Circuit board assembly and electronic equipment

Abstract

The utility model discloses a circuit board assembly and an electronic device. The circuit board assembly comprises a printed circuit board, a flexible circuit board, a first device and a second device. One end of the flexible circuit board is connected to the printed circuit board. The first device is arranged on the printed circuit board, the second device is connected to the flexible circuit board, and the thickness of the first device is smaller than that of the second device. The first device is arranged on the thicker printed circuit board, the second device is placed on the thinner flexible circuit board, and the overall thickness after the design is obtained by adding the thickness of the printed circuit board to the thickness of the second device and subtracting the height difference between the printed circuit board and the flexible circuit board, so that the thickness is reduced compared with the thickness in a traditional structure; meanwhile, due to the fact that the design of the printed circuit board is reserved, compared with the mode that a flexible circuit board is completely adopted, the circuit board assembly has the better bearing capacity, and the double advantages of reducing the thickness and maintaining the performance of the circuit board assembly are considered.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board assembly and electronic equipment. Background Art

[0002] With the continuous advancement of technology and the increasing demand for portable devices, the challenge of making the internal structures of electronic devices thinner without compromising performance has become a pressing issue. Existing solutions either require thinner printed circuit boards (PCBs) or utilize entirely flexible PCBs. However, these designs can lead to issues such as PCBs being easily damaged or flexible PCBs being unable to withstand high-power devices. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a circuit board assembly that combines a flexible circuit board, a printed circuit board, and various components to ensure the performance of the circuit board assembly while reducing the overall thickness.

[0004] The utility model also provides an electronic device having the circuit board assembly.

[0005] According to the first aspect of the present invention, the circuit board assembly includes a printed circuit board, a flexible circuit board, a first device, and a second device. The printed circuit board has a first surface and a second surface, and the first surface and the second surface are arranged back to back. One end of the flexible circuit board is connected to the printed circuit board, and the flexible circuit board has a third surface and a fourth surface, and the third surface and the fourth surface are arranged back to back. The first surface and the third surface are oriented in the same direction, and the second surface and the fourth surface are oriented in the same direction. The first device is arranged on the printed circuit board, and the second device is placed on at least one of the third surface or the fourth surface. In the thickness direction of the printed circuit board, the surface on which the second device is placed is located between the planes where the first surface and the second surface are located, and the thickness of the first device is less than the thickness of the second device.

[0006] The circuit board assembly according to the embodiment of the present invention has at least the following beneficial effects: taking the second device being arranged on the third surface as an example, the first device is arranged on a thicker printed circuit board, and the second device is placed on a thinner flexible circuit board. Since the third surface of the flexible circuit board is located between the planes where the first surface and the second surface are located in the thickness direction of the printed circuit board, the overall thickness after such design is the thickness of the printed circuit board plus the thickness of the second device minus the height difference between the first surface and the third surface. Compared with the traditional structure in which the overall thickness is the thickness of the printed circuit board plus the thickness of the second device, the thickness is reduced (i.e., the height difference between the first surface and the third surface). At the same time, since the design of the printed circuit board is retained, it has better load-bearing capacity than that of a fully flexible circuit board, and takes into account the dual advantages of reducing thickness and maintaining the performance of the circuit board assembly.

[0007] According to some embodiments of the present invention, the first device is embedded in the printed circuit board, and / or the first device is placed on at least one of the first surface and the second surface.

[0008] According to some embodiments of the present invention, the second device is soldered to the third surface, and the printed circuit board is soldered to the third surface.

[0009] According to some embodiments of the present invention, the printed circuit board includes a main body and an extension portion, the first device is embedded in the main body, the extension portion is connected to a side edge of the main body, the extension portion includes a bottom surface, and the bottom surface is welded to the third surface.

[0010] According to some embodiments of the present invention, a reference plane is defined, which divides the printed circuit board into two parts with the same thickness, and an end of the extension portion close to the main body portion is divided into two parts with the same thickness by the reference plane.

