Floating type heat dissipation device

Abstract

The utility model discloses a floating type heat dissipation device which comprises a heat dissipation device substrate, a heat conduction structure and a heat dissipation device, the heat conduction structure and the heat dissipation device are both located on the front face of the heat dissipation device substrate, the heat conduction structure is located between the heat dissipation device and the front face of the heat dissipation device substrate and comprises a heat conduction body and an auxiliary heat conduction piece, and the heat dissipation device substrate is provided with a heat exchange window. The heat conduction body is arranged on the front face of the radiator substrate and extends to the area corresponding to the heat exchange window in the plate face extending direction of the radiator substrate, the heat conduction body is provided with a suspension part extending to the heat exchange window, and the auxiliary heat conduction piece is arranged on the surface, away from the radiator, of the suspension part. The auxiliary heat conduction piece is provided with a heat absorption face extending out of the back face of the radiator substrate through the heat exchange window. The device can reduce the possibility of surface damage of a heating piece, reduce heat transfer resistance and improve heat transfer efficiency.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a floating heat dissipation device. Background Art

[0002] When soldering a chip on a printed circuit board (PCB), the thermal expansion coefficients of the chip and the PCB do not match, causing the middle area of ​​the chip to bulge upward, resulting in warping.

[0003] In the related art, a heat sink can be used to dissipate heat from the chip. However, chip warping not only results in poor heat dissipation performance of the chip, but also makes the chip easily damaged. Utility Model Content

[0004] In order to solve the above problems, the present application provides a floating heat dissipation device to reduce the possibility of damage to heat-generating components such as chips while improving the heat dissipation efficiency of heat-generating components such as chips.

[0005] The present application provides a floating heat dissipation device, comprising a heat sink substrate, a heat conducting structure and a heat sink both located on the front surface of the heat sink substrate, wherein the heat conducting structure is located between the heat sink and the front surface of the heat sink substrate.

[0006] The above-mentioned heat-conducting structure includes a heat-conducting body and an auxiliary heat-conducting part. The radiator substrate has a heat exchange window. The heat-conducting body is arranged on the front side of the radiator substrate and extends along the extension direction of the radiator substrate to the area corresponding to the heat exchange window.

[0007] The above-mentioned heat-conducting body has a suspended portion extending to the heat exchange window, and the auxiliary heat-conducting part is arranged on the surface of the suspended portion facing away from the radiator. The auxiliary heat-conducting part is gap-fitted with the heat exchange window, and the auxiliary heat-conducting part has a heat-absorbing surface extending from the back of the radiator substrate through the heat exchange window.

[0008] When the above technical solution is adopted, the heat-conducting body provided on the front of the heat sink substrate has a suspended portion extending to the heat exchange window, and the auxiliary heat-conducting part is provided on the surface of the suspended portion facing away from the heat sink. The auxiliary heat-conducting part and the heat exchange window are in clearance fit. Therefore, the suspended portion of the heat-conducting body extending to the heat exchange window and the auxiliary heat-conducting part can both move along the axial direction of the heat exchange window, thereby achieving the purpose of flexible contact between the auxiliary heat-conducting part and the chip. When the heat-absorbing surface of the auxiliary heat-conducting part extends from the back of the heat sink substrate through the heat exchange window, if the surface of the heating element has a protrusion, the heat-absorbing surface of the auxiliary heat-conducting part extends from the back of the heat sink substrate and contacts the protrusion on the surface of the heating element, so that the suspended portion of the heat-conducting body and the auxiliary heat-conducting part are offset upward in the direction away from the heating element under the action of the protrusion, thereby alleviating the problem of damage to the heating element caused by excessive contact stress between the heat-absorbing surface of the auxiliary heat-conducting part and the surface of the heating element.

[0009] Moreover, due to the flexible contact between the auxiliary heat conductive part and the chip, during the upward movement of the auxiliary heat dissipation part of the floating radiator, the auxiliary heat conductive part can also alleviate the problem of excessive contact gap caused by chip warping, and reduce the contact gap between the auxiliary heat conductive part and the surface of the heating element, thereby reducing the heat transfer resistance and improving the heat transfer efficiency.

[0010] In one possible implementation, the auxiliary heat conductor is further connected to the outer surface of the overhang portion, which is the surface of the overhang portion facing the inner sidewall of the heat exchange window. In this case, the auxiliary heat conductor can not only exchange heat through the surface of the overhang portion facing away from the heat sink, but also conduct heat through the surface of the overhang portion facing the inner sidewall of the heat exchange window. Therefore, when the auxiliary heat conductor is also connected to the surface of the overhang portion facing the inner sidewall of the heat exchange window, the heat conduction path between the auxiliary heat conductor and the heat conducting body is increased, thereby improving heat conduction efficiency.

[0011] In a possible implementation, a first gap is defined between an outer side surface of the suspended portion and an inner side wall of the heat exchange window, and the outer side surface of the suspended portion is a surface opposite to the inner side wall of the heat exchange window.

[0012] The above-mentioned auxiliary heat-conducting component includes a first heat-conducting structure and a second heat-conducting structure arranged on the first heat-conducting structure. The first heat-conducting structure is arranged on the surface of the suspended part away from the radiator, the second heat-conducting structure is located in the first gap, and there is a second gap between the second heat-conducting structure and the inner wall of the heat exchange window.

[0013] When there is a second gap between the second heat-conducting structure and the inner wall of the heat exchange window, when the auxiliary heat-conducting part moves upward under the convex action of the heating element, the heat exchange window will not constrain the auxiliary heat-conducting part, thereby ensuring that the auxiliary heat-conducting part can be in flexible contact with the heating element.

[0014] In a possible implementation, a third gap is provided between a surface of the second heat-conducting structure facing away from the inner side wall of the heat exchange window and an outer side wall of the suspended portion.

