Copper-clad plate heat dissipation structure

By setting a detachable transfer block and transfer rod on the copper clad plate, the problem of limited heat dissipation efficiency caused by the fixation of the heat dissipation fins is solved, and flexible installation and adjustment of the heat dissipation fins are realized, which enhances the heat dissipation effect and applicability.

CN223231378UActive Publication Date: 2025-08-15ANNENG ELECTRONICS CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202422481630.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-14
Publication Date
2025-08-15
Estimated Expiration
2034-10-14

AI Technical Summary

Technical Problem

The spacing and length of the existing copper clad plates are fixed, resulting in limited heat dissipation efficiency and affecting the use scenario and installation position when heat accumulates.

Method used

The copper clad plate is equipped with a detachable transfer block and a transfer rod. The surface of the transfer block is equipped with a fixing groove. The heat dissipation fins are connected to the transfer rod. The removable fixing components are used to achieve flexible installation and adjustment of the fins, thereby increasing the heat contact area between the air.

Benefits of technology

It realizes flexible installation and adjustment of heat dissipation fins, enhances heat dissipation efficiency, adapts to the needs of different usage scenarios, and avoids heat accumulation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223231378U_ABST
    Figure CN223231378U_ABST
Patent Text Reader

Abstract

The utility model discloses a copper-clad plate heat dissipation structure, relates to the technical field of copper-clad plate heat dissipation, and solves the technical problems that more efficient heat dissipation is realized on the surface of a copper-clad plate through fins with fixed lengths and intervals, and the fixed fins limit the mounting position and the application scene of the copper-clad plate. A connecting plate and a detachable transfer block are arranged on the side, away from a circuit, of a heat-dissipation copper-clad plate, a plurality of fixing grooves are formed in the surface of the transfer block, heat dissipation can be further achieved through the fixing grooves, detachable connection of a transfer rod and heat dissipation fins is achieved through the fixing grooves, the contact area between heat and air is further increased, the heat dissipation speed is increased, and the heat dissipation efficiency is improved. And the transfer rod and the heat dissipation fins can be detached relative to the transfer block, so that the heat dissipation fins conforming to corresponding use scenes can be mounted according to requirements, the distance and length between the heat dissipation fins can be changed, free assembly can be achieved according to different requirements, and the applicability is higher.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model belongs to the field of copper clad laminates, relates to heat dissipation technology, and specifically provides a copper clad laminate heat dissipation structure. Background Art

[0002] Copper clad laminate is a plate-like material made of wood pulp paper or glass fiber cloth as reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot pressed. The structure of copper clad laminate mainly consists of a reinforcing material layer (such as wood pulp paper or glass fiber cloth), a resin layer and a copper foil layer.

[0003] The reference patent name is: A heat-dissipating copper-clad laminate (patent announcement number: CN221202845U). By adding a heat-dissipating aluminum plate and a heat-conducting copper plate and a heat-dissipating top plate removed from the surface of the heat-dissipating aluminum plate by screws, the focused heat dissipation in the middle of the copper-clad laminate is achieved, and the heat on the copper-clad laminate is prevented from being conducted to the surrounding area, affecting the normal operation of nearby components.

[0004] However, when implementing the above technical solution, the following problems exist: during use, the heat dissipation of key positions of the above device is mainly improved by the heat dissipation fins on the heat dissipation top plate, but the heat dissipation fins are fixedly connected to the heat dissipation top plate, that is, the spacing between the heat dissipation fins and the length of the heat dissipation fins are fixed, and thus the heat dissipation area and the heat dissipation efficiency are also basically determined; if the heat generated by the heat source exceeds the heat dissipation capacity of the fins, it may cause heat accumulation, affecting the heat dissipation effect, and further requirements are placed on the installation position, which limits the use scenarios of the overall copper clad board.

[0005] To this end, the utility model proposes a copper clad plate heat dissipation structure. Utility Model Content

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a copper-clad laminate heat dissipation structure that solves the problem of achieving more efficient heat dissipation through fins of fixed length and spacing on the surface of the copper-clad laminate, which restricts the installation location and application scenarios of the copper-clad laminate.

