MEMS sensor chip structure

Abstract

The utility model relates to the technical field of micro electro mechanical systems, and particularly provides an MEMS sensor chip structure, which comprises a substrate, an inertia sensitive module arranged on the substrate, a signal transmission network arranged in the substrate and the inertia sensitive module to form electrical interconnection, and a cover plate matched with the substrate for packaging, the signal transmission network comprises a graphene circuit layer, a first graphene composite material circuit layer, a second graphene composite material circuit layer and a metal circuit layer which are sequentially distributed from bottom to top; according to the utility model, the signal transmission network is constructed in a layered manner, so that the construction of the signal transmission network has more possibilities, graphene materials are adopted in the multiple circuit layers, the excellent performance of graphene is facilitated, the signal transmission is ensured, the overall thickness of the signal transmission network is compressed, and the thickness of the MEMS sensor chip is further compressed; the arrangement of the support column and the anchor column can protect the inertia sensitive module and the signal transmission network in the chip, and improve the use performance of the signal transmission network.

Description

Technical Field

[0001] The utility model relates to the technical field of micro-electromechanical systems, in particular to a MEMS sensor chip structure. Background Art

[0002] Micro Electro Mechanical Systems (MEMS), or microelectromechanical systems (MEMS), are an emerging science and technology developed based on microelectronics technology that integrates micromachines, microsensors, microactuators, signal processing, and intelligent control. MEMS inertial sensors include accelerometers, angular velocity sensors, IMUs, attitude and heading reference systems, and others. Circuits are a crucial component in chip manufacturing. All chips are controlled and operated by electrical signals, and circuits transmit these signals to or from the chip. They can also transmit power to the chip to provide power. Within the chip, circuits connect components made of the same or different materials through electrical signals, forming a circuit network. This crisscrossing network ultimately forms an extremely complex electronic traffic information network. A single chip contains dozens of layers of structure, like a densely interwoven highway, facilitating the rapid transmission of multiple signals.

[0003] In traditional technology, only copper circuits are used to transmit electrical signals inside the chip. Dozens of layers of copper circuits are staggered inside the chip, occupying a large amount of internal space, making it difficult to break through the problem of chip thickness compression. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a MEMS sensor chip structure to solve the problem that the prior art only uses copper circuits to transmit electrical signals inside the chip, which occupies a large space.

[0005] To achieve the above-mentioned and other related objectives, the present invention provides a MEMS sensor chip structure, comprising a substrate, an inertial sensing module disposed on the substrate, a signal transmission network disposed between the substrate and the inertial sensing module to form an electrical interconnection, and a cover plate that cooperates with the substrate package;

[0006] The signal transmission network includes a graphene circuit layer, a first graphene composite material circuit layer, a second graphene composite material circuit layer, and a metal circuit layer, which are sequentially distributed from bottom to top;

[0007] The graphene circuit layer is made of graphene material, and the thickness of the graphene circuit layer is 5-10 nanometers;

[0008] The first graphene composite material circuit layer is made of graphene doped with ferric chloride, and the thickness of the first graphene composite material circuit layer is 10-12 nanometers;

[0009] The second graphene composite material circuit layer is made of a graphene-doped copper material, and the thickness of the second graphene composite material circuit layer is 12-15 nanometers;

[0010] The metal circuit layer is made of copper material, and the thickness of the metal circuit layer is 12-15 nanometers.

[0011] In one embodiment of the present invention, the thicknesses of the graphene circuit layer, the first graphene composite material circuit layer, the second graphene composite material circuit layer, and the metal circuit layer increase sequentially from top to bottom.

[0012] In one embodiment of the present invention, the graphene circuit layer, the first graphene composite material circuit layer, the second graphene composite material circuit layer, and the metal circuit layer each include at least 20 signal lines, and the outer side of each signal line is circumferentially covered with an insulating layer.

[0013] In one embodiment of the present invention, the insulating layer is made of silicon oxide or a high dielectric constant material to isolate different circuit layers.

[0014] In one embodiment of the present invention, a support column is provided in an edge region of the substrate, and a cover plate is packaged on an upper end of the support column.

[0015] In one embodiment of the present invention, an anchor column is provided in the middle region of the substrate, and the anchor column is supported on the lower end of the graphene circuit layer.

[0016] In an embodiment of the present invention, the substrate and the cover are both made of silicon material.

[0017] In one embodiment of the present invention, the inertial sensing module includes one or more functional parts of an accelerometer unit, a gyroscope unit, a pressure sensor unit, and a magnetic sensor unit.

