an air collecting hood 4. Figure 2 This is a schematic diagram of the internal structure of the vacuum pump cabinet with the mounting plate of cabinet 1 removed. Figure 3 and Figure 4 This is a schematic diagram of the structure of the vacuum pump cabinet with the mounting plate and the air collecting cover 4 of the cabinet body 1 removed. Figures 2 to 4 As shown, the first exhaust fan 3 is installed on the top wall of the cabinet 1, and the air collecting hood 4 is provided above the first exhaust fan 3. Specifically, the lower side of the air collecting hood 4 is connected to the top of the cabinet 1, and the upper side of the air collecting hood 4 is provided with an air outlet 41 connected to the external exhaust duct. The external exhaust duct can be understood as a channel for exhausting gas set up at the work site. A closed accommodation space is formed inside the cabinet 1, and a vacuum pump 5 and an exhaust pipe 6 are provided inside the cabinet 1, wherein the vacuum pump 5 has an air suction port and an exhaust port, and the air suction port is connected to the adsorption platform in the semiconductor lithography equipment. The exhaust port is connected to one end of the exhaust pipe 6, and the other end of the exhaust pipe 6 is fixed in the air collecting hood 4.

[0024] In the present invention, the first vent holes 2 are densely arranged small-diameter vent holes. The first vent holes 2 can be provided only on the side wall or the bottom wall, or on both the side wall and the bottom wall. The diameter of the first vent holes 2 and the specific location of the side wall or the bottom wall can be adjusted according to actual needs.

[0025] When the vacuum pump 5 in the vacuum pump cabinet is running, the first exhaust fan 3 guides the low-temperature gas outside the cabinet 1 into the interior of the cabinet 1 through the first air vent 2, and then guides the gas inside the cabinet 1 into the wind collecting hood 4 through the first exhaust fan 3, forming an airflow that continuously flows from the outside of the cabinet 1 to the inside of the cabinet 1 and then to the wind collecting hood 4, quickly taking away the heat emitted by the vacuum pump 5, so that the temperature inside the cabinet 1 is quickly reduced and maintained within a certain temperature range. Experimental measurements have shown that the air temperature in the internal space of the cabinet 1 where the vacuum pump 5 is located can be controlled at around 30°C. At the same time, the high-temperature exhaust gas generated by the exhaust port of the vacuum pump 5 is directly discharged into the air hood 4 through the exhaust pipe 6. Since the temperature of the gas entering the air hood 4 from the inside of the cabinet 1 is generally 30°C to 40°C, which is lower than the 80°C to 90°C high-temperature exhaust gas discharged from the exhaust pipe 6, the gases of different temperatures are heat-exchanged in the air hood 4 before flowing into the external exhaust pipe. Compared with the direct connection between the exhaust pipe 6 and the external exhaust pipe, the vacuum pump cabinet structure of the present invention can reduce the gas temperature in the external exhaust pipe, effectively improving the service life of the exhaust pipe. The vacuum pump cabinet of the present invention isolates the vacuum pump 5 from the external environment, preventing the heat of the vacuum pump 5 from being directly transferred to the external environment, thereby avoiding affecting the operation of the semiconductor lithography equipment. At the same time, through the cooperation of the first exhaust fan 3 and the exhaust pipe 6, the gas in the cabinet 1 and the high-temperature exhaust gas discharged from the exhaust pipe 6 are mixed in the air hood 4 and then discharged into the external exhaust pipe, which not only achieves rapid heat dissipation of the vacuum pump 5 but also improves the service life of the external exhaust pipe.

[0026] Furthermore, the cabinet body 1 is made of metal, so that the cabinet body 1 has sufficient strength to support the vacuum pump 5. The air collecting hood 4 is also made of metal, which can withstand high temperatures and increase the service life of the air collecting hood 4. The metal material in the present invention can be stainless steel, such as 304 stainless steel. Of course, it is understood that the choice of metal material is not limited to this.

[0027] The exhaust pipe 6 includes a high-temperature resistant hose 61 connected to the exhaust port, and a hard pipe 62 connected to the high-temperature resistant hose 61 and fixed to the top of the cabinet 1. Specifically, the high-temperature resistant hose 61 can be a silicone hose, and the hard pipe 62 can be a metal pipe, such as a stainless steel pipe. By connecting the high-temperature resistant hose 61 to the exhaust port, when the vacuum pump 5 is operating and vibrating, resulting in position displacement, the hose is flexible and can move with the vacuum pump 5, thereby ensuring the sealing of the exhaust port. By fixing the hard pipe 62 to the top of the cabinet 1, the accuracy of the exhaust position of the exhaust pipe 6 can be guaranteed, thereby ensuring that the high-temperature exhaust gas discharged from the exhaust pipe 6 enters the wind collecting hood 4 and is mixed with the gas discharged by the first exhaust fan 3 to cool before entering the external exhaust duct.

