Heat dissipation device of magnetic resonance imaging system and magnetic resonance imaging system
By designing multiple series heat dissipation units and control circuits in the magnetic resonance imaging system, the problem of insufficient stroke pressure in the existing system is solved, and more efficient heat dissipation and noise control is achieved, improving image quality and patient comfort.
Patent Information
- Application Number
- CN202422118658.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-08-19
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In the existing thermal dissipation system of magnetic resonance imaging systems, the fan provides insufficient air pressure and air flow, which cannot effectively cool components and patients, affecting image quality and may cause harm to patients.
A heat dissipation device including multiple series heat dissipation units is designed. Using a shielding housing and a shielding member, the opening and closing of the heat dissipation unit is flexibly controlled through a control circuit, and combined with a capacitor filter to shield radio frequency noise, providing better heat dissipation effect and noise control.
Achieve more efficient heat dissipation effect, avoid the influence of air duct resistance, provide sufficient wind pressure and wind speed, ensure image quality, improve patient comfort, and reduce radio frequency noise interference.
Smart Images

Figure CN223246912U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of medical imaging, in particular to a heat dissipation device of a magnetic resonance imaging system and a magnetic resonance imaging system. Background Art
[0002] In order to better explore the patient's lesion site, magnetic resonance imaging (MRI) systems are widely used in clinical medicine. Many components of the MRI system and the environment in which the patient is imaged have high temperature requirements. The heat generated by these components may cause image quality problems and may also cause harm to the patient. Therefore, the MRI system usually has a heat dissipation system to cool its heat-generating components or environment. In addition, the heat dissipation system can also be used to deliver fresh air to the patient in the scanning chamber to improve the patient's comfort. At present, when air is used as a cooling medium, the air duct in the heat dissipation system will cause excessive wind resistance. The wind pressure that can be provided by a single fan in the existing heat dissipation system is limited, and it cannot provide sufficient air flow for component cooling or patient cooling and breathing. Utility Model Content
[0003] In order to overcome the above-mentioned defects of the prior art, embodiments of the present invention provide a heat dissipation device for a magnetic resonance imaging system and a magnetic resonance imaging system.
[0004] The utility model provides a heat dissipation device for a magnetic resonance imaging system, comprising:
[0005] Multiple cooling units;
[0006] The shielding shell is provided with an inlet, an outlet and an internal space for accommodating the plurality of heat dissipation units, and the cooling medium entering from the inlet flows through each of the plurality of heat dissipation units in sequence and then flows out from the outlet.
[0007] Furthermore, the heat dissipation unit includes a fan, and the cooling medium includes air.
[0008] Furthermore, two adjacent heat dissipation units among the plurality of heat dissipation units are connected via an adapter.
[0009] Furthermore, the multiple heat dissipation units have the same size, capacity and wind pressure.
[0010] Furthermore, at least two of the plurality of heat dissipation units are different in at least one of size, capacity, and wind pressure.
[0011] Furthermore, the size and capacity of the heat dissipation unit close to the inlet are larger than the size and capacity of the heat dissipation unit close to the outlet.
[0012] Furthermore, the wind pressure of the heat dissipation unit close to the inlet is smaller than the wind pressure of the heat dissipation unit close to the outlet.
[0013] Furthermore, a first shielding member is provided between the inlet and the multiple heat dissipation units, and a second shielding member is provided between the outlet and the multiple heat dissipation units. The first shielding member and the second shielding member respectively include multiple through holes connected to the internal space, and the multiple through holes are evenly arranged to form a honeycomb shape.
[0014] Furthermore, a filter for filtering out impurities in the cooling medium is provided between the first shielding member and the inlet.
[0015] Furthermore, the heat dissipation device further includes:
[0016] A control circuit is connected to the plurality of heat dissipation units and is used to control the opening or closing of the plurality of heat dissipation units respectively.
[0017] Furthermore, the control circuit controls the opening or closing of the plurality of heat dissipation units according to the detected temperature of the object to be cooled.
[0018] Furthermore, the heat dissipation device further includes: a capacitive filter provided on the shielding shell, for preventing radio frequency noise generated by the heat dissipation unit from entering outside the shielding shell.
[0019] Furthermore, the capacitive filter is connected in series with a power line or a control line outside the shielding shell.
[0020] The utility model provides a magnetic resonance imaging system, comprising one or more heat dissipation devices as described in the previous aspect.
[0021] The technical solution of the present invention has the following significant beneficial effects: by arranging a plurality of heat dissipation units in series on the cooling medium flow path, a better and more flexible heat dissipation effect can be provided. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0023] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present invention in any way. Furthermore, the shapes and proportional dimensions of the components in the drawings are for illustrative purposes only and are intended to facilitate understanding of the present invention. They are not intended to limit the shapes and proportional dimensions of the components of the present invention. Those skilled in the art, guided by the present invention, may select various possible shapes and proportional dimensions to implement the present invention, depending on the specific circumstances.
