Fixed-pitch glass sealed thermistor and temperature probe

Abstract

The utility model relates to the technical field of temperature sensors, in particular to a fixed-pitch glass sealed thermistor and a temperature probe, a resistor chip is used for sensing temperature change, and a first electrode and a second electrode are respectively arranged on two sides of thermal sensitive ceramic and are used for being connected with an external circuit; the first electrode is provided with a vertical surface, namely a first vertical mounting surface, for connecting a first wire; the second electrode is provided with a vertical surface, namely a second vertical mounting surface, for connecting a second wire; the first wire is connected with the first electrode and integrally positioned on the first vertical mounting surface of the first electrode, and the second wire is connected with the second electrode and integrally positioned on the second vertical mounting surface of the second electrode, so that the attachment area is increased, and stable connection between the wires and the electrodes is ensured; and meanwhile, stress or connection problems caused by improper positions of the wires are reduced. The wiring pin pitch can be fixed, and the wire position is stable.

Description

Technical Field

[0001] The present application relates to the technical field of temperature sensors, and in particular to a fixed-pitch glass-sealed thermistor and a temperature probe. Background Art

[0002] The primary function of a temperature probe is to accurately measure the temperature of an object. This sensor senses temperature through heat conduction or resistance changes between the sensor and the object, converting this temperature information into readable data. Thermistors are the core sensor components in temperature probes. Their resistance changes with temperature, making it particularly important to ensure the stability of thermistor operation.

[0003] In the prior art, see Figure 7 As shown, the leads are connected in parallel on both sides of the chip. The wiring spacing is affected by the chip thickness and the inner diameter of the glass shell. As a result, the spacing is very small under current technology, the creepage distance is short, and it is easily affected by moisture, causing the thermistor to short-circuit or reduce resistance, which is a technical difficulty in the industry. In addition, if traditional epoxy structure technology is used, refer to Figure 6 As shown, the chip electrode surface is parallel to the lead bending surface, the packaging process is easily affected by mutual stress, resulting in displacement, low high temperature stability, and unstable wiring spacing, which is not conducive to the deep processing and use of the thermistor.

[0004] Therefore, finding an appropriate thermistor structure is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] To address the problems existing in the prior art, this application provides a fixed-pitch glass-sealed thermistor and temperature probe that increases the attachment area, increases the creepage distance between wires, ensures a stable connection between the wires and the electrodes, and reduces stress or connection problems caused by improper wire positioning. This ensures a fixed wiring pitch and stable wire positioning.

[0006] In a first aspect, the present application provides a fixed pitch glass sealed thermistor, comprising:

[0007] A resistor chip, the resistor chip comprising a thermosensitive ceramic and a first electrode and a second electrode disposed on both sides of the thermosensitive ceramic, the first electrode having a first vertical mounting surface, and the second electrode having a second vertical mounting surface;

[0008] a first wire and a second wire, the first wire being connected to the first electrode, and the second wire being connected to the second electrode;

[0009] The first conductive line is entirely located on a first vertical mounting surface of the first electrode, and the second conductive line is entirely located on a second vertical mounting surface of the second electrode.

[0010] In one embodiment, the first vertical mounting surface is a virtual surface of the first electrode in a first vertical direction, and the second vertical mounting surface is a virtual surface of the second electrode in a second vertical direction.

[0011] In one embodiment, the first electrode and the second electrode are arranged in parallel on both sides of the thermosensitive ceramic.

[0012] In one embodiment, the first vertical mounting surface is parallel to the second vertical mounting surface.

[0013] In one embodiment, the first vertical mounting surface coincides with the second vertical mounting surface.

[0014] In one embodiment, the first conductive wire includes a first connecting portion, a first bending portion, and a first straight portion, and the second conductive wire includes a second connecting portion, a second bending portion, and a second straight portion.

