Copper bar grinding device and copper bar processing equipment

Abstract

The utility model provides a copper bar grinding device and copper bar machining equipment, and the device comprises an in-place detection sensor which is used for detecting whether a copper bar reaches a first preset position or not; the moving-in assembly is used for moving the copper bar from a first preset position to a grinding area; the grinding assembly is used for grinding the copper bar in the grinding area; the moving-out assembly is used for moving the copper bar from the polishing area to a second preset position; and the controller is in signal connection with the in-place detection sensor, the moving-in assembly, the grinding assembly and the moving-out assembly and used for controlling the moving-in assembly, the grinding assembly and the moving-out assembly to work. The automation degree and the machining efficiency of copper bar grinding are improved.

Description

Technical Field

[0001] The present application relates to the technical field of metal machining, and in particular to a copper busbar grinding device and copper busbar processing equipment. Background Art

[0002] Copper busbars are long copper conductors with rectangular or chamfered rectangular cross-sections. They carry current in circuits and connect electrical devices. During the manufacturing process, the copper busbars, after punching and shearing, produce irregular burrs on their undersides, seriously compromising their connection and installation. To ensure the cross-sectional quality of the copper busbars, the current practice is to centrally store the punched and sheared copper busbars, where they are then removed using an angle grinder or grinding wheel. However, this practice has the disadvantages of potentially causing scratches on both workers and the copper busbar surface, requiring additional storage space, being labor-intensive, and reducing production efficiency. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a copper bar grinding device and copper bar processing equipment to improve the degree of automation of copper bar grinding and improve processing efficiency.

[0004] Based on the above objectives, the first aspect of the present application provides a copper bar polishing device, comprising:

[0005] An in-position detection sensor is used to detect whether the copper busbar has reached the first preset position;

[0006] A moving assembly, used for moving the copper bar from the first preset position to the polishing area;

[0007] A polishing component, used for polishing the copper busbar in the polishing area to remove burrs;

[0008] A removal assembly, used for moving the copper bar from the polishing area to a second preset position;

[0009] The controller is connected to the in-position detection sensor, the moving-in component, the grinding component and the moving-out component by signal, and is used to control the operation of the moving-in component, the grinding component and the moving-out component.

[0010] Furthermore, the grinding assembly includes at least one grinding piece and at least one driving assembly, wherein the driving assembly is drivingly connected to the grinding piece, and the driving assembly is used to drive the grinding piece to move.

[0011] Furthermore, the polishing assembly further includes a first position adjustment assembly, which is used to drive the copper bar to move along the length direction of the polishing area to approach or move away from the polishing piece.

[0012] Furthermore, the grinding assembly further includes at least one second position adjustment assembly, and the second position adjustment assembly is used to adjust the position of the grinding piece in at least one direction.

[0013] Furthermore, the polishing assembly includes a first limiting structure, a second limiting structure and a supporting structure. The first limiting structure and the supporting structure are connected in a relatively movable manner in the length direction of the polishing area. The second limiting structure and the supporting structure are connected in a relatively movably manner in the length direction of the polishing area. The first limiting structure and the second limiting structure can cooperate with each other to limit the copper busbar within the polishing area on the supporting structure.

[0014] Furthermore, it also includes a dust collection module, which includes a dust collection belt arranged below the polishing piece.

[0015] Furthermore, the moving-in component includes a first walking component and a first transfer structure, the first walking component includes a first lifting module and a first translation module, the first lifting module is used to drive the first transfer structure to rise or fall in the vertical direction to approach or move away from the copper bus, and the first translation module drives the first transfer structure to move in the horizontal direction from the first preset position to the polishing area or from the polishing area to the first preset position.

[0016] Furthermore, the removal assembly includes a second walking assembly and a second transfer structure, the second walking assembly includes a second lifting module and a second translation module, the second lifting module is used to drive the second transfer structure to move closer to or away from the copper bus in the vertical direction, and the second translation module drives the second transfer structure to move horizontally from the polishing area to the second preset position, or from the second preset position to the polishing area.

[0017] Furthermore, the moving-in assembly can be fixedly arranged on at least one of the ground, the ceiling and the wall, and / or the moving-out assembly can be fixedly arranged on at least one of the ground, the ceiling and the wall.

[0018] A second aspect of the present application provides a copper bar processing device, comprising a copper bar conveying device and a copper bar polishing device as described in the first aspect of the present application;

[0019] The copper bar conveying device can drive the copper bar to move at least to the first preset position along the preset conveying path; the number of the first preset positions is one or more, the number of the grinding areas is one or more, each first preset position corresponds to one grinding area, the central axis of the first preset position in the width direction is aligned with the central axis of the grinding area in the width direction, and multiple grinding areas are arranged in sequence along one side or both sides of the preset conveying path.

