Wafer product automatic positioning platform

Abstract

The utility model discloses an automatic positioning platform for wafer products. The automatic positioning platform comprises an XY electric displacement platform and a wafer placing platform arranged on the XY electric displacement platform, two groups of winding blocks are arranged on the outer wall of the sheet placing platform, each group comprises a plurality of winding blocks which are uniformly distributed, and the two groups of winding blocks are arranged at intervals in a staggered manner; a tension wire is arranged on the sheet placing platform, and the tension wire is sequentially and alternately wound on the two groups of winding blocks to form a plurality of parallel supporting structures; at least one elastic ejector pin is arranged on the outer wall of the wafer placing platform; the elastic ejector pins abut against the side wall of the wafer on the tension line. The plurality of tension lines arranged in parallel provide stable support for the wafer with a minimum support surface, so that the possibility of scratching and polluting the wafer is reduced on the premise of ensuring that the wafer is horizontal and free of warping. The elastic ejector pin limits the movement of the wafer, and the sliding positioning column enables the position of the wafer to be determined, thereby improving the accuracy and stability of laser marking.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer production, and in particular relates to an automatic positioning platform for wafer products. Background Art

[0002] In the field of wafer glass processing and manufacturing, laser marking is required on the glass surface. Since the laser marking depth is less than 20 microns, and the glass itself has a certain degree of warping at about 700 microns, the design of the wafer placement platform is particularly important. To ensure that the marking platform and the laser maintain a good verticality, a high-precision automatic positioning platform needs to be designed to cooperate with the laser marking operation.

[0003] Chinese patent publication number CN117182324A discloses a compatible wafer backside marking fixture device, comprising a support base, an adsorption fixture carrier, and a carrier rotation device. The carrier rotation device is mounted on the support base, and the adsorption fixture carrier is mounted on the carrier rotation device. A lifting platform and a pressing platform are positioned above the adsorption fixture carrier, from bottom to top. The lifting platform is equipped with a pressing and lifting device for raising and lowering the pressing platform. Different processing carriers can be selected based on product size and quickly replaced without tedious assembly and disassembly. The device is compatible with processing multiple sizes and product series, facilitating equipment switching and conversion. A one-time correction of the carrier to ensure perpendicularity with the optical path cut eliminates the need for subsequent recalibration of perpendicularity, thus preventing problems with batch processing. To address the adsorption function for warped products, two non-contact suction cups hold the warped product against the fixture mounting base, while a pressing ring compresses the product's periphery, completely smoothing it out.

[0004] In the aforementioned patent solution, the wafer is suctioned onto a suction fixture carrier by a suction cup for laser marking. Due to the high cleanliness requirements for the wafer, the large area of ​​the suction fixture carrier has the potential to scratch and contaminate the wafer. If the wafer is suspended or supported at multiple points, the need for suction cups to secure the wafer will cause uneven force on the wafer, which in turn will cause the wafer to warp, affecting the laser marking effect and even rendering the wafer scrapped. Utility Model Content

[0005] In order to overcome the technical problems in the prior art that, during laser marking, a large-area support platform may scratch and contaminate the wafer, and the wafer is supported in the air or at multiple points, and the suction cup used to fix the wafer will cause the wafer to be unevenly stressed, resulting in warping and affecting the marking quality; one purpose of the utility model is to provide an automatic positioning platform for wafer products, which provides a stable support surface for the wafer with a minimum contact surface by arranging multiple evenly distributed tension lines on the wafer placement platform, and at the same time, an elastic ejector is arranged on the wafer placement platform to fix the position of the wafer with elastic force for laser marking.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a wafer product automatic positioning platform, comprising an XY electric translation stage and a wafer placement platform arranged on the XY electric translation stage; two groups of winding blocks are arranged on the outer wall of the wafer placement platform, each group of the winding blocks respectively includes a plurality of evenly distributed ones, and the two groups of the winding blocks are staggered in the horizontal direction; a tension line is arranged on the wafer placement platform, and the tension line is alternately wound around the two groups of the winding blocks in sequence to form a plurality of parallel support structures; at least one elastic ejector pin is provided on the outer wall of the wafer placement platform; the elastic ejector pin is against the side wall of the wafer on the tension line.