[0018] As described above, the MEMS sensor chip structure of the present invention has the following beneficial effects:

[0019] The utility model arranges the signal transmission network in layers between the substrate and the cover plate, and uses graphene, ferric chloride and metal as conductive materials to construct the circuit, thereby ensuring signal transmission while compressing the overall thickness of the circuit layer, thereby compressing the thickness of the MEMS sensor chip. The thinner MEMS sensor chip can reduce the overall thickness of the device, reduce power consumption and achieve higher response speed and accuracy, thereby improving the performance of the MEMS sensor chip, which is particularly important for application scenarios that require high integration and lightweight. By arranging support columns and anchor columns, the support columns can support the formation of an assembly space between the substrate and the cover plate to prevent the cover plate from damaging the inertial sensitive module and the signal transmission network due to pressure contact. The anchor columns can form support at the lower end of the signal transmission network to compensate for the strength problem of the graphene material as a circuit, thereby improving the performance of the signal transmission network. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a schematic diagram of the cross-sectional structure of the present utility model.

[0021] Figure 2 Shown is a structural schematic diagram of the signal transmission network in the present invention and a partial enlarged view of the signal transmission network.

[0022] Figure 3 Shown is an enlarged view of the outer insulating layer covering a single signal line in the signal transmission network of the present invention.

[0023] Figure 4 Shown is a top view of the distribution structure of the signal transmission network in the present invention.

[0024] Component number description

[0025] Substrate 1; inertial sensing module 2; signal transmission network 3; graphene circuit layer 31; first graphene composite material circuit layer 32; second graphene composite material circuit layer 33; metal circuit layer 34; insulating layer 35; cover plate 4; support column 5; anchor column 6; metal pad 7. DETAILED DESCRIPTION

[0026] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0027] See also Figures 1 to 4. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of this utility model. Therefore, they have no substantive technical significance. Any modification of the structure, change in the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by this utility model without affecting the efficacy and purpose that can be achieved by this utility model. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of this utility model. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this utility model without substantially changing the technical content.

[0028] See also Figure 1-4 The present invention provides a MEMS sensor chip structure, comprising a substrate 1, an inertial sensing module 2 arranged on the substrate 1, a signal transmission network 3 arranged in the substrate 1 and the inertial sensing module 2 to form an electrical interconnection, and a cover plate 4 packaged with the substrate 1; the substrate 1 is also provided with a metal pad 7, which is used to electrically connect to the PCB board in actual use; the inertial sensing module 2 includes one or more functional parts such as an accelerometer unit, a gyroscope unit, a pressure sensor unit, and a magnetic sensor unit; the substrate 1 and the cover plate 4 are both made of silicon material; a support column 5 is provided in the edge area of ​​the substrate 1, and the cover plate 4 is packaged at the upper end of the support column 5; the support column can support and form an assembly space between the substrate and the cover plate to prevent the cover plate 4 from pressing and damaging the inertial sensing module 2 and the signal transmission network 3; an anchor column 6 is provided in the middle area of ​​the substrate 1, and the anchor column 6 is supported at the lower end of the graphene circuit layer 31 to compensate for the strength problem of the graphene material as a circuit and improve the performance of the signal transmission network.

[0029] The signal transmission network 3 includes a graphene circuit layer 31, a first graphene composite material circuit layer 32, a second graphene composite material circuit layer 33, and a metal circuit layer 34, which are distributed in sequence from bottom to top; the graphene circuit layer 31 is made of graphene material, and the thickness of the graphene circuit layer 31 is 5-10 nanometers; the first graphene composite material circuit layer 32 is made of graphene doped with ferric chloride, and the thickness of the first graphene composite material circuit layer 32 is 10-12 nanometers; the second graphene composite material circuit layer 33 is made of graphene doped with copper material, and the thickness of the second graphene composite material circuit layer 33 is 12-15 nanometers; the metal circuit layer 34 is made of copper material, and the thickness of the metal circuit layer 34 is 12-15 nanometers. The thickness of the graphene circuit layer 31, the first graphene composite material circuit layer 32, the second graphene composite material circuit layer 33, and the metal circuit layer 34 increase in sequence from top to bottom. By arranging the signal transmission network 3 between the substrate 1 and the cover plate 4 in layers, and using graphene, ferric chloride, and metal as conductive materials to construct the circuit, the thickness of the circuit layer as a whole is compressed while ensuring signal transmission, thereby compressing the thickness of the MEMS sensor chip. A thinner MEMS sensor chip can reduce the overall thickness of the device, reduce power consumption, achieve higher response speed and accuracy, and improve the performance of the MEMS sensor chip. This is especially important for application scenarios that require high integration and lightweight. The utility model still uses a metal circuit layer 34 at the upper end of the signal transmission network 3, so that the signal transmission layer can be compressed. The strength of the transmission network 3 is guaranteed. The present invention utilizes graphene material in all other circuit layers of the signal transmission network 3. Graphene's extremely high carrier mobility enables fast signal transmission response speeds, which are crucial for applications requiring real-time monitoring and rapid response, such as autonomous driving and drone control. It ensures that sensors can promptly capture changes in accelerometers, angular velocity, and other parameters, providing accurate feedback to the system. Graphene also possesses excellent thermal conductivity, far exceeding that of metals such as gold and copper, making it one of the best known thermal conductors. Graphene's high thermal conductivity allows it to quickly conduct heat from the chip's interior to the exterior, effectively reducing chip temperature, ensuring sensor stability and reliability over extended periods of operation, extending sensor lifespan, and reducing failure rates. Compared to precious metals like gold and copper, graphene offers significant cost advantages, thereby enhancing product competitiveness. When graphene is used as a conductive material, its extremely high electrical conductivity and two-dimensional sheet-like structure allow for a significantly reduced cross-sectional area while maintaining the same electrical conductivity. This characteristic allows for more compact circuit layouts in chip design, reducing chip size and weight. In addition, a smaller cross-sectional area of ​​conductors also means lower resistance and less energy loss, which helps improve the overall performance and energy efficiency of the chip.

