Cooling device for welding of electronic component

Abstract

The utility model relates to a cooling device for welding an electronic element. The cooling device comprises a supporting seat, a power assembly is mounted at the top of the supporting seat; a welding gun is mounted in the middle of the power assembly; the middle part of the supporting seat is fixedly connected with a pore plate; the pore plate and the supporting seat are arranged in a penetrating manner; a motor is fixedly connected to the bottom of the inner side wall of the supporting seat; the output end of the motor is fixedly connected with a sleeve; a plurality of fixing rods are rotationally connected to the bottom of the inner side wall of the supporting seat; a belt is arranged between the sleeve and the fixing rod in a sleeving manner; the tops of the fixed rod and the sleeve are fixedly connected with a telescopic rod; the top of the telescopic rod is fixedly connected with a connecting plate; a plurality of fan blades are fixedly connected to the middle part of the connecting plate; by means of the structure, the sleeve and the fixing rod can drive the connecting plate and the fan blades to rotate together and generate airflow facing the pore plate, cooling of the device during welding of the flexible circuit board is achieved, and damage caused by welding overheating of the flexible circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component welding, in particular to an electronic component welding cooling device. Background Art

[0002] A flexible printed circuit board is a circuit board made of a flexible substrate. It is highly flexible, bendable, and plastic, and can adapt to the needs of devices of different shapes and sizes. Its substrate is usually polyimide film or polyester film, which has good flexibility and high temperature resistance.

[0003] The processing flow of flexible circuit boards generally includes the following steps: material selection, FPC cleaning, conductive layer preparation, circuit pattern formation, process treatment, component placement, reflow soldering, quality inspection, functional testing, cleaning and drying, packaging and shipment.

[0004] Existing flexible circuit boards are usually placed in an environment to cool naturally during welding. During production and observation, it was found that the temperature of the internal electronic components of the flexible circuit board is difficult to drop quickly during welding, which will cause the internal temperature of the flexible circuit board to be too high, thereby causing damage to the internal electronic components of the flexible circuit board.

[0005] Therefore, in order to solve the above problems, an electronic component welding cooling device is proposed. Utility Model Content

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the problem in the prior art that the temperature of the internal electronic components of the flexible circuit board is difficult to drop quickly during welding, thereby causing damage.

[0007] In order to solve the above technical problems, the utility model provides an electronic component welding cooling and temperature reduction device, comprising a support base; a power assembly is installed on the top of the support base; a welding gun is installed in the middle of the power assembly; a hole plate is fixedly connected to the middle of the support base; the hole plate and the support base are set through; the bottom of the inner side wall of the support base is fixedly connected to a motor; the output end of the motor is fixedly connected to a sleeve; the bottom of the inner side wall of the support base is rotatably connected to multiple fixing rods; a belt is sleeved between the sleeve and the fixing rod; the top of the fixing rod and the sleeve is fixedly connected to a telescopic rod; the top of the telescopic rod is fixedly connected to a connecting plate; the middle of the connecting plate is fixedly connected to multiple fan blades; the fan blades are located at the bottom of the orifice plate; through the above structure, the sleeve and the fixing rod will rotate with the connecting plate and the fan blades and generate an airflow toward the orifice plate, so as to realize cooling of the flexible circuit board during welding by the device and reduce damage to the flexible circuit board caused by overheating of welding.

[0008] In one embodiment of the present invention, the top of the support seat is rotatably connected to a first circular plate; the bottom of the first circular plate is fixedly connected to a screw; the screw and the support seat are set through and are rotatably connected; the middle part of the screw is threadedly connected to a connecting ring; the middle part of the connecting ring is fixedly connected to multiple connecting rods; the end of the connecting rod is fixedly connected to a slide; the slide and the telescopic rod are set through and are rotatably connected; when the screw rotates, the connecting ring will move with the connecting plate so that the distance between the fan blades and the orifice plate changes, thereby realizing the device's control of the cooling wind force of the flexible circuit board and improving the accuracy of the device's temperature control during welding of the flexible circuit board.

[0009] In one embodiment of the present invention, a protrusion is fixedly connected to the middle of the first circular plate; a circular ring is fixedly connected to the top of the support seat; a plurality of grooves are opened in the middle of the circular ring; the first circular plate is located inside the circular ring; when the staff rotates the first circular plate, the first circular plate will move with the protrusion. At this time, the staff can judge the intensity of the cooling of the flexible circuit board by observing the position of the groove where the protrusion is located, thereby further improving the convenience and accuracy of the cooling intensity control when the device is welding the flexible circuit board.

