Controller

Abstract

The utility model relates to a controller, which solves the problem of poor heat dissipation effect of a small-size controller in the prior art, and adopts the technical scheme that the controller comprises a control board which comprises a circuit board and electronic components arranged on the control board, and is characterized in that the circuit board comprises a core area and a non-core area positioned at the periphery of the core area; comprising a high-heating electronic component and a low-heating electronic component, the high-heating electronic component is arranged in the non-core area, and the low-heating electronic component is arranged in the core area. The beneficial effects are that the core area and the non-core area are divided, the non-core area is located at the periphery of the core area, and the low-heating electronic component and the high-heating electronic component are respectively arranged in the core area and the non-core area, so that the periphery of the high-heating electronic component arranged in the non-core area has a larger heat dissipation space; and heat generated by the high-heating electronic component during working can be quickly dissipated, so that the heat dissipation effect of the controller is improved.

Description

Technical Field

[0001] The utility model relates to a controller, in particular to a controller capable of improving the heat dissipation effect of a small-volume controller. Background Art

[0002] For the controller, since some power components on the circuit board (or printed circuit board) continuously generate a certain amount of heat during operation, the internal temperature of the controller rises rapidly. If the heat is not dissipated in time, the temperature of the controller will continue to rise. In a high temperature environment, the electronic components on the circuit board will fail, affecting the working reliability of the controller and even causing the controller to fail to work.

[0003] To improve the heat dissipation performance of controllers, a common approach is to increase the circuit board area, creating more space between adjacent components to increase heat dissipation efficiency. However, for some small controllers, the circuit board area is affected by the size of the controller, making this heat dissipation method difficult to apply. Furthermore, it is difficult to increase the space between adjacent components within the limited space. Therefore, existing technologies have been unable to effectively improve the heat dissipation performance of small controllers. Summary of the Invention

[0004] The purpose of the present utility model is to solve the above-mentioned problems existing in the prior art and to provide a controller, which divides the circuit board into a core area and a non-core area, and the non-core area is located on the periphery of the core area, and low-heat-generating electronic components and high-heat-generating electronic components are respectively arranged in the core area and the non-core area, so that the periphery of the high-heat-generating electronic components arranged in the non-core area has a larger heat dissipation space, which is conducive to quickly dissipating the heat generated by the high-heat-generating electronic components during operation, thereby helping to improve the heat dissipation effect of the controller, and further improve the working stability and service life of the controller.

[0005] The above technical purpose of the present utility model is mainly solved by the following technical solutions: A controller, including a control board, the control board including a circuit board, and electronic components installed on the control board, characterized in that the circuit board includes a core area and a non-core area located outside the core area, including high-heating electronic components and low-heating electronic components, the high-heating electronic components are arranged in the non-core area, and the low-heating electronic components are arranged in the core area. The difference between this technical solution and the prior art is that: by dividing the core area and the non-core area on the circuit board, and the non-core area is located outside the core area, the low-heating electronic components and the high-heating electronic components are arranged in the core area and the non-core area respectively, so that the periphery of the high-heating electronic components arranged in the non-core area has a larger heat dissipation space, which is conducive to the rapid dissipation of the heat generated by the high-heating electronic components during operation, thereby helping to improve the heat dissipation effect of the controller, and further improve the working stability and service life of the controller.

[0006] As a further improvement and supplement to the above technical solution, the present invention adopts the following technical measures: the spacing between adjacent high-heat-generating electronic components is D, and the spacing between adjacent low-heat-generating electronic components is d, where D>d. This helps to further improve the rapid dissipation of heat generated by high-heat-generating electronic components, thereby improving the heat dissipation effect of the controller during operation.

[0007] In the present invention, the routing layer (commonly known as routing in the industry) and the copper layer (commonly known as copper layer in the industry) on the signal layer of each layer.

[0008] Preferably, the circuit board includes a first solder resist layer, a first signal layer, a substrate, a second signal layer and a second solder resist layer arranged from top to bottom, and the corresponding first routing layer, second routing layer and / or first copper layer, second copper layer are respectively arranged on the first signal layer and / or the second signal layer. The copper layer and the routing layer on the same signal layer are located on the same layer, and the copper layer avoids the routing layer, that is, copper is laid in the area outside the routing, and there is no contact between the routing and the copper layer.

[0009] Preferably, the copper layer of the first routing layer in the non-core area corresponding to the first signal layer has a larger area than the copper layer in the core area corresponding to the first signal layer, thereby improving heat dissipation in the non-core area. Routing and copper layering are configured based on the needs of different electronic components for different controller functions, thereby meeting controller requirements and improving heat dissipation.

