Full-automatic flexible circuit board fitting system

Abstract

The utility model relates to the technical field of flexible circuit board manufacturing equipment, in particular to a full-automatic flexible circuit board laminating system, which is characterized in that a first rack is sequentially provided with an upper-layer roll material unreeling shaft, a deviation rectifying mechanism, a stripping mechanism, a first label chasing mechanism and a first cutting mechanism along the X-axis direction; a laminating table is arranged at the end, away from the first rack, of the second rack, a material receiving table in butt joint with the first cutting mechanism is arranged at the end, close to the first rack, of the second rack, a lower-layer roll material feeding shaft is arranged on one side of the laminating table, a material pulling roller is arranged on the other side of the laminating table, and a portal frame is further arranged on the second rack. The portal frame is erected to the two ends of the second rack, the two sides of the portal frame are each provided with an adsorption attaching assembly and a transverse moving module, a first moving assembly is arranged below the material receiving table, and a cut upper circuit layer film can be conveyed to the position below the adsorption attaching assemblies. The utility model aims to realize efficient and accurate lamination of the flexible circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit board manufacturing equipment, in particular to a full-automatic flexible circuit board laminating system. Background Art

[0002] With the continuous development of electronic technology, flexible circuit boards have been widely used in keyboards and control panels due to their advantages of being thin, bendable, and foldable. In the manufacturing process of flexible circuit boards, accurately laminating the upper circuit layer film and the lower circuit layer film is one of the key steps. The traditional manual lamination method is not only inefficient, but also prone to problems such as misalignment, bubbles, and wrinkles, which affect the quality and reliability of the product. Therefore, there is an urgent need to develop a fully automatic flexible circuit board lamination system to achieve an efficient and accurate lamination process. Utility Model Content

[0003] In order to solve the problems in the above background technology, the utility model provides a fully automatic flexible circuit board bonding system.

[0004] The solution adopted by the present invention to solve its technical problems is: a fully automatic flexible circuit board bonding system, including a first frame and a second frame, the first frame is sequentially provided with an upper coil unwinding shaft for conveying an upper circuit layer film to be bonded, a correction mechanism for adjusting the position of the upper circuit layer film, a peeling mechanism for peeling off the conductive adhesive release paper on the upper circuit layer film, a first tracking mechanism for identifying the positioning mark of the upper circuit layer film, and a first cutting mechanism for cutting the upper circuit layer film according to the tracking information; the second frame extends along the Z axis direction and docks with the tail end of the first frame, and a bonding platform is provided on one end of the second frame away from the first frame along the X axis direction, which is close to A material receiving table docking with the first cutting mechanism is provided at one end of the first frame, a lower layer roll material loading shaft is provided on one side of the laminating table, and a pulling roller for pulling the lower circuit layer film and spreading it flat on the laminating table is provided on the other side. A gantry is also provided on the second frame, and the gantry is erected to both ends of the second frame, and both sides of the gantry are provided with adsorption laminating components for laminating the cut upper circuit layer film to the lower circuit layer film and a transverse movement module for driving the adsorption laminating component to move along the length direction of the gantry. A first moving component for driving it to move along the X-axis direction of the end face of the second frame is provided below the material receiving table, which can transport the cut upper circuit layer film to the bottom of each adsorption laminating component.

[0005] By adopting the above-mentioned technical solution, the upper circuit board film contained within the upper coil unwinding shaft on the first frame is transported to the end face of the frame. The film's position is then detected and adjusted in real time by a deflection correction mechanism to ensure accurate lateral and longitudinal positioning during transport. The conductive adhesive release paper on the upper circuit board film is then peeled off by a peeling mechanism, exposing its conductive adhesive layer. The film is then transported to the first tracking mechanism, which identifies the preset positioning marks on the film and transmits the position information to the cutting mechanism, enabling efficient and accurate cutting. A laminating table is provided at one end of the second frame, flanked by lower coil loading rollers and pull rollers, which flatten the film onto the end face of the laminating table. A splicing table is provided at the other end, which transports the cut upper circuit layer film to the bottom of the adsorption laminating assembly. Driven by a transverse movement module, it moves to the laminating table, where the upper circuit board film is bonded to the lower circuit board, completing the automatic bonding process.