[0020] As can be seen from the above, the present application provides a copper busbar polishing device and copper busbar processing equipment, including an in-place detection sensor, a moving-in component, a polishing component, a moving-out component and a controller. The in-place detection sensor is used to generate a first control signal when detecting that the copper busbar has reached a first preset position. The moving-in component is used to move the copper busbar from the first preset position to a polishing area, and to generate a second control signal when the copper busbar reaches the polishing area. The polishing component is used to polish the copper busbar in the polishing area to remove burrs, and to generate a third control signal when polishing is completed. The moving-out component is used to move the copper busbar from the polishing area to the second preset position; the controller is connected to the in-place detection sensor, the moving-in component, the polishing component and the moving-out component signals, and is used to control the moving-in component to work in response to the first control signal, control the polishing component to work in response to the second control signal, and control the moving-out component to work in response to the third control signal. In this way, the entire process of copper busbar grinding from loading, grinding to unloading is automated, without the need for manual transfer, storage, manual loading and manual grinding, avoiding problems such as burrs scratching workers and burrs scratching the surface of the copper busbar affecting quality during the transfer process. There is no need to occupy additional space to store the copper busbars that need to be polished, which is conducive to improving the processing efficiency of the copper busbar. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in this application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 This is a schematic structural diagram of a copper busbar processing device according to an embodiment of the present application;

[0023] Figure 2 This is a schematic structural diagram of a copper busbar polishing device according to an embodiment of the present application.

[0024] The following are the descriptions of the accompanying figures:

[0025] 100. Copper busbar processing equipment; 200. Copper busbar conveying device; 300. Copper busbar grinding device; 400. Copper busbar punching and shearing device; 1. Copper busbar; 2. First preset position; 3. Grinding area; 4. Grinding piece; 5. First limiting structure; 6. Second limiting structure; 7. Support structure; 8. Dust collection module. DETAILED DESCRIPTION

[0026] In order to make the objectives, technical solutions and advantages of this application more clear, this application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0027] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should have the usual meanings understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the embodiments of the present application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] The embodiment of the present application provides a copper busbar processing equipment to realize the automation of the entire process of copper busbar from loading, polishing to unloading. The equipment does not require manual operation to place the copper busbar into the polishing area, which is conducive to improving the automation level and processing efficiency of copper busbar polishing.

[0029] like Figure 1 As shown, in some embodiments, the copper bar processing equipment 100 includes a copper bar conveying device 200 and a copper bar polishing device 300. The copper bar conveying device 200 is configured to move the copper bar 1 along a preset conveying path to at least a first preset position 2. The copper bar polishing device 300 is configured to move the copper bar 1 from the first preset position 2 to a polishing area 3 for polishing, and remove the copper bar 1 from the polishing area 3 after polishing is completed.

[0030] like Figure 1As shown, in this embodiment, the copper bar processing equipment 100 includes a copper bar conveying device 200 and a copper bar polishing device 300. In other embodiments, the copper bar processing equipment 100 may also include a copper bar conveying device 200 and multiple copper bar polishing devices 300. The multiple copper bar polishing devices 300 can be arranged on one side or both sides of the copper bar conveying device 200. Specifically, when multiple copper bar polishing devices 300 are arranged on the same side of the copper bar conveying device 200, the multiple copper bar polishing devices 300 arranged on the same side are arranged sequentially along a preset conveying path, and the adjacent copper bar polishing devices 300 can be arranged continuously or at intervals.

[0031] The embodiment of the present application further provides a copper busbar polishing device 300 that can improve the degree of automation of the copper busbar 1 polishing process.