[0007] To achieve the above objectives, according to an embodiment of the first aspect of the present invention, a copper-clad laminate heat dissipation structure is provided, comprising a copper-clad laminate, wherein the copper-clad laminate comprises copper foil, an insulating layer, and a metal base layer, wherein a connecting plate is fixedly connected to one side of the metal base layer of the copper-clad laminate, and a heat dissipation mechanism is provided on a side of the connecting plate away from the copper-clad laminate, wherein the heat dissipation mechanism comprises:

[0008] A transfer block, which is detachably connected to the connecting plate and has a plurality of fixing grooves on its surface;

[0009] A plurality of transfer rods, each of which is adapted to the fixing groove, wherein two heat dissipation fins are fixedly connected to the surface of each transfer rod, and a fixing assembly is provided between each transfer rod and the fixing groove;

[0010] The fixing assembly includes an operating rod, which is threadedly connected to the transfer rod. An active rod is rotatably connected to the side of the operating rod close to the transfer block. A locking block is slidably connected to the inside of the transfer rod. The locking block is slidably connected to the active rod, and the moving direction of the locking block is perpendicular to the moving direction of the active rod. The cross-sectional view of the fixing groove is convex.

[0011] Optionally, a thermal insulation ring is fixedly connected to one side of the copper clad laminate that is bonded to the connecting plate, and the thermal insulation ring is in contact with the surface of the connecting plate.

[0012] Optionally, a disassembly groove is provided on the surface of the connecting plate, and three elastic blocks and a fitting block are fixedly connected to the surface of the transfer block.

[0013] Optionally, the two elastic blocks are symmetrically arranged, the other elastic block is perpendicularly arranged relative to the two elastic blocks, and the height of the fitting block is the same as the depth of the disassembly groove.

[0014] Optionally, four extension columns are threadedly connected to a side of the transfer block away from the connecting plate, and adjacent extension columns are symmetrically arranged.

[0015] Optionally, a sliding groove is provided on the surface of the agglomeration block, and a sliding column is fixedly connected to the surface of the active rod, and the sliding column is adapted to the sliding groove.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: a connecting plate and a detachable transfer block are provided on the side of the heat dissipation copper clad plate away from the circuit, and a plurality of fixing grooves are provided on the surface of the transfer block. The fixing grooves can further dissipate heat while realizing the detachable connection between the transfer rod and the heat dissipation fins, thereby further increasing the contact area between heat and air and accelerating the heat dissipation speed. Moreover, the transfer rod and the heat dissipation fins can be detached relative to the transfer block, and thus the heat dissipation fins that meet the corresponding usage scenarios can be installed according to needs, and the spacing and length between the heat dissipation fins can be changed, and they can be freely assembled according to different needs, with stronger applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural stereogram of the utility model;

[0018] Figure 2 This is a sectional view of the three-dimensional structure of the bonding block of the present invention;

[0019] Figure 3 This is a sectional view of the three-dimensional structure of the transfer rod of the present utility model;

[0020] Figure 4For the utility model Figure 2 A magnified view of the local structure at point A;

[0021] Figure 5 For the utility model Figure 3 A magnified view of the local structure at point B in the middle;

[0022] Figure 6 For the utility model Figure 5 A magnified view of the local structure at point C in the middle.

[0023] In the figure: 1. Copper clad plate; 2. Connecting plate;

[0024] 31. Transfer block; 32. Fixing slot; 33. Transfer rod; 34. Heat dissipation fin; 35. Operating rod; 36. Active rod; 37. Card block;

[0025] 41. Thermal insulation ring;

[0026] 51. Disassembly slot; 52. Elastic block; 53. Lamination block;

[0027] 61. Extension column;

[0028] 71. Sliding groove; 72. Sliding column. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] like Figure 1-6 As shown, a copper clad plate heat dissipation structure includes a copper clad plate 1,

[0031] It should be noted that the copper clad laminate 1 includes a copper foil, an insulating layer and a metal base layer, and the circuit is arranged on the surface of the copper foil;

[0032] The copper clad plate 1 has a metal base layer on one side thereof fixedly connected to a connecting plate 2.

[0033] It should be noted that the connecting plate 2 is made of a material with good thermal conductivity;

[0034] A heat dissipation mechanism is provided on the side of the connecting plate 2 away from the copper clad plate 1, and the heat dissipation mechanism includes:

[0035] The transfer block 31 is detachably connected to the connecting plate 2. A plurality of fixing grooves 32 are formed on the surface of the transfer block 31. The fixing grooves 32 are evenly arranged on the surface of the transfer block 31.