[0030] The graphene circuit layer 31, the first graphene composite material circuit layer 32, the second graphene composite material circuit layer 33, and the metal circuit layer 34 each include at least 20 signal lines, and the outer side of a single signal line is circumferentially covered with an insulating layer 35; the insulating layer 35 is made of silicon oxide or a high dielectric constant material such as aluminum oxide, zirconium oxide, etc., and is used to isolate different circuit layers to prevent charge leakage and contact short circuit.

[0031] In summary, the present invention utilizes a hierarchical structure for the signal transmission network 3, which offers a wider range of possibilities. Graphene is used in all of the multiple circuit layers, leveraging graphene's superior performance to ensure signal transmission while reducing the overall thickness of the signal transmission network. This, in turn, reduces the thickness of the MEMS sensor chip, improving its performance. The provision of support columns 5 and anchor columns 6 protects the inertial sensing module 2 and signal transmission network 3 within the chip, enhancing its performance. Therefore, the present invention effectively overcomes the shortcomings of the prior art and possesses high industrial value.

[0032] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A MEMS sensor chip structure comprising a substrate, an inertial sensing module disposed on the substrate, a signal transmission network disposed between the substrate and the inertial sensing module to form an electrical interconnection, and a cover plate for cooperating with the substrate package; Its characteristics are: The signal transmission network includes a graphene circuit layer, a first graphene composite material circuit layer, a second graphene composite material circuit layer, and a metal circuit layer, which are sequentially distributed from bottom to top; The graphene circuit layer is made of graphene material, and the thickness of the graphene circuit layer is 5-10 nanometers; The first graphene composite material circuit layer is made of graphene doped with ferric chloride, and the thickness of the first graphene composite material circuit layer is 10-12 nanometers; The second graphene composite material circuit layer is made of a graphene-doped copper material, and the thickness of the second graphene composite material circuit layer is 12-15 nanometers; The metal circuit layer is made of copper material, and the thickness of the metal circuit layer is 12-15 nanometers.

2. The MEMS sensor chip structure according to claim 1, wherein: The thicknesses of the graphene circuit layer, the first graphene composite material circuit layer, the second graphene composite material circuit layer, and the metal circuit layer increase sequentially from top to bottom.

3. The MEMS sensor chip structure according to claim 1, wherein: The graphene circuit layer, the first graphene composite material circuit layer, the second graphene composite material circuit layer, and the metal circuit layer each include at least 20 signal lines, and the outer side of each signal line is circumferentially covered with an insulating layer.

4. The MEMS sensor chip structure according to claim 3, wherein: The insulating layer is made of silicon oxide or a high dielectric constant material and is used to isolate different circuit layers.

5. The MEMS sensor chip structure according to claim 1, wherein: A supporting column is provided in the edge area of ​​the substrate, and the cover plate is packaged on the upper end of the supporting column.

6. The MEMS sensor chip structure according to claim 5, wherein: An anchor column is provided in the middle area of ​​the substrate, and the anchor column is supported on the lower end of the graphene circuit layer.

7. The MEMS sensor chip structure according to claim 6, wherein: The substrate and the cover plate are both made of silicon material.

8. The MEMS sensor chip structure according to claim 1, wherein: The inertial sensing module includes one or more functional parts of an accelerometer unit, a gyroscope unit, a pressure sensor unit, and a magnetic sensor unit.

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