Semiconductor material coating device

Abstract

The utility model discloses a semiconductor material coating device which comprises a coating box, a first supporting plate, a second supporting plate, a driving assembly, a lifting assembly, two first sliding table modules, a second sliding table module and a coating spray head, one side wall of the first supporting plate and one side wall of the second supporting plate are respectively provided with a connecting plate, and the connecting plates are connected with first sliding grooves in a sliding mode; the driving assembly is connected with the first supporting plate and the second supporting plate. A lifting plate is slidably connected into the first groove. The lifting assembly is arranged on the inner lower wall of the coating box; the two first sliding table modules are arranged on the opposite faces of the coating box correspondingly, and transverse plates are arranged on sliding tables of the two first sliding table modules. The second sliding table module is installed on the transverse plate, a sliding plate is arranged on a sliding table of the second sliding table module, and the coating nozzle is installed on the sliding plate. Therefore, the semiconductor material can be replaced during coating, the time for replacing the semiconductor material is remarkably shortened, the operation process is simple, convenient and rapid, and the overall efficiency of coating is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of coating devices, in particular to a semiconductor material coating device. Background Art

[0002] As a key equipment in the manufacturing of semiconductor products, the coating machine's main function is to accurately coat new materials on the product surface to improve the product's waterproof, dustproof and anti-static properties. This technology has been widely adopted and applied in electronics factories.

[0003] For example, a Chinese patent (publication number: CN216988318U) discloses a glue spreader for semiconductor wafer coating, comprising a glue spreader mechanism, a clamping mechanism, and a semiconductor wafer body, wherein the clamping mechanism is arranged on the glue spreader mechanism, and the semiconductor wafer body is arranged on the clamping mechanism, and the clamping mechanism comprises a fixed box, the inner side of the fixed box is fixedly connected to a motor, the output shaft of the motor is fixedly connected to a drive shaft, the outer side of the drive shaft is fixedly connected to a first gear, the top of the first gear is meshed with a second gear, the inner side of the second gear is fixedly connected to a threaded rod, the outer side of the threaded rod is threadedly connected to a threaded block, the top of the threaded block is fixedly connected to a limit block, and the top of the limit block is fixedly connected to a movable clamping block. The glue spreader for semiconductor wafer coating achieves the purpose of good clamping effect of the glue spreader, avoids the phenomenon of shaking or offsetting of the semiconductor wafer during the glue spread process, and ensures the glue spread effect of the semiconductor wafer.

[0004] However, although the above technology performs well in clamping stability, when replacing the semiconductor wafer on the workbench after the glue coating is completed, it is necessary to first control the two movable clamps to move away from each other, take out the glued semiconductor wafer and replace it with another semiconductor wafer. The operation is relatively cumbersome, and replacing the semiconductor wafer wastes a certain amount of time, resulting in low coating efficiency. Utility Model Content

[0005] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0006] To this end, one purpose of the present invention is to propose a semiconductor material coating device that can replace the semiconductor material during coating, significantly shortening the time for replacing the semiconductor material, making the operation process simple and quick, and improving the overall efficiency of coating.

[0007] To achieve the above-mentioned objectives, the first aspect of the present invention proposes a semiconductor material coating device, comprising a coating box, a first support plate, a second support plate, a driving assembly, a lifting assembly, two first slide modules, a second slide module and a coating nozzle, wherein the opposite inner walls of the coating box are respectively provided with two first slide grooves, and one side wall of the first support plate and the second support plate are respectively provided with a connecting plate, and the connecting plate is slidably connected to the first slide groove; the driving assembly is installed on the side wall of the coating box, and the driving assembly is respectively connected to the first support plate and the second support plate; the upper surface of the second support plate is provided with a first groove, the bottom of the first groove is penetrated by a through hole, and a lifting plate is slidably connected in the first groove; the lifting assembly is arranged on the inner lower wall of the coating box; the two first slide modules are respectively arranged on the opposite surfaces of the coating box, and the slides of the two first slide modules are provided with a horizontal plate; the second slide module is installed on the horizontal plate, and the slide of the second slide module is provided with a slide plate, and the coating nozzle is installed on the slide plate.

[0008] The semiconductor material coating device of the present invention can quickly switch semiconductor materials through the cooperation of the driving component, the first support plate and the second support plate, and can replace the semiconductor material while coating, which significantly shortens the time for replacing semiconductor materials. The operation process is simple and fast, and the overall efficiency of coating is improved.