[0036] A plurality of transfer rods 33, each of which is detachably connected to the transfer block 31 and adapted to the fixing slot 32. Two heat dissipation fins 34 are fixedly connected to the surface of each transfer rod 33, and the two heat dissipation fins 34 are symmetrically arranged. A fixing assembly is provided between each transfer rod 33 and the fixing slot 32;

[0037] The fixing assembly includes an operating rod 35, which is threadedly connected to the transfer rod 33. An active rod 36 is rotatably connected to the side of the operating rod 35 near the transfer block 31. The active rod 36 is slidably connected to the transfer rod 33. A clamping block 37 is slidably connected inside the transfer rod 33. The clamping block 37 is slidably connected to the active rod 36. The moving direction of the clamping block 37 is perpendicular to the moving direction of the active rod 36. The cross-section of the fixing groove 32 is convex.

[0038] The transfer rod 33 is adapted to the fixing groove 32, and the cross-section of the fixing groove 32 is convex, that is, after the transfer rod 33 is inserted into the fixing groove 32, there is a gap between the side of the transfer rod 33 close to the connecting plate 2 and the transfer rod 33. When the operating rod 35 drives the active rod 36 to approach the connecting plate 2, the locking block 37 will move toward the inner wall of the fixing groove 32 under the action of the active rod 36, and the convex shape can prevent the transfer rod 33 from being separated from the transfer block 31.

[0039] In the heat dissipation structure of the copper clad plate 1, in actual application, a connecting plate 2 and a detachable transfer block 31 are provided on the side of the heat dissipating copper clad plate 1 away from the circuit. A plurality of fixing grooves 32 are provided on the surface of the transfer block 31. The fixing grooves 32 can further dissipate heat while realizing a detachable connection between the transfer rod 33 and the heat dissipation fins 34, further increasing the contact area between heat and air and accelerating the heat dissipation speed. In addition, the transfer rod 33 and the heat dissipation fins 34 are detachable relative to the transfer block 31, and the heat dissipation fins 34 that meet the corresponding usage scenario can be installed according to needs. The spacing and length between the heat dissipation fins 34 can be changed, and they can be freely assembled according to different needs, which has stronger applicability.

[0040] In some specific embodiments, a heat-insulating ring 41 is fixedly connected to the side of the copper-clad laminate 1 that is attached to the connecting plate 2, and the heat-insulating ring 41 is in contact with the surface of the connecting plate 2;

[0041] A heat-insulating ring 41 is provided on the outside of the connecting plate 2 to limit the heat transfer position on the surface of the copper-clad laminate 1, thereby concentrating the heat in the middle, thereby preventing a large amount of heat from appearing around the copper-clad laminate 1 and affecting the operation of surrounding components;

[0042] In some specific embodiments, a disassembly groove 51 is formed on the surface of the connecting plate 2, and three elastic blocks 52 and a fitting block 53 are fixedly connected to the surface of the transfer block 31. Two of the elastic blocks 52 are symmetrically arranged, and the other elastic block 52 is arranged perpendicular to the two elastic blocks 52. The elastic blocks 52 are adapted to the disassembly groove 51; the side of the fitting block 53 away from the transfer block 31 contacts the disassembly groove 51, and the height of the fitting block 53 is the same as the depth of the disassembly groove 51.

[0043] Two of the three elastic blocks 52 are symmetrically arranged, which can be easily operated by pressing with one hand. The elastic block 52 on the other side can further limit the position of the transfer block 31. First, a single elastic block 52 is used to make one side of the transfer block 31 contact with the disassembly groove 51. Then, the symmetrical elastic block 52 is pressed to place the transfer block 31 into the disassembly groove 51. This can ensure that the transfer block 31 and the connecting plate 2 fit together and ensure the fixing effect.

[0044] In some specific embodiments, four extension columns 61 are threadedly connected to one side of the transfer block 31 away from the connecting plate 2, and adjacent extension columns 61 are symmetrically arranged;

[0045] The extension column 61 can change the distance between the copper clad laminate 1 and the fixed position, and the extension column 61 can be used to fix the copper clad laminate 1. Compared with fixed fins, it is easier to operate. In addition, according to the air flow conditions in the use scenario of the copper clad laminate 1, one side of the fin can be suspended in the air and directly in contact with the air, which can achieve faster heat dissipation under certain conditions.