[0010] In one embodiment of the present invention, a first guide plate is fixed to the top of the inner wall of the support seat; the first guide plate is located at the bottom of the orifice plate; the surface of the first guide plate is an arc-shaped structure; the airflow generated by the rotation of the edge blades will reach the surface of the first guide plate. Because the first guide plate is an arc-shaped structure, the airflow will flow along the inner wall of the first guide plate and reach the orifice plate, increasing the amount of airflow reaching the orifice plate and enhancing the cooling effect of the device on the flexible circuit board.

[0011] In one embodiment of the present invention, a plurality of elastic springs are fixedly connected to the bottom of the first guide plate; a baffle is fixedly connected to the bottom of the elastic spring; a plurality of first circular holes are opened in the middle of the baffle; the airflow blown out by the fan blades will pass through the first circular holes, and when the staff adjusts the height of the connecting plate, if the movement range is too large, the connecting plate will collide with the baffle, and after the baffle is hit, the pressure will be transferred to the elastic spring, causing the elastic spring to be compressed, and the baffle will move with the elastic spring, reducing the contact between the connecting plate and the first guide plate when it moves.

[0012] In one embodiment of the present invention, a second circular plate is rotatably connected to the middle of the first circular hole; the second circular plate and the first circular hole are connected by a torsion spring; the airflow blown out by the fan blades will reach the first circular hole and exert pressure on the second circular plate, and the second circular plate will rotate under the impact of the airflow so that the first circular hole is in an open state. When the device stops working, the second circular plate will seal the first circular hole to reduce impurities from the outside entering the first circular hole.

[0013] In one embodiment of the present invention, a second guide plate is symmetrically fixed to the middle of the second circular plate; the second guide plate is an arc-shaped structure; a plurality of second circular holes are opened in the middle of the second guide plate; when the second circular plate rotates under the action of the airflow, it will rotate with the second guide plate, and then the airflow will reach the surface of the second guide plate when passing through the first circular hole. Because the second guide plate is an arc-shaped structure, the airflow will flow along the surface of the second guide plate and flow out from the second circular hole, thereby increasing the flow range of the airflow and further increasing the airflow at the orifice plate.

[0014] In one embodiment of the present invention, a plurality of bristles are fixed to the top of the baffle; the bristles are arranged in an array; when it is necessary to clean the holes on the surface of the orifice plate, the staff can adjust the first circular plate so that the connecting plate squeezes the baffle, and the baffle will move closer to the orifice plate along with the elastic spring, and the bristles and the orifice plate will come into contact and clear the holes on the surface of the orifice plate, thereby reducing dust or other impurities accumulated on the surface of the orifice plate.

[0015] The above technical solution of the utility model has the following advantages compared with the prior art:

[0016] 1. In the electronic component welding cooling device described in the present invention, the sleeve and the fixing rod rotate together with the connecting plate and the fan blades and generate an airflow toward the orifice plate, thereby realizing cooling of the flexible circuit board during welding and reducing damage to the flexible circuit board caused by overheating during welding.

[0017] 2. In the electronic component welding cooling device described in the present invention, when the screw rotates, the connecting ring will move with the connecting plate, so that the distance between the fan blades and the orifice plate changes, thereby realizing the device's control of the cooling wind force of the flexible circuit board and improving the accuracy of the device's temperature control when welding the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic structural diagram of the first guide plate in the present utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the screw in the utility model;

[0022] Figure 4 This is a schematic structural diagram of the baffle in the utility model;

[0023] Figure 5 It is a structural diagram of the circular ring in the present utility model.

[0024] Explanation of the reference numerals in the specification: 1. Support base; 102. Power assembly; 103. Welding gun; 104. Orifice plate; 105. Motor; 106. Sleeve; 107. Telescopic rod; 108. Connecting plate; 109. Fan blade; 110. Fixed rod; 111. Belt; 2. First circular plate; 22. Screw; 23. Connecting ring; 24. Connecting rod; 25. Slide plate; 3. Bump; 32. Ring; 33. Groove; 4. First guide plate; 5. Elastic spring; 52. Baffle; 53. First circular hole; 6. Second circular plate; 7. Second guide plate; 72. Second circular hole; 8. Bristles. DETAILED DESCRIPTION

