Display module

Abstract

The utility model provides a display module which comprises a substrate, a plurality of lamp beads and a plurality of driving chips. The two opposite sides of the substrate are a first face and a second face respectively. The lamp beads are distributed on the first face of the substrate in an array mode, and the lamp beads are electrically connected with the substrate. The plurality of driving chips are distributed on the second surface of the substrate at intervals, and each driving chip is electrically connected with the substrate. A plurality of through holes are formed in the substrate at intervals, and a through hole is formed between every two adjacent lamp beads distributed in an array mode. Wherein the packaging adhesive positioned on the second surface of the substrate can flow to the first surface through the through holes, then flows along the first surface to fill the gaps among the plurality of lamp beads and cover the first surface of the substrate, so that the bonding and fixing of the lamp beads on the substrate are realized, the connection strength of the lamp beads and the substrate is enhanced, the thrust of the lamp beads is improved, and the service life of the lamp beads is prolonged. And the packaging effect of the lamp beads can be improved, so that the waterproof performance, the high and low temperature resistance, the high humidity resistance and the like of the display module are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, and in particular to a display module. Background Art

[0002] The display module in an LED display typically consists of a substrate, LED lamps, driver chips, and other components. During the display module production process, it is often encapsulated. This involves potting the display module with encapsulant to improve the LED lamp's thrust, waterproofing, and resistance to high and low temperatures and humidity. Good encapsulation is particularly important for LED displays used in outdoor and humid environments, as well as for rental applications that require frequent assembly and disassembly.

[0003] During the display module packaging process, the encapsulation glue needs to penetrate the gaps between adjacent LED beads to achieve a good packaging effect. However, as the pixel pitch of LED displays decreases, the spacing between LED beads also decreases. This makes it difficult to inject glue into the gaps between LED beads using current conventional packaging methods. This can easily lead to uneven glue distribution and inability to ensure the thrust of each LED bead. This can easily cause the LED to fall off during installation or removal of the LED display, and it can also fail to guarantee the display module's waterproof, high-temperature, and high-humidity resistance properties. Utility Model Content

[0004] The purpose of the utility model is to provide a display module capable of increasing the thrust of lamp beads.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] According to one aspect of the present application, a display module is provided, comprising a substrate, a plurality of lamp beads, and a driver chip, wherein the substrate has a first surface and a second surface on opposite sides, the plurality of lamp beads are arranged in an array on the first surface of the substrate, and each of the lamp beads is electrically connected to the substrate; the driver chip is arranged on the second surface of the substrate, and the driver chip is electrically connected to the substrate;

[0007] A plurality of through holes are provided at intervals on the substrate, and a through hole is provided between any four adjacent lamp beads distributed in an array, wherein the packaging glue located on the second surface of the substrate passes through the through hole and flows along the first surface into the intervals between the plurality of lamp beads.

[0008] In some embodiments, the center of the through hole coincides with the center of a whole formed by the four lamp beads distributed in an array.

[0009] In some embodiments, the through hole includes a first through portion and a second through portion, wherein the first through portion and the second through portion both penetrate the substrate along the thickness direction of the substrate; a middle portion of the first through portion and a middle portion of the second through portion intersect and overlap, so that the first through portion and the second through portion are connected, and a length direction of the first through portion and a length direction of the second through portion form an angle;

[0010] The intersection and overlap of the first through portion and the second through portion coincides with the center of a whole formed by the four lamp beads distributed in an array.

[0011] In some embodiments, the length of the first through portion is smaller than the distance between two adjacent lamp beads on opposite sides;

[0012] The width of the first through portion is smaller than the distance between two adjacent lamp beads.

[0013] In some embodiments, the length of the first through portion is 1 / 4 to 1 / 3 of the distance between two adjacent lamp beads on opposite sides.

[0014] The width of the first through portion is 0.2 mm to 1 mm smaller than the distance between two adjacent lamp beads.

