Packaging tube shell of flexible circuit board

Abstract

The utility model provides a packaging tube shell of a flexible circuit board, belongs to the technical field of packaging tube shells, and solves the problem that molten welding flux flows out from gaps in the prior art. A flexible circuit board is fixedly installed in the shell, an opening is formed in the upper end face of the shell, a through hole for a lead portion of the flexible circuit board to extend out of the shell is formed in the side wall of the shell, sliding grooves located in the upper side and the lower side of the through hole are vertically formed in the outer wall of the shell, and sliding blocks are arranged in the sliding grooves in a sliding mode. The sliding blocks are connected with baffles used for clamping the wire leading part, the baffles make sliding contact with the outer wall of the shell, the baffles are connected with abutting devices used for keeping the two baffles clamped mutually, and the sides, close to the wire leading part, of the baffles are provided with grooves matched with the wire leading part. The abutting device enables the two baffles to be close to each other and to be clamped and attached to the surface of the lead portion, molten solder is prevented from flowing out of the gap, the sealing quality of the through hole is guaranteed, solder removal operation is not needed, and rapid packaging production of the flexible circuit board is facilitated.

Description

Technical Field

[0001] The utility model belongs to the technical field of package tube shells, in particular to a package tube shell for a flexible circuit board. Background Art

[0002] A package is an outer shell used to protect and secure electronic components. Packages are typically made of plastic, metal, ceramic, and other materials, depending on the specific application. Metal packages are typically made of metals such as copper, aluminum, and their alloys, while ceramic packages are made of high-quality ceramic materials such as alumina and silicon nitride.

[0003] The package tube shell of a flexible circuit board can ensure that the electronic components on the flexible circuit board are isolated from the external environment, thereby improving the reliability and stability of the circuit. The flexible circuit board includes a working portion and a lead portion. The working portion with solder pads is placed inside the tube shell, and the back of the working portion is fixed to the tube shell with glue. The lead portion extends through a through-hole in the side wall of the tube shell. The through-hole is sintered with low-temperature solder to ensure that the through-hole is completely filled. Finally, the cover plate is installed to complete the assembly of the package tube shell. Before sintering, it is necessary to install a baffle on the package tube shell to block the through-hole to prevent the melted solder from flowing out of the through-hole and causing poor sealing of the through-hole. The baffle has a square window to facilitate the passage of the lead portion. After the lead portion passes through the window, the baffle is moved to fit on the package tube shell for fixation. In order to ensure that the baffle passes smoothly and quickly on the lead part, the window will be processed to a larger size, leaving a larger gap between the baffle and the lead part. Part of the melted solder will still flow out from the gap, resulting in the need to remove the outflowing solder later to prevent the solder from affecting the connection between the lead part and the electrical appliance. However, the solder removal operation is more troublesome and is not conducive to the rapid packaging production of flexible circuit boards. Utility Model Content

[0004] In response to the above-mentioned problems, the purpose of the present utility model is to provide a packaging tube shell for a flexible circuit board. The clamping device brings the two baffles close to each other and clamps them tightly against the surface of the lead portion, preventing the melted solder from flowing out of the gap, ensuring the sealing quality of the through hole, eliminating the need for solder removal operations, and facilitating the rapid packaging production of flexible circuit boards.

[0005] The technical solutions adopted in this utility model are as follows:

[0006] A packaging tube shell for a flexible circuit board includes a shell in which the flexible circuit board is fixedly installed, an opening is provided on the upper end surface of the shell, a through hole is provided on the side wall of the shell for the lead portion of the flexible circuit board to extend out of the shell, a solder material that is movably sleeved on the lead portion is provided in the through hole, a slide groove is vertically provided on the outer wall of the shell and is located on the upper and lower sides of the through hole, a slider is slidably provided in the slide groove, the slider is connected to a baffle for clamping the lead portion and the baffle is in sliding contact with the outer wall of the shell, the baffle is connected to a clamping device for keeping the two baffles clamped to each other, and a groove that is adapted to the lead portion is provided on the side of the baffle close to the lead portion.

[0007] Preferably, the tightening device includes a fixing seat installed on the shell, a screw rod is vertically threadedly connected to the fixing seat, and one end of the screw rod close to the baffle is rotatably connected to the top plate.

[0008] Preferably, a square slot is provided on the outer wall of the shell, and the fixing seat is connected to a square plug-in block that matches the square slot.