[0015] In a possible implementation, a surface of the second heat-conducting structure facing away from the inner side wall of the heat exchange window contacts the outer side wall of the suspended portion.

[0016] In one possible implementation, the heat conducting structure further includes a reinforcing plate, which is disposed on a surface of the heat conducting body close to the heat sink. The reinforcing plate can enhance the overall strength of the heat conducting body and the auxiliary heat conducting member, preventing damage to the heat conducting body.

[0017] In one possible implementation, the front surface of the heat sink substrate has a mounting groove, the inner sidewall of which has an opening. The mounting groove communicates with the heat exchange window through the opening. The heat conducting body is disposed within the mounting groove and extends into the heat exchange window through the opening.

[0018] In the technical solution disclosed in the present application, a mounting groove is provided on the front of the radiator substrate for the heat-conducting body to be arranged in the mounting groove, thereby reducing the extrusion of the radiator on the heat-conducting body and ensuring that the heat-conducting body can conduct heat normally.

[0019] In one possible implementation, the heat conducting body includes at least one first heat pipe, and the mounting slot includes at least one first mounting slot. Each first mounting slot has an opening on its sidewall, and the first heat pipe is disposed in the corresponding first mounting slot, extending into the heat exchange window through the opening.

[0020] In one possible implementation, the heat-conducting body further includes at least one second heat pipe, each of which is disposed on a corresponding first heat pipe, and the radiator is disposed on the second heat pipe. In this case, the second heat pipe not only promptly dissipates the heat absorbed by the first heat pipe but also serves as a support structure for the radiator.

[0021] In a possible implementation, one end of the first heat pipe facing away from the suspended portion is close to the opening, and the first heat pipe is a linear heat pipe.

[0022] In one possible implementation, the end of the first heat pipe facing away from the suspended portion is away from the opening, the mounting groove further includes at least one second mounting groove close to the end of the first heat pipe facing away from the suspended portion, and the heat-conducting body further includes at least one third heat pipe, and each second heat pipe is arranged on the corresponding third heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0024] Figures 1 to 4 Four structural schematic diagrams of the heat dissipation system according to the embodiment of the present application are shown;

[0025] Figure 5 A schematic structural diagram of a floating heat dissipation device disclosed in an embodiment of the present application is shown;

[0026] Figure 6 Another structural schematic diagram of the floating heat dissipation device disclosed in an embodiment of the present application is shown;

[0027] Figure 7 Another structural schematic diagram of the floating heat dissipation device disclosed in the embodiment of the present application is shown;

[0028] Figure 8 Another structural schematic diagram of the floating heat dissipation device disclosed in the embodiment of the present application is shown;

[0029] Figures 9A to 11A A schematic diagram showing the installation process of a heat-conducting structure in an XZ plane according to an embodiment of the present application is shown;

[0030] Figures 9B to 11B A schematic diagram showing the installation process of a heat-conducting structure in an XY plane according to an embodiment of the present application is shown;

[0031] Figures 12A to 14A A schematic diagram showing the installation process of another heat-conducting structure in the XZ plane according to an embodiment of the present application is shown;

[0032] Figures 12B to 14B A schematic diagram of the installation process of another heat-conducting structure in the XY plane according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0034] During chip packaging, the chip is soldered to a printed circuit board through a packaging substrate to form a packaged device. Because the chip generates heat during operation, the protective cover of the packaged device must be removed. A heat sink is then installed on the chip surface to dissipate the heat generated by the chip. During this process, the thermal expansion coefficients of the chip, packaging substrate, and printed circuit board do not match, causing chip warping.

[0035] The inventors discovered that when the chip warps, the middle area of ​​the chip bulges upward. After the protective cover of the packaged device is removed, the chip warping is difficult to suppress. As a result, the gap between the chip and the heat sink in different areas is different, and the maximum gap can reach more than 300μm, resulting in a larger heat transfer resistance between the chip and the heat sink, causing the chip's heat dissipation performance to deteriorate sharply. If the chip warps, and the contact surface between the chip and the heat sink is designed to be uniform, the stress on the raised part of the chip is relatively large, which can easily cause damage to the chip.

[0036] To address the above problems, an embodiment of the present application provides a heat dissipation system to reduce the thermal resistance between the heating element and the radiator when the contact gap between the radiator and the heating element is large, thereby improving the heat transfer efficiency of the radiator and avoiding damage to the heating element.

[0037] Figures 1 to 4Four structural schematic diagrams of the heat dissipation system of the embodiment of the present application are shown. Figures 1 to 4 As shown, the heat dissipation system 100 of the present embodiment includes a mounting substrate 101 and a heat dissipation device. The heat dissipation device includes a heat sink substrate 102 and a floating heat sink 103. The heat dissipation system also includes a heating element 104, which is disposed between the mounting substrate 101 and the heat sink substrate 102. The mounting substrate 101 can be a metal substrate or a non-metal substrate, and the specific choice can be based on actual conditions.

[0038] In practical applications, such as Figures 1 to 4 As shown, the floating heat sink 103 has multiple floating heat conductive elements 103A, and the mounting substrate 101 has multiple heat exchange windows H. The floating heat conductive elements 103A correspond to the heat exchange windows H. Each floating heat conductive element 103A can be connected to the same heat generating element 104 or different heat generating elements 104 through the corresponding heat exchange window H. In this case, the heat sink substrate 102 provides heat exchange channels for the multiple floating heat conductive elements 103A of the floating heat sink 103, so that one floating heat sink 103 can dissipate heat for the heat generating element 104 through multiple heat exchange channels.