[0010] Preferably, the second copper layer covers the lower surface of the second signal layer, or the area of the copper layer of the second routing layer arranged in the non-core area corresponding to the second signal layer is larger than the area of the copper layer arranged in the core area corresponding to the second signal layer, which helps to improve the heat dissipation effect of the non-core area. In other words, when different electronic components are arranged according to different controller functions, when no electronic components are arranged on the second signal layer, the second copper layer covers the entire lower surface of the second signal layer. When electronic components are arranged on the second signal layer, the second copper layer is arranged on the second routing layer according to the layout of the electronic components on the second signal layer.

[0011] Preferably, windows are provided on the first solder resist layer and the second solder resist layer, respectively, and the windows penetrate the corresponding solder resist layer and correspond to the connection points of the copper layer and / or the electronic components. Providing a suitable number of windows at suitable positions of the copper layer is conducive to allowing the copper layer to directly contact the air through the windows, reducing the blocking effect of the solder resist layer, and thus improving the heat dissipation effect. Providing windows at the connection points of electronic components (such as solder pads) is conducive to facilitating soldering at the window positions and facilitating the disassembly and assembly of electronic components.

[0012] Preferably, a heat sink is provided in the window corresponding to the copper layer. The provision of the heat sink is conducive to further improving the heat dissipation effect of the control, and the heat sink can be made of a good heat conductor such as tin or aluminum.

[0013] Preferably, vias are provided on the circuit board, and the vias penetrate the copper cladding on the first signal layer, the first signal layer, the substrate, the second signal layer, and the copper cladding on the second signal layer. A heat-conducting tube is embedded in the via, and the two ends of the heat-conducting tube respectively form heat-conducting and conductive connections with the copper cladding on the first signal layer, the first signal layer, the second signal layer, and the copper cladding on the second signal layer. The vias are centered on high-heat-generating components and are provided in a corresponding number and density according to the heat dissipation of the high-heat-generating components. By providing the vias, the heat from the copper cladding on the first signal layer is transferred to the copper cladding on the second signal layer through the vias, forming a three-dimensional heat dissipation mode in which the two layers of copper cladding cooperate to dissipate heat, thereby helping to improve the heat dissipation effect.

[0014] Preferably, the vias in the non-core area are arranged at a higher density than the vias in the core area. Preferably, the vias in the non-core area are arranged in a dense to sparse manner from the middle area of the circuit board to the outside.

[0015] Preferably, a glue potting layer is provided on the first solder resist layer and / or the second solder resist layer. Preferably, a glue potting layer is provided on both the first solder resist layer and the second solder resist layer.

[0016] Preferably, the controller further comprises a housing, the control board and the electronic components are arranged in the housing, and the housing limits the shape of the location of the glue potting layer.

[0017] The present invention has the following beneficial effects: 1. By dividing the circuit board into a core area and a non-core area, with the non-core area located outside the core area, low-heat generating electronic components and high-heat generating electronic components are placed in the core area and the non-core area, respectively. This creates more heat dissipation space around the high-heat generating electronic components in the non-core area, allowing the heat generated by the heat generating electronic components to be quickly dissipated during operation, thereby improving the heat dissipation efficiency of the controller and, in turn, increasing the operating stability and service life of the controller. 2. By varying the spacing between electronic components, the heat dissipation efficiency of the controller is improved during operation. 3. By using copper plating and setting the corresponding copper plating area, the heat dissipation efficiency of the controller is improved during operation. 4. By using window openings and heat sinks, the heat dissipation efficiency of the controller is improved during operation, facilitating the assembly and disassembly of electronic components. 5. By providing vias at an appropriate density, heat from the copper plating on the first signal layer is transferred through the vias to the copper plating on the second signal layer, forming a three-dimensional heat dissipation pattern where the two copper plating layers cooperate to dissipate heat, thereby improving heat dissipation efficiency. 6. By providing a glue potting layer, the heat dissipation efficiency is further improved, while also protecting the electronic components and circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural diagram of Example 1 of the present utility model.

[0019] Figure 2 This is a structural diagram of Example 2 of the present utility model.

[0020] Figure 3 yes Figure 1 and Figure 2 A schematic diagram of a front view structure.

[0021] In the figure: 1. First solder mask layer; 2. First signal layer; 3. Substrate; 4. Second signal layer; 5. Second solder mask layer; 6. Via; 7. High-heat-generating electronic components; 8. Low-heat-generating electronic components; 9. Core area; 10. Non-core area; 11. Copper layer. DETAILED DESCRIPTION

[0022] The technical solution of the present invention will be further specifically described below with reference to the embodiments and the accompanying drawings.