[0015] In some embodiments, the length of the second through portion is smaller than the distance between two adjacent lamp beads on opposite sides.

[0016] The width of the second through portion is smaller than the distance between two adjacent lamp beads.

[0017] In some embodiments, the length of the second through portion is 1 / 4 to 1 / 3 of the distance between two adjacent lamp beads on opposite sides.

[0018] The width of the second through portion is 0.2 mm to 1 mm smaller than the distance between two adjacent lamp beads.

[0019] In some embodiments, the substrate is provided with a plurality of glue guide holes spaced apart along its own circumference, and one glue guide hole is arranged between two adjacent lamp beads, wherein the packaging glue located on the second surface of the substrate passes through the glue guide hole and flows along the edge of the lamp beads located on the periphery of the substrate.

[0020] In some embodiments, the edge of the substrate is recessed toward the center of the substrate to form the glue guide hole;

[0021] The side wall of the glue guide hole is an arc-shaped surface;

[0022] The maximum diameter of the glue guide hole is consistent with the distance between two adjacent lamp beads;

[0023] The distance between the side wall of the glue guide hole and the edge of the substrate is 0.1 mm to 1 mm.

[0024] In some embodiments, the display module further includes a first sealing layer, the first sealing layer being formed by curing the encapsulation glue located on the first surface of the substrate, and the first sealing layer being distributed around the periphery of the lamp bead; the thickness of the first sealing layer being less than the height of the lamp bead;

[0025] The display module further includes a second sealing layer, which is formed by curing the packaging glue located on the second surface of the substrate, and the second sealing layer is coated on the periphery of the driving chip.

[0026] It can be seen from the above technical solution that the present invention has at least the following advantages and positive effects:

[0027] In the present application, a plurality of through holes are provided at intervals on the substrate of the display module, and a through hole is arranged between the intervals of any four adjacent lamp beads distributed in an array. In this way, when the display module is encapsulated by glue, the encapsulating glue on the second surface of the substrate can pass through the through hole and then flow to the first surface of the substrate, and can automatically flow along the first surface to the intervals between the multiple lamp beads to fill the intervals between the multiple lamp beads and cover the first surface of the substrate. The above design facilitates the uniform distribution of the encapsulating glue on the first surface, thereby achieving the bonding and fixation of the lamp beads on the substrate, so as to strengthen the connection strength between the lamp beads and the substrate, increase the thrust of the lamp beads, and at the same time improve the encapsulation effect of the lamp beads, thereby improving the waterproof, high and low temperature resistance and high humidity resistance of the display module. In addition, by providing through holes on the substrate, the present application can make the encapsulating glue automatically flow into the intervals between the lamp beads without being affected by the size of the lamp bead intervals, and can also improve the encapsulation efficiency of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the structure of the display module in this embodiment.

[0029] Figure 2 yes Figure 1 The cross-sectional view of the module along the AA direction is shown in FIG.

[0030] Figure 3 yes Figure 1 The enlarged structural diagram of the display module B is shown in the figure.

[0031] Figure 4 yes Figure 2 Enlarged structural diagram at point C in the middle.

[0032] The following are the descriptions of the reference numerals:

[0033] 1. Substrate; 11. Through hole; 111. First through portion; 112. Second through portion; 12. Glue guide hole; 2. Lamp beads; 31. First sealing layer; 32. Second sealing layer. DETAILED DESCRIPTION

[0034] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention is capable of various variations in different embodiments without departing from the scope of the present invention, and that the descriptions and illustrations herein are intended to be illustrative in nature and not to limit the present invention.

[0035] In the description of this application, it should be understood that in the embodiments shown in the drawings, indications of directions or positional relationships (such as up, down, left, right, front, and back) are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the descriptions of the positions of these elements change, the indications of these directions will also change accordingly.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0037] The following describes in detail the specific embodiments of the display module of the present application with reference to the accompanying drawings.

