Efficient liquid cooling heat dissipation device

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a high-efficiency liquid cooling heat dissipation device. The device comprises a liquid inlet pipe and a liquid return pipe, and a liquid cooling plate assembly is connected between the liquid inlet pipe and the liquid return pipe in series; the liquid cooling plate assembly comprises flow dividing pipes on the two sides and a plurality of liquid cooling plates connected between the flow dividing pipes. The two ends of each liquid cooling plate are provided with flow channel openings, and the interior of each liquid cooling plate is provided with a flow channel communicating the flow channel openings in the two ends. Flow channel openings in the two ends of each liquid cooling plate are connected to the flow dividing pipes on the two sides; a cooling gap is formed between every two adjacent liquid cooling plates and is used for accommodating a heating device; the surface of the liquid cooling plate is further covered with a heat conduction sheet containing a graphene layer. According to the liquid cooling heat dissipation device, not only is the heat dissipation performance improved, but also comprehensive optimization is carried out in the aspects of structural design, material selection, connection modes and the like, so that the liquid cooling heat dissipation device is more suitable for application requirements in a high-performance computing environment.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and in particular relates to a high-efficiency liquid cooling heat dissipation device. Background Art

[0002] With the rapid development of the information technology and communications industries, the demand for data centers and high-performance computing equipment is increasing. To meet the storage and processing requirements of these devices, the performance of server memory modules continues to improve, but this is accompanied by a sharp increase in power consumption. During operation, memory modules release a large amount of heat, posing a serious threat to the stable operation and security of servers.

[0003] Traditional air cooling technology relies primarily on fan-generated airflow to accelerate air flow, thereby improving the heat dissipation efficiency of the heat sink. However, for memory modules with compact dimensions and limited surface area, traditional air cooling methods struggle to effectively remove heat. Especially in high-density deployments and high-power computing conditions, air cooling often fails to meet the cooling requirements of modern high-performance computing equipment. Furthermore, traditional air cooling systems suffer from drawbacks such as high noise levels, space requirements, and high maintenance costs.

[0004] In recent years, liquid cooling technology has gained increasing attention due to its superior heat dissipation performance. Liquid cooling utilizes liquid as a heat transfer medium, rapidly dissipating heat through the circulation of the liquid. Its heat dissipation efficiency is far superior to traditional air cooling. However, existing liquid cooling devices still have some design limitations, such as complex structure, large space requirements, difficult installation, and high cost, which significantly limit their widespread adoption in practical applications.

[0005] This utility model aims to address these issues by providing an efficient, compact, and easy-to-install liquid cooling device, particularly suitable for cooling server memory modules. By optimizing the design of the liquid cooling plate and the selection of thermally conductive materials, this utility model significantly improves heat dissipation efficiency, ensuring stable operation of memory modules under high loads, while also reducing energy consumption and maintenance costs, and enhancing overall system performance and reliability. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides an efficient, compact, and easy-to-install liquid cooling device suitable for the cooling needs of server memory modules. By optimizing the structure of the liquid cooling plate and components, as well as the overall spatial layout, this utility model aims to significantly improve cooling efficiency, ensuring stable operation of the memory modules under high load conditions, while reducing production and maintenance costs and enhancing the overall performance and reliability of the system.

[0007] The utility model provides a high-efficiency liquid cooling heat dissipation device, comprising a liquid inlet pipe and a liquid return pipe, with a liquid cooling plate assembly connected in series between the liquid inlet pipe and the liquid return pipe; the liquid cooling plate assembly comprises shunt pipes on both sides and a plurality of liquid cooling plates connected between the shunt pipes; each liquid cooling plate has flow channel openings at both ends, and has flow channels inside that connect the flow channel openings at both ends; the flow channel openings at both ends of each liquid cooling plate are connected to the shunt pipes on both sides; a cooling gap is provided between two adjacent liquid cooling plates for accommodating heating devices; the surface of the liquid cooling plate is also covered with a heat-conducting sheet containing a graphene layer.

[0008] As a further optimization solution, the thermal conductive sheet includes an adhesive layer, a graphene thermal conductive film, a foam layer and a polyimide film layer from the inside to the outside of the liquid cooling plate surface.

