Heat dissipation air duct of oxygen generator and oxygen generator

Abstract

The utility model discloses a heat dissipation air duct of oxygenerator and oxygenerator, the heat dissipation air duct comprises a first air inlet which is arranged on the first side wall of the oxygenerator shell; the first air duct is connected with the first air inlet and located between the top wall of the shell and the top plate of the equipment cavity; the second air duct is connected with the first air duct and located between the second side wall of the shell and the second side plate of the equipment cavity; the second air inlet is formed in a second side plate of the equipment cavity; by arranging the equipment cavity, heat generated by components in the equipment cavity is prevented from being quickly diffused to other areas in the oxygenerator shell, and normal work of other components is not affected; the space in the shell is divided into a plurality of interval spaces, the length of an air duct is increased, and the number of parts through which heat dissipation airflow flows is increased; and communication between the interval spaces and communication between the interval spaces and the outside are set, so that a bent and smooth air path is formed, and the heat dissipation efficiency of parts in the air channel is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of oxygen concentrators, and particularly relates to a heat dissipation duct of an oxygen concentrator and an oxygen concentrator with the heat dissipation duct. Background Art

[0002] An oxygen concentrator is a device that extracts oxygen from the air. It's primarily used in the medical field, providing high-purity oxygen to patients requiring additional oxygen. Molecular sieve oxygen concentrators are currently the most commonly used. Two molecular sieves undergo the same cycle, achieving continuous air supply. The process works as follows: Raw air is pressurized by a compressor. The treated compressed air then enters the molecular sieve through an inlet valve, where nitrogen is adsorbed. The resulting gas is high-purity oxygen.

[0003] When a compressor compresses large quantities of filtered air, the potential energy of the molecules in the compressed air is converted into kinetic energy. Frequent molecular collisions generate heat, which can affect the lifespan of the oxygen generator if the heat isn't promptly dissipated. Currently, fans are typically used to dissipate heat from the compressor. This results in complex internal housing structures and inadequate air duct design, resulting in poor sound insulation and noise reduction. This generates significant noise during operation and results in a high temperature rise, severely impacting product performance.

[0004] The above information disclosed in this background technology is only used to increase the understanding of the background technology of this application. Therefore, it may contain information that does not constitute the prior art known to ordinary technicians in this field. Summary of the Invention

[0005] In response to the above-mentioned problems in the prior art, the present invention proposes a heat dissipation duct for an oxygen concentrator. By setting up an equipment cavity, the length of the duct is increased, the number of components through which the heat dissipation airflow flows is increased, and a smooth and curved air path is formed, thereby increasing the heat dissipation efficiency in the duct.

[0006] In order to achieve the above-mentioned purpose of the utility model, the utility model adopts the following technical solutions:

[0007] A heat dissipation duct of an oxygen concentrator, comprising:

[0008] a first air inlet, which is provided on a first side wall of the oxygen concentrator housing;

[0009] a first air duct connected to the first air inlet and located between the top wall of the housing and the top plate of the equipment cavity;

[0010] a second air duct connected to the first air duct and located between the second side wall of the housing and the second side plate of the equipment cavity;

[0011] a second air inlet, which is opened on the second side panel of the equipment cavity and is used for the airflow in the second air duct to enter the equipment cavity;

[0012] The first side wall and the second side wall are arranged opposite to each other, and the second side plate is arranged adjacent to the second side wall.

[0013] In some embodiments of the present application, the equipment cavity and the compressor cavity are arranged adjacent to each other in the upper and lower parts, and a third air inlet is provided on the top of the compressor cavity for the airflow in the equipment cavity to enter the compressor cavity.

[0014] In some embodiments of the present application, the second side panel is disposed adjacent to the second side wall.

[0015] In some embodiments of the present application, a second air inlet is provided on the second side panel of the equipment cavity for allowing the airflow in the second air duct to enter the equipment cavity, and a fan is provided in the equipment cavity for providing power for the airflow in the heat dissipation air duct.

[0016] In some embodiments of the present application, the plane where the top plate of the equipment cavity is located is lower than the first air inlet.

[0017] In some embodiments of the present application, the oxygen concentrator has a first circuit board located in the first air duct and capable of generating heat, and the first circuit board is fixed on the top plate of the equipment cavity.