[0038] Figure 1 FIG. 1 is a structural diagram of the display module in this embodiment.

[0039] refer to Figure 1 , this embodiment provides a display module, including a substrate 1, a plurality of lamp beads 2 and a plurality of driver chips. The opposite sides of the substrate 1 are a first surface and a second surface respectively. A plurality of lamp beads 2 are distributed in an array on the first surface of the substrate 1, and each lamp bead 2 is electrically connected to the substrate 1. A plurality of driver chips are distributed at intervals on the second surface of the substrate 1, and each driver chip is electrically connected to the substrate 1. A plurality of through holes 11 are provided at intervals on the substrate 1, and a through hole 11 is provided between any four adjacent lamp beads 2 distributed in an array, wherein the packaging glue located on the second surface of the substrate 1 passes through the through hole 11 and flows along the first surface to the intervals between the plurality of lamp beads 2.

[0040] In the present application, a plurality of through holes 11 are provided at intervals on the substrate 1 of the display module, and a through hole 11 is arranged between the intervals of any four adjacent lamp beads 2 distributed in an array. In this way, when the display module is encapsulated by glue, the encapsulating glue on the second surface of the substrate 1 can pass through the through hole 11 and then flow to the first surface of the substrate 1. It can automatically flow along the first surface into the intervals between the multiple lamp beads 2 to fill the intervals between the multiple lamp beads 2 to cover the outer periphery of the lamp beads 2 and cover the first surface of the substrate 1, thereby achieving the bonding and fixation of the lamp beads 2 on the substrate 1. The above design facilitates the uniform distribution of the encapsulating glue on the first surface, thereby strengthening the connection strength between the lamp beads 2 and the substrate 1, increasing the thrust of the lamp beads 2, and at the same time improving the encapsulation effect of the lamp beads 2, thereby improving the waterproof, high and low temperature resistance, and high humidity resistance of the display module. In addition, by providing the through holes 11 on the substrate 1, the present application can enable the encapsulating glue to automatically flow into the intervals between the lamp beads 2 without being affected by the size of the intervals between the lamp beads 2, and can also improve the encapsulation efficiency of the display module.

[0041] refer to Figure 1 The substrate 1 includes a board body and a plurality of pads. Opposite sides of the board body are a first surface and a second surface. The plurality of pads are distributed in an array on the first surface of the board body. In this embodiment, each pad is square.

[0042] A plurality of lamp beads 2 are arranged in an array on the first surface of the substrate 1. Each lamp bead 2 is electrically connected to the substrate 1 for emitting light. Each lamp bead 2 has a light-emitting surface for emitting light. Specifically, the plurality of lamp beads 2 are affixed to the plurality of solder pads in a one-to-one correspondence, with each lamp bead 2 affixed to a corresponding solder pad with its light-emitting surface facing away from the substrate 1. Each lamp bead 2 is electrically connected to the substrate 1 via the corresponding solder pad. In other embodiments, each lamp bead 2 is affixed to at least two adjacent solder pads arranged in the array.

[0043] The driving chips are distributed at intervals on the second surface of the substrate 1 . The driving chips are electrically connected to the substrate 1 and are used to control the current of the substrate 1 to provide a stable current to the lamp beads 2 to drive the lamp beads 2 to emit light.

[0044] Figure 2 for Figure 1 The cross-sectional view of the module along the AA direction is shown in the figure. Figure 3 for Figure 1 The enlarged structural diagram of the display module B is shown in the figure.

[0045] refer to Figures 1 to 3 The substrate 1 is provided with a plurality of through holes 11 at intervals, so that the encapsulation glue on the second surface of the substrate 1 can flow through the through holes 11 to the first surface of the substrate 1, and then flow along the first surface into the spaces between the plurality of lamp beads 2. Specifically, the plurality of through holes 11 are spaced apart on the substrate, and each through hole 11 is spaced apart from the solder pad.