[0024] Figure 1 is a schematic diagram of a magnetic resonance imaging system in an embodiment of the present application;
[0025] Figure 2 is a schematic diagram of a heat dissipation device in an embodiment of the present application;
[0026] Figure 3 is a schematic diagram of a control circuit in an embodiment of the present application;
[0027] Figure 4 is a schematic diagram of a control circuit in an embodiment of the present application;
[0028] Figure 5 is a schematic diagram of a magnetic resonance imaging system in an embodiment of the present application;
[0029] Figure 6 is a schematic diagram of a first shielding member and a second shielding member according to an embodiment of the present application;
[0030] Figure 7 Schematic diagram of a heat dissipation device according to an embodiment of the present application. DETAILED DESCRIPTION
[0031] The foregoing and other features of the embodiments of the present application will become apparent through the following description with reference to the accompanying drawings. In the description and drawings, specific embodiments of the present application are disclosed in detail, which illustrate some embodiments in which the principles of the embodiments of the present application can be adopted. It should be understood that the present application is not limited to the described embodiments. On the contrary, the embodiments of the present application include all modifications, variations and equivalents that fall within the scope of the appended claims.
[0032] In the embodiments of the present application, the terms "first", "second", etc. are used to distinguish different elements from the name, but do not indicate the spatial arrangement or temporal order of these elements, and these elements should not be limited by these terms. The term "and / or" includes any one and all combinations of one or more of the associated listed terms. The terms "comprising", "including", "having", etc. refer to the presence of the stated features, elements, components or components, but do not exclude the presence or addition of one or more other features, elements, components or components.
[0033] In the embodiments of this application, the singular forms "a," "the," etc. include plural forms and should be broadly understood to mean "a" or "a type" rather than being limited to "one." Furthermore, the term "said" should be understood to include both singular and plural forms, unless the context clearly indicates otherwise. Furthermore, the term "according to" should be understood to mean "at least in part based on...", and the term "based on" should be understood to mean "at least in part based on...", unless the context clearly indicates otherwise.
[0034] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments. The term "include / comprise" as used herein refers to the presence of a feature, an integral part, a step, or a component, but does not exclude the presence or addition of one or more other features, integral parts, steps, or components.
[0035] For ease of understanding, Figure 1 A magnetic resonance imaging (MRI) system 100 according to some embodiments of the present invention is shown.
[0036] The MRI system 100 includes a scanning unit 111. The scanning unit 111 is used to perform magnetic resonance scanning on an object (eg, a human body) 170 to generate a reconstructed image of a region of interest of the object 170. The region of interest may be a predetermined anatomical part or anatomical tissue.
[0037] The operation of the MRI system 100 is controlled by an operator workstation 110, which includes an input device 114, a control panel 116, and a display 118. The input device 114 may be a joystick, keyboard, mouse, trackball, touch-activated screen, voice control, or any similar or equivalent input device. The control panel 116 may include a keyboard, touch-activated screen, voice control, buttons, sliders, or any similar or equivalent control device. The operator workstation 110 is coupled to and in communication with a computer system 120, which enables an operator to control the generation and viewing of images on the display 118. The computer system 120 includes multiple components that communicate with each other via electrical and / or data connections 122. The connections 122 may be direct wired connections, fiber optic connections, wireless communication links, etc. The computer system 120 may include a central processing unit (CPU) 124, memory 126, and an image processor 128. In some embodiments, the image processor 128 may be replaced by image processing functionality implemented in the CPU 124. The computer system 120 may be connected to an archival media device, permanent or backup storage, or a network.The computer system 120 may be coupled to and in communication with a separate MRI system controller 130.
[0038] The MRI system controller 130 includes a set of components that communicate with each other via an electrical and / or data connection module 132. The connection module 132 can be a direct wired connection, a fiber optic connection, a wireless communication link, etc. The MRI system controller 130 can include a CPU 131, a sequence pulse generator 133 that communicates with the operator workstation 110, a transceiver (or RF transceiver) 135, a memory 137, and an array processor 139. In some embodiments, the sequence pulse generator 133 can be integrated into the resonance assembly 140 of the scanning unit 111 of the MRI system 100. The MRI system controller 130 can receive commands from the operator workstation 110 and is coupled to the scanning unit 111 to indicate the MRI scan sequence to be performed during an MRI scan, thereby controlling the scanning unit 111 to perform the aforementioned magnetic resonance scan process. The MRI system controller 130 is also coupled to and communicates with a gradient drive system 150, which is coupled to the gradient coil assembly 142 to generate magnetic field gradients during an MRI scan.