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0026] Reference Figures 1 to 5As shown, the utility model is an electronic component welding cooling device, comprising a support base 1; a power assembly 102 is installed on the top of the support base 1; a welding gun 103 is installed in the middle of the power assembly 102; a hole plate 104 is fixedly connected to the middle of the support base 1; the hole plate 104 and the support base 1 are set through; a motor 105 is fixedly connected to the bottom of the inner side wall of the support base 1; a sleeve 106 is fixedly connected to the output end of the motor 105; the bottom of the inner side wall of the support base 1 rotates A plurality of fixed rods 110 are connected; a belt 111 is provided between the sleeve 106 and the fixed rod 110; a telescopic rod 107 is fixed to the top of each of the fixed rod 110 and the sleeve 106; a connecting plate 108 is fixed to the top of the telescopic rod 107; a plurality of fan blades 109 are fixed to the middle of the connecting plate 108; the fan blades 109 are located at the bottom of the orifice plate 104; when working, the flexible circuit board is placed inside the orifice plate 104 and fixed, and then the device is started so that the power assembly 102 drives The welding gun 103 is brought close to the flexible circuit board. After the welding gun 103 moves a certain distance, the flexible circuit board will be welded. At this time, the motor 105 will also start and drive the sleeve 106 to rotate. When the sleeve 106 rotates, the belt 111 will move and drive the fixed rod 110 to rotate together. At the same time, when the sleeve 106 rotates, the telescopic rod 107 and the connecting plate 108 will rotate together, and when the fixed rod 110 rotates, the telescopic rod 107 and the connecting plate 108 will also rotate. When the connecting plate 108 rotates, the fan blades 109 will rotate and generate airflow. The airflow will pass through the surface of the orifice plate 104 and pass through the flexible circuit board. At this time, the airflow will cool the surface of the flexible circuit board, realizing the cooling work of the device when welding the surface of the flexible circuit board; the sleeve 106 and the fixed rod 110 will rotate with the connecting plate 108 and the fan blades 109 and generate airflow toward the orifice plate 104, realizing the cooling of the device when welding the flexible circuit board, reducing the damage to the flexible circuit board caused by overheating due to welding.

[0027] Reference Figure 2 and Figure 3As shown, the top of the support base 1 is rotatably connected to the first circular plate 2; the bottom of the first circular plate 2 is fixedly connected to the screw 22; the screw 22 and the support base 1 are set through and are rotatably connected; the middle part of the screw 22 is threadedly connected to the connecting ring 23; the middle part of the connecting ring 23 is fixedly connected to multiple connecting rods 24; the end of the connecting rod 24 is fixedly connected to a slide plate 25; the slide plate 25 and the telescopic rod 107 are set through and are rotatably connected; when the flexible circuit board needs to be cooled more strongly, the staff can rotate the first circular plate 2 to make the screw 22 rotate as well. When the screw 22 rotates, the connecting ring 23 will slide along the screw 22, and when the connecting ring 23 moves, it will bring the connecting rod 24 with it. When the screw 22 rotates, the connecting ring 23 will move with the connecting plate 109, causing the distance between the fan blades 109 and the orifice plate 104 to be shortened, thereby increasing the amount of airflow reaching the orifice plate 104; when the screw 22 rotates, the connecting ring 23 will move with the connecting plate 108, causing the distance between the fan blades 109 and the orifice plate 104 to change, thereby realizing the device's control over the cooling wind force of the flexible circuit board and improving the accuracy of the device's temperature control during welding of the flexible circuit board.

[0028] Reference Figure 3 and Figure 5 As shown, a protrusion 3 is fixed to the middle of the first circular plate 2; a circular ring 32 is fixed to the top of the support seat 1; a plurality of grooves 33 are opened in the middle of the circular ring 32; the first circular plate 2 is located inside the circular ring 32; the wind strength is marked around the groove 33. When the staff rotates the first circular plate 2, the first circular plate 2 will move with the protrusion 3. At this time, the staff can judge the intensity of the device's cooling of the flexible circuit board by observing the position of the groove 33 where the protrusion 3 is located, thereby further improving the convenience and accuracy of the device's control of the cooling intensity when welding the flexible circuit board.

[0029] Reference Figure 2 and Figure 4 As shown, a first guide plate 4 is fixed to the top of the inner wall of the support seat 1; the first guide plate 4 is located at the bottom of the orifice plate 104; the surface of the first guide plate 4 is an arc-shaped structure; the airflow generated by the rotation of the fan blades 109 at the edge will reach the surface of the first guide plate 4. Because the first guide plate 4 is an arc-shaped structure, the airflow will flow along the inner wall of the first guide plate 4 and reach the orifice plate 104, increasing the amount of airflow reaching the orifice plate 104 and enhancing the cooling effect of the device on the flexible circuit board.

