Flexible plate rubberizing and pressing device

Abstract

The utility model relates to the technical field of production equipment of flexible printed circuit boards, in particular to a flexible board rubberizing and pressing device which comprises a jig assembly and a workbench, the workbench is divided into a pressing area and a material changing area, and the jig assembly is transferred between a rubberizing area and a material transferring area through a transferring mechanism; the upper die assembly comprises an upper die plate and an upper driving part, heating plates are arranged on the top of the upper die plate in a laminated mode, and the upper driving part drives the heating plates and the upper die plate to ascend and descend so as to conduct hot pressing on materials and gum. According to the application, the positioning groove is formed in the jig plate, and the PIN needles for positioning are arranged around the positioning groove, so that the flexible plate is limited in the operation processes of feeding, rubberizing and pressing, and material deviation is prevented. Through the arrangement of the heating plate, hot-pressing lamination of the back glue and the flexible plate is realized, the bonding firmness of the back glue and the flexible plate is improved, and due to the fact that the back glue and the flexible plate are subjected to hot-pressing lamination, the possibility of poor glue overflow during subsequent bonding of the flexible plate and a reinforcing sheet is reduced, the appearance and the quality are improved, and therefore the scrapping of the flexible plate caused by glue overflow in production is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of production equipment for flexible printed circuit boards, in particular to a flexible board gluing and pressing device. Background Art

[0002] Flexible printed circuit board (FPCB) is a highly reliable and flexible printed circuit board made of polyimide or polyester film. It is also called FPCB for short. It has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in many products such as mobile phones, laptops, PDAs, digital cameras, LCMs, etc.

[0003] In the current production process for reinforcing sheets used in flexible boards, adhesive lamination is usually performed first and then stamping is performed. During the adhesive lamination operation, the flexible board is usually placed on a jig and pressed by the upper mold to firmly bond the flexible board to the adhesive backing.

[0004] However, a single-piece flexo board is small in size and light in weight. When multiple flexo boards are placed on a jig plate, they are prone to inaccurate positioning and easy offset during pressing. In addition, cold pressing and pressing cannot well stimulate the adhesive strength of the back glue. The back glue is not firmly attached and the pasting position is offset, which will lead to glue overflow after the flexo board and the reinforcement sheet are attached, affecting the appearance and even causing functional problems of the flexo board, resulting in the scrapping of the flexo board.

[0005] Based on the problems in the prior art, the utility model provides a flexible board gluing and pressing device. Utility Model Content

[0006] The utility model aims to provide a device for gluing and pressing a flexible board, so as to solve the technical problem in the prior art that the flexible board is not accurately positioned when the back adhesive is pasted on the flexible board, resulting in deviation in the gluing and pressing operation.

[0007] The technical solution of the utility model is: a flexible board gluing and pressing device, including a jig assembly and a workbench, the workbench is divided into a pressing area and a material transfer area, the jig assembly is transferred between the pressing area and the material transfer area through a transfer mechanism, the material is loaded and unloaded in the material transfer area, and the back glue and the material are positively pressed in the pressing area by the upper mold assembly; the upper mold assembly includes an upper mold plate and an upper driving member, a heating plate is stacked on the top of the upper mold plate, and the upper driving member drives the heating plate and the upper mold plate to rise and fall to hot-press the material and the back glue.

[0008] Preferably, the fixture assembly includes a fixture plate, and a plurality of positioning grooves and PIN pins are distributed on the top surface of the fixture plate, and the PIN pins are arranged around the periphery of the positioning grooves;

[0009] A pressing pad and a guide sleeve are provided on the upper template, and the length of the guide sleeve is greater than the thickness of the pressing pad; the PIN pin corresponds to the position of the guide sleeve, and when the upper mold is pressed together, the guide sleeve first touches the PIN pin and docks, and the pressing pad then presses the adhesive block on the material.

[0010] Preferably, a heat-insulating top plate is installed between the heating plate and the driving end of the upper driving member at the top, and heat-insulating side plates are provided on both sides of the heat-insulating top plate.

[0011] Preferably, the jig plate is supported by a carrying plate, and the carrying plate is mounted on the transfer mechanism via an assembly plate;

[0012] The PIN needle is fixedly mounted on the carrier plate, a PIN needle hole is provided on the fixture plate, and a cavity space is reserved in the PIN needle hole for inserting the guide sleeve.