[0009] As a further optimization solution, part of the heat conductive sheet is attached to one side surface of the liquid cooling plate, and another part of the heat conductive sheet is attached to the other side surface of the liquid cooling plate. The two parts of the heat conductive sheet on both sides of the liquid cooling plate are bent at the edge of the liquid cooling plate.

[0010] As a further optimization solution, the heat conducting sheet has a folding groove at the edge facing the liquid cooling plate.

[0011] As a further optimization solution, the thermal conductive sheet has a foam layer, a continuous graphene thermal conductive film is wrapped on the outside of the foam layer, an adhesive layer is provided on one side of the graphene thermal conductive film, and a polyimide film layer is provided on the other side of the graphene thermal conductive film; the side of the thermal conductive sheet close to the liquid cooling plate corresponds to the adhesive layer, and the side away from the liquid cooling plate corresponds to the polyimide film layer.

[0012] As a further optimization solution, at the two side edges of the liquid cooling plate, the outer side of the graphene thermal conductive film is covered by another part of foam material to protect the folded part of the graphene thermal conductive film.

[0013] As a further optimization solution, the heat conductive sheet has a folding groove at the edge facing the liquid cooling plate, and the folding groove partially penetrates the foam layer.

[0014] As a further optimization scheme, a pair of oppositely arranged first liquid cooling plate assemblies are connected in series between the liquid inlet pipe and the liquid return pipe; each first liquid cooling plate assembly includes a pair of parallel first diversion pipes and a plurality of liquid cooling plates connected between the first diversion pipes; in the same first liquid cooling plate assembly, each first diversion pipe is provided with a confluence port at one end close to the other first liquid cooling plate assembly, and is closed at one end away from the other first liquid cooling plate assembly; a group of diversion ports arranged along the length direction of the axis of the first diversion pipe are provided on the side wall of each first diversion pipe; the flow channel openings at both ends of each liquid cooling plate are respectively connected to the diversion ports of the first diversion pipes on both sides of the first liquid cooling plate assembly.

[0015] As a further optimization solution, one confluence port in a first liquid cooling plate assembly is connected to a confluence port pipe in another first liquid cooling plate assembly; the other two confluence ports in a pair of first liquid cooling plate assemblies are respectively connected to the liquid inlet pipe and the liquid return pipe.

[0016] As a further optimization scheme, at least one second liquid cooling plate assembly is connected in series between a pair of first liquid cooling plate assemblies; the second liquid cooling plate assembly includes a second diverter tube and a third diverter tube arranged in parallel, and also includes a plurality of liquid cooling plates connected between the second diverter tube and the third diverter tube; a confluence port is provided at both ends of the second diverter tube; a partition node is provided in the center of the second diverter tube, and the partition node divides the second diverter tube into a first flow section and a second flow section, the first flow section is close to the liquid inlet pipe, and the second flow section is close to the liquid return pipe; a group of diversion ports arranged along the axis direction of the second diverter tube are provided on the side walls of the first flow section and the second flow section; both ends of the third diverter tube are closed; a group of diversion ports arranged along the axis direction of the third diverter tube are provided on the side wall of the third diverter; a plurality of liquid cooling plates are arranged between the second diverter tube and the third diverter tube on both sides along the axis direction of the second diverter tube, and the flow channel ports at both ends of each liquid cooling plate are respectively connected to the diversion ports of the second diverter tube and the diversion ports of the third diverter tube on both sides of the second liquid cooling plate assembly.

[0017] As a further optimization solution, the liquid cooling plate is connected to the first shunt pipe, the second shunt pipe, and the third shunt pipe by brazing.

[0018] As a further optimization solution, the liquid cooling plate includes a guide frame with openings at both ends; sealing plates are provided on both sides of the guide frame; the gap between the guide frame and the sealing plate forms a flow channel, and the openings at both ends of the guide frame are clamped by the sealing plates on both sides to form a flow channel opening.

[0019] As a further optimization solution, an avoidance groove is provided on the liquid cooling plate.

[0020] As a further optimization solution, connecting parts are provided at both ends of the liquid inlet pipe and the liquid return pipe. The connecting part at one end of the liquid inlet pipe is connected to a confluence in a first liquid cooling plate assembly, and the connecting part at one end of the liquid return pipe is connected to a confluence in another first liquid cooling plate assembly.

[0021] As a further optimization solution, the liquid inlet pipe and the liquid return pipe are both polytetrafluoroethylene bellows.