[0011] According to some embodiments of the present invention, the first device is embedded in a printed circuit board, and the thickness of the printed circuit board is h1, where 0.45 mm ≤ h1 ≤ 2 mm.

[0012] According to some embodiments of the present invention, the first device is embedded in the printed circuit board, and the thickness of the first device is h2, where 0<h2<0.4mm.

[0013] According to some embodiments of the present invention, the circuit board assembly further includes a fastener, which is wrapped around the outer peripheral wall of the second component and connected to the third surface.

[0014] According to some embodiments of the present invention, the first device is a MOSFET, and / or the second device includes at least one of a resistor, a fuel gauge IC, and a protection IC.

[0015] An electronic device according to an embodiment of the second aspect of the present invention includes the circuit board assembly of any one of the embodiments of the present invention.

[0016] The electronic device according to the embodiment of the present invention has at least the following beneficial effects: the circuit board assembly of the embodiment of the present invention takes into account the dual advantages of reducing thickness and maintaining circuit board assembly performance, thereby enabling the electronic device of the embodiment of the present invention to meet the dual requirements of thinness and high performance.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 is a cross-sectional view of a circuit board assembly in a first embodiment of the present invention;

[0020] Figure 2 is a side view of a circuit board assembly in a second embodiment of the present invention;

[0021] Figure 3 It is a side view of a circuit board assembly in the prior art.

[0022] Reference numerals: circuit board assembly 100 , printed circuit board 101 , flexible circuit board 102 , first component 103 , second component 104 , first surface 105 , second surface 106 , third surface 107 , fourth surface 108 , main body 109 , extension 110 , solder paste 111 , fastener 112 , reference plane 113 , bottom surface 114 . DETAILED DESCRIPTION

[0023] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0024] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0025] In the description of this utility model, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of the terms "first" and "second" is solely for the purpose of distinguishing technical features and is not to be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0027] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0028] refer to Figure 3 , Figure 3 The circuit board assembly 100 in the prior art includes a printed circuit board 101, a first device 103 and a second device 104, wherein the first device 103 and the second device 104 are both arranged on the surface of the printed circuit board 101, and the total height of the circuit board assembly 100 is the thickness h1 of the circuit board assembly plus the thickness h3 of the second device.

[0029] refer to Figure 1According to the first embodiment of the present invention, a circuit board assembly 100 includes a printed circuit board 101, a flexible circuit board 102, a first device 103, and a second device 104. The printed circuit board 101 has a first surface 105 and a second surface 106, which are disposed opposite each other. One end of the flexible circuit board 102 is connected to the printed circuit board 101. The flexible circuit board 102 has a third surface 107 and a fourth surface 108, which are disposed opposite each other. The first surface 105 and the third surface 107 face the same direction, and the second surface 106 and the fourth surface 108 face the same direction. The first device 103 is disposed on the printed circuit board 101, and the second device 104 is placed on at least one of the third surface 107 and the fourth surface 108. In the thickness direction of the printed circuit board 101, the surface on which the second device 104 is placed is located between the planes of the first surface 105 and the second surface 106. The thickness of the first device 103 is less than that of the second device 104.

[0030] So, reference Figure 2 Taking the second device 104 being disposed on the third surface 107 as an example, the first device 103 is disposed on the thicker printed circuit board 101, and the second device 104 is placed on the thinner flexible circuit board 102. Since the third surface 107 and the fourth surface 108 of the flexible circuit board 102 are located between the planes of the first surface 105 and the second surface 106 in the thickness direction of the printed circuit board 101, the overall thickness after such a design is the thickness h1 of the printed circuit board 101 plus the thickness h3 of the second device 104 minus the height difference h4 between the first surface 105 and the third surface 107. Compared with the conventional structure (reference Figure 3 ) is the thickness h1 of the printed circuit board 101 plus the thickness h3 of the second device 104, and the thickness is reduced (i.e., the height difference h4 between the first surface 105 and the third surface 107). At the same time, since the design of the printed circuit board 101 is retained, it is equivalent to fully adopting the flexible circuit board 102 with better load-bearing capacity, taking into account the dual advantages of reducing thickness and maintaining the performance of the circuit board assembly 100.