[0039] The sequence pulse generator 133 may also receive data from a physiological acquisition controller 155, which receives signals from a plurality of different sensors (such as electrocardiogram (ECG) signals from electrodes attached to the patient) connected to a subject or patient 170 undergoing an MRI scan. The sequence pulse generator 133 is coupled to and in communication with a scan room interface system 145, which receives signals from the various sensors associated with the state of the resonance assembly 140. The scan room interface system 145 is also coupled to and in communication with a patient positioning system 147, which sends and receives signals to control the movement of the patient table to the desired position for the MRI scan.
[0040] The MRI system controller 130 provides gradient waveforms to the gradient driver system 150, which includes G x (x direction), G y (y direction) and G z (z direction) amplifier, etc. Each G x , G y and G zThe gradient amplifiers each energize a corresponding gradient coil 141 in a gradient coil assembly 142 to generate magnetic field gradients for spatially encoding MR signals during an MRI scan. The gradient coil assembly 142 is disposed within a resonance assembly 140, which also includes a superconducting magnet having superconducting coils 144 that, during operation, provide a static, uniform longitudinal magnetic field B0 throughout a cylindrical imaging volume 146. The resonance assembly 140 also includes an RF body coil 148 that, during operation, provides a transverse magnetic field B1 that is substantially perpendicular to B0 throughout the cylindrical imaging volume 146. The resonance assembly 140 may also include an RF surface coil 149 for imaging various anatomical structures of a patient undergoing an MRI scan. The RF body coil 148 and the RF surface coil 149 may be configured to operate in a transmit and receive mode, a transmit mode, or a receive mode.
[0041] The x direction can also be called the frequency encoding direction or the k direction in K space. x direction, the y direction can be called the phase encoding direction or the k direction in K space y Direction. x It can be used for frequency encoding or signal readout, and is usually called frequency encoding gradient or readout gradient. y Can be used for phase encoding, usually called phase encoding gradient. G z It can be used for slice (layer) position selection to obtain K-space data. It should be noted that the slice selection direction, phase encoding direction and frequency encoding direction can be modified according to actual needs.
[0042] An MRI scanned subject or patient 170 may be positioned within a cylindrical imaging volume 146 of the resonance assembly 140. A transceiver 135 in the MRI system controller 130 generates RF excitation pulses that are amplified by an RF amplifier 162 and provided to an RF body coil 148 via a transmit / receive switch (T / R switch) 164.
[0043] As described above, the RF body coil 148 and the RF surface coil 149 can be used to transmit RF excitation pulses and / or receive resulting MR signals from a patient undergoing an MRI scan. MR signals emitted by excited nuclei within the patient being scanned by the MRI can be sensed and received by the RF body coil 148 or the RF surface coil 149 and sent back to the preamplifier 166 via the T / R switch 164. The T / R switch 164 can be controlled by a signal from the sequence pulse generator 133 to electrically connect the RF amplifier 162 to the RF body coil 148 during a transmit mode and to connect the preamplifier 166 to the RF body coil 148 during a receive mode. The T / R switch 164 can also enable the RF surface coil 149 to be used in either a transmit mode or a receive mode.
[0044] In some embodiments, the MR signals sensed and received by the RF body coil 148 or the RF surface coil 149 and amplified by the preamplifier 166 are stored as a raw k-space data array in the memory 137 for post-processing. A reconstructed magnetic resonance image can be acquired by transforming / processing the stored raw k-space data.
[0045] In some embodiments, the MR signals sensed and received by the RF body coil 148 or the RF surface coil 149 and amplified by the preamplifier 166 are demodulated, filtered, and digitized in the receive portion of the transceiver 135 and transmitted to the memory 137 in the MRI system controller 130. For each image to be reconstructed, the data is rearranged into a separate k-space data array, and each of these separate k-space data arrays is input to the array processor 139, which is operated to Fourier transform the data into an array of reconstructed images.
[0046] The array processor 139 uses a transform method, most commonly a Fourier transform, to create images from the received MR signals. These images are transmitted to the computer system 120 and stored in the memory 126. In response to commands received from the operator workstation 110, the data used to reconstruct the image can be stored in long-term storage or can be further processed by the image processor 128 and transmitted to the operator workstation 110 for presentation on the display 118.
[0047] In various embodiments, components of computer system 120 and MRI system controller 130 may be implemented on the same computer system or on multiple computer systems. Figure 1 The MRI system 100 shown is for illustration purposes. Suitable MRI systems may include more, fewer, and / or different components.
