Silicon wafer bearing device
By designing a silicon wafer bearing device with clamping components and rotary lifting structure, the problems of low pollution and flip efficiency in traditional silicon wafer detection are solved, and efficient and pollution-free silicon wafer detection is achieved.
Patent Information
- Application Number
- CN202422115075.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-29
AI Technical Summary
During the traditional silicon wafer inspection process, the stage is prone to contamination on the silicon wafer, and the manual flip efficiency is low, which affects the detection accuracy and production capacity.
Design a silicon wafer bearing device, using clamping components to clamp the edge of the silicon wafer, combined with rotation and lifting structures, realize automatic flip and height adjustment of the silicon wafer, reduce the contact area with the carrier, and avoid pollution.
It improves the efficiency and accuracy of silicon wafer detection, reduces the risk of silicon wafer pollution, and improves work efficiency and production capacity.
Smart Images
Figure CN223244520U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a silicon wafer carrying device. Background Art
[0002] Traditionally, silicon wafer surface defect detection in laboratories involves placing the wafer on a conventional carrier (including a flat platform) and inspecting it visually under a bright light. Because wafer inspection requires observing both the front and back sides, poor cleanliness of the platform surface can cause wear and contamination of the wafer / wafer during this process.
[0003] Often, issues like silicon wafer surface cleanliness and scratches can lead to misjudgment or even inability to determine the quality of a product, resulting in product losses. This can significantly reduce inspection accuracy, affect judgment, and ultimately impact production capacity.
[0004] Traditionally, a wafer is placed on a stage. To view both sides, the wafer must be flipped over. This process involves extracting the wafer using a fixture. This process carries the risk of the wafer falling and introduces backside contamination, reducing work efficiency. Wiping the wafer surface doesn't necessarily eliminate contamination and may introduce new contamination, nor can it remove scratches. Furthermore, frequent wafer flipping reduces work efficiency and hinders productivity. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides a silicon wafer carrying device to solve the problem that the carrier easily contaminates the silicon wafer during silicon wafer inspection and the manual flipping efficiency is low.
[0006] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: a silicon wafer carrying device, comprising:
[0007] base;
[0008] A clamping assembly, comprising a bracket and a clamping structure, wherein the bracket is a ring-shaped structure having an opening, and the clamping structures are respectively provided at both ends of the opening, and the two clamping structures cooperate to clamp the edge of the silicon wafer;
[0009] A rotating structure, used to control the rotation of the clamping structure to drive the clamped silicon wafer to rotate and turn over;
[0010] A lifting structure is arranged between the base and the bracket, and is used to control the lifting movement of the bracket. The lifting structure includes a support rod fixed to the base, and a plurality of first clips are arranged on the outer peripheral surface of the support rod at intervals along its axial direction. The bottom of the bracket is provided with a second clip that can cooperate with the first clip, and the first end of the second clip is connected to the bracket through a connecting piece, so that the second end of the second clip can move in a direction away from or close to the first clip.
[0011] Optionally, the connecting member is a rotating shaft, one end of the second clip is pivotally connected to the bracket through the rotating shaft, and the first end of the second clip extends in a direction away from the second end to form a pressing portion.
[0012] Optionally, the support rod and the bracket are connected via an elastic connector, and the elastic connector is configured such that when any one of the first buckle is engaged with the second buckle, the support rod is compressed and deformed in the axial direction.
[0013] Optionally, the plurality of first buckles include a bottom buckle at one end close to the base, and when the bottom buckle is engaged with the second buckle, the deformation of the elastic connector is less than or equal to the maximum deformation of the elastic connector.
[0014] Optionally, the elastic connecting member is a spring.
[0015] Optionally, the area of the annular structure is larger than the area of the silicon wafer to be clamped, and the length of the line connecting the two ends of the opening is larger than the diameter of the silicon wafer to be clamped.
[0016] Optionally, a line connecting the two ends of the opening is tilted relative to the lifting direction of the bracket.
[0017] Optionally, the clamping structure includes a clamping body rotatably connected to the corresponding end of the opening, the clamping body has a clamping end and a rotating end along its axial direction, the clamping end is provided with a chuck, and the rotating structure includes a rotating handle fixed to the rotating end, the rotating handle is constructed to drive the clamping body to rotate along the circumferential direction of the clamping body to drive the clamped silicon wafer to rotate.