[0015] In one embodiment, the first connecting portion of the first wire and the second connecting portion of the second wire are symmetrically arranged on both sides of the resistor chip, the first bending portion of the first wire and the second bending portion of the second wire are symmetrically arranged on both sides of the resistor chip, the first straight portion and the second straight portion are arranged in parallel, and the first spacing between the first straight portion and the second straight portion is greater than the second spacing between the first connecting portion and the second connecting portion.

[0016] In one embodiment, a glass shell is further included. The glass shell is arranged outside the resistor chip and at least the first connecting portion and the first bending portion of the first wire and the second connecting portion and the second bending portion of the second wire are accommodated in the glass shell.

[0017] In one embodiment, the cross-section of the glass shell is circular, oval or square.

[0018] In one embodiment, the first connecting portion, the first bending portion and the first straight portion of the first conductive wire are in the same plane and are parallel to or coincide with the first vertical mounting surface, and the second connecting portion, the second bending portion and the second straight portion of the second conductive wire are in the same plane and are parallel to or coincide with the second vertical mounting surface.

[0019] In one embodiment, the first wire and the first electrode surface are provided with a conductive electrode, the material of which is one of gold, silver, gold-silver alloy, palladium-silver alloy, and tungsten-manganese alloy; the second wire and the second electrode surface are provided with a conductive electrode, the material of which is one of gold, silver, gold-silver alloy, palladium-silver alloy, and tungsten-manganese alloy;

[0020] In a second aspect, the present application provides a temperature probe comprising the fixed-pitch glass-sealed thermistor according to any one of the first aspects.

[0021] The fixed-pitch glass-sealed thermistor and temperature probe provided by the present application have the following advantages compared to the prior art: the resistor chip is used to sense temperature changes, and the first and second electrodes are respectively arranged on either side of the thermistor ceramic for connection to an external circuit; the first electrode has a vertical surface for connecting to a first wire, namely a first vertical mounting surface; the second electrode has a vertical surface for connecting to a second wire, namely a second vertical mounting surface; the first wire is connected to the first electrode and is entirely located on the first vertical mounting surface of the first electrode, and the second wire is connected to the second electrode and is entirely located on the second vertical mounting surface of the second electrode, thereby increasing the attachment area, ensuring a stable connection between the wires and electrodes, and reducing stress or connection problems caused by improper wire positioning. This ensures a fixed wiring pitch and stable wire positioning.

[0022] Specifically, compared with the prior art, the present application increases the attachment area while increasing the wire spacing by positioning the first wire as a whole on the first vertical mounting surface of the first electrode and the second wire as a whole on the second vertical mounting surface of the second electrode, thereby ensuring a stable connection between the wires and the electrodes and reducing stress or connection problems caused by improper wire positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 This is a partial structural diagram of a fixed pitch glass sealed thermistor according to one embodiment;

[0025] Figure 2 This is a second schematic diagram of a partial structure of a fixed pitch glass sealed thermistor according to an embodiment;

[0026] Figure 3 This is a third schematic diagram of a partial structure of a fixed pitch glass sealed thermistor according to an embodiment;

[0027] Figure 4 This is a fourth schematic diagram of a partial structure of a fixed pitch glass sealed thermistor according to an embodiment;

[0028] Figure 5 FIG5 is a partial structural diagram of a fixed pitch glass sealed thermistor according to an embodiment;

[0029] Figure 6 This is the wiring method of epoxy structure thermistor in the prior art;

[0030] Figure 7 This is a conventional glass-sealed thermistor wiring method in the prior art.

[0031] Reference numerals:

[0032] 10. Thermosensitive ceramic; 11. First electrode; 21. Second electrode; 12. First vertical mounting surface; 22. Second vertical mounting surface; F11. First vertical direction; F21. Second vertical direction; 30. Glass shell; 31. First connecting portion; 32. First bending portion; 33. First straight portion; 41. Second connecting portion; 42. Second bending portion; 43. Second straight portion; 51. Existing connecting portion; 52. Existing straight portion. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this application.