[0022] Beneficial effects

[0023] The device cools the memory sticks through liquid cooling, which can effectively and quickly remove the heat generated by the memory sticks, ensuring the stable operation of the memory sticks during high-performance computing and avoiding performance degradation or hardware damage caused by overheating.

[0024] The liquid cooling plate assembly has a compact structure and a regular spatial layout, allowing the layout of the liquid cooling plate assembly to be flexibly adjusted according to actual needs, reducing the space occupied by the assembly, while optimizing the flow path of the coolant and improving cooling efficiency.

[0025] A graphene-based thermally conductive sheet is added to the surface of the liquid cold plate. Graphene's high thermal conductivity more effectively transfers heat from the heat source to the coolant, further improving heat dissipation efficiency. Furthermore, the addition of a foam layer enhances the sheet's resilience and adaptability, ensuring close contact with the memory modules and eliminating the effects of poor thermal conductivity media such as air.

[0026] The polyimide film layer on the outermost layer of the thermal conductive sheet has good electrical insulation properties, which can prevent the occurrence of short circuits in harsh environments such as high temperature, high humidity, and dust, thereby improving the safety and reliability of the system.

[0027] The structure of the thermal conductive sheet also makes installation easy. The folding groove design at the edge of the liquid cooling plate simplifies the installation process and ensures the flatness and aesthetics after installation. It also ensures that the thermal conductive sheet is not easy to fall off during long-term use or external impact, thereby extending the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the structure of the liquid cooling device in Example 1;

[0029] Figure 2 Schematic diagram of the structure of the first liquid cooling plate assembly;

[0030] Figure 3 This is an exploded view of the liquid cooling plate;

[0031] Figure 4 Schematic diagram of the structure of the liquid cooling device in Example 2;

[0032] Figure 5 is a structural schematic diagram of the second liquid cooling plate assembly;

[0033] Figure 6 Schematic diagram of the structure of the liquid cooling device in Examples 3 and 4;

[0034] Figure 7 Schematic diagram of the structure of the heat conducting sheet in Example 3;

[0035] Figure 8 Schematic cross-sectional view of the thermal conductive sheet in Example 3;

[0036] Figure 9 Schematic cross-sectional view of the thermal conductive sheet in Example 4.

[0037] In the figure: 1. First liquid cooling plate assembly; 2. Second liquid cooling plate assembly; 4. Liquid cooling plate; 6. Cooling gap; 9. Heat conducting sheet; 31. Liquid inlet pipe; 32. Liquid return pipe; 33. Double-hole pipe clamp; 34. Connecting part; 42. Guide frame; 43. Sealing plate; 44. Avoidance groove; 51. First diverter pipe; 52. Second diverter pipe; 53. Third diverter pipe; 54. Confluence port; 91. Adhesive layer; 92. Graphene thermal conductive film; 93. Foam layer; 94. Polyimide film layer; 95. Folding groove; 521. Partition node; 522. First flow section; 523. Second flow section. DETAILED DESCRIPTION

[0038] Example 1

[0039] like Figure 1 As shown, the liquid cooling device provided in this embodiment includes a liquid inlet pipe 31 and a liquid return pipe 32. A pair of opposed first liquid cold plate assemblies 1 are connected in series between the liquid inlet pipe 31 and the liquid return pipe 32. The first liquid cold plate assemblies 1 are used to accommodate memory modules and cool the memory modules through internal circulating liquid cooling.

[0040] like Figure 2 As shown, each first liquid cooling plate assembly 1 includes a pair of parallel first manifold tubes 51 and a plurality of liquid cooling plates 4 connected between the first manifold tubes 51. Within the same first liquid cooling plate assembly 1, each first manifold tube 51 has a confluence port 54 at one end proximal to the other first liquid cooling plate assembly 1 for coolant circulation, while the end distal to the other first liquid cooling plate assembly 1 is closed. A set of manifold ports are defined on the sidewalls of each first manifold tube 51 for coolant circulation. Each liquid cooling plate 4 has flow openings at both ends, and a flow channel is internally provided connecting the two openings. Within each first liquid cooling plate assembly 1, a plurality of liquid cooling plates 4 are arranged along the axis of the first manifold tubes 51, between the first manifold tubes 51 on either side. The flow openings at both ends of each liquid cooling plate 4 are connected to the flow openings of the first manifold tubes 51 on either side. Within the same first liquid cooling plate assembly 1, a gap, or cooling gap 6, is defined between two adjacent liquid cooling plates 4 to accommodate memory modules.