[0023] Example 1: Figure 1 and Figure 3 As shown, a controller includes a control board, and the control board includes a circuit board and electronic components installed on the control board.

[0024] The difference between this technical solution and the prior art is that the circuit board includes a core area 9 and a non-core area 10 located outside the core area 9, and includes high-heat-generating electronic components 7 and low-heat-generating electronic components 8. The high-heat-generating electronic components 7 are arranged in the non-core area 10, and the low-heat-generating electronic components 8 are arranged in the core area 9.

[0025] In other words, by dividing the circuit board into a core area 9 and a non-core area 10, and the non-core area 10 is located outside the core area 9, the low-heat-generating electronic components 8 and the high-heat-generating electronic components 7 are respectively arranged in the core area 9 and the non-core area 10, so that the periphery of the high-heat-generating electronic components 7 arranged in the non-core area 10 has a larger heat dissipation space, which is conducive to the rapid dissipation of the heat generated by the high-heat-generating electronic components 7 during operation, thereby helping to improve the heat dissipation effect of the controller, and further improve the working stability and service life of the controller.

[0026] The high-heat-generating electronic components 7 include metal oxide semiconductor field effect transistors (MOSs), electrolytic capacitors, and the like; the low-heat-generating electronic components 8 include microprocessors (MCUs), resistors, and the like.

[0027] In practical applications, in order to further improve the rapid dissipation of heat generated by the high-heat-generating electronic components 7, thereby improving the heat dissipation effect of the controller when working, the spacing between adjacent high-heat-generating electronic components 7 is D, and the spacing between adjacent low-heat-generating electronic components 8 is d, D>d

[0028] Example 2: Figure 1 and Figure 3 As shown, based on Example 1, the circuit board includes a first solder resist layer 1, a first signal layer 2, a substrate 3, a second signal layer 4, and a second solder resist layer 5 arranged from top to bottom. A corresponding first routing layer, second routing layer, and / or first copper layer, and second copper layer are respectively arranged on the first signal layer 2 and / or the second signal layer 4. A copper layer 11 on the same signal layer is located on the same layer as the routing layer, and the copper layer 11 avoids the routing layer. That is, the copper is placed in an area outside the routing layer, and the routing layer and the copper layer do not contact each other.

[0029] In practical applications, the area of the copper layer 11 of the first routing layer arranged in the non-core area 10 corresponding to the first signal layer 2 is larger than the area of the copper layer 11 arranged in the core area 9 corresponding to the first signal layer 2, which helps improve the heat dissipation effect of the non-core area 10. The routing and copper layer are arranged according to the needs of different electronic components for different controller functions, which not only helps meet the needs of the controller but also helps improve the heat dissipation effect of the controller.

[0030] In practical applications, the area of the copper layer 11 of the second copper layer covering the lower surface of the second signal layer 4 or the second routing layer arranged in the non-core area 10 corresponding to the second signal layer 4 is larger than the area of the copper layer 11 arranged in the core area 9 corresponding to the second signal layer 4, which is beneficial to improving the heat dissipation effect of the non-core area 10.

[0031] In actual applications, when different electronic components are set according to different controller functions, when no electronic components are set on the second signal layer 4, the second copper layer is laid on the entire lower surface of the second signal layer 4. When electronic components are set on the second signal layer 4, the second copper layer is laid on the second routing layer according to the layout of the electronic components on the second signal layer 4.

[0032] In practical applications, to further improve the heat dissipation effect and facilitate the assembly and disassembly of electronic components, windows are respectively provided on the first solder resist layer 1 and the second solder resist layer 5. The windows penetrate the corresponding solder resist layers and correspond to the connection points of the copper cladding layer 11 and / or the electronic components. Providing an appropriate number of windows at appropriate locations on the copper cladding layer facilitates direct contact of the copper cladding with air through the windows, reducing the blocking effect of the solder resist layer, thereby improving the heat dissipation effect. Providing windows at the connection points of electronic components (such as solder pads) facilitates soldering at the window locations.

[0033] In practical applications, a heat sink is provided in the window corresponding to the copper layer 11. In this technical solution, the provision of the heat sink is conducive to further improving the heat dissipation effect of the control, and the heat sink can be a good heat conductor such as tin or aluminum.