[0034] In one embodiment, see Figure 1 As shown, the present application provides a fixed pitch glass sealed thermistor, comprising:

[0035] A resistor chip, comprising a thermosensitive ceramic 10 and a first electrode 11 and a second electrode 21 disposed on both sides of the thermosensitive ceramic 10, wherein the first electrode 11 has a first vertical mounting surface, and the second electrode 21 has a second vertical mounting surface 22;

[0036] a first wire and a second wire, wherein the first wire is connected to the first electrode 11 and the second wire is connected to the second electrode 21;

[0037] The first wire is entirely located on the first vertical mounting surface of the first electrode 11 , and the second wire is entirely located on the second vertical mounting surface 22 of the second electrode 21 .

[0038] It should be noted that the thermistor ceramic 10 is the core of the resistor chip, used to sense temperature changes. A first electrode 11 and a second electrode 21 are disposed on either side of the thermistor ceramic 10 for connection to an external circuit. The first electrode 11 has a vertical surface for connecting to a first wire, namely a first vertical mounting surface; the second electrode 21 has a vertical surface for connecting to a second wire, namely a second vertical mounting surface 22. The first wire is connected to the first electrode 11 and is positioned entirely on the first vertical mounting surface of the first electrode 11, while the second wire is connected to the second electrode 21 and is positioned entirely on the second vertical mounting surface 22 of the second electrode 21. This increases the attachment area, ensures a stable connection between the wires and electrodes, and reduces stress or connection issues caused by improper wire positioning. This ensures a fixed wiring pitch and stable wire positioning.

[0039] Specifically, compared with the prior art, the present application increases the attachment area while ensuring a stable connection between the wire and the electrode, by positioning the first wire as a whole on the first vertical mounting surface of the first electrode 11 and the second wire as a whole on the second vertical mounting surface 22 of the second electrode 21, while reducing stress or connection problems caused by improper wire positioning.

[0040] In one embodiment, see Figure 1 、 Figure 2 As shown, the first vertical mounting surface is a virtual surface on the first vertical direction F11 of the first electrode 11 , and the second vertical mounting surface 22 is a virtual surface on the second vertical direction F21 of the second electrode 21 .

[0041] It should be noted that the electrodes are set on the corresponding virtual surfaces.

[0042] In one embodiment, see Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, the first electrode 11 and the second electrode 21 are arranged in parallel on both sides of the thermosensitive ceramic 10 .

[0043] It should be noted that the first electrode 11 and the second electrode 21 are arranged in parallel on both sides of the thermistor 10. When the thermistor moves or shakes as a whole, the stresses acting on the first electrode 11 and the second electrode 21 offset each other, thereby maintaining overall stability.

[0044] In one embodiment, the first vertical mounting surface is parallel to the second vertical mounting surface 22 .

[0045] It should be noted that the position stability of the wires is improved.

[0046] In one embodiment, the first vertical mounting surface coincides with the second vertical mounting surface 22 .

[0047] It should be noted that when the first vertical mounting surface is parallel to the second vertical mounting surface 22, the connection areas of the first electrode 11 and the second electrode 21 are aligned in the vertical direction. The parallel mounting surfaces can ensure that the wires do not generate additional stress or distortion during connection, thereby improving the stability and reliability of the thermistor.

[0048] In one embodiment, the first conductive wire includes a first connecting portion 31 , a first bending portion 32 , and a first straight portion 33 , and the second conductive wire includes a second connecting portion 41 , a second bending portion 42 , and a second straight portion 43 .

[0049] Specifically, in the prior art, see Figure 7 As shown, the leads used to connect the thermal ceramic 10 are closely spaced, resulting in a short creepage distance and a tendency to short circuit when exposed to moisture. Conventional leads are connected to both sides of the chip, making them prone to displacement and unstable. Conventional connecting portion 51 and conventional straight portion 52 are coplanar, and the conventional connection method of connecting portion 51 is not stable.

