Silicon wafer carrier plate convenient for replacing mask plate

Abstract

The utility model provides a silicon wafer carrier plate convenient to replace a mask plate, which comprises a plate frame, a plurality of mounting grooves are arranged on the plate frame in an array mode, and a circle of supporting parts used for supporting mask plate assemblies are arranged on the inner sides of the mounting grooves. The mask plate assembly comprises an upper mask plate and a lower mask plate which are attached to the two sides of a silicon wafer, a plurality of pressing blocks used for fixing the mask plate assembly are arranged on the upper end face of the plate frame and around the installation groove, and after the mask plate assembly and the pressing blocks are installed and fixed, the upper end face of the mask plate assembly and the upper end face of the pressing blocks are not higher than the upper end face of the plate frame. The mask plate assembly is provided with a plurality of mounting grooves and pressing blocks, mask plate assemblies with film holes in different shapes are convenient to mount and replace, the experimental diversity requirements are met, the manufacturing efficiency is improved, and the structural design is reasonable.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic panel manufacturing, in particular to a silicon wafer carrier which is convenient for replacing a mask plate. Background Art

[0002] Heterojunction photovoltaic panels primarily consist of a crystalline silicon substrate and an amorphous silicon thin film. A layer of intrinsic amorphous silicon and a doped amorphous silicon thin film are deposited on the front and back of the crystalline silicon wafer, forming a heterojunction structure. This structure can effectively improve the performance of photovoltaic panels.

[0003] During research and development and manufacturing, researchers often set different shapes and quantities of thin films and then conduct experiments. However, in order to improve manufacturing efficiency and control variables during the experiment, masks of different shapes are often covered on different silicon wafers for coating to control variables and improve efficiency. However, existing silicon wafer carriers are mostly manufactured with a single membrane hole shape, and the mask plates cannot be replaced at will, which cannot meet the needs of experimental diversity. It is necessary to use carriers of multiple specifications at the same time, which is very inconvenient. Utility Model Content

[0004] The utility model provides a silicon wafer carrier plate which is convenient for replacing a mask plate, and can effectively solve the above-mentioned problem.

[0005] The utility model is achieved in this way:

[0006] A silicon wafer carrier for facilitating replacement of a mask plate, comprising:

[0007] A plate frame, wherein a plurality of mounting slots are arranged in an array on the plate frame, and a circle of support portions for supporting the mask plate assembly is provided inside the mounting slots;

[0008] The mask plate assembly includes an upper mask plate and a lower mask plate adhered to both sides of the silicon wafer. A number of pressing blocks for fixing the mask plate assembly are provided on the upper end surface of the plate frame and around the mounting groove. After being installed and fixed, the upper end surfaces of the mask plate assembly and the pressing blocks are not higher than the upper end surface of the plate frame.

[0009] As a further improvement, the upper surface of the lower mask plate is provided with a placement groove, the silicon wafer is first placed in the placement groove and then the upper mask plate is covered on the silicon wafer, the placement groove is provided with a positioning column, and the upper mask plate is provided with a positioning hole that cooperates with the positioning column.

[0010] As a further improvement, four first grooves are provided on the edge of the upper end surface of the lower mask plate; a second groove is provided on the upper end surface of the plate frame, and a screw hole is provided at the bottom of the second groove. When the mask plate assembly is installed on the plate frame, the first grooves are aligned with the second grooves, and the pressure block is placed in the first grooves and the second grooves and fixed by bolts, and a countersunk hole is provided on the upper end surface of the pressure block.

[0011] As a further improvement, a pick-up and placement notch is provided on the side of the placement groove, and a pick-up and placement boss is provided on the side of the upper mask plate and located at the pick-up and placement notch.

[0012] As a further improvement, the positioning posts and the positioning holes are provided in a total of six groups, arranged in three rows and two columns, the positioning posts are all cylindrical, and except for the second positioning hole in the second row which is a circular hole, the rest of the positioning holes are all long strips, and the axes of the long sides all point to the circular holes.

[0013] As a further improvement, a circle of frame is provided on the side of the plate rack.

