Printed circuit board (PCB) capable of reducing deformation

Abstract

The utility model provides a PCB board capable of reducing deformation, comprising an insulating substrate, a first copper mesh attached to a first side surface of the insulating substrate and a second copper mesh attached to a second side surface of the insulating substrate, the first copper mesh comprises a plurality of first copper foil units arranged in a first rectangular array, and the second copper mesh comprises a plurality of second copper foil units arranged in a second rectangular array. The second copper net comprises a plurality of second copper foil units which are arranged in a second rectangular array; the adjacent first copper foil units in the two arrangement directions of the first rectangular array are mutually independent, and a gap is reserved between the adjacent first copper foil units; the adjacent second copper foil units in one arrangement direction of the second rectangular array are integrally connected through a connecting part, and the adjacent second copper foil units in the other arrangement direction are mutually independent and are spaced. The first copper net and the second copper net have different arrangement designs, so that a good heat dissipation effect is ensured, and a good physical enhancement effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a PCB board with reduced deformation. Background Art

[0002] During the SMT soldering and assembly process, PCBs may deform. This deformation poses a greater risk in products with long lifecycles and high-precision soldering. One of the causes of this deformation is uneven heat conduction between the air and the PCB. PCBs typically consist of routing areas and non-routing areas. The non-routing areas are often covered with large areas of copper foil. Because copper foil has excellent thermal conductivity, it distributes heat evenly during the SMT soldering process, preventing localized heat concentration. Furthermore, the copper foil itself is less susceptible to thermal deformation and can also enhance the structural stability of the PCB.

[0003] Copper foil is generally laid in two ways: full copper and grid. Each laying method has its own advantages and disadvantages: full copper laying has better structural stability of the PCB board, especially for some thin PCB boards. However, the heat dissipation performance is poor. In terms of welding process, if the PCB board is subjected to wave soldering, it may warp and bubble due to poor heat dissipation. Grid laying has better heat dissipation performance and is suitable for high-power circuit boards and flexible circuit boards, but its effect on structural reinforcement is limited. Utility Model Content

[0004] In order to solve the above problems, the present invention provides a PCB board with reduced deformation. The PCB board has good structural strength and good heat dissipation performance, and can reduce the deformation of the PCB board during the SMT soldering assembly process.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A PCB board with reduced deformation includes an insulating substrate, a first copper mesh attached to a first side surface of the insulating substrate, and a second copper mesh attached to a second side surface of the insulating substrate, wherein the first copper mesh includes a plurality of first copper foil units arranged in a first rectangular array, and the second copper mesh includes a plurality of second copper foil units arranged in a second rectangular array; adjacent first copper foil units in two arrangement directions of the first rectangular array are independent of each other and have a spacing therebetween; adjacent second copper foil units in one arrangement direction of the second rectangular array are integrally connected by a connecting portion, and adjacent second copper foil units in the other arrangement direction are independent of each other and have a spacing therebetween.

[0007] In the present invention, both a first copper mesh and a second copper mesh are disposed in a non-wiring area of ​​a PCB board. The second side of the insulating substrate is used to accommodate conductive wires. During soldering, electronic components are attached to the first side of the insulating substrate, and the electronic components are electrically connected to the conductive wires on the second side of the insulating substrate via pins. During SMT soldering, the first side of the insulating substrate faces upward and the second side faces downward. The first and second copper meshes of the present invention have different arrangement designs. The first copper foil units in the first copper mesh are completely independent, thereby enhancing heat dissipation from the first side of the insulating substrate. The second copper foil units in the second copper mesh are partially independent, and adjacent second copper foil units in one arrangement direction of the second rectangular array are connected into an integrated structure, providing the second copper mesh with improved structural reinforcement while also ensuring improved heat dissipation. Furthermore, due to the different thermal expansion coefficients of copper and the insulating substrate under thermal conditions, the first and second copper meshes of the present invention both have internal spacing regions that can accommodate expansion of the PCB board. Furthermore, the unique structure of the second copper mesh can also limit excessive deformation of the PCB board.