[0032] like Figure 2 As shown, in some embodiments, the copper busbar polishing device 300 includes an in-place detection sensor (not shown), a moving-in component (not shown), a polishing component, a moving-out component (not shown), and a controller (not shown). The in-place detection sensor is configured to generate a first control signal when detecting that the copper busbar 1 has reached the first preset position 2, and the first control signal is used to indicate that the copper busbar 1 has reached the first preset position 2; specifically, the in-place detection sensor can be implemented using an in-place detection switch, a photoelectric sensor, an infrared sensor, an image detection sensor, etc., but this embodiment is not limited to this. The moving-in component is configured to move the copper busbar 1 from the first preset position 2 to the polishing area 3, and to generate a second control signal when the copper busbar 1 reaches the polishing area 3, and the second control signal is used to indicate that the copper busbar 1 has reached the polishing area 3; wherein the shape of the polishing area 3 is adapted to the shape of the copper busbar 1, and the length of the polishing area 3 is not less than the length of the copper busbar 1. The polishing component is configured to polish the copper busbar 1 in the polishing area 3 to remove burrs, and to generate a third control signal when polishing is completed, and the third control signal is used to indicate that the copper busbar 1 has been polished. The removal component is configured to transfer the copper bus 1 from the polishing area 3 to a second preset position, and the second preset position can be set according to actual needs. The controller is connected to the in-place detection sensor, the moving-in component, the polishing component and the removing component signal, and the controller is configured to control the moving-in component to work in response to a first control signal, control the polishing component to work in response to a second control signal, and control the removing component to work in response to a third control signal. The copper bus polishing device 300 provided in this embodiment realizes the automation of the entire process of polishing the copper bus 1 from loading, polishing to unloading, without the need for manual transfer, storage, manual loading and manual polishing, avoiding the problems of burrs that may exist in the transfer process scratching workers, burrs scratching the surface of the copper bus 1 affecting quality, and no additional space is required to store the copper bus 1 that needs to be polished, which is conducive to improving the processing efficiency of the copper bus 1.

[0033] In some cases, the specifications of the copper busbar 1 that needs to be polished are unique, and the installation position, type, quantity, etc. of the polishing piece 4 can be predetermined based on the length, width, thickness and other dimensions of the copper busbar 1. The copper busbar 1 can be polished directly after arriving at the polishing area 3, and there is no need to adaptively adjust the position of the copper busbar 1 or the position of the polishing piece 4. In response to this situation, in some embodiments, the polishing assembly includes at least one polishing piece 4 and at least one drive assembly, and the drive assembly is connected to the polishing piece 4 for driving, and the drive assembly is used to drive the polishing piece 4 to move. Specifically, for example, the polishing assembly may include two end face polishing pieces 4. For another example, the polishing assembly may include two end face polishing pieces 4 and four chamfer polishing pieces 4. For another example, the polishing assembly may include two end face polishing pieces 4 and one hole polishing piece 4. Among them, the polishing piece 4 is used to polish at least one of the end face, hole, and chamfer, and the implementation form of the polishing piece 4 includes but is not limited to a grinding belt, a grinding wheel, etc.

[0034] In some cases, the copper busbars 1 to be polished have various lengths. To accommodate copper busbars 1 of varying lengths, the length of the polishing area 3 is adapted to the copper busbar 1 with the longest length. To address this situation, in some embodiments, the polishing assembly further includes a first position adjustment assembly, which is configured to move the copper busbar 1 along the length of the polishing area 3 to move closer to or further away from the polishing member 4 when the length of the copper busbar 1 to be polished is shorter than the length of the polishing area 3.

[0035] In some cases, the copper busbar 1 to be polished may have various widths and / or thicknesses. To address this situation, in some embodiments, the polishing assembly further includes at least one second position adjustment assembly, which is configured to adjust the position of the polishing member 4 in at least one direction so that the polishing member 4 can adapt to copper busbars 1 of varying widths and / or thicknesses. The at least one direction may be at least one of a length direction, a width direction, and a thickness direction.

[0036] In some embodiments, the polishing assembly includes a first limiting structure 5, a second limiting structure 6 and a support structure 7. The first limiting structure 5 and the support structure 7 are relatively movably connected in the length direction of the polishing area 3, and the second limiting structure 6 and the support structure 7 are relatively movably connected in the length direction of the polishing area 3. The first limiting structure 5 and the second limiting structure 6 can cooperate with each other to limit the copper bar 1 in the polishing area 3 on the support structure 7, thereby avoiding the deviation of the copper bar 1 during the polishing process and affecting the polishing quality. Among them, the support structure 7 can be adopted as follows Figure 2 The structure shown may also adopt other structures that can realize the above-mentioned supporting function without affecting the realization of the functions of other modules of the copper bar polishing device, and this embodiment is not limited to this.