[0048] The MRI system controller 130 and the image processor 128 may each or jointly include a computer processor and a storage medium, on which a program for predetermined data processing to be executed by the computer processor is recorded. For example, the storage medium may store a program for implementing scanning processing (e.g., scanning procedures, imaging sequences), image reconstruction, image processing, etc. For example, a program for implementing the magnetic resonance imaging method according to an embodiment of the present invention may be stored. The storage medium may include, for example, a ROM, a floppy disk, a hard disk, an optical disk, a magneto-optical disk, a CD-ROM, or a non-volatile memory card.
[0049] Figure 1The MRI system described above is merely an example; in other embodiments, the MRI system may have various variations. The heat dissipation device of this embodiment can be installed within the scanning chamber of the MRI system to dissipate heat from certain heat-generating components or the environment within the MRI system. For example, the heat dissipation device can dissipate heat from at least some components / modules / circuits within the RF body coil 148, the gradient coil 141, or the MRI system controller 130. Alternatively, the heat dissipation device can be used to dissipate heat to a patient within the scanning chamber and to deliver fresh air. This will be described below with reference to the following embodiments.
[0050] Figure 2 Schematic diagram of the heat dissipation device 200 according to an embodiment of the present application. Figure 2 As shown, the heat dissipation device 200 includes a plurality of (N, where N is an integer greater than 1) heat dissipation units 201-1, 201-2, ..., 201-N and a shielding housing 202. The shielding housing 202 has an inlet 2021, an outlet 2022, and an interior space 2023 for accommodating the plurality of heat dissipation units. The cooling medium entering through the inlet 2021 flows sequentially through each of the plurality of heat dissipation units 201-1, 201-2, ..., 201-N and then flows out through the outlet 2022.
[0051] In some embodiments, the cooling medium may be liquid or air, and the heat dissipation unit may be a fan, a compressor, a cooler, etc., but the present application is not limited thereto. The following description will take the cooling medium as air and the heat dissipation unit as a fan as an example.
[0052] In some embodiments, the fan serving as the heat dissipation unit can be an axial flow fan driven by direct current. These fans are compact, simple in structure, low in power consumption, high in air volume, rapid in heat dissipation, and low in noise. To utilize the heat dissipation device within the scanning room of an MRI system, a shielded housing can be used to enclose the multiple heat dissipation units. The shielded housing 202 shields the fan from radio frequency noise, thereby preventing it from affecting image quality.
[0053] In some embodiments, the shielding shell 202 is provided with an inlet 2021, an outlet 2022, and an internal space 2023. The inlet 2021 and the outlet 2022 are arranged opposite each other and can be openings formed on two opposite sides of the shielding shell 202. The shielding shell 202 can be square or other three-dimensional shapes, and the embodiments of the present application are not limited thereto.
[0054] In some embodiments, a plurality of heat dissipation units are sequentially arranged in the internal space 2023 in a front-to-back order, forming a row of multiple heat dissipation units that are "connected in series" in terms of physical structure, wherein "front" refers to a position closer to the inlet 2021 and "back" refers to a position closer to the outlet 2022. The fan disks serving as fans of the multiple heat dissipation units are opposed to each other and are also opposed to the inlet 2021 and the outlet 2022. The air drawn in from the inlet 2021 flows sequentially through each heat dissipation unit 201-1, 201-2, ..., 201-N in the multiple heat dissipation units. The air, after being accelerated and pressurized by each heat dissipation unit, flows out from the outlet 2022 to act on the object to be cooled, thereby realizing an "in and out" air flow path. By arranging multiple heat dissipation units in series on the air flow path, cooling air with sufficient wind pressure and wind speed can be provided, avoiding the influence of wind resistance in the air duct, and providing a better and more flexible heat dissipation effect.
[0055] In some embodiments, the multiple heat dissipation units have the same size (length, width, and height), capacity (volume of air passing through per unit time), and pressure (airflow pressure at the fan outlet side). In other words, the multiple heat dissipation units can be identical fans.
[0056] In some embodiments, at least two of the multiple heat dissipation units differ in at least one of size, capacity, and wind pressure. For example, each of the multiple heat dissipation units may have different size, capacity, and wind pressure; or each of the multiple heat dissipation units may have different size but the same capacity and wind pressure; or each of the multiple heat dissipation units may have different size, capacity, and wind pressure but the same wind pressure; or two or more of the multiple heat dissipation units may have exactly the same size, capacity, and wind pressure, but the same size as other heat dissipation units but different wind pressure and capacity; or two or more of the multiple heat dissipation units may have the same size but different capacity and wind pressure, and may differ in size, capacity, and wind pressure from other heat dissipation units, etc., and examples are not given here one by one.
[0057] In some embodiments, when at least two of the multiple heat dissipation units have different sizes or capacities, the size and capacity of the heat dissipation unit near the inlet 2021 are larger than the size and capacity of the heat dissipation unit near the outlet 2022. In other words, the multiple heat dissipation units are arranged in order of size or capacity from largest to smallest within the internal space 2023, thereby ensuring smooth flow of the cooling medium.