[0041] During operation, the coolant enters the liquid cooling plate assembly from the liquid inlet pipe 31 and then flows back from the liquid return pipe 32, forming a cycle. The heat is quickly removed by circulating liquid cooling, which is suitable for application scenarios where memory bars are quickly cooled during high-performance computing.

[0042] The memory sticks are inserted between adjacent liquid cooling plates 4, which can quickly transfer the heat generated by the memory sticks from both sides, thereby preventing performance degradation or damage caused by excessive temperature.

[0043] like Figure 1 and Figure 2As shown, the pair of opposing first liquid cold plate assemblies 1 each utilize a first manifold 51 with a confluence opening 54 at one end and a closed end at the other, creating a compact cooling circuit for the coolant. This compact circuit layout reduces component space and reduces the length and curvature of the coolant flow path, thereby lowering coolant flow resistance and improving circulation efficiency.

[0044] The first manifold 51 is preferably made of T2 copper, obtained by extrusion casting to obtain a blank, which is then machined and trimmed. T2 copper has stable chemical properties, allowing the first manifold 51 to be used in liquid-cooled heat sinks for long periods of time. T2 copper also exhibits excellent cold and hot working properties, making it easy to process and shape.

[0045] In the first liquid cooling plate assembly 1, the liquid cooling plate 4 is brazed to the first manifold 51. Brazing can form a seamless metal connection, preventing coolant leakage and ensuring tightness between the liquid cooling plate 4 and the first manifold 51.

[0046] like Figure 1 As shown, one conduit 54 in one first liquid cooling plate assembly 1 is connected to one conduit 54 in another first liquid cooling plate assembly 1 via a pipe. The other two conduits 54 in a pair of first liquid cooling plate assemblies 1 are connected to the liquid inlet pipe 31 and the liquid return pipe 32, respectively, making the spatial layout compact while also allowing for a certain degree of flexibility.

[0047] like Figure 3 As shown, the liquid cooling plate 4 includes a guide frame 42 with openings at both ends. Sealing plates 43 are provided on either side of the guide frame 42. The gap between the guide frame 42 and the sealing plates 43 serves as a flow channel for the coolant to flow through the entire liquid cooling plate 4. The openings at both ends of the guide frame 42 are sandwiched between the sealing plates 43 to form the flow channel openings.

[0048] The guide frame 42 and the sealing plate 43 are preferably made of 304 stainless steel. 304 stainless steel has excellent corrosion resistance and high strength, protecting the liquid cooling plate 4 from corrosion by the coolant, ensuring long-term stable operation of the liquid cooling device. The guide frame 42 and the sealing plate 43 are also preferably brazed together.

[0049] like Figure 3 As shown, the liquid cooling plate 4 is also provided with a relief groove 44. The shape of the memory stick is usually irregular, and the relief groove 44 allows the liquid cooling plate 4 to better fit the memory stick, while also facilitating the insertion and removal of the memory stick into and out of the cooling gap 6 between the liquid cooling plates 4.

[0050] like Figure 1As shown, one or more double-hole pipe clamps 33 may be provided between the liquid inlet pipe 31 and the liquid return pipe 32 to help secure the liquid inlet pipe 31 and the liquid return pipe 32 and regulate their arrangement. Connectors 34 may be provided at both ends of the liquid inlet pipe 31 and the liquid return pipe 32 to facilitate pipe connection. Preferably, both the liquid inlet pipe 31 and the liquid return pipe 32 are polytetrafluoroethylene bellows.

[0051] Example 2

[0052] like Figure 4 As shown, the difference from embodiment 1 is that in this embodiment, one or more second liquid cooling plate assemblies 2 are connected in series between a pair of first liquid cooling plate assemblies 1 .

[0053] like Figure 5 As shown, the second liquid cooling plate assembly 2 includes a second diversion pipe 52 and a third diversion pipe 53 arranged in parallel, and also includes a plurality of liquid cooling plates 4 connected between the second diversion pipe 52 and the third diversion pipe 53 .