[0046] It should be noted that when each lamp bead 2 is fitted and fixed to a corresponding soldering pad, each through hole 11 is spaced apart from each soldering pad. When each lamp bead 2 is fitted and fixed to at least two soldering pads, each through hole 11 is spaced apart from the overall structure formed by the at least two soldering pads to which each lamp bead 2 is fitted and fixed. That is, each through hole 11 is spaced apart from each lamp bead 2 so as to be distributed around the periphery of the lamp bead 2. In this way, when the packaging glue flows from the second side of the board through the through holes 11 to the first side of the board, it can better fill the gaps between the multiple lamp beads 2 to cover the periphery of the lamp bead 2, thereby achieving reinforced packaging of the lamp bead 2, strengthening the thrust of the lamp bead 2, and improving the waterproof, high and low temperature resistance, and high humidity resistance of the display module.

[0047] In this embodiment, a through hole 11 is provided between any four adjacent lamp beads 2 distributed in an array, so that the packaging glue located on the second side of the board can flow to the first side of the board through any through hole 11, and facilitates the packaging glue to be evenly distributed in the intervals between the multiple lamp beads 2.

[0048] In this embodiment, the center of the through hole 11 coincides with the center of the whole formed by the four lamp beads 2 distributed in an array, so that the multiple through holes 11 are evenly distributed on the board body, so that the packaging glue flowing to the first surface of the board body through the multiple through holes 11 can be further evenly distributed in the intervals between the multiple lamp beads 2.

[0049] Exemplarily, the through hole 11 includes a first through portion 111 and a second through portion 112, and both the first through portion 111 and the second through portion 112 penetrate the substrate 1 along the thickness direction of the substrate 1. The middle portion of the first through portion 111 and the middle portion of the second through portion 112 intersect and overlap, so that the first through portion 111 and the second through portion 112 are connected. Furthermore, the length direction of the first through portion 111 and the length direction of the second through portion 112 form an angle. The intersection and overlap of the first through portion 111 and the second through portion 112 coincide with the center of the whole formed by the four lamp beads 2 distributed in an array.

[0050] Among the four adjacent lamp beads 2 distributed in an array, the four lamp beads 2 are distributed in the form of two columns spaced apart along the length direction of the first through-hole 111 and two rows spaced apart along the length direction of the second through-hole 112. In this embodiment, the structure of the through-hole 11 allows the encapsulation glue to pass through the first through-hole 111 and flow along the length direction of the first through-hole 111 toward the first surface of the substrate 1, so as to guide the encapsulation glue to flow in the gap between the two rows of lamp beads 2 distributed along the length direction of the second through-hole 112 and fill the gap between the two rows of lamp beads 2. In addition, the encapsulation glue can pass through the second through-hole 112 and flow along the length direction of the second through-hole 112 toward the first surface of the substrate 1, so as to guide the encapsulation glue to flow in the gap between the two rows of lamp beads 2 distributed along the length direction of the first through-hole 111 and fill the gap between the two rows of lamp beads 2.

[0051] That is, the through hole 11 in this embodiment is cross-shaped, so as to simultaneously guide the encapsulating glue to flow in the gaps between the two columns and two rows of lamp beads 2. In addition, the cross-shaped through hole 11 can also reduce the speed and pressure of the encapsulating glue to a certain extent, so as to ensure uniform flow of the encapsulating glue. In other embodiments, the through hole 11 can also be circular, square, or other shapes.

[0052] Specifically, the length directions of the first through portion 111 and the second through portion 112 are perpendicular to each other to adapt to the shape of the intervals between the four solder pads corresponding to the four adjacent lamp beads 2 distributed in an array, thereby facilitating the arrangement of the first through portion 111 and the second through portion 112 .