[0018] The beneficial effects of the present invention are: the edge of the silicon wafer can be clamped by the clamping structure, and the silicon wafer can be rotated and turned over by the rotating structure, thereby improving efficiency and avoiding contamination of the silicon wafer; the height of the silicon wafer can be adjusted by the lifting structure, thereby improving the convenience of silicon wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A schematic diagram showing a silicon wafer supporting device in an embodiment of the present invention;
[0020] Figure 2 A schematic diagram showing a clamping structure in an embodiment of the present utility model;
[0021] Figure 3 A schematic diagram showing a portion of the structure of a silicon wafer carrier in an embodiment of the present invention.
[0022] 1 base; 2 bracket; 3 clamping structure; 4 second buckle; 41 strip-shaped body; 42 clamping block; 5 first buckle; 6 support rod; 100 silicon wafer; 31 clamping body; 32 chuck; 33 rotating handle. DETAILED DESCRIPTION
[0023] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0024] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0025] As used in the embodiments of the present disclosure, the terms "parallel," "perpendicular," and "identical" include the strict sense of "parallel," "perpendicular," and "identical," as well as "approximately parallel," "approximately perpendicular," and "approximately identical" with respect to a certain tolerance, which, taking into account the tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the stated value.
[0026] refer to Figure 1-Figure 3 This embodiment provides a silicon wafer supporting device, including:
[0027] Base 1;
[0028] A clamping assembly, comprising a bracket 2 and a clamping structure 3. The bracket 2 is an annular structure with an opening. The two ends of the opening are respectively provided with the clamping structures 3. The two clamping structures 3 cooperate to clamp the edge of the silicon wafer.
[0029] A rotating structure for controlling the rotation of the clamping structure 3 to drive the clamped silicon wafer to rotate and flip over;
[0030] A lifting structure is provided between the base 1 and the bracket 2, and is used to control the lifting movement of the bracket 2. The lifting structure includes a support rod 6 fixed to the base 1, and a plurality of first buckles 5 are arranged on the outer peripheral surface of the support rod 6 at intervals along its axial direction. The bottom of the bracket 2 is provided with a second buckle 4 that can cooperate with the first buckle 5. The first end of the second buckle 4 is connected to the bracket 2 through a connecting piece, so that the second end of the second buckle 4 can move away from or close to the first buckle 5.
[0031] In the related art, a silicon wafer is placed on a conventional carrier, and the surface contact between the silicon wafer and the carrier is formed, which easily causes contamination to the silicon wafer. In this embodiment, the two clamping structures 3 cooperate to clamp the edges of the silicon wafer, reducing the contact area with the silicon wafer and reducing contamination to the silicon wafer.
[0032] In this embodiment, the rotation structure is configured to control the rotation of the clamping structure 3 to drive the clamped silicon wafer to rotate, eliminating the need for an additional clamp to grip the silicon wafer for flipping, thereby improving efficiency.
[0033] In this embodiment, the lifting structure can be used to control the bracket 2 to perform lifting movements to adjust the height of the clamped silicon wafer, thereby facilitating operations such as rotating the silicon wafer to turn it over.
[0034] It should be noted that the silicon wafer carrier device of this embodiment can be used in laboratories to inspect the surface of silicon wafers, but is not suitable for use in laboratories with larger carrying and transport equipment. The silicon wafer carrier device of this embodiment has a simple structure, a small size, and saves space, making it suitable for carrying silicon wafers in smaller spaces such as laboratories.
[0035] It should be noted that when the two clamping structures 3 clamp the silicon wafer, the line connecting the center points of the two clamping structures 3 (refer to Figure 1The dotted line in the figure is parallel to the radial direction of the clamped silicon wafer 100 to improve the clamping stability. Figure 1 .
[0036] In an exemplary embodiment, the connecting member is a rotating shaft, the first end of the second buckle 4 is pivotally connected to the bracket 2 via the rotating shaft, and the first end of the second buckle 4 extends away from the second end to form a pressing portion.
[0037] By adopting the above technical solution, by pressing the pressing portion, the second end of the second buckle 4 can be moved away from the first buckle 5 to disengage from the first buckle 5, thereby adjusting the height of the bracket 2.
