Integrated circuit board and vehicle equipment

Abstract

The utility model discloses an integrated circuit board and vehicle equipment, the integrated circuit board comprises a circuit board body and a copper bar, and the copper bar is fixed on the circuit board body for transmitting current. The integrated circuit can be applied to vehicle equipment. A current-carrying path is replaced by the copper bar from a copper foil on the board surface of the integrated circuit board, and the compactness and the current-carrying capacity of the copper bar are far higher than those of the copper foil, so that the temperature rise of the copper bar is lower through the same current value, meanwhile, only the copper bar with a very small size is needed, and the board area of the integrated circuit board can be effectively saved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit board and vehicle equipment. Background Art

[0002] With the continued advancement of electrified and intelligent vehicles, automotive electronics are playing an increasingly important role. Integrated circuit boards (PCBs) are the core structure of automotive electronics, and their design directly determines product quality. Existing PCBs typically use electrolytic deposition or electroplating processes to form a copper layer on the substrate surface, providing circuit connections and current flow.

[0003] However, the poor density of the copper deposit on the PCB surface often leads to excessive temperature rise, which can affect the user experience of end products, such as automotive electronics, and even the safety of vehicle passengers. Furthermore, in existing products, copper deposits for different phases of current on the PCB are all placed on the same surface. Therefore, if the copper depositing process is not strictly controlled, it can lead to conduction between phases. Furthermore, to ensure electrical safety, if copper deposits for different phases of current are all placed on the same surface, sufficient electrical clearance and creepage distances must be maintained. This also increases the board surface area, hindering the development of product miniaturization. Utility Model Content

[0004] In order to solve some or all of the problems in the prior art, the present invention provides an integrated circuit board in a first aspect, comprising:

[0005] a circuit board body; and

[0006] The copper bus is fixed on the circuit board and is used for transmitting current.

[0007] Furthermore, the copper busbar is fixed to the circuit board body through welding holes.

[0008] Furthermore, two welding pins are provided at both ends of the copper busbar, and the welding pins pass through the welding holes.

[0009] Furthermore, the distance between the two welding pins is 2 mm.

[0010] Furthermore, the integrated circuit board includes a U-phase copper busbar, a V-phase copper busbar, and a W-phase copper busbar.

[0011] Furthermore, the integrated circuit board also includes an isolation module, which is arranged on the surface of the circuit board body and includes at least one through hole, wherein a copper bus is arranged in each through hole, but at least the soldering pins of the copper bus are exposed.

[0012] Furthermore, the isolation module is made of insulating material.

[0013] Based on the integrated circuit board as described above, a second aspect of the present invention provides a vehicle device, which includes the integrated circuit board as described above.

[0014] The utility model provides an integrated circuit board and automotive equipment, which replace the current-carrying path from the copper foil on the integrated circuit board surface to a soldered copper busbar. Since the density and current-carrying capacity of the copper busbar are much higher than those of the copper foil, only a very small copper busbar is needed to pass the same current value, which can effectively save the board area of ​​the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To further illustrate the above and other advantages and features of various embodiments of the present invention, a more detailed description of various embodiments of the present invention will be presented with reference to the accompanying drawings. It will be understood that these drawings depict only typical embodiments of the present invention and are not to be considered as limiting the scope thereof. In the drawings, for clarity, identical or corresponding components will be represented by the same or similar reference numerals.

[0016] Figure 1 A schematic diagram showing the structure of an integrated circuit board according to an embodiment of the present invention; and

[0017] Figure 2 A schematic structural diagram of soldering pins of a copper busbar of an integrated circuit board according to an embodiment of the present invention is shown.

[0018] Reference Signs List

[0019] 101 copper busbar

[0020] 1011 U-phase copper busbar

[0021] 1012 V phase copper busbar

[0022] 1013 W phase copper busbar

[0023] 111 soldering pins

[0024] 102 Isolation Module

[0025] 103 circuit board body DETAILED DESCRIPTION

[0026] The present invention will be further described below with reference to the accompanying drawings in conjunction with specific embodiments. It should be noted that the components in the accompanying drawings may be exaggerated for illustration purposes and are not necessarily proportional. In the accompanying drawings, components that are identical or have the same function are given the same reference numerals.

[0027] In this utility model, unless otherwise specified, the expressions "arranged on," "arranged above," and "arranged above" do not exclude the existence of intermediate objects between the two. Furthermore, "arranged on or above" merely indicates the relative positional relationship between two components. In certain circumstances, such as after reversing the product orientation, it can also be converted to "arranged below or below," and vice versa.

[0028] In the present invention, each embodiment is only intended to illustrate the solution of the present invention and should not be understood as limiting.

[0029] In the present invention, unless otherwise specified, the quantifiers "a" and "an" do not exclude the presence of multiple elements.

[0030] It should also be pointed out that in the embodiments of the present invention, for the sake of clarity and simplicity, only a portion of the parts or components may be shown, but a person skilled in the art will understand that under the guidance of the present invention, the required parts or components may be added according to the needs of the specific scenario.

[0031] It should also be noted that within the scope of the present invention, terms such as "same," "equal," and "equal to" do not mean that the values ​​of two items are absolutely equal, but rather allow for a certain reasonable error. In other words, the terms also encompass "substantially the same," "substantially equal," and "substantially equal." Similarly, in the present invention, terms such as "perpendicular to" and "parallel to" indicating direction also encompass the meaning of "substantially perpendicular to" and "substantially parallel to."