[0053] In this embodiment, the length of the first through-portion 111 is less than the distance between the opposing sides of two adjacent lamp beads 2, ensuring that there is a gap between the two adjacent through-holes 11 along the length of the first through-portion 111. This ensures that the strength of the board can be maintained while allowing glue to flow through the multiple through-holes 11. The distance between the opposing sides of two adjacent lamp beads 2 here refers to the distance along the length of the first through-portion 111 between the opposing sides of two adjacent lamp beads 2 that are spaced apart and distributed along the length of the first through-portion 111.

[0054] Exemplarily, the length of the first through-hole 111 is 1 / 4 to 1 / 3 of the distance between two adjacent lamp beads 2 on opposite sides, so that while the glue is conducted through the first through-hole 111, the setting of the first through-hole 111 will not interfere with the setting of the solder pad.

[0055] The width of the first through-hole 111 is smaller than the spacing between two adjacent lamp beads 2. This allows for easy access to the solder pads corresponding to the lamp beads 2 and ensures the strength of the board. The spacing between two adjacent lamp beads 2 here refers to the distance along the width of the first through-hole 111 between the adjacent lamp beads 2.

[0056] For example, the width of the first through-hole 111 is 0.2 mm to 1 mm smaller than the spacing between two adjacent lamp beads 2 , so that while the glue is conducted through the first through-hole 111 , the arrangement of the first through-hole 111 will not interfere with the arrangement of the solder pad.

[0057] In this embodiment, the length of the second through-portion 112 is less than the distance between the opposing sides of two adjacent lamp beads 2, ensuring that there is a gap between the two adjacent through-holes 11 along the length of the second through-portion 112. This ensures that the strength of the board can be maintained while ensuring the conduction of glue through the multiple through-holes 11. The distance between the opposing sides of two adjacent lamp beads 2 here refers to the distance along the length of the second through-portion 112 between the opposing sides of two adjacent lamp beads 2 that are spaced apart.

[0058] Exemplarily, the length of the second through-hole 112 is 1 / 4 to 1 / 3 of the distance between two adjacent lamp beads 2 on opposite sides, so that while the glue is conducted through the second through-hole 112, the setting of the second through-hole 112 will not interfere with the setting of the solder pad.

[0059] The width of the second through-hole 112 is smaller than the spacing between adjacent lamp beads 2. This allows for easy access to the solder pads corresponding to the lamp beads 2 and ensures the strength of the board. The spacing between adjacent lamp beads 2 refers to the distance along the width of the second through-hole 112 between adjacent lamp beads 2 that are spaced apart from each other.

[0060] For example, the width of the second through-hole 112 is 0.2 mm to 1 mm smaller than the spacing between two adjacent lamp beads 2 , so that while the glue is conducted through the second through-hole 112 , the second through-hole 112 will not interfere with the soldering pad.

[0061] refer to Figure 1 and Figure 3The substrate 1 is provided with a plurality of adhesive guide holes 12 spaced apart along its circumference, with one adhesive guide hole 12 arranged between two adjacent lamp beads 2. This allows adhesive from the second surface of the substrate 1 to flow through the adhesive guide holes 12 to the first surface of the substrate 1, and then flow along the edges of the lamp beads 2 located on the periphery of the substrate 1, thereby surrounding the periphery of the lamp beads 2 located on the periphery of the substrate 1. It should be noted that the periphery of the substrate 1 here does not specifically refer to the circumferential edge of the substrate 1, but rather refers to an annular area of a certain width that includes the circumferential edge of the substrate 1.

[0062] Specifically, the edge of substrate 1 is recessed toward the center of substrate 1 to form glue guide hole 12. That is, glue guide hole 12 opens at the edge of substrate 1, allowing a portion of the encapsulation glue to flow into glue guide hole 12 along the direction from the second surface to the first surface of substrate 1. Simultaneously, a portion of the encapsulation glue can also flow into glue guide hole 12 from the edge of substrate 1 through glue guide hole 12. Of the encapsulation glue flowing into glue guide hole 12, a portion flows from the edge of substrate 1 toward the center of substrate 1 to the first surface of substrate 1, where it merges with the encapsulation glue flowing toward the first surface of substrate 1 through through-hole 11, thereby filling the spaces between the lamp beads located at the periphery of the substrate. A portion of the encapsulation glue flows along the side of the lamp beads located at the edge of substrate 1 closer to the edge of substrate 1, thereby encapsulating the periphery of substrate 1 and the lamp beads 2 located at the periphery of substrate 1. This improves the thrust of the lamp beads 2 located at the periphery of substrate 1, further improves the encapsulation efficiency of the display module, and ensures the encapsulation effect of the display module.