[0009] In addition, the semiconductor material coating device proposed in the application may also have the following additional technical features:

[0010] Specifically, the drive assembly includes a motor, a drive shaft, a gear and two gear plates, wherein the motor is mounted on the outer wall of the coating box; one end of the drive shaft is connected to the output end of the motor, and the other end of the drive shaft extends to the interior of the coating box; the gear is arranged on the drive shaft, and the gear is respectively engaged with the two gear plates; the two gear plates are respectively arranged on the side walls of the first support plate and the second support plate, and the two gear plates are respectively slidably connected to the corresponding first slide grooves.

[0011] Specifically, the lifting assembly includes a driving member and an ejector plate, wherein the driving member is installed inside the coating box; and the ejector plate is arranged at the output end of the driving member.

[0012] Specifically, a plurality of second sliding grooves are provided on the upper surface of the second supporting plate, and a slider is slidably provided in the second sliding groove, and the slider is connected to the side wall of the lifting plate.

[0013] Specifically, the semiconductor material coating device of the present invention also includes a plurality of lifting components, which are respectively arranged opposite to each other on the lifting plate and the first support plate, and the lifting components include a lifting plate and a spring, wherein the upper surfaces of the lifting plate and the first support plate are provided with a second groove, and the lifting plate is slidably connected to the second groove; the spring is arranged in the second groove, and the two ends of the spring are respectively connected to the lower surfaces of the lifting plate and the second groove.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0016] Figure 1 This is a schematic structural diagram of a semiconductor material coating device according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic structural diagram of a driving component in a semiconductor material coating device according to an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the internal structure of a semiconductor material coating device according to one embodiment of the present invention;

[0019] Figure 4 This is a cross-sectional view of a second support plate in a semiconductor material coating device according to an embodiment of the present invention.

[0020] As shown in the figure: 1. Coating box; 2. First support plate; 3. Second support plate; 4. Drive assembly; 5. Lifting assembly; 6. First slide module; 7. Second slide module; 8. Coating nozzle; 9. Lifting plate; 10. First slide; 11. Connecting plate; 12. Horizontal plate; 13. Slide plate; 14. Slider; 15. Lifting assembly; 16. Second groove; 30. First groove; 31. Through hole; 32. Second slide; 40. Motor; 41. Drive shaft; 42. Gear; 43. Tooth plate; 50. Drive member; 51. Ejector plate; 150. Lifting plate; 151. Spring. DETAILED DESCRIPTION

[0021] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the present invention include all variations, modifications, and equivalents that fall within the spirit and scope of the appended claims.

[0022] The semiconductor material coating device according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0023] like Figures 1 to 4 As shown, the semiconductor material coating device of an embodiment of the present invention may include a coating box 1, a first support plate 2, a second support plate 3, a driving assembly 4, a lifting assembly 5, two first slide modules 6, a second slide module 7 and a coating nozzle 8.

[0024] Two first chutes 10 are respectively provided on opposite inner walls of the coating box 1 , and a connecting plate 11 is respectively provided on one side wall of the first support plate 2 and the second support plate 3 . The connecting plate 11 is slidably connected to the first chutes 10 .

[0025] It should be noted that an entrance is provided on one side of the coating box described in this embodiment, which facilitates pushing the first support plate 2 or the second support plate 3 into the interior of the coating box 1, and a support platform is provided outside the coating box 1, which can support the second support plate 3.

[0026] Furthermore, the first support plate 2 is higher than the second support plate 3 , and there is a gap between the first support plate 2 and the second support plate 3 , so that no interference occurs when the first support plate 2 and the second support plate 3 move closer to each other.

[0027] The driving assembly 4 is installed on the side wall of the coating box 1, and the driving assembly 4 is respectively connected to the first support plate 2 and the second support plate 3. The upper surface of the second support plate 3 is provided with a first groove 30, and the bottom of the first groove 30 is penetrated by a through hole 31, and a lifting plate 9 is slidably connected in the first groove 30. The lifting assembly 5 is arranged on the inner lower wall of the coating box 1.

[0028] In an embodiment of the present invention, the driving component 4 can drive the first support plate 2 and the second support plate 3 to move in opposite directions to quickly switch the two semiconductors. When the second support plate 3 is located inside the coating box 1, the lifting plate 9 can be lifted by the lifting component 5 so that the lifting plate 9 is flush with the first support plate 2.