[0006] Furthermore, the first tracking mechanism includes support rods connecting both sides of the first frame, a second moving component arranged on both sides of the first frame for driving the support rods to move along the X-axis direction, a sensor arranged on the support rods for identifying positioning marks, and a third moving component arranged on the top of the support rods for driving the sensor to move along the Z-axis direction. A pressure roller is also provided at the tail end of the first tracking mechanism.

[0007] By adopting the above technical solution, the second moving component and the third moving component can drive the sensor to move along the X-axis and Z-axis directions, ensuring that the sensor can accurately identify positioning marks in multiple dimensions.

[0008] Furthermore, the first cutting mechanism is adjacent to the tail end of the first label tracking mechanism, and the first cutting mechanism is provided with a lower cutter on the end surface of the first frame, a support frame mounted on both sides of the first frame, an upper cutter movably arranged under the support frame, and several pushing cylinders arranged on the top of the support frame and connected to the upper cutter for driving the upper cutter to move downward for cutting.

[0009] By adopting this technical solution, the control system triggers the push cylinder based on the positioning information provided by the first tracking mechanism, rapidly driving the upper cutter downward. The upper and lower cutters work together to precisely cut the film, ensuring a neat and consistent cut edge.

[0010] Furthermore, a first pulling mechanism for increasing the tension of the upper circuit layer film during transmission is also provided at the front end of the first tracking mechanism. The first pulling mechanism includes a bracket provided on the end face of the first frame, a transmission roller group arranged on the top of the bracket, and a tension roller that can be raised and lowered on the bracket.

[0011] By adopting the above technical solution, the liftable tension roller can adjust the tension of the film as needed to ensure that the film is in a tensioned state during the transmission process.

[0012] Furthermore, the adsorption and bonding component includes a supporting base fixed on the transverse movement module, a Y-axis drive motor fixed on the supporting base, a Y-axis screw rod transmission connected to the Y-axis drive motor, a Y-axis nut seat threadedly connected to the Y-axis screw rod, two Y-axis slide rails parallel to both sides of the Y-axis screw rod, a Y-axis slider slidably installed on the Y-axis slide rails, a lifting plate fixedly connected to the Y-axis nut seat and the two Y-axis sliders, and a vacuum suction head installed on the lifting plate.

[0013] By adopting the above technical solution, the Y-axis drive motor drives the Y-axis screw to rotate, and then the Y-axis nut seat moves linearly along the Y-axis screw, so that the Y-axis sliders on both sides of the lifting plate move up and down along the Y-axis slide rails on both sides to drive the vacuum suction head to rise and fall.

[0014] Furthermore, it also includes a cutting table connected to the bonding table for cutting the bonded flexible circuit board into finished products, and the cutting table is sequentially provided with a second pulling mechanism, a second label tracking mechanism and a second cutting mechanism.

[0015] In summary, the beneficial effects of the present invention are as follows: the fully automatic flexible circuit board laminating system provided by the present invention includes a first frame and a second frame; wherein the upper circuit board film in the upper coil unwinding shaft on the first frame can be conveyed to the end face of the frame, and the position of the film layer is detected and adjusted in real time by the correction mechanism. Then, the conductive adhesive release paper on the upper circuit board film can be peeled off by the peeling mechanism to expose its conductive adhesive layer. The film is then conveyed to the first tracking mechanism, which can identify the preset positioning marks on the film layer and transmit the position information to the cutting mechanism to achieve efficient and accurate cutting. A laminating table is set at one end of the second frame, and the lower coil feeding roller and the pulling roller are respectively provided on both sides, which can flatten the lower circuit layer film onto the surface of the laminating table. At the other end of the second frame, a receiving table is provided for receiving the cut upper circuit layer film from the first frame and conveying it to the bottom of the adsorption laminating component. Driven by a transverse movement module, the cut upper circuit layer films are precisely moved to the lamination table, ultimately accurately laminating the upper circuit board film to the lower circuit board, completing the entire automatic lamination process. The entire system automates the entire process, from unwinding, deflection correction, peeling, cutting, to automatic lamination with the lower circuit layer film, significantly improving production efficiency and reducing labor costs.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of this embodiment;

[0018] Figure 2 Schematic diagram of the first material pulling mechanism and the first label tracking mechanism of this embodiment;

[0019] Figure 3 is a schematic diagram of the first cutting mechanism of this embodiment;

[0020] Figure 4 is a schematic diagram of the second rack of this embodiment;

[0021] Figure 5 It is a partially enlarged schematic diagram of the adsorption and lamination component of this embodiment.