[0031] refer to Figure 1 and Figure 2In some embodiments of the present invention, the first device 103 is embedded in the printed circuit board 101, and / or the first device 103 is placed on at least one of the first surface 105 and the second surface 106. Embedding the first device 103 in the printed circuit board 101 can further reduce the overall thickness. However, for processing reasons, the first device 103 can also be placed directly on the surface of the printed circuit board 101. This design still reduces the overall thickness because the plane where the thicker second device 104 is placed is located between the first surface 105 and the second surface 106.

[0032] It should be noted that, in some embodiments of the present invention, the first device 103 being embedded in the printed circuit board 101 means that the first device 103 is completely located inside the printed circuit board 101 and is not exposed outside the printed circuit board 101 .

[0033] It should be noted that the reference Figure 1 In some embodiments of the present invention, the first surface 105 , the second surface 106 , and the fourth surface 108 do not have electronic components, thereby meeting the thinning requirements of the circuit board assembly 100 .

[0034] refer to Figure 1 In some embodiments of the present invention, the second device 104 is soldered to the third surface 107, and the printed circuit board 101 is soldered to the third surface 107. This design allows all the soldered portions of the flexible circuit board 102 to be placed on the same surface (i.e., the third surface 107 in the embodiments of the present invention), making processing more convenient.

[0035] It should be noted that in some embodiments of the present invention, the second device 104 and the flexible circuit board 102 can be soldered together, as can the printed circuit board 101 and the flexible circuit board 102, by reflow soldering, using solder paste 111. The reflow soldering process is as follows: solder paste 111 is applied to the surface of the pad of the object to be soldered; solder paste 111 is heated to a molten state using infrared heating or laser heating; and instantaneous pressure is applied to fully melt and bond the solder paste 111 to the object to be soldered. In this way, solder paste 111 can be applied in advance to the area on the third surface 107 where the second device 104 is to be soldered or to the printed circuit board 101. This pretreatment can effectively improve work efficiency and facilitate assembly. After soldering, the solder paste 111 can also achieve electrical connection between the two components to be soldered. Furthermore, solder paste 111 soldering offers advantages such as high soldering quality, fast soldering speed, and convenient operation.

[0036] refer to Figure 1In some embodiments of the present invention, the printed circuit board 101 includes a main body 109 and an extension 110. The first device 103 is embedded in the main body 109. The extension 110 is connected to a side edge of the main body 109. The extension 110 includes a bottom surface 114, which is soldered to the third surface 107. The main body 109 is used to set up the circuit and embed the first device 103. The extension 110 is used to connect to the flexible circuit board 102. This allows the printed circuit board 101 and the flexible circuit board 102 to be connected without increasing the overall thickness and without occupying the structure within the main body 109. This simple design facilitates subsequent repair and maintenance of the printed circuit board 101 or the flexible circuit board 102 if a fault occurs.

[0037] refer to Figure 1 In some embodiments of the present invention, a reference plane 113 is defined. Reference plane 113 divides printed circuit board 101 into two sections of equal thickness. The end of extension 110 adjacent to main body 109 is also divided into two sections of equal thickness by reference plane 113. Symmetrical designs offer a more mature and streamlined manufacturing process, making it easier to manufacture extension 110. Asymmetric designs complicate lamination and circuit fabrication, requiring additional steps.