[0063] In this embodiment, the sidewalls of the adhesive guide hole 12 are curved, with the concave portion of the curved surface facing away from the substrate 1. In other words, the adhesive guide hole 12 is an arc-shaped hole. This design significantly improves the dynamic performance of the encapsulant, reduces resistance during the passage of the encapsulant, and increases the flow efficiency of the encapsulant, thereby improving the packaging efficiency of the display module.

[0064] In other embodiments, the glue guide hole 12 may also be in a square, triangle or other shape.

[0065] In this embodiment, the maximum diameter of the glue guide hole 12 is consistent with the spacing between two adjacent lamp beads 2. Without affecting the arrangement of the solder pads corresponding to the lamp beads 2, the cross-sectional area of the glue guide hole 12 is expanded to improve the passing efficiency of the packaging glue and improve the packaging efficiency of the display module.

[0066] Exemplarily, the glue guide hole 12 can be a semicircular hole, and the maximum diameter of the glue guide hole 12 is located at the edge of the substrate 1, so that more packaging glue can enter the glue guide hole 12 from the edge of the substrate 1, and then flow through the glue guide hole 12 to the center of the substrate 1, so as to improve the glue guiding effect of the glue guide hole 12.

[0067] The distance from the side wall of the glue guide hole 12 to the edge of the substrate 1 is 0.1mm to 1mm. On the premise of ensuring that there is a gap between the glue guide hole 12 and the adjacent through hole 11, the glue guide hole 12 has a good glue guiding effect and ensures that the substrate 1 has good strength.

[0068] Figure 4 for Figure 2 Enlarged structural diagram at point C in the middle.

[0069] refer to Figure 2 and Figure 4 The display module also includes a first sealing layer 31, which is formed by curing the sealing glue located on the first surface of the substrate 1, and the first sealing layer 31 is distributed on the periphery of the lamp bead 2 to encapsulate the lamp bead 2 and the first surface of the substrate 1, so as to improve the thrust, waterproof, high and low temperature resistance and high humidity resistance of the lamp bead 2.

[0070] In this embodiment, the thickness of the first sealing adhesive layer 31 is less than the height of the lamp bead 2. This reduces the likelihood of the sealing adhesive adhering to the light-emitting surface of the lamp bead 2, thereby preventing obstruction of the light-emitting surface of the lamp bead 2 and ensuring that the lamp bead 2 can emit light normally, thereby improving the display effect of the display module. For example, the thickness of the first sealing adhesive can be 1 / 4 to 1 / 2 of the height of the lamp bead 2, which can effectively increase the thrust of the lamp bead 2 and ensure a good display effect.

[0071] The display module also includes a second sealing layer 32, which is formed by curing the encapsulation glue located on the second surface of the substrate 1. The second sealing layer 32 is coated around the periphery of the driver chip to encapsulate the driver chip and the second surface of the substrate 1, thereby improving the waterproof performance, high and low temperature resistance, and high humidity resistance of the driver chip.

[0072] In this embodiment, the packaging glue can be black. In the process of covering the first and second surfaces of the substrate 1 with the packaging glue, the connection strength between the lamp beads 2 and the driver chip and the substrate 1 can be further strengthened, and the thrust of the lamp beads 2 can be increased. At the same time, the packaging effect of the lamp beads 2 and the driver chip can be improved. It can also ensure that the first surface of the substrate 1 and the gap between the lamp beads 2 are black, so as to ensure the consistency of the ink color of the first surface of the substrate 1 and improve the display effect of the display module.