[0039] like Figures 1 to 4 As shown, the floating heat sink 103 is disposed on the surface of the heat sink substrate 102 facing away from the mounting substrate 101. The heat sink substrate 102 has a heat exchange window H. The floating heat sink 103 is connected to the heating element 104 via the heat exchange window H. The floating heat sink 103 can move away from or toward the heating element 104 based on the stress on the surface of the heating element 104 it contacts, resulting in flexible contact between the floating heat sink 103 and the heating element 104. Therefore, when the surface of the heating element 104 where the floating heat sink 103 is connected is raised, although the stress on the surface of the heating element 104 increases, the floating heat sink 103 can move away from the heating element 104. This not only reduces the contact stress between the floating heat sink 103 and the heating element 104, thus lowering the possibility of damage to the heating element 104, but also alleviates the problem of excessive contact gap between the heating element 104 and the floating heat sink 103 caused by warping of the heating element 104, thereby ensuring normal heat dissipation from the heating element 104.

[0040] In practical applications, such as Figures 1 to 4 As shown, the heat dissipation system 100 disclosed in the embodiment of the present application further includes a thermal interface connection structure ( Figures 1 to 4 (not shown), the floating heat sink 103 is connected to the heating element 104 via a thermal interface connection structure. The thermal interface connection structure can promote heat transfer between the heating element 104 and the floating heat sink, ensuring the heat dissipation effect of the heating element 104.

[0041] For example, in the technical solutions disclosed in the embodiments of this application, Figures 1 to 4 As shown, a thermally conductive resin such as silicone grease is filled between the heating element 104 and the floating heat sink 103, resulting in a uniform contact surface between the heating element 104 and the floating heat sink 103. When a bump occurs on the surface of the heating element 104, the floating heat sink 103 can move away from the surface of the heating element 104, absorbing the bump, thereby improving the heat transfer efficiency of the floating heat sink 103 and preventing damage to the heating element 104.

[0042] For example, Figures 1 to 4 As shown, the thickness of the thermal interface structure formed by the thermal interface material can be controlled so that the thermal interface structure can be equal to the height of the protrusions on the surface of the heating element 104 (e.g., 300 μm). In this way, the thermal interface structure can fill the protrusions on the surface of the heating element 104, making the gap width between the surface of the heating element 104 and the floating heat sink 103 close to or uniform (for example, the gap width can be controlled to 0.1 mm).

[0043] In an alternative approach, Figures 1 to 4 As shown, the heating element 104 disclosed in the embodiment of the present application may include a packaged device, or may be other electronic devices or structural parts with a heating function. For example, when the heating element 104 is a packaged device, the heating element 104 includes a printed circuit board 1041, a package substrate 1042 and a chip 1043. The printed circuit board 1041 is arranged on the mounting substrate 101. The package substrate 1042 is arranged on the surface of the printed circuit board 1041 away from the mounting substrate 101. For example, the package substrate 1042 can be connected to the printed circuit board 1041 through a ball grid array; the chip 1043 is arranged on the surface of the package substrate 1042 away from the printed circuit board 1041, and the floating heat sink 103 is connected to the chip 1043 through the heat exchange window H.

[0044] like Figures 1 to 4 As shown, during the soldering process between the package substrate 1042 and the printed circuit board 1041, chip 1043 warps due to the mismatch of the materials of chip 1043, package substrate 1042, and printed circuit board 1041. Connecting the floating heat sink 103 to chip 1043 through the heat exchange window H reduces damage to chip 1043 and mitigates poor heat dissipation caused by warping, thereby ensuring the reliability of chip 1043.

[0045] For example, Figures 1 to 4As shown, in the technical solution disclosed in the embodiment of the present application, the heat dissipation system 100 also includes a reinforcement ring 105, which is arranged on the surface of the packaging substrate 1042 away from the printed circuit board 1041, and the chip 1043 is located in the inner ring area of ​​the reinforcement ring 105, and the reinforcement ring 105 is located between the packaging substrate 1042 and the radiator substrate 102.

[0046] like Figures 1 to 4 As shown, when the reinforcement ring 105 is located between the packaging substrate 1042 and the heat sink substrate 102, the chip 1043 is located in the inner ring area of ​​the reinforcement ring 105, so that the reinforcement ring 105 can support the heat sink substrate 102, alleviate the squeezing force of the heat sink substrate 102 on the chip 1043 under the action of gravity, and prevent the chip 1043 from being squeezed by the heat sink substrate 102.

[0047] For example, Figures 1 to 4 As shown, when the heat dissipation system 100 further includes a thermal interface connection structure, the thermal interface connection structure corresponds to the chip 1043, and each chip 1043 is connected to the floating heat sink 103 via the thermal interface connection structure. In this case, the thermal interface connection structure can reduce the heat transfer resistance between the chip 1043 and the floating heat sink 103, thereby improving the heat dissipation capability of the chip 1043.

[0048] In practical applications, such as Figures 1 to 4 As shown, when the floating heat sink 103 has multiple floating heat conducting members 103A, the number of heat exchange windows H and chips 1043 are both multiple, and the heat exchange windows H, chips 1043 and floating heat conducting members 103A correspond to each other. Each floating heat conducting member 103A is connected to the corresponding chip 1043 through the corresponding heat exchange window H. It should be understood that Figures 1 to 4 Only two chips 1043 are shown, but there may actually be one or more chips 1043 .

[0049] like Figures 1 to 4 As shown, when each floating heat conductor 103A can extend out of the heat exchange window H and connect to the corresponding chip 1043, the heat sink substrate 102 can provide a heat exchange channel for the multiple floating heat conductors 103A of the floating heat sink 103, so that the floating heat sink 103 can dissipate heat for the multiple chips 1043.

[0050] For example, Figures 1 to 4As shown, the heat dissipation system 100 further includes a plurality of connectors 106, which are distributed along the circumference of the mounting substrate 101. The mounting substrate 101 and the heat sink substrate 102 are connected via the plurality of connectors 106. When the floating heat sink 103 can be connected to the heat generating element 104 via the heat exchange window H, the plurality of connectors 106 can be connected to the mounting substrate 101 and the heat sink substrate 102 with relatively low alignment accuracy. Therefore, the heat dissipation system 100 disclosed in the embodiment of the present application is simple to install and has relatively low installation accuracy.