[0029] The two first slide modules 6 are respectively arranged on the opposite surfaces of the coating box 1, and a horizontal plate 12 is provided on the slides of the two first slide modules 6. The second slide module 7 is installed on the horizontal plate 12, and a slide plate 13 is provided on the slide of the second slide module 7. The coating nozzle 8 is installed on the slide plate 13.

[0030] In an embodiment of the present invention, the first slide module 6 can drive the horizontal plate 12 to move along the first direction, and the second slide module 7 can drive the slide plate 13 to move along the second direction, and the movement in the first direction and the movement in the second direction are perpendicular to each other, so as to drive the coating nozzle 8 to move in the first direction and the second direction respectively.

[0031] Furthermore, the coating nozzle 8 is connected to an external glue barrel (not shown in the figure), and the glue liquid can be delivered to the coating nozzle 8 through the glue supply system.

[0032] In one embodiment of the present invention, Figure 2 As shown, the drive assembly 4 may include a motor 40, a drive shaft 41, a gear 42 and two tooth plates 43, wherein the motor 40 is mounted on the outer wall of the coating box 1, one end of the drive shaft 41 is connected to the output end of the motor 40, and the other end of the drive shaft 41 extends to the interior of the coating box 1, the gear 42 is arranged on the drive shaft 41, and the gear 42 is respectively meshed with the two tooth plates 43, and the two tooth plates 43 are respectively arranged on the side walls of the first support plate 2 and the second support plate 3, and the two tooth plates 43 are respectively slidably connected to the corresponding first slide groove 10.

[0033] It should be noted that the motor 40 described in this embodiment can rotate forward and reverse. When the motor 40 is started, it can drive the drive shaft 41 and the gear 42 to rotate, and with the cooperation of the two gear plates 43, drive the first support plate 2 and the second support plate 3 to move in the opposite direction.

[0034] In one embodiment of the present invention, Figure 3 As shown, the lifting assembly 5 may include a driving member 50 and an ejector plate 51 , wherein the driving member 50 is installed inside the coating box 1 , and the ejector plate 51 is provided at the output end of the driving member 50 .

[0035] It should be noted that the driving member 50 described in this embodiment can be an electric push rod or a pneumatic rod. The driving member 50 can drive the ejection plate 51 to move upward, and the ejection plate 51 drives the lifting plate 9 to move upward through the through hole 31, and finally makes the lifting plate 9 flush with the first support plate 2. When the driving member 50 drives the ejection plate 51 to move downward, the lifting plate 9 returns to the first groove 30 under the action of gravity.

[0036] Furthermore, if Figure 2 and Figure 4As shown, a plurality of second sliding grooves 32 are provided on the upper surface of the second supporting plate 3 , and a slider 14 is slidably provided in the second sliding groove 32 , and the slider 14 is connected to the side wall of the lifting plate 9 .

[0037] In the embodiment of the present invention, the second sliding groove 32 and the slider 14 can limit the moving direction of the lifting plate 9 to prevent the lifting plate 9 from being offset.

[0038] In one embodiment of the present invention, Figure 4 As shown, the semiconductor material coating device of the present invention also includes a plurality of lifting components 15, and the plurality of lifting components 15 are respectively arranged on the lifting plate 9 and the first support plate 2. The lifting components 15 may include a lifting plate 150 and a spring 151, wherein the upper surfaces of the lifting plate 9 and the first support plate 2 are both provided with a second groove 16, the lifting plate 150 is slidingly connected to the second groove 16, the spring 151 is arranged in the second groove 16, and the two ends of the spring 151 are respectively connected to the lower surfaces of the lifting plate 150 and the second groove 16.

[0039] It should be noted that the upper surfaces of the lifting plate 9 and the first support plate 2 are respectively detachably connected with multiple positioning plates, which are fitted with the side walls of the semiconductor material. The positioning plates can position and limit the semiconductor material, thereby improving the accuracy of coating.

[0040] Furthermore, a pair of pulling assemblies 15 are respectively provided on the lifting plate 9 and the first support plate 2, and the pair of pulling assemblies 15 are arranged opposite to each other. The pulling assemblies 15 can quickly pull the semiconductor material upward to facilitate its replacement.