[0038] refer to Figure 1 In some embodiments of the present invention, the first device 103 is embedded in the printed circuit board 101. The thickness of the printed circuit board 101 is h1, where 0.45 mm ≤ h1 ≤ 2 mm. The thickness of the printed circuit board 101 determines its load-bearing capacity and the thickness of the first device 103 that can be embedded therein. When h1 is less than 0.45 mm, the printed circuit board 101 is too thin, has poor load-bearing capacity, and has a large thickness limit for the first device 103 that can be embedded therein. When h2 is greater than 2 mm, the printed circuit board 101 is too thick and does not meet the requirements for thinness.

[0039] refer to Figure 1 In some embodiments of the present invention, the first device 103 is embedded in the printed circuit board 101, and the thickness of the first device 103 is h2, where 0 < h2 < 0.4 mm. When the thickness h2 of the first device 103 is ≥ 0.4 mm, the thickness is too large to meet the requirement of embedding in the printed circuit board 101. If the thickness of the first device 103 and the second device 104 are both greater than 0.4 mm, and the thickness of the first device 103 and the second device 104 are equal, they are both disposed on the third surface 107. Because the thickness of the flexible circuit board 102 is lower than that of the printed circuit board 101 and the height of the third surface 107 is lower than that of the first surface 105, the overall thickness can still be reduced.

[0040] It should be noted that the reason why thinner devices are embedded in the printed circuit board 101 rather than directly embedding thicker devices in the printed circuit board 101 is due to the consideration of the technical effect to be achieved. To embed thicker devices requires a thicker printed circuit board 101, which does not meet the thinning requirements.

[0041] refer to Figure 1 In some embodiments of the present invention, the circuit board assembly 100 further includes a fastener 112, which is wrapped around the outer peripheral wall of the second component 104 and connected to the third surface 107. Because the flexible circuit board 102 is relatively thin, further wrapping the second component 104 disposed on the flexible circuit board 102 can improve its stress resistance and enhance structural stability. It should be noted that in some embodiments of the present invention, the fastener 112 is molded and cured. After the second component 104 is soldered to the third surface 107, the molded and cured surrounding the second component 104 further enhances its stability and stress resistance.

[0042] In some embodiments of the present invention, first device 103 is a MOSFET (metal-oxide semiconductor field-effect transistor), and / or second device 104 includes at least one of a resistor, a fuel gauge IC (fuel gauge chip), and a protection IC (protection chip). In some embodiments of the present invention, circuit board assembly 100 serves as a battery protection board for an electronic device. The battery protection board provides charge and discharge protection, temperature protection, and other functions for the battery. MOSFETs, which have functions such as current switching, signal amplification, and voltage regulation, are relatively thin and, in some embodiments of the present invention, are embedded within printed circuit board 101 as first device 103. Resistors, fuel gauge ICs, and protection ICs are all commonly used electronic components in battery protection circuits and are relatively thick. In some embodiments of the present invention, they are disposed on flexible printed circuit board 102 as second device 104.

[0043] It should be noted that the first device 103 and the second device 104 do not specifically refer to a certain device. Figure 1 As shown, the first device 103 and the second device 104 can be provided in multiple or multiple forms, as long as the thickness relationship is satisfied.

[0044] It should be noted that in some embodiments of the present invention, the first device 103 and the second device 104 can also be other types of components, which can be divided and installed according to the thickness of the first device 103 and the second device 104, and the requirement of reducing the overall thickness of the circuit board assembly 100 can also be achieved.

[0045] An electronic device according to an embodiment of the second aspect of the present invention includes a circuit board assembly 100 according to any one of the embodiments of the present invention. The circuit board assembly 100 of the present embodiment places a thicker second device 104 on a thinner flexible circuit board 102. Because the third surface 107 and the fourth surface 108 of the flexible circuit board 102 are located between the planes of the first surface 105 and the second surface 106 in the thickness direction of the printed circuit board 101, the overall thickness of the circuit board assembly 100 is calculated as the thickness of the printed circuit board 101 plus the thickness of the second device 104, minus the height difference between the first surface 105 and the third surface 107, or the thickness of the printed circuit board 101 plus the thickness of the thinner first device 103. Compared to a conventional structure in which the overall thickness is the thickness of the printed circuit board 101 plus the thickness of the thicker second device 104, the thickness is reduced. Furthermore, because the design of the printed circuit board 101 is retained, the load-bearing capacity of the circuit board assembly 100 is not reduced. This achieves the dual advantages of reduced thickness and maintained performance of the circuit board assembly 100, thereby enabling the electronic device of the present embodiment to meet the dual requirements of thinness and high performance.