[0038] refer to Figure 3 ( Figure 3 Only a portion of the bracket 2 is shown. In an exemplary embodiment, the first clip 5 is a clamping column protruding from the outer peripheral surface of the support rod 6, and the extending direction of the clamping column is parallel to the radial direction of the support rod 6.
[0039] The second buckle 4 includes a strip-shaped body 41 , a clamping block 42 is provided at the second end of the strip-shaped body 41 , and the clamping block 42 is perpendicular to the strip-shaped body 41 to be clamped and matched with the clamping column.
[0040] In an exemplary embodiment, two rows of the clamping columns are provided on the outer peripheral surface of the support rod 6, and the two rows of the clamping columns are relatively arranged on opposite sides of the support rod 6 along the radial direction of the support rod 6. The lifting structure includes two second buckles 4 corresponding to the two rows of the clamping columns, respectively, to improve the connection stability when the first buckle 5 and the second buckle 4 are engaged.
[0041] In some embodiments, the first buckle 5 is a telescopic column telescopically arranged on the support rod 6, the extension direction of the telescopic column is parallel to the radial direction of the support rod 6, the support rod 6 is hollow inside, a connecting rod is provided inside the support rod 6, the axial direction of the connecting rod is parallel to the axial direction of the support rod 6, a plurality of the telescopic columns are fixedly provided on the connecting rod, a plurality of through holes are provided on the outer circumference of the support rod 6, and the plurality of through holes are provided in a one-to-one correspondence with the plurality of the telescopic columns, the connecting rod is connected to the inner side wall of the support rod 6 by a spring, and the spring is engaged with the inner wall of the support rod 6. Under the elastic action of the spring, the telescopic column is exposed to the support rod 6 through the through hole, and an adjusting column is also provided on the connecting rod. The extension direction of the adjusting column is parallel to the radial direction of the support rod 6. The length of the adjusting column is greater than or equal to the length of the telescopic column. The adjusting column is exposed to the support rod 6 through the adjusting hole on the side wall of the support rod 6. By pressing the adjusting column, under the elastic action of the spring, the multiple telescopic columns can be retracted into the support rod 6, so that the first clip 5 and the second clip 4 are disengaged to perform the lifting movement of the bracket 2.
[0042] In an exemplary embodiment, the support rod 6 and the bracket 2 are connected by an elastic connector, and the elastic connector is constructed so that when any one of the first buckle 5 and the second buckle 4 is engaged, the support rod 6 is compressed and deformed in the axial direction.
[0043] When the first buckle 5 and the second buckle 4 are engaged, the elastic connector is in a compressed deformation state. In this way, after the first buckle 5 and the second buckle 4 are disengaged, the bracket 2 can be made to move upward under the action of elasticity, or it can be manually pressed down to make the bracket 2 descend. The operation is convenient, and under the elastic action of the elastic connector, the staff can control the lifting and lowering of the bracket 2 with one hand, and the operation is flexible, easy and simple.
[0044] In an exemplary embodiment, the plurality of first clips 5 include a bottom clip at one end close to the base 1. When the bottom clip is engaged with the second clip 4, the deformation of the elastic connector is less than or equal to the maximum deformation of the elastic connector.
[0045] By adopting the above solution, damage to the elastic connecting member is avoided.
[0046] In an exemplary embodiment, the elastic connecting member is a spring, but the present invention is not limited thereto.
[0047] In an exemplary embodiment, the area of the annular structure is larger than the area of the silicon wafer to be clamped, and the length of the line connecting the two ends of the opening is larger than the diameter of the silicon wafer to be clamped. Figure 1.
[0048] The above solution provides space for clamping the silicon wafer.
[0049] Generally, the silicon wafer is circular. In some embodiments, the annular structure is a part of a circle. In some embodiments, the annular structure is a semicircle. The line connecting the center points of the two clamping structures 3 (refer to Figure 1 The dotted line in FIG1 passes through the center of the annular structure, so that the radius of the silicon wafer to be clamped can be determined by the radius of the annular structure.
[0050] Exemplarily, the radius of the annular structure is larger than the radius of the silicon wafer to be clamped to avoid damage to the silicon wafer.