[0041] In an embodiment of the present invention, the lifting plate 150 is an L-shaped plate. When the spring 151 is in a natural state, the horizontal plate of the lifting plate 150 is flush with the upper surface of the lifting plate 9.

[0042] Specifically, when coating the semiconductor material, the relevant personnel adjust the position of the positioning plate according to the size of the semiconductor material, and then place the semiconductor material to be coated on the first support plate 2 and the lifting plate 9. The positioning plate can position and limit it to ensure the accuracy of the coating.

[0043] Then, the coating nozzle 8 can be adjusted by the first slide module 6 and the second slide module 7 to coat the glue on the semiconductor material.

[0044] After the coating is completed, the relevant personnel controls the motor 40 to start, and the motor 40 drives the drive shaft 41 and the gear 42 to rotate, and through the cooperation of the gear 42 and the tooth plate 43, drives the first support plate 2 and the second support plate 3 to move in opposite directions, thereby exchanging the first support plate 2 and the second support plate 3. When the second support plate 3 moves to the inside of the coating box 1, the relevant personnel controls the driving member 50 to start, and the driving member 50 drives the ejection plate 51 to move upward to eject the lifting plate 9 from the first groove 30, and make the lifting plate 9 flush with the upper surface of the first support plate 2, and then use the coating nozzle 8 to spray it. At the same time, the relevant personnel replace the semiconductor on the first support plate 2, which is convenient to operate, shortens the time for replacing semiconductors, and improves the coating efficiency.

[0045] In summary, the semiconductor material coating device of the embodiment of the utility model can quickly switch semiconductor materials through the cooperation of the driving component, the first support plate and the second support plate, and can replace the semiconductor material while coating, which significantly shortens the time for replacing the semiconductor material. The operation process is simple and fast, and the overall efficiency of the coating is improved.

[0046] In this specification, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this utility model, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0047] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

Claims

1. A semiconductor material coating device, characterized in that: It includes a coating box, a first support plate, a second support plate, a driving assembly, a lifting assembly, two first slide modules, a second slide module and a coating nozzle, wherein: Two first chutes are respectively provided on opposite inner walls of the coating box, and a connecting plate is respectively provided on one side wall of the first support plate and the second support plate, and the connecting plate is slidably connected to the first chutes; The driving assembly is mounted on the side wall of the coating box, and the driving assembly is connected to the first support plate and the second support plate respectively; A first groove is provided on the upper surface of the second support plate, a through hole is provided through the bottom of the first groove, and a lifting plate is slidably connected in the first groove; The lifting assembly is arranged on the inner lower wall of the coating box; The two first slide modules are respectively arranged on opposite surfaces of the coating box, and the slides of the two first slide modules are provided with transverse plates; The second slide module is installed on the transverse plate, and a slide plate is provided on the slide of the second slide module, and the coating nozzle is installed on the slide plate.

2. The semiconductor material coating device according to claim 1, characterized in that: The drive assembly includes a motor, a drive shaft, a gear and two gear plates, wherein: The motor is mounted on the outer side wall of the coating box; One end of the drive shaft is connected to the output end of the motor, and the other end of the drive shaft extends into the interior of the coating box; The gear is arranged on the driving shaft, and the gear is meshed and connected with the two gear plates respectively; The two tooth plates are respectively arranged on the side walls of the first support plate and the second support plate, and the two tooth plates are respectively slidably connected to the corresponding first sliding grooves.

3. The semiconductor material coating device according to claim 1, characterized in that: The lifting assembly includes a driving member and an ejector plate, wherein: The driving member is installed inside the coating box; The ejector plate is arranged at the output end of the driving member.

4. The semiconductor material coating device according to claim 1, characterized in that A plurality of second sliding grooves are provided on the upper surface of the second supporting plate. Slide blocks are slidably provided in the second sliding grooves. The slide blocks are connected to the side walls of the lifting plate.

5. The semiconductor material coating device according to claim 1, characterized in that: It also includes a plurality of lifting components, which are respectively arranged on the lifting plate and the first support plate in opposition, and the lifting components include a lifting plate and a spring, wherein: The upper surfaces of the lifting plate and the first supporting plate are both provided with a second groove, and the lifting plate is slidably connected to the second groove; The spring is arranged in the second groove, and two ends of the spring are respectively connected to the lifting plate and the lower surface of the second groove.

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