[0058] In some embodiments, when the wind pressures of at least two of the multiple heat dissipation units are different, the wind pressure of the heat dissipation unit near the inlet 2021 is lower than the wind pressure of the heat dissipation unit near the outlet 2022. In other words, the multiple heat dissipation units are arranged in the internal space 2023 in order of the wind pressure from the lowest to the highest, thereby ensuring smooth flow of the cooling medium.
[0059] That is to say, for two heat dissipation units, when the size or capacity is the same, the heat dissipation unit with smaller wind pressure is placed at the front end of the internal space, and the heat dissipation unit with smaller wind pressure is placed at the rear end of the internal space. When the wind pressure is the same, the heat dissipation unit with larger size or capacity is placed at the front end of the internal space, and the heat dissipation unit with smaller size or capacity is placed at the rear end of the internal space.
[0060] In some embodiments, two adjacent heat dissipation units among the plurality of heat dissipation units may be connected via an adapter 31 or may not be connected via an adapter, and may simply be arranged in sequence. For example, if two adjacent heat dissipation units are of different sizes, they may be connected via an adapter 31; if two adjacent heat dissipation units are of the same size, they may not be connected via an adapter, and may simply be arranged so that the fan trays face each other. Furthermore, when connected without an adapter, the adjacent heat dissipation units may or may not have a gap between them, and this is not intended to limit the embodiments of the present application.
[0061] In some embodiments, a first shielding member 32 is provided between the inlet 2021 and the plurality of heat dissipating units 201-1, 201-2, ..., 201-N. In other words, the first shielding member is disposed between the inlet 2021 and the heat dissipating unit 201-1. A second shielding member 33 is provided between the outlet 2022 and the plurality of heat dissipating units 201-1, 201-2, ..., 201-N. In other words, the plurality of heat dissipating units 201-1, 201-2, ..., 201-N are sandwiched between the first shielding member 32 and the second shielding member 33.
[0062] In some embodiments, as Figure 6 As shown, the first shielding member 32 and the second shielding member 33 each include a plurality of through holes 34 communicating with the internal space 2023. The through holes in the shielding members further allow air circulation between the heat dissipation unit and the outside. On the other hand, the walls of each through hole attenuate and shield noise that would diffuse outward from the inlet and outlet. This not only achieves heat dissipation, but also further shields radio frequency noise, preventing it from diffusing from the ends to the outside and thus preventing interference with the magnetic field. This allows the heat dissipation device to be used in scanning rooms and saves costs.
[0063] In some embodiments, as Figure 6As shown, in order to achieve both ideal heat dissipation and noise shielding effects, multiple through-holes can be evenly arranged to form a honeycomb structure. For example, each through-hole 34 has a hexahedral structure, and a through-hole can be adjacent to multiple other through-holes and share a hole wall. The above-mentioned multiple through-holes can also be arranged in other mesh structures, and the embodiments of the present application are not limited thereto.
[0064] The materials of the shielding shell, the first shielding member and the second shielding member include non-magnetic metal materials, such as metal aluminum, etc., but the embodiments of the present application are not limited thereto.
[0065] In some embodiments, a filter 36 for filtering impurities from the cooling medium can be disposed between the first shielding member 32 and the inlet 2021 to prevent tiny contaminants or other objects that could affect the cleanliness of the components to be cooled or the environment from entering the shielded housing when the cooling medium enters through the inlet. The filter 36 can be disposed at the front end of the first shielding member 32. For example, when air is drawn into the heat sink through the inlet 2021, it undergoes preliminary filtration through the filter 36 before passing through the through-holes of the first shielding member 32, the multiple heat sink units 201-1, 201-2, ..., 201-N, and the through-holes of the second shielding member 33, and finally exiting through the outlet 2022.
[0066] In some embodiments, the filter 36, the first shielding member 32, and the second shielding member 33 can be connected to each other and fixed to the shielding housing 202 using screws. The heat dissipation unit 201-1 can be fixed to the first shielding member 32 using screws, and the heat dissipation unit 201-N can be fixed to the second shielding member 33 using screws, but this embodiment of the present application is not limited to this. For example, other connection methods besides screws can also be used for fixed connection, and these examples are not listed here.
[0067] In some embodiments, an adapter interface 35 may also be provided at the outlet 2022. This adapter interface 35 is a hollow structure that defines an air flow channel. This adapter interface 35 can be coupled to the external air duct 81 to connect the heat sink to the object to be cooled in the magnetic resonance imaging system. In other words, the outlet 2022 of the heat sink is connected to the air duct through the adapter interface 35. The accelerated and pressurized air flowing out of the outlet enters the air duct and is blown toward the object to be cooled.