[0008] Furthermore, the first copper foil unit is square in shape, and the side spacings of adjacent first copper foil units in two arrangement directions of the first rectangular array are equal.

[0009] Furthermore, the side length of the first copper foil unit is 0.4-0.6 mm, and the side distance between adjacent first copper foil units in two arrangement directions of the first rectangular array is 0.1-0.2 mm.

[0010] Furthermore, the second copper foil unit is square in shape, and the side spacings of adjacent second copper foil units in two arrangement directions of the second rectangular array are equal.

[0011] Furthermore, the side length of the second copper foil unit is 0.6-0.8 mm, and the side distance between adjacent second copper foil units in two arrangement directions of the second rectangular array is 0.1-0.3 mm.

[0012] Furthermore, the connecting portion is rectangular in shape, and an end portion of the connecting portion is connected to a middle portion of a corresponding collar edge of the second copper foil unit.

[0013] Furthermore, the width of the connecting portion is 0.4 to 0.7 times the side length of the second copper foil unit.

[0014] Furthermore, the thickness of the insulating substrate is 0.3-0.5 mm.

[0015] Furthermore, the thickness of the first copper foil unit and the second copper foil unit is 0.03-0.05 mm.

[0016] Furthermore, the connection direction of the connection portion is not parallel to the long side of the PCB board.

[0017] The application of this utility model can achieve the following beneficial effects:

[0018] 1. The first copper mesh and the second copper mesh of the present invention have different arrangement designs. The first copper foil units in the first copper mesh are completely independent of each other, so that the first side surface of the insulating substrate has a better heat dissipation effect. The second copper foil units in the second copper mesh are partially independent of each other. The adjacent second copper foil units in one arrangement direction of the second rectangular array are connected into an integrated structure, so that the second copper mesh has a better structural reinforcement effect while ensuring that the second copper mesh has a better heat dissipation effect.

[0019] 2. Due to the different thermal expansion coefficients of copper and insulating substrate under heating conditions, the first copper mesh and the second copper mesh of the utility model both have internal spacing areas that can adapt to the expansion of the PCB board. At the same time, due to the unique structure of the second copper mesh, excessive deformation of the PCB board can be limited. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the structure of a PCB board with reduced deformation in an embodiment;

[0021] Figure 2 for Figure 1 Schematic diagram of the structure of the first copper mesh;

[0022] Figure 3 for Figure 1 Schematic diagram of the structure of the second copper mesh;

[0023] In the figure, 1-insulating substrate, 2-first copper mesh, 21-first copper foil unit, 3-second copper mesh, 31-second copper foil unit, 32-connecting portion. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example

[0025] Reference Figure 1This embodiment provides a PCB board with reduced deformation, which includes an insulating base layer 1, a first copper mesh 2 attached to a first side surface of the insulating substrate, and a second copper mesh 3 attached to a second side surface of the insulating substrate. The first copper mesh and the second copper mesh are arranged in a non-wiring area of ​​the insulating substrate. The second side surface of the insulating substrate is used to set a wire. During the soldering process, the electronic component is attached to the first side surface of the insulating substrate, and the electronic component is electrically connected to the wire on the second side surface of the insulating substrate through the pin. During the SMT soldering process, the first side surface of the insulating substrate faces upward and the second side surface faces downward.

[0026] More specifically:

[0027] Reference Figure 2 The first copper mesh 2 includes a plurality of first copper foil units 21 arranged in a first rectangular array. The first copper foil units are square structures. In two arrangement directions of the first rectangular array, adjacent first copper foil units are independent of each other and a spacing is left between adjacent sides, and the spacing in the two arrangement directions is equal;

[0028] Reference Figure 3 The second copper mesh 3 includes a plurality of second copper foil units 31 arranged in a second rectangular array. The second copper foil units are square structures. In one arrangement direction of the second matrix, adjacent second copper foil units are independent of each other and a spacing is left between the sides close to each other. In another arrangement direction, a spacing is left between the sides close to each other of the second copper foil units and the sides close to each other are connected by a connecting portion 32, so that two adjacent second copper foil units form an integrated structure. After the multiple second copper foil units are connected in sequence in this arrangement direction, an integrated strip structure unit is formed. The extension direction of the strip structure unit is not parallel to the long side of the PCB board.