[0046] In some specific embodiments, a sliding groove 71 is provided on the surface of the agglomeration block 37 , and a sliding column 72 is fixedly connected to the surface of the active rod 36 , and the sliding column 72 is adapted to the sliding groove 71 ;

[0047] The working principle of the present invention is as follows: when installing the heat dissipation mechanism, first press the elastic block 52 to make a single elastic block 52 snap into the disassembly groove 51, and then press the remaining elastic blocks 52 to make the transfer block 31 completely fit with the connecting plate 2, and then the transfer rod 33 and the heat dissipation fins 34 can be set inside the fixing groove 32 according to the usage scenario of the copper clad plate 1; insert the transfer rod 33 into the fixing groove 32, and then rotate the operating rod 35. The rotation of the operating rod 35 prompts the active rod 36 to move toward the connecting plate 2. The movement of the active rod 36 will squeeze the locking block 37, prompting the locking block 37 to slide out of the transfer rod 33, and the surface of the locking block 37 is in contact with the fixing groove 32 and locked, thus completing the installation of the transfer rod 33 and the heat dissipation fins 34; finally, install an extension column 61 of appropriate length on the surface of the transfer block 31.

[0048] The above embodiments are only used to illustrate the technical method of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A copper-clad laminate heat dissipation structure, comprising a copper-clad laminate (1), characterized in that: The copper-clad laminate (1) comprises a copper foil, an insulating layer and a metal base layer; a connecting plate (2) is fixedly connected to one side of the metal base layer on the copper-clad laminate (1); a heat dissipation mechanism is provided on the side of the connecting plate (2) away from the copper-clad laminate (1); the heat dissipation mechanism comprises: A transfer block (31), the transfer block (31) is detachably connected to the connecting plate (2), and a plurality of fixing grooves (32) are formed on the surface of the transfer block (31); A plurality of transfer rods (33), wherein the transfer rods (33) are adapted to the fixing grooves (32), two heat dissipation fins (34) are fixedly connected to the surfaces of the transfer rods (33), and a fixing assembly is provided between the transfer rods (33) and the fixing grooves (32); The fixing assembly comprises an operating rod (35), the operating rod (35) being threadedly connected to the transfer rod (33), an active rod (36) being rotatably connected to a side of the operating rod (35) close to the transfer block (31), a clamping block (37) being slidably connected inside the transfer rod (33), the clamping block (37) being slidably connected to the active rod (36), and a moving direction of the clamping block (37) being perpendicular to a moving direction of the active rod (36); and a cross-sectional view of the fixing groove (32) being convex.

2. The copper clad laminate heat dissipation structure according to claim 1, characterized in that: A heat-insulating ring (41) is fixedly connected to one side of the copper-clad plate (1) that is in contact with the connecting plate (2), and the heat-insulating ring (41) is in contact with the surface of the connecting plate (2).

3. The copper clad laminate heat dissipation structure according to claim 1, characterized in that: A disassembly groove (51) is provided on the surface of the connecting plate (2), and three elastic blocks (52) and a fitting block (53) are fixedly connected to the surface of the transfer block (31).

4. The copper clad laminate heat dissipation structure according to claim 3, characterized in that: The two elastic blocks (52) are symmetrically arranged, and the other elastic block (52) is vertically arranged relative to the two elastic blocks (52). The height of the fitting block (53) is the same as the depth of the disassembly groove (51).

5. The copper clad laminate heat dissipation structure according to claim 1, characterized in that: Four extension columns (61) are threadedly connected to a side of the transfer block (31) away from the connecting plate (2), and adjacent extension columns (61) are symmetrically arranged.

6. The copper clad laminate heat dissipation structure according to claim 1, characterized in that: A sliding groove (71) is provided on the surface of the agglomeration block (37), and a sliding column (72) is fixedly connected to the surface of the active rod (36), and the sliding column (72) is adapted to the sliding groove (71).

Citation Information

Patent Citations

  • Heat dissipation copper-clad plate

    CN221202845U