[0068] In some embodiments, the heat dissipation device 200 may further include a control circuit 41, which is connected to the plurality of heat dissipation units and is configured to control the opening or closing of the plurality of heat dissipation units. The plurality of heat dissipation units may be considered to be connected in parallel to the control circuit 41. The control circuit 41 may be located in the interior space 2023 of the shielding housing, but this embodiment of the present application is not limited thereto. The functionality of the control circuit 41 may also be integrated into the MRI system controller 130.
[0069] In some embodiments, for example, the control circuit 41 is located in the interior space of the shielding housing. The control circuit 41 can be electrically connected to each of the plurality of heat dissipation units via internal control lines and power lines 43. Furthermore, the control circuit 41 can communicate with the MRI system controller 130 (e.g., via external control lines), and the control circuit 41 can also be connected to an external power supply via external power lines 42.
[0070] In some embodiments, different cooling effects can be achieved by controlling the different combinations of the on and off states of multiple cooling units. For example, different wind speed controls can be achieved by controlling the different combinations of the on and off states of multiple fans. For example, when N cooling units are independently turned on, the wind speeds are S1, S2, ..., SN respectively. When any two of the N cooling units are turned on at the same time and the other cooling units are turned off, the wind speeds are Y1, Y2, ..., YZ respectively, where Z = CN (2). When any three of the N cooling units are turned on at the same time and the other cooling units are turned off, the wind speeds are P1, P2, ..., PM respectively, where M = CN (3). Similarly, when all cooling units are turned on at the same time, the wind speed is Q. In other words, by controlling the different combinations of the on and off states of N cooling units, at most X wind speeds can be controlled, where X = N + Z + M + ... + 1.
[0071] In some embodiments, the control circuit 41 includes multiple switch circuits 41-1, 41-2, ..., 41-X that control different combinations of on and off states of multiple heat dissipation units. When each switch circuit is independently turned on, a corresponding wind speed control is implemented. Figure 3 Schematic diagram of the control circuit of the embodiment of the present application. Figure 3 As shown, taking N=2 as an example, the control circuit includes three switch circuits: switch circuit 41-1 independently controls the on / off switching of heat dissipation unit 201-1, switch circuit 41-2 independently controls the on / off switching of heat dissipation unit 201-2, and switch circuit 41-3 controls the simultaneous on / off switching of heat dissipation units 201-1 and 201-2. When only switch circuit 41-1 is on, the wind speed is low; when only switch circuit 41-2 is on, the wind speed is medium; and when only switch circuit 41-3 is on, the wind speed is high.
[0072] In some embodiments, the control circuit can control the opening or closing of multiple heat dissipation units according to the signal of the controller 130. Figure 4 Schematic diagram of the control circuit of the embodiment of the present application. Figure 4As shown, taking N=2 as an example, the control circuit 41 is connected to the external power supply 42 and the controller 130, respectively, and adjusts the wind speed to three levels according to the signal from the controller 130. When the controller 130 provides a low signal, the control circuit 41 controls only the switch circuit 41-1 to be turned on, that is, the heat dissipation unit 201-1 is turned on, the heat dissipation unit 201-2 is turned off, and the wind speed is low. When the controller 130 provides a medium signal, the control circuit 41 controls only the switch circuit 41-2 to be turned on, that is, the heat dissipation unit 201-2 is turned on, the heat dissipation unit 201-1 is turned off, and the wind speed is medium. When the controller 130 provides a high signal, the control circuit 41 controls only the switch circuit 41-3 to be turned on, that is, the heat dissipation unit 201-1 is turned on, and the heat dissipation unit 201-2 is also turned on, and the wind speed is high.
[0073] In some embodiments, the signal of the controller 130 can be manually input, or can be automatically generated according to the temperature of the object to be cooled. In other words, the control circuit 41 can also automatically control the opening or closing of the plurality of heat dissipation units according to the temperature of the object to be cooled. Figure 4 For example, when it is detected that the temperature is higher than the first threshold, the controller 130 adaptively generates a high signal, the control circuit 41 controls only the switch circuit 41-3 to be turned on, and the wind speed is high to achieve rapid cooling of the object to be cooled. When it is detected that the temperature is greater than the second threshold and less than or equal to the first threshold, the controller 130 generates a medium signal, and the control circuit 41 controls only the switch circuit 41-2 to be turned on. When it is detected that the temperature is greater than the third threshold and less than or equal to the second threshold, the controller 130 generates a low signal, and the control circuit 41 controls only the switch circuit 41-1 to be turned on. Examples are not given one by one here. The above thresholds can be determined as needed, and the embodiments of the present application are not limited thereto.