[0018] In some embodiments of the present application, the first circuit board is spaced apart from the top plate of the equipment cavity, a plurality of support columns are provided on the top plate of the equipment cavity, and the first circuit board is fixed on the plurality of support columns.

[0019] In some embodiments of the present application, the support column has a column body and a snap-fit ​​limiting top cap located at the upper end of the column body, and a first fixing hole matching the snap-fit ​​limiting top cap is opened on the first circuit board.

[0020] In some embodiments of the present application, the locking limiting top cap has a connecting portion connected to the column, two claws arranged opposite to each other along the top of the connecting portion, the claw has a claw portion away from the connecting portion in a downward direction, and a supporting portion extending downward along the claw portion, and the supporting portion rests on the upper end surface of the first circuit board.

[0021] In some embodiments of the present application, an elastic plate is provided on the column and abuts against the lower end surface of the first circuit board, and the elastic plate is located on the lower side of the engaging and limiting top cap.

[0022] In some embodiments of the present application, the elastic plate is arranged to be inclined in an upward arc shape in a direction away from the column.

[0023] In some embodiments of the present application, a compressor is provided in the compressor cavity, and a heat dissipation pipe connected to the compressor and used to transport compressed gas is provided in the equipment cavity, and the heat dissipation pipe is provided on the inner side of the second air inlet.

[0024] In some embodiments of the present application, a second circuit board is provided in the equipment cavity, and the second circuit board is fixed on a first side panel of the equipment cavity opposite to the second side panel, and the second circuit board is spaced apart from the first side panel.

[0025] In some embodiments of the present application, a fixing frame for fixing the second circuit board is provided on the first side panel, the fixing frame having a supporting portion extending inward along the first side panel and a fixing portion bent and extended along the inner end of the supporting portion, and the second circuit board is fixed on the fixing portion.

[0026] In some embodiments of the present application, the equipment cavity and the compressor cavity are arranged adjacent to each other vertically, and a third air inlet is provided on the top of the compressor cavity for supplying air from the equipment cavity to the compressor cavity, and the fan is fixed at the third air inlet.

[0027] In some embodiments of the present application, a silencer module is further included below the compressor cavity, and a fourth air inlet is provided on the bottom plate of the compressor cavity for conveying the airflow in the compressor cavity to the silencer module.

[0028] In some embodiments of the present application, a downwardly extending air outlet cavity is provided on the bottom wall of the housing, and an air outlet for discharging gas is provided on the side wall of the air outlet cavity.

[0029] In some embodiments of the present application, a first circuit board is provided in the first air duct, and the first circuit board is fixed on the top plate of the equipment cavity.

[0030] In some embodiments of the present application, a second circuit board is provided in the device cavity, and the heat dissipation of the plurality of first components provided on the first circuit board is greater than the heat dissipation of the plurality of second components provided on the second circuit board.

[0031] In some embodiments of the present application, an inclined panel frame is provided between the top plate and the second side wall of the shell, a control panel is mounted on the panel frame, and the panel frame is inclined upward away from the second side wall; the inner side of the panel frame guides the airflow passing through.

[0032] Based on the above-mentioned heat dissipation duct, the present application also provides an oxygen concentrator having the above-mentioned heat dissipation duct. By setting an equipment cavity and a compressor cavity, it is beneficial to increase the length of the duct, increase the number of components through which the heat dissipation airflow flows, and form a winding and smooth air path, thereby increasing the heat dissipation efficiency in the duct.

[0033] An oxygen concentrator is provided with the above-mentioned heat dissipation duct.

[0034] Compared with the prior art, the advantages and positive effects of the present invention are as follows: by setting up an equipment cavity, the heat generated by the components in the equipment cavity is prevented from quickly diffusing to other areas in the oxygen concentrator housing, thereby affecting the normal operation of other components; and the space in the housing is divided into multiple partitions, which is conducive to increasing the length of the air duct and increasing the number of components through which the heat dissipation airflow flows; and the connection between the partitions and the outside world is set up to form a tortuous and smooth air path, thereby increasing the heat dissipation efficiency of the components in the air duct. By setting up a first air duct, the airflow enters from the first air inlet and flows between the top wall of the housing and the top plate of the equipment cavity, which can dissipate heat for the components located above the top plate of the equipment cavity, thereby improving the heat dissipation effect.