[0037] During the grinding process of the copper busbar 1, fine copper shavings and dust are generated. These shavings form dust inside the device and are adsorbed on the surface of the copper busbar 1, which can easily scratch the surface of the copper busbar 1, causing surface defects such as burrs, peeling, and pits, which may cause the insulation of the supported transformer winding to be broken down. At the same time, the dust also poses health risks to human skin and respiratory tract. In order to solve the above problems, in some embodiments, the copper busbar grinding device 300 also includes a dust collection module 8, which includes a dust collection belt arranged below the grinding piece 4. In this embodiment, the dust collection belt can adsorb dust by the principle of electrostatic adsorption. Specifically, for example, a DC power supply is used to power the power transmission component, and the power transmission component supplies charge to the dust collection belt, so that electrostatic charge accumulates on the dust collection belt, and the dust collection belt with accumulated electrostatic charge adsorbs the copper shavings and dust. In other embodiments, the dust collection belt can also adsorb dust by generating negative pressure through a negative pressure device. Other adsorption methods can also be used in this article, and this embodiment is not limited to this. Specifically, the dust collection module 8 may further include a storage structure connected to the dust collecting belt to store the collected copper dust. It should be noted that the connection relationship between the storage structure and the dust collecting belt and the specific structure of the storage structure can be set according to actual needs, and this embodiment is not limited thereto.

[0038] In some embodiments, the moving-in component includes a first walking component and a first transfer structure, the first walking component includes a first lifting module and a first translation module, the first lifting module is used to drive the first transfer structure to rise or fall in the vertical direction to approach or move away from the copper bus 1, and the first translation module drives the first transfer structure to move in the horizontal direction from the first preset position 2 to the polishing area 3 or from the polishing area 3 to the first preset position 2.

[0039] In this embodiment, the initial position of the first transfer structure is located above the first preset area, and the working process of the moving-in component to move the copper busbar 1 from the first preset position 2 to the polishing area 3 may include the following steps: Step 1, the first lifting module drives the first transfer structure to descend from the initial position in the vertical direction to a preset height, and the preset height is determined according to the thickness of the copper busbar 1 that currently needs to be transferred; Step 2, the first translation module drives the first transfer structure to move along the width direction of the copper busbar 1, so that the copper busbar 1 is moved from the first preset area to the polishing area 3 under the drive of the first transfer structure; Step 3, the first walking component drives the first transfer structure to return to the initial position. In other embodiments, the initial position of the first transfer structure can also be set to other positions that do not affect the transportation and polishing of the copper busbar 1 according to actual needs. It should be noted that when the initial position of the first transfer structure changes, its working path also needs to be adjusted accordingly to meet the needs of transferring the copper busbar 1.

[0040] In some embodiments, the number of movable components can be one or more, and the number of grinding areas 3 can be one or more, with each movable component corresponding to one first preset position 2 and one grinding area 3. Using multiple movable components and multiple grinding components to work simultaneously can improve production efficiency.

[0041] In other embodiments, the number of movable components can be one or more, the number of polishing areas 3 can be multiple, and each movable component corresponds to multiple first preset positions 2 and multiple polishing areas 3. Compared with the implementation method in which each movable component corresponds to one first preset position 2 and one polishing area 3, the first translation module in this embodiment is also used to drive the first transfer structure to move horizontally from the current position to the target first preset position 2, and then move from the target first preset position 2 to the corresponding polishing area 3. Among them, the target first preset position 2 is the first preset position 2 where the copper busbar 1 that currently needs to be transferred is located. Compared with the implementation method in which each movable component corresponds to one first preset position 2 and one polishing area 3, this embodiment can reduce the production cost of the copper busbar polishing device 300 while improving the polishing efficiency of the copper busbar 1.

[0042] Wherein, the first transfer structure can be a push member, which can abut against the copper busbar 1 and push the copper busbar 1 to move under the drive of the first walking assembly. During the movement of the copper busbar 1, the push member can provide support for the copper busbar 1 it pushes in the horizontal direction, but cannot provide support for the copper busbar 1 it pushes in the vertical direction. The first preset position 2 or the polishing area 3 can at least partially contact the bottom surface of the copper busbar 1 to provide support for the copper busbar 1 in the vertical direction. The positional relationship between the first preset position 2 and the polishing area 3 can be selected to meet the following conditions: the first preset position 2 and the polishing area 3 are arranged side by side, the first preset position 2 and the polishing area 3 are in or approximately in the same plane, there is no gap between the first preset position 2 and the polishing area 3 or the gap between the two can ensure that the copper busbar 1 does not fall during the process of moving from the first preset position 2 to the polishing area 3.

[0043] The first transfer structure may also be a clamping member, which can drive the copper busbar 1 to move under the drive of the first walking assembly. During the movement of the copper busbar 1, the clamping member can provide at least partial support in the vertical direction for the copper busbar 1 it clamps. At this time, the first preset position 2 or the polishing area 3 may be in contact with or not in contact with the copper busbar 1. The first preset position 2 and the polishing area 3 may be in the same or different planes, and there may be a gap between them or no gap.