[0054] The second diverter tube 52 has a confluence port 54 at both ends and a partition node 521 in the center. The partition node 521 divides the second diverter tube 52 into a first flow section 522 and a second flow section 523. A group of diverter ports are provided on the side walls of the first flow section 522 and the second flow section 523. The third diverter tube 53 is closed at both ends and has a group of diverter ports on the side walls. Several liquid cooling plates 4 are arranged between the second diverter tube 52 and the third diverter tube 53 on both sides. The flow channel ports at both ends of each liquid cooling plate 4 are respectively connected to the diverter ports of the second diverter tube 52 and the diverter ports of the third diverter tube 53 on both sides of the second liquid cooling plate assembly 2. In the same second liquid cooling plate assembly 2, there is a gap between two adjacent liquid cooling plates 4, namely the cooling gap 6, to accommodate the memory modules.

[0055] After the coolant flows into the second diversion pipe 52 from the confluence port 54 of the first flow section 522, it flows into the third diversion pipe 53 through the liquid cooling plate 4 on the side of the first flow section 522 of the second liquid cooling plate assembly 2, and then flows into the second flow section 523 of the second diversion pipe 52 through the liquid cooling plate 4 on the side of the second flow section 523 of the second liquid cooling plate 4, and finally flows out from the confluence port 54 of the second flow section 523, forming a circuitous flow path.

[0056] Compared with Example 1, the layout of Example 2 can arrange more liquid cooling plates 4 within a certain range, form more cooling gaps, and increase the cooling capacity. It also helps to reduce the space occupied by the liquid cooling plate assembly and the associated pipelines in the chassis, and improve the regularity of the liquid cooling plate assembly and the associated pipelines.

[0057] Example 3

[0058] like Figure 6As shown, different from Example 2, the surfaces of the liquid cooling plates 4 in the first liquid cooling plate assembly 1 and the second liquid cooling plate assembly 2 in this embodiment are further provided with a heat conducting sheet 9, which is a graphene-based heat conducting sheet.

[0059] like Figure 6 、 Figure 7 、 Figure 8 As shown, each liquid cooling plate 4 is wrapped with a heat conducting sheet 9 , which includes an adhesive layer 91 , a graphene heat conducting film 92 , a foam layer 93 and a polyimide film layer 94 from the inside to the outside of the liquid cooling plate 4 .

[0060] Graphene is a material with extremely high thermal conductivity, far exceeding that of traditional metal materials. The graphene thermally conductive film 92 applied to the surface of the liquid cooling plate 4 effectively conducts heat from the heat source to the coolant, accelerating heat transfer and improving overall heat dissipation efficiency. The foam layer 93 imparts excellent resilience to the thermally conductive sheet 9. After deformation under pressure, the thermally conductive sheet 9 generates a force to restore its original shape. This helps it fit tightly into irregular gaps between the memory stick and the liquid cooling plate 4, ensuring that no poor heat-conducting media, such as air, are present between the two, thereby improving heat dissipation efficiency. The compressibility and elasticity of the thermally conductive sheet 9 allow it to adapt to varying installation forces during memory stick installation. This prevents the memory stick from being difficult to insert due to excessive rigidity and ensures that it is not damaged during installation. The outermost layer of the thermally conductive sheet 9 is a polyimide film layer 94, which offers excellent electrical insulation properties. This ensures that the thermally conductive sheet 9 will not cause circuit short circuits even in harsh environments such as high temperature, high humidity, and high dust levels, thereby enhancing system safety and reliability.

[0061] like Figure 6 、 Figure 7 、 Figure 8 As shown, a portion of the heat-conducting sheet 9 is attached to one side surface of the liquid cooling plate 4, and another portion of the heat-conducting sheet 9 is attached to the other side surface of the liquid cooling plate 4. The two portions of the heat-conducting sheet 9 are bent 180° at the edge of the liquid cooling plate 4; the heat-conducting sheet 9 has a folding groove 95 facing the edge of the liquid cooling plate 4.

[0062] By bending the heat-conducting sheet 9 180° at the edge of the liquid cooling plate 4 and providing a folding groove 95 at the position opposite the edge, the integrity of the heat-conducting sheet 9 and the bonding force with the liquid cooling plate 4 can be effectively enhanced, thereby preventing the heat-conducting sheet 9 from falling off during long-term use or when subjected to external impact. The folding groove 95 makes the bending of the heat-conducting sheet 9 at the edge of the liquid cooling plate 4 smoother and more natural, reduces stress concentration, and avoids damage caused by excessive bending of the material. This not only simplifies the installation process of the heat-conducting sheet 9, but also ensures the flatness and aesthetics after installation. Moreover, the polyimide film layer 94, as the outermost layer of the heat-conducting sheet 9, has good electrical insulation properties. The bending at the edge of the liquid cooling plate 4 ensures continuous coverage of the polyimide film layer 94 over the entire edge area, further improving the electrical safety of the system and avoiding the risk of short circuits due to exposed edges.