[0051] In an exemplary embodiment, the line connecting the two ends of the opening is tilted relative to the lifting direction of the bracket 2, so that the structure is similar to a globe, which is convenient for operations such as testing of silicon wafers.
[0052] refer to Figure 2 In an exemplary embodiment, the clamping structure 3 includes a clamping body 31 rotatably connected to the corresponding end of the opening, and the clamping body 31 has a clamping end and a rotating end along its axial direction, and the clamping end is provided with a clamping head 32, and the rotating end is fixedly connected to a rotating handle 33, and the rotating handle 33 is constructed to drive the clamping body to rotate along the circumferential direction of the clamping body to drive the clamped silicon wafer to rotate.
[0053] The clamped silicon wafer can be rotated and turned over by rotating the rotating handle 33 without causing contamination to the silicon wafer.
[0054] In an exemplary embodiment, the chuck 32 is provided with adsorption holes for clamping the silicon wafer by adsorption, but the present invention is not limited thereto.
[0055] In an exemplary embodiment, the two clamping structures 3 can move toward or away from each other to clamp silicon wafers of different sizes.
[0056] In order to enable the two clamping structures 3 to move toward or away from each other, in some embodiments, the clamping body 31 is provided with a plurality of first spiral holes at intervals in its extension direction, and a second spiral hole is provided on the end face of each end of the opening to cooperate with the first spiral hole for the bolt to pass through.
[0057] There are a few points to note:
[0058] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.
[0059] (2) For the sake of clarity, the thickness of layers or regions in the drawings used to describe the embodiments of the present disclosure are exaggerated or reduced, i.e., these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.
[0060] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.
[0061] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.
Claims
1. A silicon wafer supporting device, characterized in that: include: base; A clamping assembly, comprising a bracket and a clamping structure, wherein the bracket is a ring-shaped structure having an opening, and the clamping structures are respectively provided at both ends of the opening, and the two clamping structures cooperate to clamp the edge of the silicon wafer; A rotating structure, used to control the rotation of the clamping structure to drive the clamped silicon wafer to rotate and turn over; A lifting structure is arranged between the base and the bracket, and is used to control the lifting movement of the bracket. The lifting structure includes a support rod fixed to the base, and a plurality of first clips are arranged on the outer peripheral surface of the support rod at intervals along its axial direction. The bottom of the bracket is provided with a second clip that can cooperate with the first clip, and the first end of the second clip is connected to the bracket through a connecting piece, so that the second end of the second clip can move in a direction away from or close to the first clip.
2. The silicon wafer carrying device according to claim 1, wherein: The connecting member is a rotating shaft, one end of the second buckle is pivotally connected to the bracket through the rotating shaft, and the first end of the second buckle extends in a direction away from the second end to form a pressing portion.
3. The silicon wafer carrying device according to claim 1, wherein: The support rod and the bracket are connected via an elastic connector. The elastic connector is configured such that when any one of the first buckle is engaged with the second buckle, the support rod is compressed and deformed in the axial direction.
4. The silicon wafer carrying device according to claim 3, characterized in that: Among the plurality of first buckles, there is a bottom buckle at one end close to the base. When the bottom buckle is engaged with the second buckle, the deformation of the elastic connector is less than or equal to the maximum deformation of the elastic connector.
5. The silicon wafer carrying device according to claim 3, wherein: The elastic connecting member is a spring.
6. The silicon wafer carrying device according to claim 1, wherein: The area of the annular structure is larger than the area of the silicon wafer to be clamped, and the length of the line connecting the two ends of the opening is larger than the diameter of the silicon wafer to be clamped.
7. The silicon wafer carrying device according to claim 1, wherein: The connecting line between the two ends of the opening is arranged to be inclined relative to the lifting direction of the bracket.
8. The silicon wafer carrying device according to claim 1, wherein: The clamping structure includes a clamping body rotatably connected to the corresponding end of the opening, the clamping body has a clamping end and a rotating end along its axial direction, the clamping end is provided with a clamping head, and the rotating structure includes a rotating handle fixed to the rotating end, and the rotating handle is constructed to drive the clamping body to rotate along the circumferential direction of the clamping body to drive the clamped silicon wafer to rotate.