[0029] For reference, this embodiment also provides a specific arrangement of the first copper mesh and the second copper mesh:

[0030] In the first copper mesh, the side length of the first copper foil unit is 0.5 mm, the side spacing between adjacent first copper foil units in the two arrangement directions of the first rectangular array is 0.14 mm, and the thickness of the first copper foil unit is 0.035 mm;

[0031] In the second copper mesh, the side length of the second copper foil unit is 0.6 mm. In both arrangement directions of the second rectangular array, the side spacing between adjacent second copper foil units is 0.16 mm. The width of the connecting portion for connecting two second copper foil units is 0.3 mm. The thickness of the second copper foil unit and the connecting portion is 0.035 mm.

[0032] The thickness of the insulating substrate is 0.5 mm.

[0033] The above is only one of the preferred embodiments proposed after considering the cost and processing difficulty. In other embodiments, the first copper foil unit or the second copper foil unit may also be other shapes such as round, rectangular, diamond, etc. According to the shape difference of the first copper foil unit or the second copper foil unit, the side spacing of the first copper foil unit or the second copper foil unit in the two arrangement directions of the rectangular array may also be designed to be different from each other, the shape of the connecting part may also be non-rectangular, and the connection position of the connecting part may not be the middle of the side of the second copper foil unit.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A PCB board with reduced deformation, characterized by: It includes an insulating substrate, a first copper mesh attached to the first side of the insulating substrate, and a second copper mesh attached to the second side of the insulating substrate, wherein the first copper mesh includes a plurality of first copper foil units arranged in a first rectangular array, and the second copper mesh includes a plurality of second copper foil units arranged in a second rectangular array; the first copper foil units adjacent in the two arrangement directions of the first rectangular array are independent of each other and have a spacing therebetween; the second copper foil units adjacent in one arrangement direction of the second rectangular array are integrally connected by a connecting portion, and the second copper foil units adjacent in the other arrangement direction are independent of each other and have a spacing therebetween.

2. The PCB board with reduced deformation according to claim 1, characterized in that: The first copper foil units are square in shape, and the side spacings of adjacent first copper foil units in two arrangement directions of the first rectangular array are equal.

3. The PCB board with reduced deformation according to claim 2, wherein: The side length of the first copper foil unit is 0.4-0.6 mm, and the side distance between adjacent first copper foil units in two arrangement directions of the first rectangular array is 0.1-0.2 mm.

4. The PCB board with reduced deformation according to claim 1, wherein: The second copper foil units are square in shape, and the side spacings of adjacent second copper foil units in two arrangement directions of the second rectangular array are equal.

5. The PCB board with reduced deformation according to claim 4, characterized in that: The side length of the second copper foil unit is 0.6-0.8 mm, and the side distance between adjacent second copper foil units in two arrangement directions of the second rectangular array is 0.1-0.3 mm.

6. The PCB board with reduced deformation according to claim 4, characterized in that: The connecting portion is rectangular in shape, and an end portion of the connecting portion is connected to the middle portion of the corresponding collar edge of the second copper foil unit.

7. The PCB board with reduced deformation according to claim 6, characterized in that: The width of the connecting portion is 0.4 to 0.7 times the side length of the second copper foil unit.

8. The PCB board with reduced deformation according to claim 1, wherein: The thickness of the insulating substrate is 0.3-0.5 mm.

9. The PCB board with reduced deformation according to claim 1, characterized in that: The thickness of the first copper foil unit and the second copper foil unit is 0.03-0.05 mm.

10. The PCB board with reduced deformation according to claim 1, characterized in that: The connection direction of the connecting portion is not parallel to the long side of the PCB board.

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