Silicon wafer transfer device
By designing stretchable and compressible silicon wafer transport devices, the problems of low space utilization and cumbersome operation of existing silicon wafer transport tools are solved, and efficient and automated silicon wafer transport is achieved.
Patent Information
- Application Number
- CN202422346236.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-25
AI Technical Summary
The existing silicon wafer transport tools have low space utilization, inconvenient transportation, easy wear, cumbersome operation and low efficiency.
A silicon wafer transport device including a top plate, a bottom plate and a middle partition plate is designed, and the connection portion can be stretched or compressed to adjust the spacing of the middle partition plates, providing a flexible connection, adapting to automated robot pick-up and loading and batch transport.
It improves space utilization, simplifies operating procedures, reduces silicon wafer wear, and realizes the convenience and efficiency of automated batch transportation.
Smart Images
Figure CN223260563U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of tooling and loading tools, in particular to a silicon wafer transporting device. Background Art
[0002] During solar cell production, batches of semi-finished products are often transferred. These products lack metal electrodes, and their velvet surfaces are easily abraded. Currently, the commonly used carriers are silicon wafer baskets or wafers stacked with paper between them before being packed into boxes.
[0003] Using dedicated wafer baskets for transport is bulky and heavy, resulting in low space utilization and inconvenient transport. Furthermore, the contact area between the wafer and the basket is easily worn, leading to leakage. Stacking wafers with paper between them for transport is cumbersome, requiring paper to be added during stacking and removed between uses, resulting in low transport efficiency. Utility Model Content
[0004] The purpose of the utility model is to provide a silicon wafer transfer device to alleviate the problems of low space utilization and inconvenience in transfer using a dedicated silicon wafer flower basket; and cumbersome operation and low transfer efficiency in transfer using a stack of silicon wafers with spacer paper in the middle.
[0005] In order to solve the above technical problems, the technical solution provided by the present invention is:
[0006] A silicon wafer transfer device, comprising: a top plate, a bottom plate, a plurality of intermediate partitions, and a connecting portion, wherein the plurality of intermediate partitions are spaced apart along a height direction between the top plate and the bottom plate, and the connecting portion connects the top plate, the plurality of intermediate partitions, and the bottom plate;
[0007] The connecting portion is configured to be capable of being stretched to increase the interval between the plurality of intermediate partitions, and capable of being compressed to reduce the interval between the plurality of intermediate partitions.
[0008] Furthermore,
[0009] The connecting part includes a top plate connector, an intermediate connector and a bottom plate connector. The top plate connector connects the top plate and the top intermediate partition, the intermediate connector connects multiple intermediate partitions, and the bottom plate connector connects the bottom intermediate partition and the bottom plate.
[0010] Furthermore,
[0011] The top plate connector, the middle connector and the bottom plate connector can all be folded and retracted in the height direction.
[0012] Furthermore,
[0013] The intermediate connector connects the plurality of intermediate partitions at equal intervals.
[0014] Furthermore,
[0015] The middle partition has an outward folding structure.
[0016] Furthermore,
[0017] The upper surface of the middle partition is provided with a flexible membrane structure.
[0018] Furthermore,
[0019] The flexible membrane structure includes one or more of paper, fleece and gel.
[0020] Furthermore,
[0021] The top plate is provided with a first fixing structure, and the bottom plate is provided with a second fixing structure.
[0022] Furthermore,
[0023] The first fixing structure includes a first fixing plate and a second fixing plate, the first fixing plate is vertically connected to the top plate, and the second fixing plate is vertically connected to the first fixing plate.
[0024] Furthermore,
[0025] The second fixing structure includes a third fixing plate and a fourth fixing plate. The third fixing plate is vertically connected to the bottom plate, and the fourth fixing plate is vertically connected to the third fixing plate.
[0026] The utility model brings at least the following beneficial effects:
[0027] The utility model provides a silicon wafer transfer device, comprising: a top plate, a bottom plate, a plurality of intermediate partitions and a connecting portion, wherein the plurality of intermediate partitions are arranged between the top plate and the bottom plate at intervals along the height direction, and the connecting portion connects the top plate, the plurality of intermediate partitions and the bottom plate; the connecting portion is configured to be able to be stretched to increase the spacing between the plurality of intermediate partitions, and to be able to be compressed to reduce the spacing between the plurality of intermediate partitions.
[0028] Multiple intermediate partitions can be used to place semi-finished silicon wafers, which are not easy to wear. The setting of the connection part makes the silicon wafer transfer device have two states, stretching and compression. When stretched, the spacing between the multiple intermediate partitions increases, presenting a flower basket state, which can be automatically picked up and placed by a robot. When compressed, the spacing between the multiple intermediate partitions decreases, presenting a state similar to a silicon wafer box, which is suitable for batch transfer. When the silicon wafers need to be used, the connection part is stretched, and the silicon wafers can be automatically taken out in batches using a robot, which is simple to operate. The silicon wafer transfer device changes the connection method between the intermediate partitions from a hard connection to a foldable flexible connection. It can be stretched to have the intermediate partition spacing of a flower basket, and can be compressed to reduce the occupied space, thereby improving space utilization and facilitating transfer.