[0022] In the figure: 1. First frame; 11. Upper coil unwinding shaft; 12. Correction mechanism; 13. Peeling mechanism; 14. First tracking mechanism; 141. Support rod; 142. Second moving assembly; 143. Sensor; 144. Third moving assembly; 145. Pressing roller; 15. First cutting mechanism; 151. Lower cutter; 152. Support frame; 153. Upper cutter; 154. Push cylinder; 2. Second frame; 21. Laminating table; 22. Material receiving table; 221. First moving assembly; 23. Lower layer coil loading shaft; 24, pulling roller; 25, gantry; 3, adsorption and laminating component; 31, bearing seat; 32, Y-axis drive motor; 33, Y-axis screw; 34, Y-axis nut seat; 35, Y-axis slide rail; 36, Y-axis slider; 37, vacuum suction head; 38, lifting plate; 4, transverse movement module; 5, first pulling mechanism; 51, bracket; 52, transmission roller group; 53, tension roller; 6, cutting table; 61, second pulling mechanism; 62, second tracking mechanism; 63, second cutting mechanism. DETAILED DESCRIPTION

[0023] In order to make the content of the present invention more clearly understood, the present invention will be further described below based on specific embodiments in conjunction with the accompanying drawings.

[0024] It should be noted that the terms "center," "upper," "lower," "front," "back," "left," "right," "inner," and "outer" used herein to indicate positions or locations are based on the positions or locations shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Unless otherwise specified, "plurality" means two or more.

[0025] Unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0026] like Figures 1 to 5 As shown, a fully automatic flexible circuit board bonding system, wherein this embodiment includes a first frame 1 and a second frame 2, the first frame 1 is sequentially provided with an upper roll unwinding shaft 11 for conveying an upper circuit layer film to be bonded, a correction mechanism 12 for adjusting the position of the upper circuit layer film, a peeling mechanism 13 for peeling off the conductive adhesive release paper on the upper circuit layer film, a first tracking mechanism 14 for identifying the positioning mark of the upper circuit layer film, and a first cutting mechanism 15 for cutting the upper circuit layer film according to the tracking information; and the second frame 2 extends along the Z axis direction and docks with the tail end of the first frame 1; a bonding table 21 is provided on the end of the second frame 2 away from the first frame 1 along the X axis direction, which is close to the end of the first frame 1 A material receiving table 22 is provided on the top for docking with the first cutting mechanism 15, a lower layer roll material loading shaft 23 is provided on one side of the laminating table 21, and a pulling roller 24 for pulling the lower circuit layer film and spreading it flat on the laminating table 21 is provided on the other side. A gantry 25 is also provided on the second frame 2, and the gantry 25 is erected to both ends of the second frame 2. Both sides thereof are provided with adsorption laminating components 3 for laminating the cut upper circuit layer film to the lower circuit layer film and a transverse movement module 4 for driving the adsorption laminating component 3 to move along the length direction of the gantry 25. A first moving component 221 for driving it to move along the X-axis direction of the end face of the second frame 2 is provided below the material receiving table 22, which can transport the cut upper circuit layer film to the bottom of each adsorption laminating component 3.