[0051] In some embodiments, as Figures 1 to 4 As shown, the mounting substrate 101 has a plurality of first mounting holes distributed along the circumference of the mounting substrate 101, and the heat sink substrate 102 has a plurality of second mounting holes distributed along the circumference of the heat sink substrate 102. The first mounting holes correspond to the second mounting holes, and each connector 106 connects the corresponding first mounting hole and the second mounting hole. For example, the connector 106 may include a columnar member such as a connecting column, bolt, or screw. Each columnar member can be passed through the first mounting hole and the corresponding second mounting hole to achieve a connection between the mounting substrate 101 and the printed circuit board 1041.

[0052] In an alternative approach, Figures 1 to 4 As shown, the floating heat sink 103 disclosed in the embodiment of the present application includes a heat sink 103B and a floating heat conductor 103A. The floating heat conductor 103A is connected to the heating element 104 through a heat exchange window H. The heat sink 103B is arranged on the side of the floating heat conductor 103A away from the heating element 104, and is used to increase the overall heat dissipation area of ​​the floating large heat element.

[0053] like Figures 1 to 4 As shown, when heat sink 103B is positioned on the side of floating thermal conductor 103A facing away from heating element 104, heat sink substrate 102 can serve as a support plate for heat sink 103B. Heat sink 103B can be soldered to heat sink substrate 102. When heat dissipation system 100 includes reinforcement ring 105, reinforcement ring 105 can support heat sink substrate 102, preventing the heat sink substrate 102 from squeezing heating element 104, such as chip 104, due to excessive weight of heat sink 103B.

[0054] like Figures 1 to 4 As shown, after the floating heat conductive member 103A absorbs the heat generated by the heating element 104, the heat generated by the heating element 104 can be quickly conducted away through the radiator 103B, so that the floating heat conductive member 103A can be quickly cooled down, thereby increasing the heat difference between the floating heat conductive member 103A and the heating element 104, and improving the heat conduction efficiency of the floating heat conductive member 103A.

[0055] In practical applications, the heat sink disclosed in the embodiment of the present application may be a finned heat sink, which may be an integrated or split finned heat sink, as described below. It should be understood that the following description is for illustrative purposes only and is not intended to be limiting.

[0056] like Figure 1 As shown, the heat sink 103B may be a split-fin heat sink having multiple fins distributed in a direction away from the floating heat conductive element 103A. Each fin may be a horizontally positioned sheet fin, and the multiple sheet fins are arranged in parallel. The heat dissipation system 100 also includes multiple sets of support structures 107. Each set of support structures 107 may be provided on the floating heat conductive element 103A. Each set of support structures may include one or more support members, which may be columnar support members.

[0057] like Figure 1 As shown, when each set of support structures 107 is provided on the floating heat conducting member 103A, multiple sets of support structures 107 are connected to each fin. In this case, the floating heat conducting member 103A can be used as a fixed structure of the support structure, so that the floating heat conducting member 103A and the multiple fins form an integral whole, which is convenient for installation.

[0058] For example, Figure 1 As shown, the support members included in each group of support structures 107 can be heat-conductive support members. For example, the heat-conductive support members can include heat pipes, heat-conductive pipes made of heat-conductive materials, such as metal pipes, etc. The heat-conductive support members can not only combine the floating heat-conductive member 103A with the multiple fins, but also transfer the heat conducted by the heat conduction path between the floating heat-conductive member 103A and the radiator 103B to the multiple fins as quickly as possible.

[0059] like Figure 2 As shown, when the heat sink 103B has multiple split fins, the multiple split fins are all arranged on the side of the floating heat conductive element 103A facing away from the heat generating element 104. For example, each split fin can be a U-shaped fin, with the openings of each U-shaped fin facing the same direction, and in two adjacent U-shaped fins, the open end of one U-shaped fin abuts against the back of the other U-shaped fin.

[0060] The heat sink 103B has an integral fin, which may be a Figure 3 The folded fins shown can also be Figure 4 Spade-tooth fins shown.

[0061] When the integrated fin is a folded fin, the flat fin can be folded repeatedly to form a folded fin, and the folded portion of the folded fin is arranged on the radiator substrate; when the integrated fin is a shovel-toothed fin, the shovel-toothed fin has multiple openings on the same side, and there are shovel teeth between two adjacent openings, and the side of the shovel-toothed fin facing away from the multiple openings is arranged on the radiator substrate.

[0062] It can be seen that the heat dissipation system disclosed in the embodiment of the present application can be applicable to the heat dissipation of single-chip packaged devices or multi-chip packaged devices. The floating heat conductor of the floating heat sink has good resilience, which absorbs the problems caused by chip warping by rebounding, reduces the contact stress borne by the chip, improves the packaging reliability and heat dissipation performance, and reduces the installation complexity and heat dissipation cost.

[0063] Furthermore, when the heat dissipation system disclosed in the embodiments of this application is applied to a multi-chip package, even if the multiple chips have different sizes, the same or similar structure can be used to cool the different chips. For example, for a multi-chip package, the heat sink substrate can be designed with multiple heat exchange windows, with the size of the heat exchange window corresponding to each chip matching the chip size to provide maximum heat exchange channels for the corresponding chip.

[0064] The embodiment of the present application also provides a floating heat sink, which can be used as a heat sink in the heat dissipation system of the embodiment of the present application. The floating heat sink can achieve flexible contact with the heating element, reduce the thermal resistance between the chip and the floating heat sink, improve the heat transfer efficiency of the floating heat sink, reduce the heat dissipation cost, reduce the contact stress on the heating element, and avoid damage to the heating element.