[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in related technologies, the following briefly introduces the drawings required for use in the specific implementation methods or related technical descriptions. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0031] Figure 1 A schematic diagram of a silicon wafer transfer device in a stretched state provided by an embodiment of the present utility model;
[0032] Figure 2 This is a schematic diagram of the compressed state of the silicon wafer transfer device provided in an embodiment of the present invention.
[0033] icon:
[0034] 100-top plate; 200-bottom plate; 300-middle partition; 400-connecting part; 410-top plate connector; 420-middle connector; 430-bottom plate connector; 500-first fixing structure; 510-first fixing plate; 520-second fixing plate; 600-second fixing structure; 610-third fixing plate; 620-fourth fixing plate. DETAILED DESCRIPTION
[0035] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.
[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.
[0037] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Physical quantities in formulas, unless separately marked, should be understood as basic quantities of the International System of Units, or derived quantities derived from basic quantities through mathematical operations such as multiplication, division, differentiation or integration.
[0038] Furthermore, terms such as "horizontal," "vertical," and "overhanging" do not necessarily imply that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.
[0039] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0040] The following describes some embodiments of the present invention in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other. Figure 1 A schematic diagram of a silicon wafer transfer device in a stretched state provided by an embodiment of the present utility model; Figure 2 This is a schematic diagram of the compressed state of the silicon wafer transfer device provided in an embodiment of the present invention.
[0041] Example 1
[0042] Existing carriers for bulk transfer of silicon wafers use dedicated wafer baskets or stacks of wafers with a layer of paper between them, which are then stacked and packed into boxes. These wafer baskets are bulky and heavy, resulting in low space utilization and inconvenient transport. Furthermore, the contact area between the wafers and the basket is susceptible to wear, leading to electrical leakage. Stacking wafers with paper between them is cumbersome, requiring additional paper during stacking and removal between uses, resulting in low transport efficiency.
[0043] In view of this, an embodiment of the present invention provides a silicon wafer transfer device, including: a top plate 100, a bottom plate 200, a plurality of intermediate partitions 300 and a connecting portion 400, wherein the plurality of intermediate partitions 300 are arranged between the top plate 100 and the bottom plate 200 at intervals along the height direction, and the connecting portion 400 connects the top plate 100, the plurality of intermediate partitions 300 and the bottom plate 200; the connecting portion 400 is configured to be able to be stretched to increase the spacing between the plurality of intermediate partitions 300, and to be able to be compressed to reduce the spacing between the plurality of intermediate partitions 300.
[0044] Multiple intermediate partitions 300 can be used to place semi-finished silicon wafers, which are not easy to wear. The setting of the connecting part 400 enables the silicon wafer transfer device to have two states, stretching and compression. When stretched, the spacing between the multiple intermediate partitions 300 increases, presenting a flower basket state, which can be automatically picked up and placed by a robot. When compressed, the spacing between the multiple intermediate partitions 300 decreases, presenting a state similar to a silicon wafer box, which is suitable for batch transfer. When the silicon wafers need to be used, the connecting part 400 is stretched, and the silicon wafers can be automatically taken out in batches using a robot, which is simple to operate. The silicon wafer transfer device changes the connection method between the intermediate partitions 300 from a hard connection to a foldable flexible connection. It can have the spacing between the intermediate partitions 300 of a flower basket after stretching, and can reduce the occupied space after compression, thereby improving space utilization and facilitating transfer.
[0045] In an optional manner of this embodiment, the connecting portion 400 includes a top plate connector 410, an intermediate connector 420 and a bottom plate connector 430. The top plate connector 410 connects the top plate 100 and the top intermediate partition 300, the intermediate connector 420 connects multiple intermediate partitions 300, and the bottom plate connector 430 connects the bottom intermediate partition 300 and the bottom plate 200.
[0046] See Figure 1 The top plate 100 and the top intermediate partition 300 are connected by a top plate connector 410, the multiple intermediate partitions 300 are connected by intermediate connectors 420, and the bottom intermediate partition 300 and the bottom plate 200 are connected by bottom plate connectors 430. The top plate connector 410, the intermediate connector 420, and the bottom plate connector 430 can be made of either rigid or flexible materials, as long as the intermediate partitions 300 are foldably connected.
[0047] In an optional manner of this embodiment, the top plate connector 410, the middle connector 420 and the bottom plate connector 430 can all be folded and retracted in the height direction.
[0048] Figure 1 The top plate connector 410 , the middle connector 420 and the bottom plate connector 430 are all stretched to their longest state in the height direction. At this time, an automated pick-and-place operation can be performed to place the silicon wafer on the middle partition 300 . Figure 2 The top plate connector 410, the middle connector 420 and the bottom plate connector 430 are all compressed to the shortest state along the height direction. At this time, the volume of the device is reduced, which is convenient for transportation.