[0044] In some embodiments, the removal assembly includes a second walking assembly and a second transfer structure, the second walking assembly includes a second lifting module and a second translation module, the second lifting module is used to drive the second transfer structure to move closer to or away from the copper bus 1 in the vertical direction, and the second translation module drives the second transfer structure to move horizontally from the polishing area 3 to the second preset position, or from the second preset position to the polishing area 3.

[0045] Among them, the second transfer structure can be a push member or a clamping member. For the description of the push member and the clamping member, please refer to the above record of the push member and the clamping member in the first transfer structure, which will not be repeated here.

[0046] In some embodiments, the moving-in assembly can be fixedly disposed on at least one of the floor, the ceiling, and the wall, and / or the moving-out assembly can be fixedly disposed on at least one of the floor, the ceiling, and the wall.

[0047] The copper bar processing equipment 100 provided in the embodiment of the present application includes a copper bar conveying device 200 and a copper bar polishing device 300; the copper bar conveying device 200 can drive the copper bar to move at least to a first preset position 2 along a preset conveying path; the number of the first preset positions 2 is one or more, the number of the polishing areas 3 is one or more, each first preset position 2 corresponds to a polishing area 3, the central axis of the first preset position 2 in the width direction is aligned with the central axis of the polishing area 3 in the width direction, and multiple polishing areas 3 are arranged in sequence along one side or both sides of the preset conveying path. The copper bar 1 polishing scheme provided by the related art requires manual placement of the copper bar 1 in the polishing area 3. In comparison, the present embodiment realizes the automation of the entire process of copper bar 1 polishing from loading, polishing to unloading, without the need for manual loading, storage and manual polishing, avoiding possible problems such as burrs scratching workers and burrs scratching the surface of the copper bar 1 affecting quality, and no additional space is required to store the copper bar 1 that needs to be polished, which is conducive to improving the processing efficiency of the copper bar 1. In addition, the copper bar polishing device 300 can also be set in the middle or at the end of the preset conveying path. Compared with the solution of setting it in the middle of the preset conveying path, the solution of setting the copper bar polishing device 300 on the side of the preset conveying path can avoid affecting the conveying of the copper bar 1. Compared with the solution of setting it at the end of the preset conveying path, the solution of setting the copper bar polishing device 300 on the side of the preset conveying path can reduce the total length of the copper bar processing equipment 100, so that the copper bar processing equipment 100 can adapt to a smaller installation space.

[0048] In some cases, according to actual needs, the copper busbar 1 conveyed by the copper busbar conveying device 200 sometimes needs to be polished and sometimes does not need to be polished. In response to this situation, in some embodiments, the copper busbar processing equipment 100 also includes a diversion operation module, which is connected to the controller signal and is used to send a state switching signal to the controller in response to preset operation information, so that the controller switches the working state of the copper busbar polishing device 300 in response to the state switching signal. The preset operation information is used to indicate whether the copper busbar 1 moving along the preset conveying path needs to be polished. In this way, the copper busbar 1 that does not need to be polished will no longer be transferred to the copper busbar polishing device 300 for polishing when passing through the first preset position 2, so that different copper busbar 1 processing needs can be adapted.

[0049] Specifically, the preset operation information may be generated by a diversion operation module according to a user's input operation, and the diversion operation module may be an operation button, a touch panel, or the like.

[0050] Specifically, the diversion operation module can be provided on the copper bar polishing device 300 , or can be provided separately from the copper bar polishing device 300 . For example, the diversion operation module can be installed on a mobile terminal.

[0051] Specifically, the preset operation information includes first preset information, and the diversion operation module is used to send a fourth control signal to the controller in response to the first preset information. The fourth control signal is used to indicate that the copper busbar 1 moving along the preset conveying path does not need to be polished, and the controller can switch the copper busbar polishing device 300 to a non-working state in response to the fourth control signal.

[0052] Specifically, the preset operation information includes second preset information, and the diversion module is also used to send a fifth control signal to the controller in response to the second preset information; the fifth control signal is used to indicate that the copper busbar 1 moving along the preset conveying path needs to be polished, and the controller can switch the copper busbar polishing device 300 to a working state in response to the fifth control signal.