[0009] Preferably, a step hole for placing solder is provided in the through hole.

[0010] Preferably, a support rod is provided at the bottom of the shell, and the upper end of the support rod is connected to a support plate for mounting a flexible circuit board.

[0011] Preferably, a cover plate is installed at the opening, and a lower surface of the cover plate is provided with a plurality of positioning posts in contact with the inner wall of the shell.

[0012] Preferably, a guiding slope is provided on a side of the positioning column close to the inner wall of the shell.

[0013] Preferably, a step for placing a cover plate is provided in an annular shape at the opening.

[0014] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0015] The clamping device brings the two baffles close to each other and clamps them tightly against the surface of the lead part, preventing the melted solder from flowing out of the gap, ensuring the sealing quality of the through hole, eliminating the need for solder removal operations, and facilitating the rapid packaging production of flexible circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1A simplified schematic diagram of the main structure provided by an embodiment of the utility model;

[0018] Figure 2 A schematic diagram of the main cross-sectional structure provided by an embodiment of the utility model;

[0019] Figure 3 A left-side structural diagram provided for an embodiment of the present utility model;

[0020] Figure 4 This is a schematic diagram of the top structure provided by an embodiment of the utility model.

[0021] Figure markings: 1-shell; 2-support rod; 3-support plate; 4-working part; 5-slide groove; 6-slider; 7-step hole; 8-solder; 9-baffle; 10-top plate; 11-fixed seat; 12-screw; 13-square plug; 14-square slot; 15-positioning column; 16-through hole; 17-cover plate; 18-guide slope; 19-step; 20-lead part; 21-groove. DETAILED DESCRIPTION

[0022] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that if the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the application is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0025] The following combination Figures 1-4 The utility model is described in detail.

[0026] Example

[0027] A packaging tube shell for a flexible circuit board includes a shell 1 in which a flexible circuit board is fixedly installed. An opening is provided on the upper end surface of the shell 1, and a through hole 16 is provided on the side wall of the shell 1 for allowing a lead portion 20 of the flexible circuit board to extend out of the shell 1. A solder material 8 that is movably sleeved on the lead portion 20 is provided in the through hole 16. The outer wall of the shell 1 is vertically provided with a slide groove 5 located on the upper and lower sides of the through hole 16, and a slider 6 is slidably provided in the slide groove 5. The slider 6 is connected to a baffle 9 for clamping the lead portion 20 and the baffle 9 is in sliding contact with the outer wall of the shell 1. The baffle 9 is connected to a tightening device for keeping the two baffles 9 clamped to each other, and a groove 21 that is compatible with the lead portion 20 is provided on the side of the baffle 9 close to the lead portion 20.

[0028] The flexible circuit board includes a working portion 4 and a lead portion 20 connected to the working portion 4. Figure 1 As shown, after the lead portion 20 extends out of the housing 1 through the through-hole 16, two baffles 9 clamp the lead portion 20 and seal the through-hole 16 to prevent the melted solder 8 from flowing out of the through-hole 16. Specifically, the edges of the working portion 4 located on both sides of the lead portion 20 are in contact with the interior of the housing 1, allowing the lead portion 20 to extend out of the housing 1 in the correct posture. This ensures that the grooves 21 on the baffles 9 align with the lead portion 20 for proper clamping. After the lead portion 20 extends out of the through-hole 16 and the solder 8 is installed, the baffles 9 are moved to clamp the lead portion 20. Finally, a tightening device is used to clamp the two baffles 9 together and tightly fit the lead portion 20 to prevent the solder from flowing out of the through-hole 16.

[0029] The abutting device includes a fixing base 11 mounted on the housing 1, a screw 12 is vertically threadedly connected to the fixing base 11, and the end of the screw 12 close to the baffle 9 is rotatably connected to the top plate 10. The screw 12 is rotated to make the top plate 10 abut against the baffle 9, so that the baffle 9 fits on the lead portion 20.

[0030] A square slot 14 is provided on the outer wall of the housing 1, and the fixing base 11 is connected to a square plug 13 that cooperates with the square slot 14. The fixing base 11 is detachably connected to the housing 1 through the interference fit between the square plug 13 and the square slot 14. After the through hole 16 is sealed, the tightening device can be removed and reused.