[0027] This embodiment includes a first rack 1 and a second rack 2 connected to the rear end thereof, wherein the first rack 1 is referenced to Figure 1In the X-axis direction, the upper coil unwinding shaft 11, the correction mechanism 12, the peeling mechanism 13, the first tracking mechanism 14 and the first cutting mechanism 15 are arranged in sequence from left to right, and a conveying roller is arranged between each mechanism. The upper coil unwinding shaft 11 is rolled with the upper circuit board film, which is pulled to the end face of the frame by the air-inflated shaft on the frame, and then corrected by the correction mechanism 12. It can detect and adjust the position of the film layer in real time to ensure that its horizontal and vertical positions during the conveying process are accurate. Then, the peeling mechanism 13 with a reel and a blowing and suction component peels off the release paper with conductive glue on the upper circuit board film, exposing the conductive glue layer, completing the preparatory work. It is then conveyed to the first tracking mechanism 14. Due to the preset positioning marks (such as hole positions, alignment lines, etc.) on the film layer, the tracking mechanism can automatically identify these positioning marks through an optical sensor 143 or other detection equipment. The tracking system is usually integrated with the automatic control system to transmit the identified mark position information to the cutting mechanism to achieve efficient and accurate cutting. During this process, the adjustment roller on the frame will also fine-tune the film layer to ensure the flatness and stability of the film during transmission, further reduce the alignment deviation caused by mechanical errors, and thus improve the accuracy of subsequent cutting. The second frame 2 is divided into two end faces, of which a receiving table 22 is provided on the end face close to the first frame 1, and a bonding table 21 is provided on the end face away from the first frame 1, both of which are arranged along the X-axis direction. Specifically, a lower layer coil feeding roller is provided on the right side of the bonding table 21, with the lower circuit layer film rolled inside, and a pulling roller 24 is provided on the left side, which can cooperate with the feeding roller to spread the film layer flat to the end face of the bonding table 21. The end face of the bonding table 21 is also arranged with an array of adsorption holes and an adsorption component inside, which can adsorb and fix the lower circuit layer film. A gantry 25 is further provided, with its two end legs fixed to the sides in the middle of the two end faces. A transverse movement module 4 is provided on both sides of the gantry 25. The transverse movement module 4 is composed of a linear guide and a linear motor. A suction laminating assembly 3 is fixed to each transverse movement module 4. The transverse movement module 4 can be controlled by a control system to drive the suction laminating assembly 3 to move along the Z-axis. A first moving assembly 221 is provided below the material receiving platform 22. This comprises linear guides and a linear motor on both sides of the frame end face. This can drive the material receiving platform 22 to move along the X-axis on the end face of the second frame 2, automatically transporting the cut upper circuit layer film to the bottom of the suction laminating assembly 3, where it is driven by the transverse movement module 4 to be attached to the lower circuit layer film.

[0028] like Figure 1 and Figure 2As shown, the first tracking mechanism 14 of this embodiment includes a support rod 141 connecting the two sides of the first frame 1, a second moving assembly 142 provided on both sides of the first frame 1 for driving the support rod 141 to move along the X-axis direction, a sensor 143 provided on the support rod 141 for identifying the positioning mark, and a third moving assembly 144 arranged on the top of the support rod 141 for driving the sensor 143 to move along the Z-axis direction. A pressure roller 145 is also provided at the tail end of the first tracking mechanism 14. Specifically, the second moving assembly 142 and the third moving assembly 144 have the same structure as the first moving assembly 221 described above, and can drive the fixed optical sensor 143 above the support rod 141 to move along the X-axis and Z-axis directions, ensuring that the sensor 143 can accurately identify the positioning mark in multiple dimensions, thereby improving the accuracy of positioning. The pressure roller 145 provided at the tail end can ensure the flatness of the film when identifying the mark, reducing the recognition error caused by the undulation of the film.

[0029] like Figure 1 and Figure 3 As shown, the first cutting mechanism 15 of this embodiment is located adjacent to the tail end of the first label tracking mechanism 14. The first cutting mechanism 15 comprises a lower cutter 151 on the end face of the first frame 1, support frames 152 mounted on both sides of the first frame 1, an upper cutter 153 movably mounted below the support frames 152, and a plurality of push cylinders 154 located at the top of the support frames 152 and connected to the upper cutter 153 for driving the upper cutter 153 downward for cutting. The first cutting mechanism 15 is located adjacent to the tail end of the first label tracking mechanism 14, ensuring that the film is precisely positioned before cutting. The lower cutter 151 is fixed to the end face of the first frame 1, while the upper cutter 153 is movably mounted below the support frames 152, initially maintaining a certain distance from the lower cutter 151. Two push cylinders 154 are provided, one located at the top of the support frames 152 and connected to the upper cutter 153, to drive the upper cutter 153 downward for cutting. Based on the positioning information provided by the first tracking mechanism 14, the control system triggers the push cylinder 154, rapidly driving the upper cutter 153 downward. The upper cutter 153 cooperates with the lower cutter 151 to precisely cut the film, ensuring a neat and consistent cut edge. After cutting is complete, the push cylinder 154 resets the upper cutter 153, preparing for the next cut.