[0035] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, a brief introduction will be given below to the drawings required for use in the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 This is a structural schematic diagram of an embodiment of a heat dissipation duct of an oxygen concentrator proposed in the present utility model;

[0038] Figure 2 for Figure 1 A schematic cross-sectional view of the structure;

[0039] Figure 3 for Figure 1 The schematic diagram of the structure after the front shell of the housing and part of the cavity plate of the equipment cavity are exploded;

[0040] Figure 4 for Figure 3 The schematic diagram of the structure after some cavity plates of the compressor cavity are removed;

[0041] Figure 5 for Figure 1 Schematic diagram of the structure after the outer shell is removed;

[0042] Figure 6 for Figure 5 A schematic cross-sectional structural diagram of a;

[0043] Figure 7 for Figure 5 Another cross-sectional structural diagram;

[0044] Figure 8 for Figure 7 A magnified schematic diagram of area A in the middle;

[0045] Figure 9 is a structural schematic diagram of the first circuit board and the support column;

[0046] Figure 10 Schematic diagram of the structure of the support column;

[0047] Among them, oxygen concentrator 100;

[0048] Housing 10; first side wall 11; second side wall 12; top wall 13; air outlet cavity 14; air outlet 141; first air inlet 155; panel frame 19;

[0049] Equipment cavity 20; first side panel 21; fixing frame 211; supporting portion 2111; fixing portion 2112; second side panel 22; second air inlet 221; top panel 23; fan 25; second circuit board 27; supporting column 28; column 281; engaging and limiting top cap 282; connecting portion 2821; claw 2822; claw portion 28221; abutting portion 28222; elastic plate 283; engaging and limiting bottom cap 284; first circuit board 29; first fixing hole 291;

[0050] Compressor cavity 30; cavity top 33; third air inlet 331; fourth air inlet 341; compressor 35; heat dissipation pipe 351;

[0051] Heat dissipation duct 40; first duct 41; second duct 42;

[0052] Noise reduction module 50. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0054] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", etc. are based on the positional relationships shown in the accompanying drawings, with the direction closer to the center of the oxygen concentrator being "inside" and the opposite being "outside". The terms are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0055] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0056] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0057] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art may recognize the application of other processes and / or the use of other materials.

[0058] See also Figures 1-10 , is an embodiment of a heat dissipation duct for an oxygen concentrator proposed in the present invention. The oxygen concentrator 100 comprises a housing 10, an equipment chamber 20 and a compressor chamber 30 disposed within the housing 10, with the equipment chamber 20 being located above the compressor chamber 30. The provision of the equipment chamber 20 and the compressor chamber 30 prevents heat generated by components within the compressor 30 and the equipment chamber 20 from rapidly dissipating to other areas within the housing of the oxygen concentrator, thereby affecting the normal operation of other components.

[0059] See also Figure 2 As shown, the heat dissipation duct 40 of an oxygen concentrator 100 includes: a first duct 41, a second duct 42, and a first air inlet 155 located at the inlet end of the first duct 41. The first air inlet 155 is located on the first side wall 11 of the housing 10; the housing 10 is approximately square and has four side walls. The compressor chamber 30 and the equipment chamber 20 are also square shells, and the compressor chamber 30 and the equipment chamber 20 are spaced apart from the side walls of the housing 10. The first side wall 11 and the second side wall 12 of the housing 10 are arranged opposite each other. The first side panel 21 of the equipment chamber 20 is adjacent to the first side wall 11, and the second side panel 22 is adjacent to the second side wall 12. Figure 2 The arrows in the figure indicate the direction of the cooling airflow.