[0050] It should be noted that the first connecting portion 31 is the portion where the wire directly connects to the first electrode 11 on the resistor chip. The first connecting portion 31 fits tightly against the surface of the first electrode 11 to ensure good electrical and mechanical connection. The design of the first bent portion 32 allows the wire to flexibly adjust its direction within a limited space to accommodate different packaging requirements while increasing the spacing between the first and second wires. The first straight portion 33 is used to connect to other devices for ease of manufacturing and processing. The second connecting portion 41 is the portion where the wire directly connects to the second electrode 21 on the resistor chip. The second connecting portion 41 fits tightly against the surface of the second electrode 21 to ensure good electrical and mechanical connection. The design of the second bent portion 42 allows the wire to flexibly adjust its direction within a limited space to accommodate different packaging requirements while increasing the spacing between the first and second wires. The second straight portion 43 is used to connect to other devices for ease of manufacturing and processing.

[0051] In one embodiment, the first connecting portion 31 of the first wire and the second connecting portion 41 of the second wire are symmetrically arranged on both sides of the resistor chip, the first bending portion 32 of the first wire and the second bending portion 42 of the second wire are symmetrically arranged on both sides of the resistor chip, the first straight portion 33 and the second straight portion 43 are arranged in parallel, and the first spacing between the first straight portion 33 and the second straight portion 43 is greater than the second spacing between the first connecting portion 31 and the second connecting portion 41.

[0052] It should be noted that the first connecting portion 31 and the second connecting portion 41 are symmetrically arranged to improve stability. The first spacing between the first straight portion 33 and the second straight portion 43 is greater than the second spacing between the first connecting portion 31 and the second connecting portion 41, which increases the spacing between the first wire and the second wire, making the circuit more stable.

[0053] In one embodiment, see Figure 4 、 Figure 5 As shown, a glass shell 30 is further included, which is arranged outside the resistor chip and at least the first connecting portion 31 and the first bending portion 32 of the first wire and the second connecting portion 41 and the second bending portion 42 of the second wire are accommodated in the glass shell 30.

[0054] It should be noted that the first connecting portion 31 and the first bending portion 32 of the first wire and the second connecting portion 41 and the second bending portion 42 of the second wire are accommodated in the glass shell 30, ensuring the sealing, stability and reliability of the entire thermistor.

[0055] Specifically, at the same time, the first bend portion 32 and the second bend portion 42 expand the wires outward in the same plane and fuse them into the glass shell 30, so that the wire spacing at the position where the wires exit the glass shell 30 is increased, the creepage distance is increased, and the risk of the overall resistance value of the thermistor decreasing is reduced.

[0056] In one embodiment, the cross-section of the glass shell 30 is circular, oval or square.

[0057] It should be noted that the cross-section of the glass shell 30 is not limited to circular, oval or square, and may also be other shapes.

[0058] In one embodiment, the first connecting portion 31, the first bending portion 32 and the first straight portion 33 of the first conductive wire are in the same plane and are parallel to or coincide with the first vertical mounting surface, and the second connecting portion 41, the second bending portion 42 and the second straight portion 43 of the second conductive wire are in the same plane and are parallel to or coincide with the second vertical mounting surface 22.

[0059] It should be noted that the design in which the respective parts of the first conductive wire and the second conductive wire are parallel to or overlap with their respective corresponding vertical mounting surfaces of the electrodes can improve stability and reliability.

[0060] In one embodiment, the first wire and the first electrode 11 are provided with a conductive electrode, the material of which is one of gold, silver, gold-silver alloy, palladium-silver alloy, and tungsten-manganese alloy; the second wire and the second electrode 21 are provided with a conductive electrode, the material of which is one of gold, silver, gold-silver alloy, palladium-silver alloy, and tungsten-manganese alloy.

[0061] It should be noted that the stability of the electrode connection is improved.

[0062] In a second aspect, the present application provides a temperature probe comprising the fixed-pitch glass-sealed thermistor according to any one of the first aspects.