[0007] The outer surface of the tension wire is smooth and has a small contact area with the wafer, while providing a stable support surface for the wafer. The elastic ejector pin utilizes elastic force to press against the side wall of the wafer for fixation, thereby facilitating stable laser marking on the wafer.

[0008] Furthermore, two fixed positioning columns are symmetrically arranged on the upper end of the wafer placement platform; the two fixed positioning columns are distributed on both sides of the tension line; one elastic ejector pin is provided, and the elastic force of the elastic ejector pin pushes the wafer to counteract the two fixed positioning columns.

[0009] The two fixed positioning columns and the one elastic ejector pin define the position of the wafer, and the structure is simple, stable and reliable.

[0010] Furthermore, a notch is provided on the outer wall of the wafer; a positioning plate is slidably connected to the wafer placement platform; the sliding direction of the positioning plate coincides with the elastic force direction of the elastic ejector pin; a sliding positioning column is provided on the positioning plate, and the sliding positioning column can selectively enter the notch.

[0011] The sliding positioning column limits the sliding of the wafer, ensuring that the marking position of the wafer is uniquely determined.

[0012] Specifically, the positioning plate is provided with a sliding groove which passes through the positioning plate; a locking screw is threadedly connected to the sheet placing platform; and the locking screw is located in the sliding groove.

[0013] The locking screw can optionally fix the positioning plate on the film placement platform.

[0014] Preferably, two gaskets are symmetrically provided on the upper end of the sheet placing platform; the two gaskets are distributed on both sides of the tension line; and the two gaskets are located between the fixed positioning column and the elastic ejector pin.

[0015] Specifically, two wire pressing screws are provided on the upper end of the film placing platform; the two groups of winding blocks are located between the two wire pressing screws; and the two ends of the tension wire are respectively pressed tightly on the film placing platform by the wire pressing screws.

[0016] Furthermore, an electric lifting platform is provided at the upper end of the XY electric translation platform; an electric rotating platform is provided at the upper end of the electric lifting platform; an inclination adjustment platform is provided at the upper end of the electric rotating platform; and the film placing platform is provided on the inclination adjustment platform.

[0017] Furthermore, the electric lifting platform is detachably connected to a supporting plate; the electric lifting platform is arranged on the upper end of the supporting plate; and two handles are symmetrically arranged on the supporting plate.

[0018] The support plate is directly placed on the XY electric translation stage, which is convenient for overall replacement and is used for compatibility with wafers of different sizes and models.

[0019] Specifically, a groove is provided on the upper end of the XY electric translation stage; the supporting plate is located in the groove; and the upper end of the supporting plate is flush with the upper end of the XY electric translation stage.

[0020] Specifically, the electric lifting platform includes two diamond-shaped connecting rod groups and a lifting motor that is transmission-connected to the two diamond-shaped connecting rod groups.

[0021] Compared to existing technologies, this invention offers the following advantages: Multiple parallel tension lines provide stable support for the wafer with a minimal support surface, ensuring a level, warp-free wafer while reducing the risk of scratches and contamination. Elastic pins limit wafer movement, while sliding positioning posts restrict circumferential rotation, ensuring a uniquely defined wafer position and improving laser marking accuracy and stability. The overall design utilizes a modular design with standardized components, resulting in a streamlined structure that is easy to assemble and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural diagram of the utility model;

[0023] Figure 2 This is a schematic diagram of the parts explosion of the utility model;

[0024] Figure 3 It is a structural schematic diagram of the film placing platform of the present utility model.

[0025] In the figure: 1. XY electric translation stage; 11. Groove; 21. Support plate; 22. Handle; 3. Electric lifting platform; 31. Diamond connecting rod group; 32. Lifting motor; 41. Electric rotating table; 42. Tilt adjustment table; 51. Film placement platform; 511. Winding block; 512. Wire pressing screw; 52. Elastic ejector pin; 53. Ejector pin pressure plate; 54. Positioning plate; 541. Slide groove; 542. Sliding positioning column; 55. Tension line; 56. Fixed positioning column; 57. Gasket. DETAILED DESCRIPTION

[0026] Below, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0027] In the description of the present invention, it should be noted that, for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Therefore, the terms "first" and "second" may explicitly or implicitly refer to one or more of these features. In the description of this utility model, "several" means two or more, unless otherwise specifically defined.