[0060] In this embodiment, the first air duct 41 is located between the top wall 13 of the housing 10 and the top plate 23 of the device chamber 20. The second air duct 42 is connected to the first air duct 41 and is located between the second side wall 12 of the housing 10 and the second side plate 22 of the device chamber 20. The heat dissipation airflow blown in through the first air inlet 155 enters the first air duct 41, passing through the top of the device chamber 20, and then flows downward into the second air duct 42. A fan 25 is provided within the device chamber 20 to power the airflow within the heat dissipation duct 40. When the fan 25 is turned on, negative pressure is generated within the first and second air ducts 41, 42, allowing outside air to enter the heat dissipation duct 40 through the first air inlet 155. A compressor 35 is provided within the compressor chamber 30. The heat dissipation airflow flows through the compressor 35, dissipating heat from the compressor 35. The provision of the equipment cavity 20 facilitates dividing the space within the housing 10 into multiple compartments, thereby increasing the length of the air duct and the number of components through which the heat dissipation airflow flows. Furthermore, connections are provided between the compartments, as well as with the outside world, forming a smooth, winding air path, thereby increasing the heat dissipation efficiency of the components within the heat dissipation duct 40. The provision of the first air duct 41 allows the airflow to enter through the first air inlet 155 and flow between the top wall 13 of the housing 10 and the top plate 23 of the equipment cavity 20. The heat dissipation airflow flows over the equipment cavity 20, dissipating heat for components located above the top plate 23 of the equipment cavity 20 and improving the heat dissipation effect. While continuing to dissipate heat for the compressor 35, the main heat dissipation component, the heat dissipation airflow can extend the heat dissipation air path, increasing the number of components it passes through and dissipating heat for other heat dissipation components.

[0061] In some embodiments of this application, see Figure 2 and Figure 3 As shown, a second air inlet 221 is provided on the second side panel 22 of the equipment cavity 20, and the airflow in the second air duct 42 enters the equipment cavity 20 through the second air inlet 221. The top panel 23 of the equipment cavity 20 is arranged at a plane lower than the first air inlet 155, so that the airflow entering from the first air inlet 155 is directly blown above the equipment cavity 20. The second air inlet 221 is provided on the second side panel 22, so that the airflow in the second air duct 42 is sucked into the equipment cavity 20; the first air inlet 155 is provided on the first side wall 11, so that the heat dissipation air duct 40 flows above the equipment cavity 20, then bends and flows downward, and then enters the equipment cavity 20 through the second air inlet 221. Compared with the existing air duct arrangement, the first air duct 41 and the second air duct 42 are added.

[0062] In some embodiments of the present application, the oxygen concentrator 100 includes a first circuit board 29 located within a first air duct 41. The first circuit board 29 is fixed to the ceiling 23 of the equipment chamber 20. Heat dissipation air flows through the first circuit board 29, dissipating heat from the first circuit board 29. The first circuit board 29 is the top circuit board and generates heat during operation. Positioning it within the first air duct 41 facilitates timely heat removal. The first components include sensing components, detection components, and the like.

[0063] In some embodiments of the present application, an inclined panel frame 19 is provided between the top plate 13 and the second side wall 12 of the housing 10. The panel frame 19 is inclined upwardly away from the second side wall 12, and the inner side of the panel frame 19 forms a guide for airflow. The control panel is mounted on the panel frame 19. With the side closest to the user during normal use of the oxygen concentrator being the front, and the opposite side being the rear, the second side wall 12 serves as the front panel of the oxygen concentrator. As the airflow within the first air duct 41 passes through the inner side of the panel frame 19, it needs to bend downward to change direction. The inclined arrangement of the panel frame 19 serves to guide the airflow.

[0064] In some embodiments of the present application, the first circuit board 29 is spaced apart from the top plate 23 of the equipment cavity 20. Firstly, this can increase the shock absorption effect and prevent the vibration of the top plate 23 from being directly transmitted to the first circuit board 29. Secondly, the heat dissipation airflow can pass through the top and bottom of the first circuit board 29. Both the upper and lower end surfaces of the first circuit board 29 can be in contact with the heat dissipation airflow, which is beneficial to increase the contact area between the first circuit board 29 and the heat dissipation airflow and improve the heat dissipation effect. The first circuit board 29 is arranged parallel to the top plate 23. The distance between the first circuit board 29 and the top plate 23 is small. The heat generated by the first circuit board 29 can be transferred to the top plate 23, and the top plate 23 acts as a heat sink for the first circuit board 29. When the heat dissipation airflow passes through the first air duct 41, some of the heat on the top plate 23 is also taken away. A plurality of support columns 28 are provided on the top plate 23 of the equipment cavity 20. The first circuit board 29 is fixed on the plurality of support columns 28 to achieve the spacing between the first circuit board 29 and the top plate 23.