[0031] The through hole 16 is provided with a stepped hole 7 for placing the solder 8. The stepped hole 7 can limit the placement position of the solder 8, preventing the solder 8 from moving into the housing 1 and affecting the welding sealing effect.

[0032] The bottom of the housing 1 is provided with a support rod 2, and the upper end of the support rod 2 is connected to a support plate 3 for mounting a flexible circuit board. After the working part 4 is mounted on the support plate 3, the working part 4 is located in the middle of the through hole 16 to ensure the quality of welding.

[0033] A cover plate 17 is mounted at the opening. Several positioning posts 15 are provided on the lower surface of the cover plate 17, which contact the inner wall of the housing 1. A step 19 is provided in a circular pattern at the opening for placing the cover plate 17. The positioning posts 15 position the cover plate 17 so that the cover plate 17 is spaced a certain distance from the steps 19, facilitating subsequent sealing of the cover plate 17 and the housing 1 using solder or glue.

[0034] A guide slope 18 is provided on one side of the positioning post 15 close to the inner wall of the housing 1. The guide slope 18 can facilitate the positioning post 15 to be quickly inserted into the housing 1 and contact the inner wall of the housing 1.

[0035] During the packaging operation, first apply glue to the back of the working part 4, then place the working part 4 into the shell 1 and extend the lead part 20 into the through hole 16; install the working part 4 against the support plate 3, and adjust the position of the lead part 20 before the glue solidifies so that the two baffles 9 can correctly clamp the lead part 20.

[0036] Place solder 8 into through hole 16 from the outside of housing 1, then install the clamping device to make baffle 9 abut against clamping lead part 20, and finally Figure 1 The illustrated state is rotated 90° counterclockwise and placed in a vacuum tube furnace for soldering. Solder 8 is a low-temperature, insulated, solid solder sheet: a tin-bismuth solder. The melting temperature of this solder is less than 280°C, thus preventing thermal damage to the flexible circuit board. After soldering through-hole 16, the clamping device is removed and the cover plate 17 is installed for sealing.

[0037] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A packaging tube shell for a flexible circuit board, comprising a shell (1) in which a flexible circuit board is fixedly installed, wherein an opening is formed on the upper end surface of the shell (1), and wherein: The side wall of the shell (1) is provided with a through hole (16) for the lead portion (20) of the flexible circuit board to extend out of the shell (1), and a soldering material (8) movably sleeved on the lead portion (20) is provided in the through hole (16). The outer wall of the shell (1) is vertically provided with a slide groove (5) located on the upper and lower sides of the through hole (16), and a slider (6) is slidably provided in the slide groove (5). The slider (6) is connected to a baffle (9) for clamping the lead portion (20), and the baffle (9) is in sliding contact with the outer wall of the shell (1). The baffle (9) is connected to a clamping device for keeping the two baffles (9) clamped to each other, and a groove (21) adapted to the lead portion (20) is provided on the side of the baffle (9) close to the lead portion (20).

2. The package shell of a flexible circuit board according to claim 1, characterized in that: The tightening device comprises a fixing seat (11) mounted on the housing (1), a screw rod (12) being vertically threadedly connected to the fixing seat (11), and an end of the screw rod (12) close to the baffle (9) being rotatably connected to the top plate (10).

3. The package tube shell of a flexible circuit board according to claim 2, characterized in that: A square slot (14) is provided on the outer wall of the housing (1), and the fixing seat (11) is connected with a square plug-in block (13) that matches the square slot (14).

4. The package shell of a flexible circuit board according to claim 1, characterized in that: The through hole (16) is provided with a stepped hole (7) for placing solder (8).

5. The package shell of a flexible circuit board according to claim 1, characterized in that: A support rod (2) is provided at the bottom of the housing (1), and the upper end of the support rod (2) is connected to a support plate (3) for mounting a flexible circuit board.

6. The flexible circuit board package according to claim 1, wherein: A cover plate (17) is installed at the opening, and a lower surface of the cover plate (17) is provided with a plurality of positioning columns (15) in contact with the inner wall of the housing (1).

7. The package shell of a flexible circuit board according to claim 6, characterized in that: A guide slope (18) is provided on one side of the positioning column (15) close to the inner wall of the housing (1).

8. The package shell of a flexible circuit board according to claim 6, characterized in that: A step (19) for placing a cover plate (17) is provided in an annular manner at the opening.

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