[0029] In this utility model, unless otherwise specified or limited, terms such as "disposed" and "installed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection; direct connection, connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0030] See also Figure 1-Figure 3 , an automatic positioning platform for wafer products, which is equipped with an XY electric translation stage 1, a support plate 21, an electric lifting platform 3, an electric rotating platform 41, an inclination adjustment platform 42, and a wafer placing platform 51 from bottom to top.

[0031] The film placement platform 51 is circular; two groups of winding blocks 511 are provided on the outer wall of the film placement platform 51, each group of winding blocks 511 includes a plurality of evenly distributed winding blocks, and the two groups of winding blocks 511 are staggered in the horizontal direction; a tension wire 55 is provided on the film placement platform 51, and the tension wire 55 is alternately wound around the two groups of winding blocks 511 in sequence, forming multiple parallel tension wires above the film placement platform 51. Two wire pressing screws 512 are provided at the upper end of the film placement platform 51; the two groups of winding blocks 511 are located between the two wire pressing screws 512; the ends of the tension wire 55 are respectively pressed against the film placement platform 51 by the wire pressing screws 512.

[0032] Two fixed positioning posts 56 are symmetrically arranged on the upper end of the wafer placement platform 51; the two fixed positioning posts 56 are located on either side of the tension line 55. An elastic ejector pin 52 is provided on the outer wall of the wafer placement platform 51; an ejector pin pressure plate 53 is provided on the upper end of the wafer placement platform 51; the elastic ejector pin 52 is pressed against the wafer placement platform 51 by the ejector pin pressure plate 53. The elastic ejector pin 52 abuts against the side wall of the wafer on the tension line, and the elastic force of the elastic ejector pin 52 pushes the wafer until it abuts against the two fixed positioning posts 56.

[0033] The elastic ejector pin 52 includes a cylindrical shell, an end head axially connected to the cylindrical shell for sliding movement, and a spring disposed between the end head and the cylindrical shell; the elastic force of the spring is used to slide the end head outward, that is, toward the wafer.

[0034] The outer wall of the wafer is provided with a notch; a positioning plate 54 is slidably connected to the wafer placement platform; the sliding direction of the positioning plate 54 coincides with the direction of the elastic force of the elastic ejector pin, that is, the sliding direction of the end head coincides; the positioning plate 54 is provided with a sliding positioning post 542, which can optionally enter the notch. The positioning plate 54 is provided with a sliding groove 541 that passes through the positioning plate 54; a locking screw is threadedly connected to the wafer placement platform 51; the locking screw is located in the sliding groove 541 and can selectively fix the positioning plate 54 to the wafer placement platform 51.

[0035] Two gaskets 57 are symmetrically provided on the upper end of the wafer placement platform 51; the two gaskets are distributed on both sides of the tension line 55; the two gaskets 57 are located between the fixed positioning column 56 and the elastic ejector pin 52, and the gaskets 57 are against the lower end of the wafer on the tension line.

[0036] The upper end of the XY motorized translation stage 1 is provided with a groove 11; the support plate 21 is detachably connected to the groove 11; the upper end of the support plate 21 is flush with the upper end of the XY motorized translation stage 1; and two handles 22 are symmetrically provided on the support plate 21. The XY motorized translation stage 1 includes a base plate, a first sliding plate connected to the base plate for horizontal sliding in the X-direction, a first drive module disposed at the upper end of the base plate and transmission-connected to the first sliding plate, a second sliding plate connected to the first sliding plate for horizontal sliding in the Y-direction, and a second drive module disposed at the upper end of the first sliding plate and transmission-connected to the second sliding plate; the X-direction and the Y-direction are perpendicular to each other; the groove 11 is disposed at the upper end of the second sliding plate.