[0065] Figure 5 A structural diagram of a floating heat dissipation device disclosed in an embodiment of the present application is shown. Figure 6 Another structural diagram of the floating heat dissipation device disclosed in the embodiment of the present application is shown. Figure 7 FIG2 shows another structural diagram of the floating heat dissipation device disclosed in an embodiment of the present application. Figure 8 FIG. 1 shows another structural diagram of the floating heat sink disclosed in the embodiment of the present application. Figures 5 to 8 As shown, the floating heat dissipation device 200 disclosed in the embodiment of the present application includes: a heat sink substrate 201 and a heat conducting structure 202A and a heat sink 202B both located on the front surface of the heat sink substrate 201 , and the heat conducting structure 202A is located between the heat sink 202B and the front surface of the heat sink substrate 201 .

[0066] like Figure 5 and Figure 6As shown, the heat-conducting structure 202A includes a heat-conducting body 2021 and an auxiliary heat-conducting member 2022. The heat sink substrate 201 has a heat exchange window 2011. The heat-conducting body 2021 is disposed on the front surface of the heat sink substrate 201 and extends along the surface of the heat sink substrate 201 to the area corresponding to the heat exchange window 2011. The heat-conducting body 2021 has a suspended portion extending to the heat exchange window 2011. In this case, the end of the heat-conducting body 2021 extending to the heat exchange window 2011 is a free end, which can be suspended above the heat exchange window 2011. Therefore, when the heat-conducting body 2021 is subjected to an upward force, the free end can deflect upward without constraint. When the heat-conducting body 2021 is subjected to a downward force, the free end can deflect downward without constraint.

[0067] like Figures 5 to 8 As shown, the auxiliary heat conducting member 2022 can be provided on the surface of the suspended portion facing away from the heat sink 202B, and the auxiliary heat conducting member 2022 is in clearance with the inner wall of the heat exchange window 2011. In other words, there is a gap between the outer wall of the auxiliary heat conducting member 2022 and the inner wall of the heat exchange window 2011. The width of the gap can be set according to actual conditions. For example, the gap width can be 0.5 mm to 1.5 mm (e.g., 1.0 mm). Therefore, the auxiliary heat conducting member 2022 can move freely within the heat exchange window 2011 along the axial direction of the heat exchange window 2011.

[0068] For example, Figures 5 to 8 As shown, the above-mentioned heat-conducting body 2021 can be welded on the front side of the radiator substrate 201, and the auxiliary heat-conducting part 2022 can be welded on the surface of the suspended part away from the radiator 202B, so that the heat-conducting body 2021 and the auxiliary heat-conducting part 2022 are integrated.

[0069] like Figures 5 to 8 As shown, the auxiliary heat conducting member 2022 has a heat absorbing surface extending from the back of the heat sink substrate 201 through the heat exchange window 2011. Therefore, the heat absorbing surface of the auxiliary heat conducting member 2022 contacts the surface of the heat generating element. Here, the length of the auxiliary heat conducting member 2022 extending from the heat exchange window 2011 can be 0.1mm to 0.3mm.

[0070] like Figures 5 to 8 As shown, when the heat generating element is a packaged device, the radiator substrate 201 included in the floating heat dissipation device 200, the printed circuit board 1041 included in the packaged device, and the mounting substrate 101 can be fixed together by screws, so that the floating heat dissipation device 200 gradually approaches the packaged device.

[0071] like Figures 5 to 8As shown, during the soldering process of the chip to the printed circuit board 1041 via the package substrate 1042, the chip warps, causing a bulge on the chip surface. Therefore, as the floating heat sink 200 gradually approaches the packaged device, the heat-absorbing surface of the auxiliary thermal conductive member 2022 in the floating heat sink 200 first contacts the chip's bulge. Because the auxiliary thermal conductive member 2022 is spaced from the heat exchange window 2011, and the end of the heat conductive body 2021 extending into the heat exchange window 2011 is free and unconstrained, when the heat-absorbing surface of the auxiliary thermal conductive member 2022 first contacts the chip's bulge, the auxiliary thermal conductive member 2022 gradually moves upward (away from the chip). This reduces the gap between the chip and the heat sink 202B, lowering the thermal resistance and thereby absorbing the chip warping caused by the packaging process.

[0072] It can be seen that Figures 5 to 8 As shown, if the surface of the heating element has a protrusion, the heat-absorbing surface of the auxiliary heat-conducting component 2022 extends from the back of the radiator substrate 201 and contacts the protrusion on the surface of the heating element, so that the suspended portion of the heat-conducting body 2021 and the auxiliary heat-conducting component 2022 are offset upward in the direction away from the heating element under the action of the protrusion, thereby alleviating the problem of damage to the heating element caused by excessive contact stress between the heat-absorbing surface of the auxiliary heat-conducting component 2022 and the surface of the heating element.

[0073] Moreover, if Figures 5 to 8 As shown, due to the flexible contact between the auxiliary heat conductive part 2022 and the chip, during the upward movement of the auxiliary heat dissipating part of the radiator 202B, the auxiliary heat conductive part 2022 can also alleviate the problem of excessive contact gap caused by chip warping, and reduce the contact gap between the auxiliary heat conductive part 2022 and the surface of the heating element, thereby reducing the heat transfer resistance and improving the heat transfer efficiency.

[0074] In an alternative approach, Figures 5 to 8 As shown, the auxiliary heat conducting member 2022 disclosed in the embodiment of the present application is also connected to the outer side surface of the overhang portion, which is the surface of the overhang portion opposite the inner sidewall of the heat exchange window 2011. In this case, the auxiliary heat conducting member 2022 can not only exchange heat through the surface of the overhang portion facing away from the heat sink 202B, but also conduct heat through the surface of the overhang portion facing the inner sidewall of the heat exchange window 2011. Therefore, when the auxiliary heat conducting member 2022 is also connected to the surface of the overhang portion facing the inner sidewall of the heat exchange window 2011, the heat conduction path between the auxiliary heat conducting member 2022 and the heat conducting body 2021 can be increased, thereby improving heat conduction efficiency.