[0073] In other embodiments, the packaging glue may also be transparent or opaque packaging glue of other colors.

[0074] In this embodiment, the encapsulant can be a matte encapsulant, so that the first encapsulant layer 31 formed by curing the encapsulant can effectively prevent glare from being generated under external ambient light, thereby affecting the display effect of the display module. In other embodiments, the encapsulant can also be a glossy encapsulant.

[0075] For example, the matte packaging glue can be a polyurethane system potting glue, which has high mechanical strength and hardness, and its hardness can reach 40D80D, so that the first sealing glue layer 31 and the second sealing glue layer 32 formed by the curing of the polyurethane system potting glue can withstand a large external force, which can greatly improve the thrust of the lamp bead 2 after packaging; and the polyurethane system potting glue also has good flexibility and vibration resistance and good low temperature resistance and insulation performance, which can improve the anti-collision performance of the lamp bead 2, driver chip and other devices on the display module and protect them from external force impact.

[0076] In other embodiments, the matte packaging glue may also be an epoxy system potting glue or a silicone system potting glue.

[0077] The packaging steps of the above display module are exemplified as follows:

[0078] A bracket is provided, having an opening on one side forming a receiving groove. The shape of the receiving groove is adapted to the shape of the substrate 1. The depth of the receiving groove is greater than the height of the display module to fully accommodate the display module. The bracket is made of a light-transmitting material. For example, the bracket can be made of transparent silicone, quartz glass, or transparent acrylic.

[0079] The display module is placed into the receiving groove with the lamp beads 2 facing upwards, and there is a gap between the bottom of the display module and the bottom wall of the receiving groove.

[0080] Liquid encapsulation glue is injected into the gap between the display module and the bottom wall of the accommodating tank through the through-holes 11. During the continuous injection of the encapsulation glue, the encapsulation glue will first completely fill the gap between the display module and the bottom wall of the accommodating tank to cover the second side of the substrate 1. The encapsulation glue will then overflow upward from the multiple through-holes 11 to flow to the first side of the substrate 1 and flow within the gaps between the multiple lamp beads 2. At the same time, the encapsulation glue will flow upward through the multiple glue guide holes 12 to merge with the encapsulation glue overflowing from the through-holes 11 until the height of the encapsulation glue on the first side of the substrate 1 reaches 1 / 4 to 1 / 2 of the height of the lamp beads 2. The specific height is determined according to needs. Then the encapsulation glue injection is stopped.

[0081] The encapsulant is irradiated with ultraviolet light, causing the encapsulant on the first side of substrate 1 to solidify into a first encapsulant layer 31, and the encapsulant on the second side of substrate 1 to solidify into a second encapsulant layer 32. The wavelength of the ultraviolet light may be 340 nm to 400 nm. In other embodiments, the encapsulant may also be cured at room temperature or by heating.

[0082] After the encapsulation glue is completely cured, the display module is encapsulated and can be removed from the bracket. The shape and size of the encapsulated display module are the same as the shape and size of the bracket's receiving groove, eliminating the need for cutting, which can further improve production efficiency.

[0083] It can be seen from the above technical solution that the present invention has at least the following advantages and positive effects:

[0084] In the present application, a plurality of through holes are provided at intervals on the substrate of the display module, and a through hole is arranged between the intervals of any four adjacent lamp beads distributed in an array. In this way, when the display module is encapsulated by glue, the encapsulating glue on the second surface of the substrate can pass through the through hole and then flow to the first surface of the substrate, and can automatically flow along the first surface to the intervals between the multiple lamp beads to fill the intervals between the multiple lamp beads and cover the first surface of the substrate. The above design facilitates the uniform distribution of the encapsulating glue on the first surface, thereby achieving the bonding and fixation of the lamp beads on the substrate, so as to strengthen the connection strength between the lamp beads and the substrate, increase the thrust of the lamp beads, and at the same time improve the encapsulation effect of the lamp beads, thereby improving the waterproof, high and low temperature resistance and high humidity resistance of the display module. In addition, by providing through holes on the substrate, the present application can make the encapsulating glue automatically flow into the intervals between the lamp beads without being affected by the size of the lamp bead intervals, and can also improve the encapsulation efficiency of the display module.