[0028] Furthermore, the first exhaust fan 3 is located on the side of the top wall close to the exhaust port, and the end of the hard tube 62 away from the hose is arranged in the exhaust path of the first exhaust fan 3. On the one hand, the above arrangement can effectively shorten the length of the high-temperature resistant hose 61 in the exhaust duct, shorten the transmission path of the high-temperature exhaust gas discharged by the vacuum pump 5 into the wind collecting hood 4, and realize the rapid discharge of high-temperature exhaust gas, while reducing the probability of increased exhaust resistance due to bending or entanglement of the long pipeline; on the other hand, the end of the hard tube 62 away from the high-temperature resistant hose 61 is arranged in the exhaust path of the first exhaust fan 3, which improves the heat exchange efficiency between the high-temperature exhaust gas discharged by the hard tube 62 and the gas extracted by the first exhaust fan 3, and avoids the discharge of high-temperature gas into the external exhaust duct.

[0029] Furthermore, at least one partition 7 is provided in the cabinet 1, and the partition 7 divides the interior of the cabinet 1 into multiple layers of storage space. The multiple layers of storage space include a first storage space 11 located on the top layer and at least one second storage space 12 located below the first storage space 11. The first storage space 11 is used to place at least one of the vacuum pumps 5 and / or electrical equipment 9, and the second storage space 12 is used to place electrical equipment 9. Placing at least one vacuum pump 5 in the top layer of the first storage space 11 can not only reduce the length of the high-temperature resistant hose 61, allowing the high-temperature exhaust gas discharged by the vacuum pump 5 to be quickly discharged into the wind collecting hood 4, but also achieve rapid heat dissipation of the vacuum pump 5 through the cooperation of the first exhaust fan 3 and the exhaust pipe 6. In addition, both the first storage space 11 and the second storage space 12 can be used to place electrical equipment 9. By utilizing the vertical space of the vacuum pump cabinet, the area occupied by the electrical equipment 9 is saved, thereby improving space utilization.

[0030] In a specific embodiment of the present invention, when multiple vacuum pumps 5 are placed in the first storage space 11, exhaust pipes 6 corresponding to the number of vacuum pumps 5 are provided in the vacuum pump cabinet, and the exhaust port of each vacuum pump 5 is connected to the corresponding exhaust pipe 6, so that the high-temperature gas discharged by each vacuum pump 5 can be quickly discharged into the wind collecting hood 4, and after mixing with the low-temperature gas and cooling, it flows into the external exhaust pipe.

[0031] Furthermore, each of the partitions 7 is provided with a second air vent 8, which is used to connect the two adjacent layers of the storage space. When the first exhaust fan 3 is working, the gas in the second storage space 12 enters the first storage space 11 through the second air vent 8 on the partition 7, and is then discharged into the wind collecting hood 4 through the first exhaust fan 3, so that a cooling airflow from bottom to top is formed in the vacuum pump cabinet, and the heat of the vacuum pump 5 and the electrical equipment 9 is taken away by the flow of the cooling airflow, thereby improving the heat dissipation efficiency of the vacuum pump 5 and the electrical equipment 9.

[0032] In the present invention, when the electrical equipment 9 in the vacuum pump cabinet is a device that generates a large amount of heat, such as a transformer, each of the partitions 7 is provided with at least one second exhaust fan 10 to accelerate the airflow from bottom to top in the vacuum pump cabinet and improve the heat dissipation efficiency of the electrical equipment 9 in the second storage space 12. It is understandable that when a plurality of partitions 7 are provided in the vacuum pump cabinet, the vacuum pump cabinet is divided into multiple layers of storage space from top to bottom, and the multiple layers of storage space include a first storage space 11 located at the top layer and at least one second storage space 12 located below the first storage space 11. Each partition 7 is provided with a second vent 8 and a second exhaust fan 10, so that the vacuum pump cabinet forms a cooling airflow that flows from the bottom second storage space 12, through the plurality of upper second storage spaces 12, and finally flows to the first storage space 11. The cooling airflow removes the heat of the vacuum pump 5 and the electrical equipment 9, thereby improving the heat dissipation efficiency of the vacuum pump 5 and the electrical equipment 9.