[0014] The beneficial effects of the utility model are:

[0015] There are multiple mounting slots on the plate frame, which can be used to install mask plate assemblies with different shapes and numbers of membrane holes according to experimental requirements. This allows R&D personnel to control variables more flexibly when conducting experiments and explore the impact of different film shapes and quantities on the performance of photovoltaic panels, greatly improving the diversity and effectiveness of the experiments. The mask plate is only fixed by bolting the pressure block. When it needs to be replaced, it only needs to unscrew the bolts and remove the pressure block for disassembly and replacement. By replacing different mask plate assemblies, R&D personnel do not need to use carrier plates of multiple specifications, reducing the investment cost of experimental equipment and improving the convenience of experimental operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure provided by an embodiment of the utility model.

[0018] Figure 2 It is a schematic diagram of a partial installation structure provided by an embodiment of the utility model.

[0019] Figure 3 This is a schematic structural diagram of a mask plate assembly provided by an embodiment of the present utility model.

[0020] Figure 4 This is a schematic diagram of the upper mask plate structure provided by an embodiment of the present utility model.

[0021] Figure 5 This is a schematic diagram of silicon wafer installation provided by an embodiment of the present utility model.

[0022] Reference numerals:

[0023] 1. Plate rack; 11. Second groove; 2. Mask plate assembly; 21. Upper mask plate; 211. Positioning hole; 212. Pick-up and placement boss; 22. Lower mask plate; 221. First groove; 222. Pick-up and placement notch; 223. Positioning column; 23. Film hole; 3. Frame; 4. Press block; 5. Silicon wafer. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is claimed, but merely represents selected embodiments of the present invention.

[0025] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically specified.

[0026] Reference Figure 1-5 As shown, a silicon wafer carrier that is convenient for replacing a mask plate comprises:

[0027] The plate rack 1 has twenty-four mounting slots arranged in an array in four rows and six columns. The specific number and size can be set according to actual needs. A circle of support parts for supporting the mask plate assembly 2 is provided on the inner side of the mounting slot. The support parts are stepped, and the side surfaces of the mask plate assembly 2 are formed into an inverted step shape for matching; the support parts on the inner side of the mounting slot are stepped, which match the inverted step shape on the side surfaces of the mask plate assembly 2. This design can ensure the stability of the mask plate assembly 2 in the mounting slot, prevent displacement or shaking during the coating process, and thus ensure the accuracy and quality of the coating.

[0028] The mask plate assembly 2 includes an upper mask plate 21 and a lower mask plate 22 that are attached to both sides of the silicon wafer. The upper mask plate 21 and the lower mask plate 22 are provided with film holes 23 of different shapes and numbers according to actual requirements. Four pressure blocks 4 for fixing the mask plate assembly 2 are provided on the upper end surface of the plate frame 1 and around the mounting groove. The pressure blocks 4 are symmetrically distributed on two sides of the mounting groove, and the adjacent sides of two adjacent mounting grooves share the pressure blocks 4, that is, the pressure blocks 4 press the two adjacent groups of mask plate assemblies 2 at the same time. The pressure blocks 4 on the upper end surface of the plate frame 1 are symmetrically distributed on both sides of the mounting groove, and the adjacent sides of two adjacent mounting grooves share the pressure blocks 4. This design not only saves materials, but also can press the two adjacent groups of mask plate assemblies 2 at the same time, thereby improving the reliability of fixation. After the mask plate assembly 2 and the pressure blocks 4 are installed and fixed, their upper end surfaces are flush with the upper end surface of the plate frame 1, and the lower end surface of the mask plate assembly 2 is also flush with the lower end surface of the plate frame 1, making the entire structure more regular and convenient for operation and mechanical automation.

[0029] Furthermore, in order to ensure accurate assembly and alignment of the upper mask plate 21 and the lower mask plate 22, a placement groove is provided on the upper end surface of the lower mask plate 22. The silicon wafer is first placed in the placement groove and then the upper mask plate 21 is placed on the silicon wafer. A positioning column 223 is provided in the placement groove, and the upper mask plate 21 is provided with a positioning hole 211 that cooperates with the positioning column 223.