[0030] Reference Figure 4As shown, a plurality of elastic springs 5 ​​are fixed to the bottom of the first guide plate 4; a baffle 52 is fixed to the bottom of the elastic spring 5; a plurality of first circular holes 53 are opened in the middle of the baffle 52; the airflow blown out by the fan blades 109 will pass through the first circular holes 53. When the staff adjusts the height of the connecting plate 108, if the movement range is too large, the connecting plate 108 will collide with the baffle 52. After the baffle 52 is hit, the pressure will be transferred to the elastic spring 5, causing the elastic spring 5 to be compressed, and the baffle 52 will move with the elastic spring 5, thereby reducing the contact between the connecting plate 108 and the first guide plate 4 when it moves.

[0031] Reference Figure 4 As shown, the middle part of the first circular hole 53 is rotatably connected to the second circular plate 6; the second circular plate 6 and the first circular hole 53 are connected by a torsion spring; the airflow blown out by the fan blade 109 will reach the first circular hole 53 and exert pressure on the second circular plate 6, and the second circular plate 6 will rotate under the impact of the airflow so that the first circular hole 53 is in an open state. When the device stops working, the second circular plate 6 will seal the first circular hole 53 to reduce impurities from the outside entering the first circular hole 53.

[0032] Reference Figure 4 As shown, a second guide plate 7 is symmetrically fixed to the middle of the second circular plate 6; the second guide plate 7 is an arc-shaped structure; a plurality of second circular holes 72 are opened in the middle of the second guide plate 7; when the second circular plate 6 rotates under the action of the airflow, it will rotate with the second guide plate 7, and then the airflow will reach the surface of the second guide plate 7 when passing through the first circular hole 53. Because the second guide plate 7 is an arc-shaped structure, the airflow will flow along the surface of the second guide plate 7 and flow out from the second circular hole 72, thereby increasing the flow range of the airflow and further increasing the airflow at the orifice plate 104.

[0033] Reference Figure 4 As shown, a plurality of bristles 8 are fixed to the top of the baffle 52; the bristles 8 are arranged in an array; when it is necessary to clean the holes on the surface of the orifice plate 104, the staff can adjust the first circular plate 2 so that the connecting plate 108 squeezes the baffle 52, and the baffle 52 will carry the bristles 8 together with the elastic spring 5 to approach the orifice plate 104, and the bristles 8 and the orifice plate 104 will come into contact and dredge the holes on the surface of the orifice plate 104, thereby reducing the dust or other impurities accumulated on the surface of the orifice plate 104.

[0034] Working principle: After the flexible circuit board is placed inside the orifice plate 104 and fixed, the device is started so that the power component 102 drives the welding gun 103 to approach the flexible circuit board. After the welding gun 103 moves a certain distance, it will weld the flexible circuit board. At this time, the motor 105 will also start and drive the sleeve 106 to rotate. When the sleeve 106 rotates, the belt 111 will move and drive the fixed rod 110 to rotate together. At the same time, when the sleeve 106 rotates, it will rotate with the telescopic rod 107 and the connecting plate 108. When the fixed rod 110 rotates, the telescopic rod 107 and the connecting plate 108 will also rotate. When the connecting plate 108 rotates, the fan blades 109 will rotate and generate airflow. The airflow will pass through the surface of the orifice plate 104 and pass through the flexible circuit board. When the flexible circuit board is welded, the airflow will cool down the surface of the flexible circuit board, realizing the cooling work of the device when welding the surface of the flexible circuit board; when the flexible circuit board needs to be cooled more strongly, the staff can rotate the first circular plate 2 to make the screw 22 rotate as well. When the screw 22 rotates, the connecting ring 23 will slide along the screw 22. When the connecting ring 23 moves, it will move with the connecting rod 24. When the connecting rod 24 moves, it will move together with the slide plate 25. When the slide plate 25 moves, it will contact the connecting plate 108 and move it. When the connecting plate 108 moves, the length of the telescopic rod 107 will change. At this time, the connecting plate 108 will move with the fan blade 109, so that the distance between the fan blade 109 and the flexible circuit board at the orifice plate 104 is shortened. , increasing the air flow reaching the orifice plate 104; when the staff rotates the first circular plate 2, the first circular plate 2 will move with the bump 3. At this time, the staff can judge the intensity of the device cooling the flexible circuit board by observing the position of the groove 33 where the bump 3 is located; the air flow generated by the rotation of the edge blades 109 will reach the surface of the first guide plate 4. Because the first guide plate 4 is an arc-shaped structure, the air flow will flow along the inner wall of the first guide plate 4 and reach the orifice plate 104, increasing the air flow reaching the orifice plate 104; the air flow blown out by the fan blades 109 will pass through the first circular hole 53. When the staff adjusts the height of the connecting plate 108, if the movement is too large, the connecting plate 108 will collide with the baffle 52, and the baffle 52 will be hit. The pressure is transmitted to the elastic spring 5 so that the elastic spring 5 is compressed, and the baffle 52 moves with the elastic spring 5; the airflow blown out by the fan blade 109 reaches the first circular hole 53 and exerts pressure on the second circular plate 6. The second circular plate 6 rotates under the impact of the airflow, so that the first circular hole 53 is in an open state. When the device stops working, the second circular plate 6 seals the first circular hole 53; when the second circular plate 6 rotates under the action of the airflow, it rotates with the second guide plate 7, and then the airflow passes through the first circular hole 53 and reaches the surface of the second guide plate 7. Because the second guide plate 7 is an arc-shaped structure, the airflow flows along the surface of the second guide plate 7 and flows out from the second circular hole 72, thereby increasing the flow range of the airflow;When it is necessary to clean the holes on the surface of the orifice plate 104, the staff can adjust the first circular plate 2 so that the connecting plate 108 presses the baffle 52. The baffle 52 will move the bristles 8 along with the elastic spring 5 toward the orifice plate 104. The bristles 8 will come into contact with the orifice plate 104 and clear the holes on the surface of the orifice plate 104.