[0013] Preferably, the heating plate is a brass plate, and heating rods are installed at intervals inside.

[0014] Preferably, the transfer mechanism adopts a linear module.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] (1) This application arranges positioning grooves on the jig plate and positioning PIN pins around the positioning grooves to position the flexible board for loading, and limits the flexible board during the gluing and pressing operations to prevent material deviation.

[0017] (2) This application provides a positioning sleeve on the bottom of the upper template. During pressing, the positioning sleeve cooperates with the PIN pin to perform pressing positioning and limit, preventing material deviation. Since the sleeve is positioned before the upper template, the pre-pressing step is omitted, saving time and improving work efficiency.

[0018] (3) The present application provides an upper template and a heating plate for heating the upper template on the top of the jig plate, and hot presses the back glue and the flexible board, thereby stimulating the viscosity of the back glue and improving the bonding strength between the back glue and the flexible board. Moreover, since the back glue and the flexible board have been hot pressed, the possibility of glue overflow when the flexible board is subsequently bonded to the reinforcement sheet is reduced, thereby improving the appearance and quality, thereby reducing the scrapping of the flexible board due to glue overflow during production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0020] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the flexible plate gluing and pressing device of the present invention;

[0021] Figure 2 It is a schematic diagram of the partial structure of the workbench surface of the utility model;

[0022] Figure 3 This is a schematic diagram of the partial structure of the fixture assembly of the present invention;

[0023] Figure 4 This is a partial exploded schematic diagram of the upper mold assembly of the present invention;

[0024] Figure 5 This is a schematic top view of the jig plate of the present invention;

[0025] Figure 6 This is a partial exploded schematic diagram of the upper mold assembly of the present invention;

[0026] Figure 7 This is a schematic diagram of the reverse side of the material described in the present utility model;

[0027] Among them: 1. Fixture components;

[0028] 11. Jig plate, 12. Loading plate, 13. Assembly plate;

[0029] 101, positioning groove, 102, PIN needle, 103, PIN pin hole;

[0030] 2. Workbench; 21. Pressing area; 22. Material transfer area;

[0031] 3. Upper mold assembly;

[0032] 31. Upper template, 32. Upper driving member, 33. Heating plate, 34. Insulation top plate, 35. Insulation side plate;

[0033] 301, pressing pad, 302, guide sleeve;

[0034] 4. Transfer mechanism. DETAILED DESCRIPTION

[0035] The following is a further detailed description of the present invention in conjunction with specific embodiments:

[0036] To facilitate understanding, let's first explain the application scenario of this application. Usually, a flexible board (flexible circuit board, generally in sheet form) is loaded onto a jig, and the upper mold is pressed to firmly bond the flexible board to the adhesive. However, a one-piece flexible board is small in size and light in weight. When multiple flexible boards are placed on the jig board, it is easy to position them inaccurately. The adhesive is one-piece, and multiple pieces of one-piece adhesive are covered and pasted on the surface of the flexible board on the jig board. It is difficult to ensure that all adhesives are accurately positioned, and cold pressing cannot fully exert the adhesive's viscosity. The hot pressing method of this application is equipped with a PIN sleeve for guiding and positioning. While accurately positioning, it can better exert the adhesive's bonding effect.

[0037] like Figure 1 As shown, a flexible board gluing and pressing device includes a jig assembly 1 and a workbench 2, and an upper mold assembly 3 is arranged above the jig assembly 1. Figure 2 The workbench 2 is divided into a pressing area 21 and a material transfer area 22. Materials are loaded and unloaded in the material transfer area 22. In the pressing area 21, the upper mold assembly 3 positively presses the adhesive and the material. The fixture assembly 1 is transferred between the pressing area 21 and the material transfer area 22 by the transfer mechanism 4. The transfer mechanism 4 adopts a linear module.

[0038] The fixture assembly 1 is provided with different specifications and sizes. Different fixture assemblies 1 are installed on the transfer mechanism 4 according to different needs. Figure 3 As shown, combined with the attached Figure 4 The fixture assembly 1 includes a fixture plate 11 , which is supported by a carrying plate 12 , and the carrying plate 12 is mounted on the transfer mechanism 4 through an assembly plate 13 .