[0037] The electric lift 3 is mounted on the upper end of the support plate 21. The electric lift 3 includes two diamond-shaped connecting rods 31 mounted on the support plate 21, and a lift motor 32 mounted on the support plate 21 and in transmission connection with the two diamond-shaped connecting rods 31. The diamond-shaped connecting rods 31 include a drive rod slidably connected to the support plate 21 for driving the diamond-shaped connecting rods 31 to extend and retract. A screw is rotatably connected to the support plate 21 and in transmission connection with the two drive rods. The screw is in transmission connection with the lift motor 32.

[0038] The electric rotating platform 41 includes a rotating base arranged on the electric lifting platform 3, a turntable rotatably connected to the upper end of the rotating base, and a rotating motor arranged on the rotating base and connected to the turntable; the turntable can rotate 360 ​​degrees.

[0039] The inclination adjustment platform 42 includes an adjustment base arranged on the turntable, an adjustment table located at the upper end of the adjustment base, a support ball arranged between the adjustment base and the adjustment table, and two electric telescopic support rods arranged on the adjustment base; the sliding end of the electric telescopic support rod is against the lower end of the adjustment table.

[0040] The above description is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any technician in this field within the scope of the present invention are included in the patent scope of the present invention.

Claims

1. A wafer product automatic positioning platform, characterized by: It includes an XY electric translation stage and a wafer placement platform arranged on the XY electric translation stage; two groups of winding blocks are arranged on the outer wall of the wafer placement platform, each group of winding blocks includes a plurality of evenly distributed winding blocks, and the two groups of winding blocks are staggered in the horizontal direction; a tension line is arranged on the wafer placement platform, and the tension line is alternately wound around the two groups of winding blocks in sequence to form a plurality of parallel support structures; at least one elastic ejector pin is arranged on the outer wall of the wafer placement platform; the elastic ejector pin is abutted against the side wall of the wafer on the tension line.

2. The positioning platform according to claim 1, wherein: Two fixed positioning columns are symmetrically arranged on the upper end of the wafer placing platform; the two fixed positioning columns are distributed on both sides of the tension line; one elastic ejector pin is provided, and the elastic force of the elastic ejector pin pushes the wafer to counteract the two fixed positioning columns.

3. The positioning platform according to claim 2, wherein: The outer wall of the wafer is provided with a notch; a positioning plate is slidably connected to the wafer placement platform; the sliding direction of the positioning plate coincides with the elastic force direction of the elastic ejector pin; a sliding positioning column is provided on the positioning plate, and the sliding positioning column can selectively enter the notch.

4. The positioning platform according to claim 3, wherein: The positioning plate is provided with a sliding groove which passes through the positioning plate; the sheet placing platform is threadedly connected with a locking screw; the locking screw is located in the sliding groove.

5. The positioning platform according to claim 2, wherein: Two gaskets are symmetrically arranged on the upper end of the sheet placing platform; the two gaskets are distributed on both sides of the tension line; and the two gaskets are located between the fixed positioning column and the elastic ejector pin.

6. The positioning platform according to any one of claims 1 to 5, characterized in that: Two wire pressing screws are provided on the upper end of the film placing platform; the two groups of winding blocks are located between the two wire pressing screws; and the two ends of the tension wire are respectively pressed tightly on the film placing platform by the wire pressing screws.

7. The positioning platform according to any one of claims 1 to 5, characterized in that: An electric lifting platform is provided on the upper end of the XY electric translation platform; an electric rotating platform is provided on the upper end of the electric lifting platform; an inclination adjustment platform is provided on the upper end of the electric rotating platform; and the film placing platform is provided on the inclination adjustment platform.

8. The positioning platform according to claim 7, wherein: The electric lifting platform is detachably connected to a supporting plate; the electric lifting platform is arranged at the upper end of the supporting plate; and two handles are symmetrically arranged on the supporting plate.

9. The positioning platform according to claim 8, wherein: The upper end of the XY electric translation stage is provided with a groove; the supporting plate is located in the groove; the upper end of the supporting plate is flush with the upper end of the XY electric translation stage.

10. The positioning platform according to claim 7, wherein: The electric lifting platform comprises two diamond-shaped connecting rod groups and a lifting motor which is transmission-connected with the two diamond-shaped connecting rod groups.

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