[0074] The above structure of the control circuit 41 is merely an example, and the embodiments of the present application are not limited thereto.
[0075] In some embodiments, the control circuit 41 may further adjust the wind speed (air volume) of each fan based on changes in the duty cycle of a pulse width modulation (PWM) signal, thereby providing more refined wind speed control. The duty cycle of the PWM signal may be manually input or automatically determined based on the detected temperature of the object to be cooled, and the embodiments of the present application are not limited thereto.
[0076] In some embodiments, heat sink 200 further includes a capacitive filter 44 disposed on shielding housing 202 to prevent radio frequency noise generated by the heat sink from entering the shielding housing. Capacitive filter 44 is connected in series with power or control lines 42 outside the shielding housing. The provision of capacitive filter 44 prevents radio frequency noise generated by the heat sink from entering the scanning room via power or control lines 42.
[0077] The first shielding member, the second shielding member, and the capacitive filter may be implemented individually or in combination, and the present application is not limited thereto.
[0078] It can be seen from the above embodiments that by arranging multiple heat dissipation units in series on the cooling medium flow path, a better and more flexible heat dissipation effect can be provided. For example, by arranging multiple fans in series on the air flow path, cooling air with sufficient wind pressure and wind speed can be provided, avoiding the influence of wind resistance in the air duct, and providing a better and more flexible heat dissipation effect.
[0079] In addition, at least one of the first shielding element, the second shielding element, and the capacitive filter can prevent radio frequency noise from entering the scanning room through the shielding shell, so that the heat dissipation device can be used in the scanning room of the magnetic resonance imaging system.
[0080] In addition, by setting up multiple heat dissipation units and corresponding control circuits, the start and stop of multiple heat dissipation units can be flexibly controlled, thereby providing cooling media with multiple speeds or pressures to meet the needs of various heat dissipation scenarios, and the heat dissipation effect is more flexible.
[0081] In addition, the control circuit can also automatically control the start and stop of multiple cooling units according to the detected temperature, and can adaptively adjust the cooling effect of the cooling device according to the environment, with a high degree of automation.
[0082] The present application also provides a heat dissipation device. This embodiment differs from the aforementioned embodiment in that the shielding housing of the heat dissipation device can be provided with multiple (W, where W is an integer greater than 1) inlets and corresponding multiple (W) outlets, with the multiple inlets and the multiple outlets corresponding one to one. Multiple (N) heat dissipation units can be interposed between each corresponding set of inlets and outlets. The specific implementation is as described above and will not be repeated here.
[0083] For example, Figure 7 Schematic diagram of the heat dissipation device according to an embodiment of the present application. Figure 7As shown, two inlets 91, 92 and two outlets 93, 94 can be provided on the shielding shell, wherein one inlet 91 and one outlet 93 are opposite to each other, and the other inlet 92 and the other outlet 94 are opposite to each other, and the two inlets and the two outlets are openings formed on two opposite sides of the shielding shell respectively. Between one inlet 91 and one outlet 93, N1 heat dissipation units are provided, and between the other inlet 92 and the other outlet 94, N2 heat dissipation units are provided. N1 and N2 can be integers greater than 1, and N1 and N2 can be the same or different. In other words, two rows of multiple heat dissipation units that are "connected in series" in physical structure are formed in the shielding shell, which will not be described one by one here. For the implementation of other components in the heat dissipation device, reference can be made to the aforementioned embodiments. The two outlets can be connected to an air duct through the adapter interface 35, or can be connected to two air ducts respectively, and the embodiments of the present application are not limited to this.
[0084] An embodiment of the present application further provides a magnetic resonance imaging system, which further includes one or more heat dissipation devices 200 , and the structure of each heat dissipation device 200 (eg, the number of heat dissipation units included, etc.) is the same or different.
[0085] In some embodiments, the heat dissipation device 200 may be installed on the top or bottom side of the scanning chamber housing or on a support portion supporting the moving bed, but the embodiments of the present application are not limited thereto.
[0086] In some embodiments, the side of the shielding shell of the heat dissipation device 200 near the inlet can be fixed to a support frame. For example, an opening can be provided in the support frame, and the side of the shielding shell near the inlet can be inserted into the opening. The support frame can then be fixed to the top or bottom of the scanning chamber housing or to the support portion supporting the moving bed using screws or other connecting parts. This allows the shielding shell inlet to draw cooling medium from the environment.
[0087] In some embodiments, the side of the shielding shell of the heat dissipation device 200 near the outlet and the air duct connected thereto can be embedded in the scanning cavity housing, or embedded in the support portion, or disposed outside the housing. The air outlet of the air duct is connected to the object to be cooled.