[0033] In a specific embodiment of the present invention, the two side walls of the cabinet 1 opposite to each other along the first direction are doors 13 that can be opened and closed. Figure 1 As shown, the first direction is the front-to-back direction of the cabinet 1. It is understood that the door 13 can be a single door or multiple independent doors corresponding to each storage space layer. The provision of the door 13 facilitates the installation and maintenance of the vacuum pump 5 and electrical equipment 9. The bottom of the cabinet 1 is equipped with rollers to facilitate the movement of the vacuum pump cabinet. A partition 7 is provided in the cabinet 1, and the interior of the cabinet 1 is divided into a first storage space 11 and a second storage space 12 arranged in an upper and lower manner by the partition 7. A vacuum pump 5 is placed in the first storage space 11, and the electrical equipment 9 placed in the second storage space 12 is a transformer. The partition 7 is a metal partition 7, and the vacuum pump 5 is arranged in the middle of the partition 7. Four second exhaust fans 10 are symmetrically arranged on the partition 7. A plurality of second ventilation holes 8 are dispersedly arranged around the partition 7. The first ventilation hole 2 is arranged on the bottom wall of the cabinet 1 and on two opposite side walls of the second storage space 12. Specifically, the first ventilation hole 2 is arranged on two side walls opposite to the second direction perpendicular to the first direction, and the position of the first ventilation hole 2 corresponds to the second storage space 12. Figure 1As shown, the second direction is the left-right direction of the cabinet 1. When the first exhaust fan 3 and the second exhaust fan 10 are working simultaneously, the external gas first enters the second storage space 12 through the first vent 2, then enters the first storage space 11 through the second vent 8, and finally is discharged into the wind collecting hood 4 through the first exhaust fan 3, so that an airflow from bottom to top is formed in the vacuum cabinet to take away the heat from the transformer and the vacuum pump 5. At the same time, the high-temperature exhaust gas discharged from the exhaust port of the vacuum pump 5 flows through the high-temperature resistant hose 61 and the hard pipe 62 in turn into the wind collecting hood 4. The high-temperature exhaust gas is mixed with the gas extracted by the first exhaust fan 3 in the wind collecting hood 4 and then flows into the external exhaust channel, realizing rapid heat dissipation of the vacuum pump 5 and the electrical equipment 9 in the vacuum pump cabinet.

[0034] The vacuum pump cabinet of the present invention isolates the vacuum pump 5 from the external environment, preventing heat from the vacuum pump 5 from being directly transferred to the external environment and thus affecting the operation of semiconductor lithography equipment. Furthermore, through the cooperation of the first exhaust fan 3 and the exhaust pipe 6, the gas within the cabinet 1 and the high-temperature exhaust gas discharged from the exhaust pipe 6 are mixed in the wind collecting hood 4 before being discharged into the external exhaust pipe. This not only achieves rapid heat dissipation from the vacuum pump 5 but also extends the service life of the external exhaust pipe.

[0035] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the concept of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A vacuum pump cabinet for semiconductor lithography equipment, characterized in that: include: A cabinet body, wherein the side walls and / or bottom wall of the cabinet body are provided with closely arranged first ventilation holes; a first exhaust fan, mounted on the top wall of the cabinet; An air collecting hood is provided above the first exhaust fan, the lower side of the hood is connected to the top of the cabinet, and the upper side is provided with an air outlet connected to an external exhaust duct; A vacuum pump is located inside the cabinet, and has an air extraction port and an air exhaust port, wherein the air extraction port is connected to the adsorption platform in the semiconductor lithography equipment; An exhaust pipe, one end of which is connected to the exhaust port, and the other end of which passes through the cabinet and is fixed in the air collecting hood.

2. The vacuum pump cabinet for semiconductor lithography equipment according to claim 1, characterized in that: The exhaust pipeline includes a high-temperature resistant hose connected to the exhaust port and a hard pipe connected to the high-temperature resistant hose and fixed to the top of the cabinet.

3. The vacuum pump cabinet for semiconductor lithography equipment according to claim 2, characterized in that: The first exhaust fan is located on a side of the top wall close to the exhaust port, and one end of the hard tube away from the high-temperature resistant hose is arranged in an exhaust path of the first exhaust fan.

4. The vacuum pump cabinet for semiconductor lithography equipment according to claim 2, characterized in that: The high temperature resistant hose is a silicone hose, and the hard tube is a metal tube.

5. The vacuum pump cabinet for semiconductor lithography equipment according to claim 1, characterized in that: At least one partition is provided in the cabinet body, and the partition divides the interior of the cabinet into multiple layers of storage space. The multiple layers of storage space include a first storage space located on the top layer and at least one second storage space located below the first storage space. The first storage space is used to place at least one vacuum pump and / or electrical equipment, and the second storage space is used to place electrical equipment.

6. The vacuum pump cabinet for semiconductor lithography equipment according to claim 5, characterized in that: The exhaust port of each vacuum pump is connected to the corresponding exhaust pipeline.

7. The vacuum pump cabinet for semiconductor lithography equipment according to claim 5, characterized in that: Each of the partitions is provided with a second ventilation hole, and the second ventilation hole is used to connect the storage spaces of two adjacent layers.

8. The vacuum pump cabinet for semiconductor lithography equipment according to claim 5 or 7, characterized in that: Each of the partitions is provided with at least one second exhaust fan.

9. The vacuum pump cabinet for semiconductor lithography equipment according to claim 5, characterized in that: A partition is provided in the cabinet, and the interior of the cabinet is divided into a first storage space and a second storage space arranged up and down by the partition. The first ventilation hole is provided on the bottom wall of the cabinet and on two opposite side walls located in the second storage space.

10. The vacuum pump cabinet for semiconductor lithography equipment according to claim 1, characterized in that: The air collecting cover is made of metal.

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