[0049] In an optional manner of this embodiment, the intermediate connector 420 connects multiple intermediate partitions 300 at equal intervals.
[0050] The multiple intermediate partitions 300 are arranged at equal intervals, which makes it easy to place multiple silicon wafers one by one on each intermediate partition 300. After the intermediate connector 420 is compressed, a certain space is left between adjacent intermediate partitions 300, which will not cause squeezing of the silicon wafers.
[0051] In an optional manner of this embodiment, the middle partition 300 has an outward folding structure.
[0052] The middle partition 300 is folded outward to facilitate automated picking and placing by a robot. After the transfer is completed, the middle partition 300 is stretched and folded outward to facilitate the use of a robot to automatically take out the silicon wafers in batches.
[0053] In an optional manner of this embodiment, a flexible membrane structure is provided on the upper surface of the middle partition 300 .
[0054] The middle partition 300 is made of a lightweight and high-hardness material, and the flexible membrane structure can reduce the wear of the silicon wafer surface. The flexible membrane structure can be made of one or more of paper, flannel and gel, and is bonded to the upper surface of the middle partition 300.
[0055] In an optional manner of this embodiment, the top plate 100 is provided with a first fixing structure 500 , and the bottom plate 200 is provided with a second fixing structure 600 .
[0056] See Figure 1 Both the top plate 100 and the bottom plate 200 are made of a high-strength, lightweight material, such as carbon fiber. A first fixing structure 500 is positioned on each side of the top plate 100's length, while a second fixing structure 600 is positioned on each side of the bottom plate 200's length. The first and second fixing structures 500 and 600 allow the wafer transfer device to be secured to the automated machine, facilitating stretching or compression.
[0057] Specifically, the first fixing structure 500 includes a first fixing plate 510 and a second fixing plate 520 . The first fixing plate 510 is vertically connected to the top plate 100 , and the second fixing plate 520 is vertically connected to the first fixing plate 510 .
[0058] See Figure 1 The first fixing plate 510 and the second fixing plate 520 are vertically connected to form an L-shaped structure, which is convenient for fixing on an automated machine to perform stretching or compression actions.
[0059] Similarly, the second fixing structure 600 includes a third fixing plate 610 and a fourth fixing plate 620 . The third fixing plate 610 is vertically connected to the bottom plate 200 , and the fourth fixing plate 620 is vertically connected to the third fixing plate 610 .
[0060] Please continue to see Figure 1 The third fixing plate 610 and the fourth fixing plate 620 are vertically connected to form an L-shaped structure, which cooperates with the first fixing structure 500 and is also convenient for fixing on an automated machine to perform stretching or compression actions.
[0061] The silicon wafer transfer device provided in this embodiment has two states: stretched and compressed. When stretched, it resembles a flower basket, allowing for robotic pick-and-place operations. When compressed, it resembles a silicon wafer box, suitable for batch transfer. This solves the problems of bulky and inefficient flower basket transfers and the cumbersome paper stacking and transfer of silicon wafer boxes.
[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A silicon wafer transport device, characterized in that: include: A top plate, a bottom plate, a plurality of intermediate partitions, and a connecting portion, wherein the plurality of intermediate partitions are spaced apart between the top plate and the bottom plate along a height direction, and the connecting portion connects the top plate, the plurality of intermediate partitions, and the bottom plate; The connecting portion is configured to be capable of being stretched to increase the interval between the plurality of intermediate partitions, and capable of being compressed to reduce the interval between the plurality of intermediate partitions.
2. The silicon wafer transfer device according to claim 1, characterized in that: The connecting part includes a top plate connector, an intermediate connector and a bottom plate connector. The top plate connector connects the top plate and the top intermediate partition, the intermediate connector connects multiple intermediate partitions, and the bottom plate connector connects the bottom intermediate partition and the bottom plate.
3. The silicon wafer transfer device according to claim 2, wherein: The top plate connector, the middle connector and the bottom plate connector can all be folded and retracted in the height direction.
4. The silicon wafer transfer device according to claim 2, wherein: The intermediate connector connects the plurality of intermediate partitions at equal intervals.
5. The silicon wafer transfer device according to claim 1, wherein: The middle partition has an outward folding structure.
6. The silicon wafer transport device according to claim 5, characterized in that: The upper surface of the middle partition is provided with a flexible membrane structure.
7. The silicon wafer transporting device according to claim 6, characterized in that: The flexible membrane structure includes one or more of paper, fleece and gel.
8. The silicon wafer transporting device according to claim 1, wherein: The top plate is provided with a first fixing structure, and the bottom plate is provided with a second fixing structure.
9. The silicon wafer transporting device according to claim 8, characterized in that: The first fixing structure includes a first fixing plate and a second fixing plate, the first fixing plate is vertically connected to the top plate, and the second fixing plate is vertically connected to the first fixing plate.
10. The silicon wafer transporting device according to claim 9, characterized in that: The second fixing structure includes a third fixing plate and a fourth fixing plate. The third fixing plate is vertically connected to the bottom plate, and the fourth fixing plate is vertically connected to the third fixing plate.