[0046] It should be noted that in some embodiments of the present invention, the electronic device is a mobile phone, which includes a housing, a battery, a circuit board assembly 100 of an embodiment of the present invention, and a complete machine end. The circuit board assembly 100 of an embodiment of the present invention is arranged inside the housing, the battery is connected to the printed circuit board 101 of the circuit board assembly 100, and the complete machine end (that is, other circuit components inside the mobile phone) is connected to the flexible circuit board 102 of the circuit board assembly 100. Connecting the battery to the harder printed circuit board 101 can make the structure more solid, and connecting the complete machine end to the flexible circuit board 102 can have better flexibility, meet the requirements of internal wiring and layout, and have better adaptability.

[0047] It should be noted that in some embodiments of the present invention, the circuit board assembly 100 serves as a battery protection board for the battery, the first device 103 and the second device 104 are electronic components on the battery protection board, and the circuit board assembly 100 plays a role in protecting the battery from charge and discharge.

[0048] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various modifications can be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. In addition, the embodiments of the present invention and the features of the embodiments can be combined with each other unless there is a conflict.

Claims

1. A circuit board assembly, characterized in that include: a printed circuit board, the printed circuit board having a first surface and a second surface, the first surface and the second surface being arranged opposite to each other; a flexible circuit board, one end of the flexible circuit board being connected to the printed circuit board, the flexible circuit board having a third surface and a fourth surface, the third surface and the fourth surface being arranged opposite to each other, the first surface and the third surface facing the same direction, and the second surface and the fourth surface facing the same direction; a first component, the first component being disposed on the printed circuit board; a second device, wherein the second device is placed on at least one of the third surface or the fourth surface; In the thickness direction of the printed circuit board, the surface on which the second device is placed is located between the planes where the first surface and the second surface are located; The thickness of the first device is smaller than the thickness of the second device.

2. The circuit board assembly according to claim 1, wherein: The first component is embedded in the printed circuit board, and / or the first component is placed on at least one of the first surface and the second surface.

3. The circuit board assembly according to claim 2, wherein: The second component is soldered to the third surface, and the printed circuit board is soldered to the third surface.

4. The circuit board assembly according to claim 3, wherein: The printed circuit board includes a main body and an extension part. The first device is embedded in the main body. The extension part is connected to a side edge of the main body. The extension part includes a bottom surface, and the bottom surface is welded to the third surface.

5. The circuit board assembly according to claim 4, wherein: A reference plane is defined, where the reference plane divides the printed circuit board into two parts with the same thickness, and an end of the protruding portion close to the main body portion is divided into two parts with the same thickness by the reference plane.

6. The circuit board assembly according to claim 2, wherein: The first device is embedded in the printed circuit board, and the thickness of the printed circuit board is h1, 0.45 mm ≤ h1 ≤ 2 mm.

7. The circuit board assembly according to claim 2, wherein: The first component is embedded in the printed circuit board, and the thickness of the first component is h2, where 0<h2<0.4mm.

8. The circuit board assembly according to claim 2, wherein: The circuit board assembly further includes a fastener wrapped around the outer peripheral wall of the second component, and the fastener is connected to the third surface.

9. The circuit board assembly according to claim 2, wherein: The first device is a MOSFET, and / or the second device includes at least one of a resistor, a fuel gauge IC, and a protection IC.

10. An electronic device, characterized in that The electronic device comprises the circuit board assembly according to any one of claims 1 to 9.

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