[0088] For example, Figure 5 As shown, the heat dissipation device 200 can be installed on the lower side of the scanning chamber housing. The heat dissipation device can be connected to the air duct 81 through an adapter interface and connected to the inside of the scanning chamber through the air duct 81, so that the cold air blown out by the heat dissipation device 200 can flow into the accommodating space (cylindrical imaging volume 146) that accommodates the object to be inspected, so as to dissipate the heat of the object to be inspected, deliver fresh air, and relieve the discomfort caused by the heat of the body and the lack of air circulation.
[0089] For example, the heat dissipation device 200 can be installed on the top of the scanning chamber housing. The heat dissipation device can be connected to the air duct through an adapter interface and connected to the inside of the scanning chamber through the air duct, so that the cold air blown out by the heat dissipation device 200 can flow into the space where the body coil is located to dissipate heat for the body coil.
[0090] For example, the heat dissipation device 200 can be installed on the support part supporting the movable bed. The heat dissipation device can be connected to the air duct through the adapter interface and connected to the inside of the scanning chamber through the air duct, so that the cold air blown out by the heat dissipation device 200 can be circulated into the accommodation space (cylindrical imaging volume 146) accommodating the object to be inspected, so as to dissipate the heat of the object to be inspected, deliver fresh air, and alleviate the discomfort caused by the heat of the body and the lack of air circulation.
[0091] The embodiment of the present application does not limit the number and position of the heat dissipation device. The above is only an example and will not be given one by one here. The above embodiments can be implemented separately or in combination, and the embodiment of the present application is not limited thereto.
[0092] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for all purposes. The term "essentially consisting of..." describing a combination should include the identified elements, ingredients, parts or steps and other elements, ingredients, parts or steps that do not substantially affect the basic novel features of the combination. The use of the terms "comprising" or "including" to describe the combination of elements, ingredients, parts or steps herein also contemplates an embodiment that is essentially composed of these elements, ingredients, parts or steps. By using the term "may", it is intended to illustrate that any attribute described that "may" include is optional. Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure "one" or "an" used to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.
[0093] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to in detail. The above embodiments are only for illustrating the technical concept and features of the utility model. Their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly. They are not intended to limit the scope of protection of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the scope of protection of the utility model.
Claims
1. A heat dissipation device for a magnetic resonance imaging system, characterized in that: include: Multiple cooling units; The shielding shell is provided with an inlet, an outlet and an internal space for accommodating the plurality of heat dissipation units, and the cooling medium entering from the inlet flows through each of the plurality of heat dissipation units in sequence and then flows out from the outlet.
2. The heat dissipation device according to claim 1, wherein: The heat dissipation unit includes a fan, and the cooling medium includes air.
3. The heat dissipation device according to claim 1, wherein: Two adjacent heat dissipation units among the plurality of heat dissipation units are connected via an adapter.
4. The heat dissipation device according to claim 1, wherein: The multiple heat dissipation units are all the same in size, capacity and wind pressure.
5. The heat dissipation device according to claim 1, wherein: At least two of the plurality of heat dissipation units are different in at least one of size, capacity, and wind pressure.
6. The heat dissipation device according to claim 5, wherein: The size and capacity of the heat dissipation unit near the inlet are larger than the size and capacity of the heat dissipation unit near the outlet.
7. The heat dissipation device according to claim 5, wherein: The wind pressure of the heat dissipation unit close to the inlet is smaller than the wind pressure of the heat dissipation unit close to the outlet.
8. The heat dissipation device according to claim 1, wherein: A first shielding member is provided between the inlet and the plurality of heat dissipation units, and a second shielding member is provided between the outlet and the plurality of heat dissipation units. The first shielding member and the second shielding member respectively include a plurality of through holes connected to the internal space, and the plurality of through holes are evenly arranged to form a honeycomb shape.
9. The heat dissipation device according to claim 8, wherein: A filter for filtering out impurities in the cooling medium is provided between the first shielding member and the inlet.
10. The heat dissipation device according to claim 1, wherein: The heat dissipation device further comprises: A control circuit is connected to the plurality of heat dissipation units and is used to control the opening or closing of the plurality of heat dissipation units respectively.
11. The heat dissipation device according to claim 10, wherein: The control circuit controls the opening or closing of the plurality of heat dissipation units according to the detected temperature of the object to be cooled.
12. The heat dissipation device according to claim 1, wherein: The heat dissipation device further includes: a capacitor filter provided on the shielding shell, for preventing radio frequency noise generated by the heat dissipation unit from entering outside the shielding shell.
13. The heat dissipation device according to claim 12, wherein: The capacitor filter is connected in series with a power line or a control line outside the shielding shell.
14. A magnetic resonance imaging system, characterized in that: The magnetic resonance imaging system comprises one or more heat dissipation devices according to any one of claims 1-13.