[0075] like Figures 5 to 8As shown, when a first gap exists between the outer side surface of the suspended portion and the inner side wall of the heat exchange window 2011, the outer side surface of the suspended portion is the surface of the suspended portion opposite the inner side wall of the heat exchange window 2011. The auxiliary heat conductive member 2022 includes a first heat conductive structure and a second heat conductive structure disposed on the first heat conductive structure. The first heat conductive structure is disposed on the surface of the suspended portion facing away from the heat sink 202B, and the second heat conductive structure is located within the first gap. A second gap exists between the second heat conductive structure and the inner side wall of the heat exchange window 2011. At this time, when the auxiliary heat conductive member 2022 moves upward under the convex action of the heating element, the heat exchange window 2011 will not constrain the auxiliary heat conductive member 2022, thereby ensuring that the auxiliary heat conductive member 2022 can flexibly contact the heating element.

[0076] For example, Figures 5 to 8 As shown, when a third gap exists between the surface of the second heat-conducting structure facing away from the inner sidewall of the heat exchange window 2011 and the outer sidewall of the overhanging portion, contact is also possible. When the surface of the second heat-conducting structure facing away from the inner sidewall of the heat exchange window 2011 contacts the outer sidewall of the overhanging portion, the heat exchange effect between the second heat-conducting structure and the overhanging portion is improved, further improving the heat transfer efficiency between the auxiliary heat-conducting member 2022 and the heat-conducting body 2021.

[0077] In an alternative approach, Figure 5 and Figure 6 As shown, the heat-conducting structure 202A of the present embodiment further includes a reinforcing plate 2023, which is disposed on the surface of the heat-conducting body 2021 near the heat sink 202B. The reinforcing plate 2023 can enhance the overall strength of the heat-conducting body 2021 and the auxiliary heat-conducting member 2022, thereby preventing damage to the heat-conducting body 2021. For example, if the heat-conducting body 2021 is a heat pipe, significant pressure on the heat pipe can hinder heat conduction.

[0078] For example, Figures 5 to 8 As shown, the reinforcing plate 2023 can be welded to the heat-conducting body 2021, and the auxiliary heat-conducting member 2022 can be welded to the heat-conducting body 2021. In this way, the reinforcing plate 2023, the heat-conducting body 2021, and the auxiliary heat-conducting member 2022 form a unified heat-conducting device. When installing the floating heat sink 200, the heat sink 202B can be directly welded to the front surface of the heat sink base plate 201. This installation method is simple, quick, and easy to operate.

[0079] like Figures 5 to 8 As shown, the thickness of the reinforcing plate 2023 can be greater than 0.2 mm, and the reinforcing plate 2023, the heat conducting body 2021 and the auxiliary heat conducting member 2022 can be made of metal materials such as copper and iron, but are not limited thereto. The material of the heat sink substrate 201 can be made of metal materials such as copper and aluminum, but are not limited thereto.

[0080] In an alternative approach, Figures 5 to 8 As shown, the front surface of the heat sink substrate 201 has a mounting groove 2012, the inner sidewall of which has an opening. The mounting groove 2012 communicates with the heat exchange window 2011 through the opening. The heat conducting body 2021 is disposed within the mounting groove 2012 and extends into the heat exchange window 2011 through the opening. Providing the mounting groove 2012 on the front surface of the heat sink substrate 201 allows the heat conducting body 2021 to be positioned therein, thereby reducing the pressure exerted by the heat sink 202B on the heat conducting body 2021 and ensuring proper heat conduction from the heat conducting body 2021.

[0081] Illustratively, the heat conducting body 2021 includes at least one first heat pipe, and the mounting slot 2012 includes at least one first mounting slot. Each first mounting slot has an opening on its sidewall, and a first heat pipe is disposed in the corresponding first mounting slot, extending into the heat exchange window 2011 through the opening.

[0082] like Figure 8 As shown, when the heat-conducting body 2021 also includes at least one second heat pipe, each second heat pipe is provided on the corresponding first heat pipe. For example, the first heat pipe is connected to the second heat pipe, and the radiator 202B is provided on the second heat pipe. In this case, the second heat pipe can not only export the heat absorbed by the first heat pipe in a timely manner, but also support the radiator 202B as a supporting structure. For example, when the end of the first heat pipe facing away from the suspended portion is close to the opening, the first heat pipe is a linear heat pipe. In this case, the second heat pipe can be provided at the end of the corresponding first heat pipe facing away from the opening.

[0083] When the distance between the end of the first heat pipe facing away from the suspended portion and the opening is relatively close, the heat dissipation effect of the first heat pipe is poor. However, since the second heat pipe is arranged on the corresponding first heat pipe and the second heat pipe can extend into the radiator along the height direction, the second heat pipe can quickly transfer the heat of the first heat pipe to the radiator.

[0084] Exemplarily, the end of the first heat pipe facing away from the suspended portion is distal to the opening, the mounting slot further includes at least one second mounting slot, and the end of the first heat pipe facing away from the suspended portion is proximate to the second mounting slot. The heat conducting body further includes at least one third heat pipe, each third heat pipe being disposed within a corresponding second mounting slot, and each second heat pipe being disposed on a corresponding group of third heat pipes.

[0085] When the end of the first heat pipe facing away from the suspended portion is away from the opening, the first heat pipe can transfer the absorbed heat to an area farther from the opening, where the temperature is lower and is conducive to heat dissipation. Therefore, when the second mounting groove is close to the end of the first heat pipe facing away from the suspended portion, the second mounting groove is in an area with a lower temperature. At this time, after the third heat pipe is arranged in the second mounting groove, on the one hand, the third heat pipe is closer to the end of the first heat pipe facing away from the suspended end, and on the other hand, the temperature difference between the internal heat exchange fluid of the third heat pipe and the internal fluid of the end of the first heat pipe facing away from the suspended end is relatively large, and its heat exchange efficiency is relatively high. Therefore, through the heat exchange between the first heat pipe and the third heat pipe, the third heat pipe can quickly extract the heat from the first heat pipe, thereby allowing the first heat pipe to extract the heat from the heating element more quickly.