[0035] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. An electronic component welding cooling device, comprising a support base (1), characterized in that: The top of the support seat (1) is mounted with a power assembly (102); the middle of the power assembly (102) is mounted with a welding gun (103); the middle of the support seat (1) is fixed with a hole plate (104); the hole plate (104) and the support seat (1) are arranged to penetrate each other; the bottom of the inner side wall of the support seat (1) is fixed with a motor (105); the output end of the motor (105) is fixed with a sleeve (106); the bottom of the inner side wall of the support seat (1) is fixed with a hole plate (104 ... The sleeve (106) is rotatably connected to a plurality of fixed rods (110); a belt (111) is provided between the sleeve (106) and the fixed rod (110); the tops of the fixed rod (110) and the sleeve (106) are fixedly connected to a telescopic rod (107); the top of the telescopic rod (107) is fixedly connected to a connecting plate (108); the middle of the connecting plate (108) is fixedly connected to a plurality of fan blades (109); the fan blades (109) are located at the bottom of the orifice plate (104).

2. The electronic component welding cooling device according to claim 1, characterized in that: The top of the support seat (1) is rotatably connected to a first circular plate (2); the bottom of the first circular plate (2) is fixedly connected to a screw rod (22); the screw rod (22) and the support seat (1) are arranged through and are rotatably connected; the middle of the screw rod (22) is threadedly connected to a connecting ring (23); the middle of the connecting ring (23) is fixedly connected to a plurality of connecting rods (24); the ends of the connecting rods (24) are fixedly connected to a slide plate (25); the slide plate (25) and the telescopic rod (107) are arranged through and are rotatably connected.

3. The electronic component welding cooling device according to claim 2, characterized in that: A protrusion (3) is fixedly connected to the middle of the first circular plate (2); a circular ring (32) is fixedly connected to the top of the support seat (1); a plurality of grooves (33) are provided in the middle of the circular ring (32); and the first circular plate (2) is located inside the circular ring (32).

4. The electronic component welding cooling device according to claim 3, characterized in that: A first guide plate (4) is fixedly connected to the top of the inner side wall of the support seat (1); the first guide plate (4) is located at the bottom of the orifice plate (104); and the surface of the first guide plate (4) is an arc-shaped structure.

5. The electronic component welding cooling device according to claim 4, characterized in that: A plurality of elastic springs (5) are fixedly connected to the bottom of the first guide plate (4); a baffle (52) is fixedly connected to the bottom of the elastic spring (5); and a plurality of first circular holes (53) are opened in the middle of the baffle (52).

6. The electronic component welding cooling device according to claim 5, characterized in that: A second circular plate (6) is rotatably connected to the middle portion of the first circular hole (53); the second circular plate (6) and the first circular hole (53) are connected via a torsion spring.

7. The electronic component welding cooling device according to claim 6, characterized in that: A second guide plate (7) is symmetrically fixed to the middle of the second circular plate (6); the second guide plate (7) is an arc-shaped structure; a plurality of second circular holes (72) are opened in the middle of the second guide plate (7).

8. The electronic component welding cooling device according to claim 7, characterized in that: A plurality of bristles (8) are fixedly connected to the top of the baffle (52); the bristles (8) are arranged in an array.

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