[0053] In some embodiments, as Figure 1 As shown, the copper bar processing equipment 100 may further include a copper bar punching and shearing device 400. The discharge side of the copper bar punching and shearing device 400 is connected to the copper bar conveying device 200. The copper bar punched and sheared by the copper bar punching and shearing device 400 can be conveyed to the first preset position 2 by the copper bar conveying device 200. In this way, the copper bar 1 processing process is automated. After the punching and shearing is completed, there is no need for manual transfer, storage, manual loading and manual polishing. This avoids the problems of burrs scratching workers and burrs scratching the surface of the copper bar 1 affecting the quality during the transfer process. No additional space is required to store the copper bar 1 that needs to be polished, which is conducive to improving the processing efficiency of the copper bar 1.

[0054] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. Within the scope of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0055] The embodiments of the present application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of this application.

Claims

1. A copper bar polishing device, characterized in that: include: An in-position detection sensor, used for detecting whether the copper busbar (1) has reached a first preset position (2); A moving assembly for moving the copper busbar (1) from the first preset position (2) to the polishing area (3); A polishing assembly, used for polishing the copper busbar (1) in the polishing area (3) to remove burrs; A removal assembly for moving the copper bar (1) from the polishing area (3) to a second preset position; The controller is connected to the in-position detection sensor, the moving-in component, the grinding component and the moving-out component by signal, and is used to control the operation of the moving-in component, the grinding component and the moving-out component.

2. The copper bar polishing device according to claim 1, characterized in that: The grinding assembly comprises at least one grinding piece (4) and at least one driving assembly, wherein the driving assembly is drivingly connected to the grinding piece (4), and the driving assembly is used to drive the grinding piece (4) to move.

3. The copper bar polishing device according to claim 2, characterized in that: The polishing assembly further comprises a first position adjustment assembly, which is used to drive the copper bar (1) to move along the length direction of the polishing area (3) to approach or move away from the polishing piece (4).

4. The copper bar polishing device according to claim 2, characterized in that: The grinding assembly further comprises at least one second position adjustment assembly, wherein the second position adjustment assembly is used to adjust the position of the grinding member (4) in at least one direction.

5. The copper bar polishing device according to claim 2, characterized in that: The polishing assembly comprises a first limiting structure (5), a second limiting structure (6) and a supporting structure (7); the first limiting structure (5) and the supporting structure (7) are connected to each other in a relatively movable manner in the length direction of the polishing area (3); the second limiting structure (6) and the supporting structure (7) are connected to each other in a relatively movably manner in the length direction of the polishing area (3); the first limiting structure (5) and the second limiting structure (6) can cooperate with each other to limit the copper busbar (1) in the polishing area (3) on the supporting structure (7).

6. The copper bar polishing device according to claim 2, characterized in that: It also includes a dust collection module (8), and the dust collection module (8) includes a dust collection belt arranged below the grinding piece (4).

7. The copper busbar polishing device according to claim 1, characterized in that: The moving-in assembly comprises a first walking assembly and a first transfer structure, the first walking assembly comprises a first lifting module and a first translation module, the first lifting module is used to drive the first transfer structure to rise or fall in the vertical direction to approach or move away from the copper busbar (1), and the first translation module drives the first transfer structure to move in the horizontal direction from the first preset position (2) to the polishing area (3) or from the polishing area (3) to the first preset position (2).

8. The copper bar polishing device according to claim 1, characterized in that: The removal assembly includes a second walking assembly and a second transfer structure, the second walking assembly includes a second lifting module and a second translation module, the second lifting module is used to drive the second transfer structure to move closer to or away from the copper busbar (1) in the vertical direction, and the second translation module drives the second transfer structure to move horizontally from the polishing area (3) to the second preset position, or from the second preset position to the polishing area (3).

9. The copper bar polishing device according to claim 1, characterized in that: The moving-in assembly can be fixedly arranged on at least one of the ground, the ceiling and the wall, and / or the moving-out assembly can be fixedly arranged on at least one of the ground, the ceiling and the wall.

10. A copper busbar processing equipment, characterized in that: It comprises a copper bar conveying device and a copper bar polishing device according to any one of claims 1 to 9; The copper bar conveying device is capable of driving the copper bar (1) to move at least to the first preset position (2) along the preset conveying path; the number of the first preset positions (2) is one or more, the number of the grinding areas (3) is one or more, each of the first preset positions (2) corresponds to one grinding area (3), the central axis of the first preset position (2) in the width direction is aligned with the central axis of the grinding area (3) in the width direction, and the multiple grinding areas (3) are arranged in sequence along one side or both sides of the preset conveying path.

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