[0039] Refer to the attached Figure 7 Combined with attachment Figure 5 The flexible sheet is a single piece of uniform material, laid flat on the material area of the jig plate 11. To ensure precise positioning, the top surface of the jig plate 11 is provided with several positioning grooves 101 and PIN pins 102. The PIN pins are arranged around the positioning grooves 101. The PIN pins 102 are fixedly mounted on the carrier plate 12, and the jig plate 11 is provided with PIN pin holes 103.

[0040] The upper mold assembly 3 comprises an upper mold plate 31 and an upper drive 32, which is a telescopic cylinder. A heating plate 33 is stacked on top of the upper mold plate 31. This brass plate houses a heating rod, which conducts heat to the lower mold plate 31. The upper drive 32 drives the heating plate 33 and the upper mold plate 31 upward and downward, pressing the material and adhesive together.

[0041] A heat-insulating top plate 34 is installed between the heating plate 33 and the driving end of the top upper driving member 32, and heat-insulating side plates 35 are provided on both sides of the heat-insulating top plate 34 to prevent heat conduction from damaging other components of the equipment.

[0042] For details, refer to the attached Figure 6 The upper mold plate 31 is equipped with a pressing block 301 and a guide sleeve 302. The guide sleeve 302 is longer than the pressing block 301, and the PIN hole 103 has space reserved for the guide sleeve 302 to be inserted. The PIN pin 102 and the guide sleeve 302 are positioned correspondingly. When the upper mold is pressed together, the guide sleeve 302 first contacts and docks with the PIN pin 102, and the pressing block 301 then presses against the adhesive block on the material.

[0043] The pressing pads 301 are configured as silicone blocks, and the distribution of the pressing pads 301 is the same as the distribution of the adhesive on the flexible board material sheet, with the silicone blocks facing the pressed adhesive.

[0044] Since the guide sleeve 302 and the PIN needle 102 cooperate with each other for guiding and orientation, after the material is loaded and positioned, no pre-pressing is required, and the material can be unloaded directly by transferring and pressing. There is no need for pre-pressing and lifting and pulling the PIN needle 102, which saves operation time and improves work efficiency.

[0045] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they are not intended to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A flexible board gluing and pressing device, characterized in that: include: The invention comprises a jig assembly (1) and a workbench (2); the workbench (2) is divided into a pressing area (21) and a material transfer area (22); the jig assembly (1) is transferred between the pressing area (21) and the material transfer area (22) by a transfer mechanism (4); materials are loaded and unloaded in the material transfer area (22); and the adhesive backing and the material are positively pressed in the pressing area (21) by an upper mold assembly (3); The upper mold assembly (3) comprises an upper mold plate (31) and an upper driving member (32). A heating plate (33) is stacked on top of the upper mold plate (31). The upper driving member (32) drives the heating plate (33) and the upper mold plate (31) to rise and fall so as to heat-press the material and the adhesive.

2. The flexible board gluing and pressing device according to claim 1, characterized in that: The jig assembly (1) comprises a jig plate (11), a plurality of positioning grooves (101) and PIN pins (102) are distributed on the top surface of the jig plate (11), and the PIN pins are arranged around the periphery of the positioning grooves (101); A pressing pad (301) and a guide sleeve (302) are provided on the upper mold plate (31), and the length of the guide sleeve (302) is greater than the thickness of the pressing pad (301); the PIN pin and the guide sleeve (302) correspond in position, and when the upper mold is pressed together, the guide sleeve (302) first touches the PIN pin and docks, and the pressing pad (301) then presses the adhesive block on the material.

3. The flexible board gluing and pressing device according to claim 2, characterized in that: A heat-insulating top plate (34) is installed between the heating plate (33) and the driving end of the upper driving member (32) at the top, and heat-insulating side plates (35) are provided on both sides of the heat-insulating top plate (34).

4. The flexible board gluing and pressing device according to claim 2, characterized in that: The jig plate (11) is supported by a carrier plate (12), and the carrier plate (12) is mounted on the transfer mechanism (4) via an assembly plate (13); The PIN needle (102) is fixedly mounted on the carrier plate (12), a PIN needle hole (103) is provided on the fixture plate (11), and a cavity space is reserved in the PIN needle hole for inserting the guide sleeve (302).

5. The flexible board gluing and pressing device according to claim 1, characterized in that: The heating plate (33) is made of a brass plate, and heating rods are installed at intervals inside.

6. The flexible board gluing and pressing device according to claim 1, characterized in that: The transfer mechanism (4) adopts a linear module.

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