[0063] It should be noted that in the temperature probe provided by this application, the thermistor ceramic 10 is the core part of the resistor chip, used to sense temperature changes. The first electrode 11 and the second electrode 21 are respectively arranged on both sides of the thermistor ceramic 10 for connecting to an external circuit. The first electrode 11 has a vertical surface for connecting to a first wire, namely a first vertical mounting surface; the second electrode 21 has a vertical surface for connecting to a second wire, namely a second vertical mounting surface 22. The first wire is connected to the first electrode 11 and is entirely located on the first vertical mounting surface of the first electrode 11. The second wire is connected to the second electrode 21 and is entirely located on the second vertical mounting surface 22 of the second electrode 21. This increases the attachment area, ensures a stable connection between the wire and the electrode, and reduces stress or connection problems caused by improper wire positioning. This can ensure a fixed wiring pitch and stable wire positioning.

[0064] It should be noted that when an element is referred to as being “fixed on” or “set on” another component, it can be directly on the other component or indirectly set on the other component; when a component is referred to as being “connected to” another component, it can be directly connected to the other component or indirectly connected to the other component.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" or "several" means two or more, unless otherwise specifically defined.

[0066] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application.

[0067] The above description of the disclosed embodiments will enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. Fixed pitch glass sealed thermistor, characterized by: include: A resistor chip, the resistor chip comprising a thermosensitive ceramic and a first electrode and a second electrode disposed on both sides of the thermosensitive ceramic, the first electrode having a first vertical mounting surface, and the second electrode having a second vertical mounting surface; a first wire and a second wire, the first wire being connected to the first electrode, and the second wire being connected to the second electrode; The first conductive line is entirely located on a first vertical mounting surface of the first electrode, and the second conductive line is entirely located on a second vertical mounting surface of the second electrode.

2. The fixed pitch glass sealed thermistor according to claim 1, wherein: The first vertical mounting surface is a virtual surface of the first electrode in a first vertical direction, and the second vertical mounting surface is a virtual surface of the second electrode in a second vertical direction.

3. The fixed pitch glass sealed thermistor according to claim 1, wherein: The first electrode and the second electrode are arranged in parallel on both sides of the thermosensitive ceramic.

4. The fixed pitch glass sealed thermistor according to claim 1, wherein: The first vertical mounting surface is parallel to the second vertical mounting surface; Alternatively, the first vertical mounting surface coincides with the second vertical mounting surface.

5. The fixed pitch glass sealed thermistor according to claim 1, wherein: The first conductive wire includes a first connecting portion, a first bending portion, and a first straight portion, and the second conductive wire includes a second connecting portion, a second bending portion, and a second straight portion.

6. The fixed pitch glass sealed thermistor according to claim 5, wherein: The first connecting portion of the first wire and the second connecting portion of the second wire are symmetrically arranged on both sides of the resistor chip, the first bending portion of the first wire and the second bending portion of the second wire are symmetrically arranged on both sides of the resistor chip, the first straight portion and the second straight portion are arranged in parallel, and the first spacing between the first straight portion and the second straight portion is greater than the second spacing between the first connecting portion and the second connecting portion.

7. The fixed pitch glass sealed thermistor according to claim 5, wherein: It also includes a glass shell, which is arranged outside the resistor chip and contains at least the first connecting portion and the first bending portion of the first wire and the second connecting portion and the second bending portion of the second wire.

8. The fixed pitch glass sealed thermistor according to claim 5, wherein: The first connecting portion, first bending portion and first straight portion of the first wire are in the same plane and parallel to or coincide with the first vertical mounting surface. The second connecting portion, second bending portion and second straight portion of the second wire are in the same plane and parallel to or coincide with the second vertical mounting surface.

9. The fixed pitch glass sealed thermistor according to claim 5, wherein: The first wire and the first electrode surface are provided with a conductive electrode, the material of which is one of gold, silver, gold-silver alloy, palladium-silver alloy, and tungsten-manganese alloy; the second wire and the second electrode surface are provided with a conductive electrode, the material of which is one of gold, silver, gold-silver alloy, palladium-silver alloy, and tungsten-manganese alloy.

10. A temperature probe, characterized in that: The fixed-pitch glass-sealed thermistor comprises the fixed-pitch glass-sealed thermistor according to any one of claims 1 to 9.

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