[0030] like Figure 2 As shown, the front end of the first tracking mechanism 14 of this embodiment is also provided with a first pulling mechanism 5 for increasing the tension of the upper circuit layer film during transport. The first pulling mechanism 5 includes a bracket 51 disposed on the end surface of the first frame 1, a transmission roller group 52 arranged on the top of the bracket 51, and a tension roller 53 that can be raised and lowered on the bracket 51. The first pulling mechanism 5 increases the tension of the upper circuit layer film during transport via the tension roller 53, ensuring the flatness and stability of the film during transport and reducing alignment errors caused by slack or wrinkles.

[0031] like Figure 4 as well as Figure 5 As shown, the adsorption and laminating assembly 3 of this embodiment includes a supporting base 31 fixed on the traverse module 4, a Y-axis drive motor 32 fixed on the supporting base 31, a Y-axis screw 33 drivingly connected to the Y-axis drive motor 32, a Y-axis nut seat 34 threadedly connected to the Y-axis screw 33, two Y-axis slide rails 35 arranged parallel to both sides of the Y-axis screw 33, a Y-axis slider 36 slidably mounted on the Y-axis slide rails 35, a lifting plate 38 fixedly connected to the Y-axis nut seat 34 and the two Y-axis sliders 36, and a vacuum suction head 37 mounted on the lifting plate 38. The control system sends a command to the Y-axis drive motor 32, driving the Y-axis screw 33 to rotate, thereby linearly moving the Y-axis nut seat 34 along the Y-axis screw 33, driving the Y-axis sliders 36 on both sides of the lifting plate 38 to move up and down along the Y-axis slide rails 35 on both sides, thereby driving the vacuum suction head 37 to rise and fall for lamination.

[0032] In another embodiment, Figure 1 As shown, the cutting station 6 is also included, which is docked with the laminating station 21 and is used to cut the laminated flexible circuit board into finished products. The cutting station 6 is sequentially equipped with a second material pulling mechanism 61, a second label tracking mechanism 62, and a second cutting mechanism 63. The cutting station 6 is arranged parallel to the side of the first frame 1. The second material pulling mechanism 61, the second label tracking mechanism 62, and the second cutting mechanism 63 sequentially arranged on the end surface are all structurally consistent with the first material pulling mechanism 5, the first label tracking mechanism 14, and the first cutting mechanism 15 described above. The laminated flexible circuit board can be cut into the required specifications to meet customer needs.

[0033] In summary, the beneficial effects of this embodiment are as follows: This embodiment comprises a first frame 1 and a second frame 2; the first frame 1 is sequentially provided with an upper coil unwinding shaft 11, a deflection correction mechanism 12, a peeling mechanism 13, a first tracking mechanism 14, and a first cutting mechanism 15. The upper coil unwinding shaft 11 conveys the upper circuit board film within to the end face of the frame. The deflection correction mechanism 12 then monitors and adjusts the film's position in real time, ensuring accurate lateral and longitudinal positioning during transport. The peeling mechanism 13 then peels the conductive adhesive release paper from the upper circuit board film, exposing the conductive adhesive layer. The film is then conveyed forward to the first tracking mechanism 14, which identifies the pre-set positioning marks on the film and transmits this positional information to the cutting mechanism, thereby achieving efficient and accurate cutting. A laminating table 21 is provided at one end of the second frame 2, flanked by a lower coil loading roller and a pull roller 24, respectively, which spread the lower circuit layer film flat onto the surface of the laminating table 21. At the other end of the second frame 2, a receiving table 22 is provided for receiving the cut upper circuit layer film from the first frame 1 and conveying it to the bottom of the adsorption laminating assembly 3. Driven by the transverse movement module 4, the cut upper circuit layer film can be accurately moved to the laminating table 21, and finally the upper circuit board film is accurately laminated to the lower circuit board, completing the entire automatic laminating process.