[0086] In order to further improve the heat dissipation effect, each second heat pipe can also be arranged on the corresponding third heat pipe, so that the heat absorbed by the third heat pipe is transferred to the second heat pipe, and the radiator is arranged on the second heat pipe. Therefore, the radiator can not only absorb heat through heat exchange with the first heat pipe, but also absorb heat through heat exchange with the second heat pipe, thereby improving the heat absorption path and achieving better heat dissipation effect.

[0087] like Figures 5 to 7 As shown, when the heat conducting body 2021 includes a first heat pipe, reference may be made to Figures 2 to 4 Provide a heat sink 202B, such as Figure 8 , when the heat conducting body 2021 includes a first heat pipe, a second heat pipe and a third heat pipe, you can refer to Figure 1 A heat sink 202B is provided.

[0088] Figures 9A to 11A A schematic diagram showing the installation process of a heat-conducting structure in an XZ plane according to an embodiment of the present application is shown; Figures 9B to 11B The following is a schematic diagram showing the installation process of a heat-conducting structure in the XY plane according to an embodiment of the present application. Figures 9A to 11A and Figures 9B to 11B A schematic diagram depicting the conductive structure. Here, the number of chips packaged in the packaged device is taken as two, but the number of packaged chips may be more or less.

[0089] The first step, such as Figure 9A and Figure 9B As shown, by considering the chip size packaged by the packaging device, the spacing between chips, and the size of the auxiliary heat-conducting parts, two heat exchange windows 3011 and a first mounting groove 3012 corresponding to each heat exchange window 3011 are processed on the metal substrate 301, thereby obtaining a heat sink substrate. Here, the first mounting groove 3012 is located on the front side of the metal substrate 301, and the metal substrate 301 can be made of a high thermal conductivity material, such as copper, aluminum, etc., but is not limited to this.

[0090] from Figure 9A and Figure 9B As can be seen, the heat exchange window 3011 communicates with the first mounting groove 3012, and the first mounting groove 3012 extends along the outer edge of the heat exchange window 3011. Each heat exchange window 3011 can communicate with two first mounting grooves 3012. For ease of manufacturing, the two first mounting grooves 3012 can be continuous. For two heat exchange windows 3011, the corresponding first mounting grooves 3012 can be arranged in a finger-like interlaced pattern to save space.

[0091] The second step is Figure 10A and Figure 10B As shown, the first heat pipe 3021A can be welded in the first mounting groove 3012. The first heat pipe 3021A extends to the area where the heat exchange window 3011 is located, and has a certain gap with the inner wall of the heat exchange window 3011, so that the first heat pipe 3021A extends into the area where the heat exchange window 3011 is located to form a suspended portion. The first heat pipe 3021A can be made of copper and is welded on the first heat pipe 3021A. The auxiliary heat conductor 3022 can extend from the back side of the metal substrate 301, and its extended length can be 0.1mm to 0.3mm.

[0092] The third step, such as Figure 11A and Figure 11B As shown, a reinforcing plate 3023 is welded on the side of the first heat pipe 3021A away from the auxiliary heat conducting member 2022. The reinforcing plate 3023 can be made of copper with a thickness of not less than 0.1 mm. For a heat exchange window 3011, a reinforcing plate 3023 can be welded to the first heat pipe 3021A placed in the two first mounting grooves 3012 connected to the heat exchange window 3011 to improve the strength of the first heat pipe 3021A. Finally, you can refer to Figures 5 to 7 The heat sink type shown in Figure 11A and Figure 11B A heat sink is provided on the metal substrate 301 as shown.

[0093] from Figures 9A to 11A and Figures 9B to 11B It can be seen that the radiator substrate can be configured with four first heat pipes 3021A, each heat exchange window 3011 corresponds to two first heat pipes 3021A, and the first heat pipes 3021A corresponding to the two heat exchange windows 3011 are distributed in a finger-like manner, thereby quickly conducting the chip heat to the surrounding areas of the radiator substrate to solve the heat dissipation needs of high-power chips and reduce the interface thermal resistance between the chip and the radiator.

[0094] Figures 12A to 14A A schematic diagram showing the installation process of another heat-conducting structure in the XZ plane according to an embodiment of the present application is shown; Figures 12B to 14BThe schematic diagram of the installation process of another heat-conducting structure in the XY plane of the embodiment of the present application is shown. The following takes the packaged device as an example. Figures 12A to 14A and Figures 12B to 14B A schematic diagram depicting the conductive structure. Here, the number of chips packaged in the packaged device is taken as two, but the number of packaged chips may be more or less.

[0095] The first step, such as Figure 12A and Figure 12B As shown, reference Figure 9A and Figure 9B The metal substrate 301 is processed to obtain a radiator substrate. Figure 9A and Figure 9B The difference is that a second mounting groove 3013 can be further processed on the metal substrate 301 , which is close to the end of the first mounting groove 3012 away from the heat exchange window 3011 .

[0096] like Figure 12A and Figure 12B As shown, for each heat exchange window 3011, one corresponding first heat pipe 3021A is a straight heat pipe, and the other first heat pipe 3021A is a curved heat pipe, extending along the outer extension of the heat exchange window 3011. For two heat exchange windows 3011, the straight heat pipes corresponding to the two heat exchange windows 3011 are centrally symmetrically distributed, while the two curved heat pipes are centrally symmetrically distributed.