[0032] The current-carrying technology of existing integrated circuit boards (PCBs) is mostly achieved by laying copper foil inside the board. However, due to the poor density of the copper on the PCB board surface, it may cause its temperature to rise too high. In addition, the copper for currents of different phase sequences is laid on the same board surface. Once the copper laying process is not strictly controlled, it will cause conduction between phases, resulting in a high risk of electrical safety regulations. In order to ensure electrical safety, when the copper for currents of different phase sequences is laid on the same board surface, the electrical clearance and creepage distance must be large enough, which will lead to an increase in the board surface. The utility model provides an integrated circuit board, which solves the above problems by changing the current-carrying technology of existing PCB board surface copper. Specifically, the integrated circuit board changes the current-carrying path from copper on the board surface to a copper busbar with higher density to solve the problem of excessive temperature rise. When the integrated circuit board is used in automotive electronic products, etc., the automotive electronic products have a lower temperature rise under the premise that the same amount of heat is dissipated while performing work. At the same time, strong physical insulation is used between the copper busbars of each phase to prevent conduction, fully ensuring electrical safety regulations. Changing the current-carrying path from copper plating on the board surface to soldered copper busbars can effectively free up the area of ​​the PCB board.

[0033] The present invention will be further described below with reference to the accompanying drawings in conjunction with specific embodiments.

[0034] Figure 1 FIG. 1 is a schematic diagram showing the structure of an integrated circuit board according to an embodiment of the present invention. Figure 1 As shown, an integrated circuit board includes a circuit board body 103 and a copper busbar 101. The copper busbar 101 is fixed to the circuit board body 103 and is used to transmit current. In one embodiment of the present invention, the thickness of the copper busbar is not greater than 2 mm.

[0035] In one embodiment of the present invention, a bend is provided on the copper bus 101 to adapt to the structure of different integrated circuit boards. In one embodiment of the present invention, the bend is a rounded bend.

[0036] In one embodiment of the present invention, the copper busbar 101 is fixed to the circuit board body 103 through welding holes. Figure 2 The following is a schematic diagram showing the structure of the soldering pins of the copper busbar of an integrated circuit board according to an embodiment of the present invention. Figure 2 As shown, two welding pins 111 are provided at both ends of the copper busbar 101 . After the welding pins 111 pass through the welding holes, they are welded to the circuit board body 103 through a soldering process.

[0037] like Figure 2 As shown, in one embodiment of the present invention, the spacing between the two soldering pins is 2 mm. This structure can effectively solder the copper busbar to the corresponding soldering hole of the circuit board body and effectively prevent it from falling off.

[0038] As mentioned above, the integrated circuit board can be used in electronic equipment such as automotive equipment. In such equipment, three-phase electricity is usually used. Figure 1 As shown, in one embodiment of the present invention, the integrated circuit board includes a U-phase copper busbar 1011, a V-phase copper busbar 1012, and a W-phase copper busbar 1013. In order to ensure that there is no conduction between phases, in one embodiment of the present invention, the integrated circuit board also includes an isolation module 102, which is arranged on the surface of the circuit board body 103 and includes at least one through hole. The shape and size of the through hole are adapted to the copper busbar, and then a copper busbar can be arranged in each through hole, but at least the soldering pins of the copper busbar are exposed. On the one hand, the isolation module 102 can isolate the copper busbars of different phases from each other, and on the other hand, it can also prevent the copper busbars from directly contacting other components, circuits, and other circuit structures on the PCB board. To achieve the isolation effect, in one embodiment of the present invention, the isolation module 102 is made of an insulating material, such as plastic.

[0039] Based on the integrated circuit board as described above, the utility model further provides a vehicle device, which includes the integrated circuit board as described above.

[0040] The present invention provides an integrated circuit board, which has welding holes opened on a PCB board, and then reserved welding pins on a copper busbar, and then the copper busbar is soldered to the board surface of the PCB through a soldering process, so as to replace the existing copper foil current-carrying technology. Since the density of the copper busbar material is much higher than the density of the copper foil laid on the PCB board surface, when the same current value passes through, the temperature rise of the copper busbar is lower. At the same time, plastic parts are provided between the copper buses of different phase sequences of the integrated circuit board to strengthen the physical isolation insulation and ensure that there is no conduction between phases. Since the density and current-carrying capacity of the copper busbar are much higher than those of the copper foil, when the current-carrying path is replaced by the copper foil on the PCB board surface with the soldered copper busbar, the same current value can be passed with only a copper busbar of a very small volume, and the area of ​​the PCB board can also be effectively saved.

[0041] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not limitation. It will be apparent to those skilled in the relevant art that various combinations, modifications, and variations may be made thereto without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention as disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely in accordance with the appended claims and their equivalents.

Claims

1. An integrated circuit board, characterized in that: include: Circuit board body; as well as The copper bus is fixed on the circuit board body through welding holes and is configured to transmit current.

2. The integrated circuit board according to claim 1, wherein: Two welding pins are provided at both ends of the copper busbar, and the welding pins pass through the welding holes.

3. The integrated circuit board according to claim 2, wherein: The spacing between the two soldered pins on the same end is 2 mm.

4. The integrated circuit board according to claim 1, wherein: The integrated circuit board includes a U-phase copper busbar, a V-phase copper busbar, and a W-phase copper busbar.

5. The integrated circuit board according to claim 2, wherein: It also includes an isolation module, which is arranged on the surface of the circuit board body and includes at least one through hole, wherein a copper bus is arranged in each through hole, but at least the welding pins of the copper bus are exposed.

6. The integrated circuit board according to claim 5, wherein: The isolation module is made of insulating material.

7. A vehicle device, characterized in that: Comprising the integrated circuit board according to any one of claims 1 to 6.

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