[0034] In actual application, in order to further improve the heat dissipation effect, a via 6 is provided on the circuit board, and the via 6 passes through the copper cladding 11 on the first signal layer 2, the first signal layer 2, the substrate 3, the second signal layer 4 and the copper cladding 11 on the second signal layer 4. A heat-conducting tube is embedded in the via 6, and the two ends of the heat-conducting tube respectively form heat-conducting and conductive connections with the copper cladding 11 on the first signal layer 2, the first signal layer 2 and the second signal layer 4 and the copper cladding 11 on the second signal layer 4.

[0035] With high-heat-generating components as the core, vias 6 are provided in appropriate numbers and densities according to the heat dissipation of the high-heat-generating components. The vias 6 allow heat from the copper on the first signal layer 2 to be transferred to the copper on the second signal layer 4 through the vias 6, forming a three-dimensional heat dissipation pattern in which the two layers of copper cooperate to dissipate heat, thereby improving the heat dissipation effect.

[0036] In practical applications, the arrangement density of the vias 6 corresponding to the non-core area 10 is greater than the arrangement density of the vias 6 corresponding to the core area 9 .

[0037] Preferably, the arrangement density of the vias 6 in the non-core area 10 is distributed from the middle area of the circuit board to the outside in a manner from dense to sparse.

[0038] Example 3: Figure 1-Figure 3 As shown, on the basis of embodiment 1 or embodiment 2, a glue potting layer is provided on the first solder resist layer 1 and / or the second solder resist layer 5 .

[0039] In practical applications, preferably, a glue potting layer is provided on both the first solder resist layer 1 and the second solder resist layer 5 .

[0040] In practical applications, the controller further includes a housing, the control board and the electronic components are arranged in the housing, and the housing limits the shape of the location of the glue potting layer.

[0041] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Various modifications and variations are possible in the above embodiments. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A controller comprising a control board, wherein the control board comprises a circuit board and electronic components mounted on the control board, characterized in that The circuit board comprises a core area (9), a non-core area (10) located outside the core area (9), and comprises high-heat-generating electronic components (7) and low-heat-generating electronic components (8). The high-heat-generating electronic components (7) are arranged in the non-core area (10), and the low-heat-generating electronic components (8) are arranged in the core area (9).

2. The controller according to claim 1, characterized in that The spacing between adjacent high-heat-generating electronic components (7) is D, and the spacing between adjacent low-heat-generating electronic components (8) is d, where D>d.

3. The controller according to claim 1, characterized in that The circuit board comprises a first solder resist layer (1), a first signal layer (2), a substrate (3), a second signal layer (4) and a second solder resist layer (5) arranged from top to bottom; a corresponding first routing layer, a second routing layer and / or a first copper layer, a second copper layer are respectively arranged on the first signal layer (2) and / or the second signal layer (4); the copper layer (11) and the routing layer on the same signal layer are located on the same layer, and the copper layer (11) avoids the routing layer.

4. The controller according to claim 3, characterized in that The area of the copper layer (11) of the first wiring layer arranged in the non-core area (10) corresponding to the first signal layer (2) is larger than the area of the copper layer (11) arranged in the core area (9) corresponding to the first signal layer (2); The second copper layer (11) covers the lower surface of the second signal layer (4), or the area of the copper layer of the second routing layer arranged in the non-core area (10) corresponding to the second signal layer (4) is greater than the area of the copper layer arranged in the core area (9) corresponding to the second signal layer (4).

5. The controller according to claim 4, characterized in that Windows are respectively provided on the first solder resist layer (1) and the second solder resist layer (5), the windows penetrating the corresponding solder resist layers, and the windows correspond to the connection points of the copper layer (11) and / or electronic components.

6. The controller according to claim 5, characterized in that A heat sink is provided in the window corresponding to the copper layer (11).

7. The controller according to any one of claims 3 to 6, characterized in that A via hole (6) is provided on the circuit board, and the via hole (6) passes through the copper cladding (11) on the first signal layer (2), the first signal layer (2), the substrate (3), the second signal layer (4), and the copper cladding (11) on the second signal layer (4); a heat-conducting tube is embedded in the via hole (6), and two ends of the heat-conducting tube respectively form heat-conducting and conductive connections with the copper cladding on the first signal layer (2), the first signal layer (2), the second signal layer (4), and the copper cladding on the second signal layer (4).

8. The controller according to claim 7, characterized in that The arrangement density of the via holes (6) corresponding to the non-core area (10) is greater than the arrangement density of the via holes (6) corresponding to the core area (9).

9. The controller according to claim 8, characterized in that A glue potting layer is provided on the first solder resist layer (1) and / or the second solder resist layer (5).

10. The controller according to claim 9, characterized in that It also includes a shell, the control board and the electronic components are arranged in the shell, and the shell limits the shape of the location of the glue potting layer.

Images