[0065] In some embodiments of this application, see Figure 9 and Figure 10 As shown, the support column 28 includes a column body 281, a snap-fitting cap 282 located at the upper end of the column body 281, and a first fixing hole 291 that matches the snap-fitting cap 282 is formed on the first circuit board 29. The snap-fitting cap 282 is snap-fitted and fixedly engaged with the first fixing hole 291. The support column 28 is provided to achieve a spacing between the first circuit board 29 and the top plate 23. The snap-fitting cap 282 is provided to achieve snap-fitting and fixing of the support column 28 with the first circuit board 29, which helps improve installation efficiency.

[0066] In some embodiments of the present application, the locking cap 282 includes a connecting portion 2821 connected to the column 281, two claws 2822 disposed opposite each other along the top of the connecting portion 2821, and abutment portions 28222 extending downwardly from the claws 28221. The abutment portions 28222 abut against the upper surface of the first circuit board 29. The two claws 28221 move downwardly away from each other to engage with the first fixing hole 291. The abutment portions 28222 are provided to limit the upward movement of the first circuit board 29. An elastic plate 283 is provided on the column 281 to abut against the lower surface of the first circuit board 29. The elastic plate 283 is located below the locking cap 282. The provision of the elastic plate 283 limits the downward movement of the first circuit board 29, ensuring the stability of the first circuit board 29. The elastic plate 283 is arranged to be inclined in an upward arc in the direction away from the column 281. When the support column 28 is installed on the first circuit board 29, in order to realize the engagement and limiting of the top cap 282 through the first fixing hole 291, the elastic plate 283 is pressed downward and deformed by the first circuit board 29. Thereafter, the elastic plate 283 can be moved upward and reset, so that the first circuit board 29 is confined between the elastic plate 283 and the abutment portion 28222, thereby achieving firm fixation.

[0067] In some embodiments of the present application, the lower end of the support column 28 is provided with a snap-fit ​​bottom cap 284. The snap-fit ​​bottom cap 284 can adopt the same structure as the snap-fit ​​top cap 282 to achieve snap-fit ​​fixation of the lower end of the support column 28 to the top plate 23. The lower end of the support column 28 can also adopt other structures that can achieve fixation. Multiple support columns 28 are provided between the top plate 23 and the first circuit board 29 to provide support for the first circuit board 29.

[0068] In some embodiments of this application, see Figure 3 As shown, a heat dissipation pipe 351 connected to the compressor 35 is provided within the equipment chamber 20. This pipe is used to transport compressed gas. Its S-shaped structure increases the contact area between the pipe 351 and the cooling airflow, facilitating heat dissipation. The heat dissipation pipe 351 is located inside the second air inlet 221. The cooling airflow within the second air duct 42 enters the equipment chamber 20 through the second air inlet 221, dissipating heat first from the heat dissipation pipe 351.

[0069] In some embodiments of this application, see Figure 7As shown, a second circuit board 27 is provided within the equipment cavity 20. The second circuit board 27 is fixed to the first side panel 21 of the equipment cavity 20. The first side panel 21 and the second side panel 22 are arranged opposite each other, with the second circuit board 27 spaced apart from the first side panel 21 and arranged parallel to the first side panel 21. The spacing of the second circuit board 27 from the first side panel 21 enhances shock absorption, preventing vibrations from the first side panel 21 from being directly transferred to the second circuit board 27. Secondly, the smaller spacing between the second circuit board 27 and the first side panel 21 allows heat generated by the second circuit board 27 to be transferred to the first side panel 21, which acts as a heat sink for the second circuit board 27. Thirdly, the cooling airflow can pass through both the inside and outside of the second circuit board 27, increasing the contact area between the second circuit board 27 and the cooling airflow and improving the cooling effect. The cooling airflow entering the equipment cavity 20 first passes through both the inside and outside of the second circuit board 27, dissipating heat from the second circuit board 27, before being drawn into the fan 25.

[0070] In some embodiments of this application, see Figure 8 As shown, a fixing bracket 211 for securing the second circuit board 27 is provided on the first side panel 21. The fixing bracket 211 comprises a support portion 2111 extending inwardly from the first side panel 21, and a fixing portion 2112 extending and bending along the inner end of the support portion 2111. The second circuit board 27 is secured to the fixing portion 2112. The fixing bracket 211 secures the second circuit board 27 and spaces it from the first side panel 21. The second circuit board 27 is secured to the fixing portion 2112 using fasteners. The second circuit board 27 is arranged vertically, and multiple fixing brackets 211 are provided on the first side panel 21.