[0063] Example 4

[0064] like Figure 6 、 Figure 9 As shown, different from Example 3, the heat conducting sheet 9 in this embodiment adopts a graphene wrapped structure.

[0065] like Figure 9 As shown, the thermal conductive sheet 9 has a foam layer 93 in the middle, and a continuous graphene thermal conductive film 92 is wrapped on the outside of the foam layer 93. An adhesive layer 91 is provided on one side of the graphene thermal conductive film 92, and a polyimide film layer 94 is provided on the other side of the graphene thermal conductive film 92; the side of the thermal conductive sheet 9 close to the liquid cooling plate 4 corresponds to the adhesive layer 91, and the side away from the liquid cooling plate 4 corresponds to the polyimide film layer 94.

[0066] As mentioned above, the thermally conductive sheet 9 utilizes a graphene wrapping structure, with the graphene thermally conductive film 92 wrapped around the outside of the foam layer 93. This effectively and rapidly conducts heat from the heat source to the liquid cooling plate 4, where it is then removed by the coolant. This significantly improves overall heat dissipation efficiency, ensuring stable operation of the memory modules during high-performance computing. Furthermore, this structure of the thermally conductive sheet 9 maintains its excellent mechanical properties, ease of installation, electrical safety, and durability.

[0067] A portion of the heat conducting sheet 9 is attached to one side of the liquid cooling plate 4, and another portion of the heat conducting sheet 9 is attached to the other side of the liquid cooling plate 4. The two portions of the heat conducting sheet 9 are bent 180 degrees at the edge of the liquid cooling plate 4. Figure 9 As shown, the heat conducting sheet 9 has a folding groove 95 at the edge facing the liquid cooling plate 4 .

[0068] Since the gap between the liquid cooling plates 4 is small, the presence of the folding groove 95 not only facilitates the preforming of the heat conducting sheet 9 , but also facilitates the installation of the heat conducting sheet 9 and the cooling plate.

[0069] Preferably, at both side edges of the liquid cooling plate 4 , the outer side of the graphene thermal conductive film 92 is covered by another portion of foam material to ensure the continuity and reliability of the graphene thermal conductive film 92 .

[0070] The above embodiments are exemplary. Their purpose is to illustrate the technical concepts and features of this embodiment so that those skilled in the art can understand the content of this embodiment and implement it accordingly. They are not intended to limit the scope of protection of this embodiment. Any equivalent changes or modifications made based on the spirit of this embodiment shall be included in the scope of protection of this embodiment.

Claims

1. A high-efficiency liquid cooling device, characterized by: The invention comprises a liquid inlet pipe (31) and a liquid return pipe (32), wherein a liquid cooling plate assembly is connected in series between the liquid inlet pipe (31) and the liquid return pipe (32); the liquid cooling plate assembly comprises a shunt pipe on both sides and a plurality of liquid cooling plates (4) connected between the shunt pipes; each of the liquid cooling plates (4) has a flow channel opening at both ends, and has a flow channel inside for connecting the flow channel openings at both ends; the flow channel openings at both ends of each liquid cooling plate (4) are connected to the shunt pipes on both sides; a cooling gap (6) is provided between two adjacent liquid cooling plates (4) for accommodating a heating device; the surface of the liquid cooling plate (4) is also covered with a heat-conducting sheet (9) containing a graphene layer.

2. The high-efficiency liquid cooling device according to claim 1, characterized in that: The heat-conducting sheet (9) comprises, from the inside to the outside of the surface of the liquid cooling plate (4), an adhesive layer (91), a graphene heat-conducting film (92), a foam layer (93) and a polyimide film layer (94).

3. The high-efficiency liquid cooling device according to claim 2, characterized in that: A portion of the heat-conducting sheet (9) is attached to one side surface of the liquid cooling plate (4), and another portion of the heat-conducting sheet (9) is attached to the other side surface of the liquid cooling plate (4). The two portions of the heat-conducting sheet (9) on both sides of the liquid cooling plate (4) are bent at the edge of the liquid cooling plate (4).