[0085] While the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope of the appended claims. Therefore, all changes and modifications that fall within the scope of the claims or their equivalents are intended to be covered by the appended claims.

Claims

1. A display module, characterized in that: The device comprises a substrate, a plurality of lamp beads and a driver chip, wherein the two opposite sides of the substrate are respectively a first surface and a second surface, the plurality of lamp beads are distributed in an array on the first surface of the substrate, and each of the lamp beads is electrically connected to the substrate; the driver chip is distributed on the second surface of the substrate, and the driver chip is electrically connected to the substrate; A plurality of through holes are provided at intervals on the substrate, and a through hole is provided between any four adjacent lamp beads distributed in an array, wherein the packaging glue located on the second surface of the substrate passes through the through hole and flows along the first surface into the intervals between the plurality of lamp beads.

2. The display module according to claim 1, wherein: The center of the through hole coincides with the center of a whole formed by the four lamp beads distributed in an array.

3. The display module according to claim 2, wherein: The through hole includes a first through portion and a second through portion, wherein the first through portion and the second through portion both penetrate the substrate along the thickness direction of the substrate; a middle portion of the first through portion and a middle portion of the second through portion intersect and overlap, so that the first through portion and the second through portion are connected, and a length direction of the first through portion and a length direction of the second through portion form an angle; The intersection and overlap of the first through portion and the second through portion coincides with the center of a whole formed by the four lamp beads distributed in an array.

4. The display module according to claim 3, wherein: The length of the first through portion is smaller than the distance between two adjacent lamp beads on opposite sides; The width of the first through portion is smaller than the distance between two adjacent lamp beads.

5. The display module according to claim 4, wherein: The length of the first through portion is 1 / 4 to 1 / 3 of the distance between two adjacent lamp beads on opposite sides; The width of the first through portion is 0.2 mm to 1 mm smaller than the distance between two adjacent lamp beads.

6. The display module according to claim 3, wherein: The length of the second through portion is smaller than the distance between two adjacent lamp beads on opposite sides; The width of the second through portion is smaller than the distance between two adjacent lamp beads.

7. The display module according to claim 6, wherein: The length of the second through portion is 1 / 4 to 1 / 3 of the distance between two adjacent lamp beads on opposite sides; The width of the second through portion is 0.2 mm to 1 mm smaller than the distance between two adjacent lamp beads.

8. The display module according to claim 1, wherein: The substrate is provided with a plurality of glue guide holes spaced apart along its own circumference, and one glue guide hole is arranged between two adjacent lamp beads, wherein the packaging glue located on the second surface of the substrate passes through the glue guide hole and flows along the edge of the lamp beads located on the outer periphery of the substrate.

9. The display module according to claim 8, wherein: The edge of the substrate is recessed toward the center of the substrate to form the glue guide hole; The side wall of the glue guide hole is an arc-shaped surface; The maximum diameter of the glue guide hole is consistent with the distance between two adjacent lamp beads; The distance between the side wall of the glue guide hole and the edge of the substrate is 0.1 mm to 1 mm.

10. The display module according to claim 1, wherein: The display module further includes a first sealing layer, which is formed by curing the packaging glue on the first surface of the substrate, and the first sealing layer is distributed around the periphery of the lamp bead; the thickness of the first sealing layer is less than the height of the lamp bead; The display module further includes a second sealing layer, which is formed by curing the packaging glue located on the second surface of the substrate, and the second sealing layer is coated on the periphery of the driving chip.

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