[0097] The second step is Figure 13A and Figure 13B As shown, reference Figure 10A and Figure 10B The first heat pipe 3021A can be welded in the first mounting groove 3012, and the first heat pipe 3021A extends to the area where the heat exchange window 3011 is located, and has a certain gap with the inner wall of the heat exchange window 3011, so that the part where the first heat pipe 3021A extends into the area where the heat exchange window 3011 is located forms a suspended portion. The auxiliary heat conductive member 3022 can be made of copper and is welded on the first heat pipe 3021A. The auxiliary heat conductive member 3022 can extend from the back side of the metal substrate 301, and its extension length can be 0.1mm to 0.3mm.

[0098] like Figure 13A and Figure 13B As shown, the first heat pipe 3021A is divided into two types: a straight heat pipe and a curved heat pipe. For the straight heat pipe, a second heat pipe 3021B is also provided on the straight heat pipe. For the curved heat pipe, a third heat pipe 3021C is also provided on the end of the curved heat pipe away from the heat exchange window 3011, and the third heat pipe 3021C is located in the second mounting groove 3013. Furthermore, the second heat pipe 3021B can also be provided on the third heat pipe 3021C.

[0099] from Figure 13A and Figure 13B As can be seen, in the solution disclosed in the embodiments of the present application, different heat dissipation methods can be designed for the first heat pipe 3021A based on its shape and heat dissipation environment. For example, for a straight heat pipe with a poor heat dissipation environment, the second heat pipe 3021B can be directly installed on it to quickly dissipate heat from the straight heat pipe. For a curved heat pipe with a better heat dissipation environment, a straight heat pipe can be first installed, and then the second heat pipe 3021B can be installed on the straight heat pipe to dissipate heat.

[0100] The third step, such as Figure 14A and Figure 14B As shown, a reinforcing plate 3023 is welded on the side of the first heat pipe 3021A away from the auxiliary heat conducting member 3022. The reinforcing plate 3023 can be made of copper with a thickness of not less than 0.1 mm. For a heat exchange window 3011, a reinforcing plate 3023 can be welded to the first heat pipe 3021A placed in the two first mounting grooves 3012 connected to the heat exchange window 3011 to improve the strength of the first heat pipe 3021A. Finally, you can refer to Figure 8 In the heat sink form shown, the heat sink is provided on a metal substrate 301 .

[0101] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0102] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0103] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on this application.

[0104] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0105] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0106] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A floating heat dissipation device, characterized in that: A heat sink substrate and a heat conducting structure and a heat sink are both located on the front surface of the heat sink substrate, wherein the heat conducting structure is located between the heat sink and the front surface of the heat sink substrate; The heat-conducting structure includes a heat-conducting body and an auxiliary heat-conducting member. The radiator substrate has a heat exchange window. The heat-conducting body is arranged on the front surface of the radiator substrate and extends along the extension direction of the plate surface of the radiator substrate to the area corresponding to the heat exchange window. The heat-conducting body has a suspended portion extending to the heat exchange window. The auxiliary heat-conducting member is arranged on the surface of the suspended portion facing away from the radiator. The auxiliary heat-conducting member is loosely fitted with the heat exchange window. The auxiliary heat-conducting member has a heat-absorbing surface extending from the back surface of the radiator substrate through the heat exchange window.

2. The floating heat sink according to claim 1, wherein: The auxiliary heat conducting member is further connected to the outer side surface of the suspended portion, and the outer side surface of the suspended portion is the surface of the suspended portion opposite to the inner side wall of the heat exchange window.

3. The floating heat sink according to claim 1, wherein: There is a first gap between the outer side surface of the suspended portion and the inner side wall of the heat exchange window, and the outer side surface of the suspended portion is the surface of the suspended portion opposite to the inner side wall of the heat exchange window; The auxiliary heat-conducting component includes a first heat-conducting structure and a second heat-conducting structure arranged on the first heat-conducting structure, the first heat-conducting structure is arranged on the surface of the suspended portion facing away from the radiator, the second heat-conducting structure is located in the first gap, and a second gap is formed between the second heat-conducting structure and the inner side wall of the heat exchange window.

4. The floating heat sink according to claim 3, characterized in that: A third gap is formed between the surface of the second heat-conducting structure facing away from the inner side wall of the heat exchange window and the outer side wall of the suspended portion; or A surface of the second heat-conducting structure facing away from the inner sidewall of the heat exchange window contacts the outer sidewall of the suspended portion.

5. The floating heat sink according to claim 1, wherein: The heat-conducting structure further includes a reinforcing plate, which is arranged on a surface of the heat-conducting body close to the heat sink.

6. The floating heat sink according to any one of claims 1 to 5, characterized in that: The front surface of the radiator substrate is provided with a mounting groove, and the inner side wall of the mounting groove is provided with an opening; The mounting groove is communicated with the heat exchange window through the opening. The heat conducting body is arranged in the mounting groove. The heat conducting body extends into the heat exchange window through the opening.

7. The floating heat sink according to claim 6, characterized in that: The heat-conducting body includes at least one first heat pipe, and the mounting groove includes at least one first mounting groove; The side wall of each first installation groove has the opening, the first heat pipe is arranged in the corresponding first installation groove, and the first heat pipe extends into the heat exchange window through the opening.

8. The floating heat sink according to claim 7, characterized in that: The heat-conducting body further includes at least one second heat pipe, each of the second heat pipes is arranged on the corresponding first heat pipe, and the radiator is arranged on the second heat pipe.

9. The floating heat sink according to claim 8, characterized in that: One end of the first heat pipe facing away from the suspended portion is close to the opening, and the first heat pipe is a linear heat pipe.

10. The floating heat sink according to claim 8, wherein: An end of the first heat pipe facing away from the suspended portion is away from the opening, and the mounting groove further comprises at least one second mounting groove close to the end of the first heat pipe facing away from the suspended portion; The heat-conducting body further includes at least one third heat pipe, each of the third heat pipes is arranged in the corresponding second installation groove, and each of the second heat pipes is arranged on the corresponding third heat pipe.

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