[0030] Furthermore, there are six groups of positioning posts 223 and positioning holes 211, which are arranged in three rows and two columns. The positioning posts 223 are all cylindrical. Except for the second positioning hole 211 in the second row, which is a circular hole, the remaining positioning holes 211 are all long strip-shaped positioning holes 211, and the axes of the long sides all point to the circular positioning holes 211, which can reduce the requirements for processing accuracy and improve the success rate of assembly.

[0031] Furthermore, in order to ensure that the upper end surface of the pressure block 4 is flush with the upper end surface of the plate frame 1 after assembly, four first grooves 221 are provided on the edge of the upper end surface of the lower mask plate 22; a second groove 11 is provided on the upper end surface of the plate frame 1, and a screw hole is provided at the bottom of the second groove 11. When the mask plate assembly 2 is installed on the plate frame 1, the first groove 221 is aligned with the second groove 11, the pressure block 4 is placed in the first groove 221 and the second groove 11 and fixed by bolts, and a countersunk hole is provided on the upper end surface of the pressure block 4.

[0032] Furthermore, in order to facilitate the disassembly and assembly of the upper mask plate 21 , a pick-up and placement notch 222 is provided on the side of the placement groove, and a pick-up and placement boss 212 is provided on the side of the upper mask plate 21 and located at the pick-up and placement notch 222 .

[0033] Furthermore, in order to facilitate the transportation and placement of the carrier board, a circle frame 3 is provided on the side of the board rack 1, and the frame 3 is formed by splicing four frame profiles.

[0034] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A silicon wafer carrier that facilitates replacement of mask plates, characterized in that: include: A plate frame (1), wherein a plurality of mounting grooves are arranged in an array on the plate frame (1), and a circle of supporting parts for supporting the mask plate assembly (2) is provided on the inner side of the mounting groove; The mask plate assembly (2) comprises an upper mask plate (21) and a lower mask plate (22) attached to both sides of a silicon wafer. A plurality of pressing blocks (4) for fixing the mask plate assembly (2) are provided on the upper end surface of the plate frame (1) and around the mounting groove. After being mounted and fixed, the upper end surfaces of the mask plate assembly (2) and the pressing blocks (4) are not higher than the upper end surface of the plate frame (1).

2. The silicon wafer carrier for facilitating replacement of a mask plate according to claim 1, characterized in that: The upper end surface of the lower mask plate (22) is provided with a placement groove, the silicon wafer is first placed in the placement groove and then the upper mask plate (21) is covered on the silicon wafer, the placement groove is provided with a positioning column (223), and the upper mask plate (21) is provided with a positioning hole (211) that cooperates with the positioning column (223).

3. The silicon wafer carrier for facilitating replacement of a mask plate according to claim 1, characterized in that: Four first grooves (221) are provided on the edge of the upper end face of the lower mask plate (22); a second groove (11) is provided on the upper end face of the plate frame (1); a screw hole is provided at the bottom of the second groove (11); when the mask plate assembly (2) and the plate frame (1) are installed, the first groove (221) and the second groove (11) are aligned; the pressing block (4) is placed in the first groove (221) and the second groove (11) and fixed by bolts; and a countersunk hole is provided on the upper end face of the pressing block (4).

4. The silicon wafer carrier for facilitating replacement of a mask plate according to claim 2, characterized in that: A pick-up and placement notch (222) is provided on the side of the placement groove, and a pick-up and placement boss (212) is provided on the side of the upper mask plate (21) and located at the pick-up and placement notch (222).

5. The silicon wafer carrier for facilitating replacement of a mask plate according to claim 2, characterized in that: The positioning posts (223) and the positioning holes (211) are provided in a total of six groups, arranged in three rows and two columns. The positioning posts (223) are all cylindrical. Except for the second positioning hole (211) in the second row which is a circular hole, the remaining positioning holes (211) are all long strips, and the axes of the long sides of the positioning holes (211) all point to the circular holes.

6. The silicon wafer carrier for facilitating replacement of a mask plate according to claim 1, characterized in that: A circle frame (3) is provided on the side of the plate frame (1).

Images