[0034] The embodiments described above are only preferred implementation methods of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and modifications made by technicians in this field on the basis of the utility model shall fall within the scope of protection of the present invention.

Claims

1. A fully automatic flexible circuit board lamination system, characterized in that: The first frame comprises a first frame and a second frame, wherein the first frame is provided with an upper coil unwinding shaft for conveying an upper circuit layer film to be laminated, a correction mechanism for adjusting the position of the upper circuit layer film, a peeling mechanism for peeling off the conductive adhesive release paper on the upper circuit layer film, a first tracking mechanism for identifying a positioning mark on the upper circuit layer film, and a first cutting mechanism for cutting the upper circuit layer film according to the tracking information. The second frame extends along the Z-axis direction and docks with the tail end of the first frame. A laminating table is provided on one end of the second frame away from the first frame along the X-axis direction, and a receiving table docking with the first cutting mechanism is provided on one end of the second frame close to the first frame. A lower layer roll loading shaft is provided on one side of the laminating table, and a pulling roller for pulling the lower circuit layer film and spreading it flat on the laminating table is provided on the other side. A gantry is also provided on the second frame, and the gantry is erected to both ends of the second frame. Both sides of the gantry are provided with adsorption laminating components for laminating the cut upper circuit layer film to the lower circuit layer film and a transverse movement module for driving the adsorption laminating component to move along the length direction of the gantry. A first moving component for driving it to move along the X-axis direction of the end face of the second frame is provided below the receiving table, which can transport the cut upper circuit layer film to the bottom of each adsorption laminating component.

2. The fully automatic flexible circuit board bonding system according to claim 1, characterized in that: The first tracking mechanism includes support rods connecting the two sides of the first frame, a second moving component arranged on both sides of the first frame for driving the support rods to move along the X-axis direction, a sensor arranged on the support rods for identifying positioning marks, and a third moving component arranged on the top of the support rods for driving the sensor to move along the Z-axis direction. A pressure roller is also provided at the tail end of the first tracking mechanism.

3. The fully automatic flexible circuit board bonding system according to claim 1, characterized in that: The first cutting mechanism is adjacent to the tail end of the first label tracking mechanism. The first cutting mechanism is provided with a lower cutter on the end surface of the first frame, a support frame mounted on both sides of the first frame, an upper cutter movably arranged under the support frame, and several pushing cylinders arranged on the top of the support frame and connected to the upper cutter for driving the upper cutter to move downward for cutting.

4. The fully automatic flexible circuit board bonding system according to claim 1, characterized in that: The front end of the first tracking mechanism is also provided with a first pulling mechanism for increasing the tension of the upper circuit layer film during transmission. The first pulling mechanism includes a bracket arranged on the end face of the first frame, a transmission roller group arranged on the top of the bracket, and a tension roller that can be raised and lowered on the bracket.

5. The fully automatic flexible circuit board bonding system according to claim 1, characterized in that: The adsorption and bonding component includes a supporting base fixed on the transverse movement module, a Y-axis drive motor fixed on the supporting base, a Y-axis screw rod transmission connected to the Y-axis drive motor, a Y-axis nut seat threadedly connected to the Y-axis screw rod, two Y-axis slide rails parallel to both sides of the Y-axis screw rod, a Y-axis slider slidably installed on the Y-axis slide rails, a lifting plate fixedly connected to the Y-axis nut seat and the two Y-axis sliders, and a vacuum suction head installed on the lifting plate.

6. The fully automatic flexible circuit board lamination system according to claim 1, characterized in that: It also includes a cutting table connected to the bonding table for cutting the bonded flexible circuit board into finished products, and the cutting table is sequentially provided with a second material pulling mechanism, a second label tracking mechanism and a second cutting mechanism.

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