4. The high-efficiency liquid cooling device according to claim 3, characterized in that: The heat-conducting sheet (9) has a folding groove (95) at an edge facing the liquid cooling plate (4).

5. The liquid cooling device according to claim 1, wherein: The heat-conducting sheet (9) has a foam layer (93), a continuous graphene heat-conducting film (92) is wrapped on the outside of the foam layer (93), an adhesive layer (91) is provided on one side of the graphene heat-conducting film (92), and a polyimide film layer (94) is provided on the other side of the graphene heat-conducting film (92); the side of the heat-conducting sheet (9) close to the liquid cooling plate (4) corresponds to the adhesive layer (91), and the side away from the liquid cooling plate (4) corresponds to the polyimide film layer (94).

6. The high-efficiency liquid cooling device according to claim 5, characterized in that: At the edges of both sides of the liquid cooling plate (4), the outer side of the graphene heat-conducting film (92) is covered by another portion of foam material to protect the folded portion of the graphene heat-conducting film (92).

7. The high-efficiency liquid cooling device according to claim 6, characterized in that: The heat-conducting sheet (9) has a folding groove (95) at an edge facing the liquid cooling plate (4), and the folding groove (95) partially intrudes into the foam layer (93).

8. The high-efficiency liquid cooling device according to any one of claims 1 to 7, characterized in that: A pair of oppositely arranged first liquid cooling plate assemblies (1) are connected in series between the liquid inlet pipe (31) and the liquid return pipe (32); each of the first liquid cooling plate assemblies (1) comprises a pair of parallel first shunt pipes (51) and a plurality of liquid cooling plates (4) connected between the first shunt pipes (51); in the same first liquid cooling plate assembly (1), each of the first shunt pipes (51) is provided with a confluence port (54) at one end close to the other first liquid cooling plate assembly (1), while the end away from the other first liquid cooling plate assembly (1) is closed; a group of shunt ports arranged along the longitudinal direction of the axis of the first shunt pipe (51) are opened on the side wall of each first shunt pipe (51); the flow channel ports at both ends of each of the liquid cooling plates (4) are respectively connected to the shunt ports of the first shunt pipes (51) on both sides of the first liquid cooling plate assembly (1).

9. The liquid cooling device according to claim 1, wherein: At least one second liquid cooling plate assembly (2) is connected in series between the pair of first liquid cooling plate assemblies (1); the second liquid cooling plate assembly (2) includes a second shunt pipe (52) and a third shunt pipe (53) arranged in parallel, and also includes a plurality of the liquid cooling plates (4) connected between the second shunt pipe (52) and the third shunt pipe (53); both ends of the second shunt pipe (52) are provided with a confluence port (54); a partition node (521) is provided in the center of the second shunt pipe (52), and the partition node (521) divides the second shunt pipe (52) into a first flow section (522) and a second flow section (523), wherein the first flow section (522) is close to the liquid inlet pipe (31), and the second flow section (523) is close to the liquid inlet pipe (31). 3) close to the return liquid pipe (32); a group of diversion openings arranged along the axial direction of the second diversion pipe (52) are opened on the side walls of the first flow section (522) and the second flow section (523); both ends of the third diversion pipe (53) are closed; a group of diversion openings arranged along the axial direction of the third diversion pipe (53) are opened on the side walls of the third diversion pipe (53); a plurality of liquid cooling plates (4) are arranged between the second diversion pipe (52) and the third diversion pipe (53) on both sides along the axial direction of the second diversion pipe (52), and the flow channel openings at both ends of each liquid cooling plate (4) are respectively connected to the diversion openings of the second diversion pipe (52) and the diversion openings of the third diversion pipe (53) on both sides of the second liquid cooling plate assembly (2).

10. The high-efficiency liquid cooling device according to claim 8, characterized in that: The liquid cooling plate (4) includes a flow guide frame (42), and openings are provided at both ends of the flow guide frame (42); sealing plates (43) are provided on both sides of the flow guide frame (42); a gap between the flow guide frame (42) and the sealing plates (43) forms a flow channel, and the openings at both ends of the flow guide frame (42) are clamped by the sealing plates (43) on both sides to form a flow channel opening.

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