[0071] In some embodiments of the present application, the components within the oxygen concentrator 100 are classified and integrated. Components that dissipate less heat during operation are placed on a first circuit board 29, which is fixed to the upper side of the top plate 23 of the equipment cavity 20 and located within the first air duct 41. A plurality of first components are provided on the first circuit board 29, and the first components include sensing components, detection components, and the like. Components that dissipate more heat during operation are placed on a second circuit board 27, which is fixed inside the equipment cavity 20 to prevent heat from being quickly transferred to the outside of the housing 10; and the heat is carried away by the airflow within the heat dissipation duct 40. A plurality of second components are provided on the second circuit board 27, and the second components include drive components for fans and compressors, and the like.

[0072] In some embodiments of the present application, the equipment chamber 20 and the compressor chamber 30 are arranged adjacent to each other vertically. The bottom plate of the equipment chamber 20 also serves as the ceiling of the compressor chamber 30. A third air inlet 331 is provided on the ceiling 33 for supplying air to the compressor chamber 30. The fan 25 is fixed to the third air inlet 331. The fan 25 blows the heat dissipation airflow downward into the compressor chamber 30 through the third air inlet 331.

[0073] In some embodiments of the present application, the oxygen concentrator 100 further includes a silencer module 50 located below the compressor chamber 30, and a fourth air inlet 341 is provided on the bottom plate of the compressor chamber 30 for conveying the airflow in the compressor chamber 30 to the silencer module 50. A downwardly extending air outlet cavity 14 is provided on the bottom wall of the housing 10, and an air outlet 141 for discharging gas is provided on the side wall of the air outlet cavity 14. By providing the silencer module 50, silencing is performed when the gas is discharged to avoid excessive noise; by providing the air outlet cavity 14, the gas is prevented from being directly discharged downward from the oxygen concentrator 100 and is discharged from the air outlet 141 on the side wall. Firstly, the length and bends of the air outlet path can be increased, further achieving a silencing effect; secondly, the gas is prevented from being directly discharged downward and impacting the ground, affecting the subsequent discharge of gas.

[0074] In this embodiment, the first side wall 11 serves as the rear wall of the housing 10, that is, the first air inlet 155 is provided on the rear wall of the housing 10. After the fan 25 is started, the air in the equipment chamber 20 is first drawn into the fan 25, creating a negative pressure in the equipment chamber 20. The air outside the equipment chamber 20 is then replenished into the equipment chamber 20 through the second air inlet 221 of the second side panel 22. In other words, the air in the second air duct 42 is drawn into the equipment chamber 20, creating a negative pressure in the second air duct 42. The air in the first air duct 41 is then replenished into the second air duct 42, and then the outside air enters the first air duct 41 through the first air inlet 155 on the first side wall 11 of the housing 10. That is, the outside air enters the first air duct 41 through the first air inlet 155, and the heat dissipation airflow flows through the first circuit board 29, taking away part of the heat emitted by the first circuit board 29; then the heat dissipation air flows through the guide of the panel frame 19, bends downward and enters the second air duct 42, and enters the equipment cavity 20 through the second air inlet 221, the heat dissipation airflow flows through the heat dissipation pipe 351, and part of the heat dissipation airflow flows through the second circuit board 27; then enters the fan 25 and is blown downward into the compressor cavity 30 to dissipate heat for the compressor 35; then downward through the fourth air inlet 341 into the silencer module 50 for silencer processing; finally reaches the air outlet cavity 14 and is discharged through the air outlet 141.

[0075] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, it is still possible for a person skilled in the art to modify the technical solutions described in the above embodiments, or to replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions claimed to be protected by the present invention.

Claims

1. A heat dissipation duct of an oxygen concentrator, characterized in that: include: a first air inlet, which is provided on a first side wall of the oxygen concentrator housing; a first air duct connected to the first air inlet and located between the top wall of the housing and the top plate of the equipment cavity; a second air duct connected to the first air duct and located between the second side wall of the housing and the second side plate of the equipment cavity; a second air inlet, which is opened on the second side panel of the equipment cavity and is used for the airflow in the second air duct to enter the equipment cavity; The first side wall and the second side wall are arranged opposite to each other, and the second side plate is arranged adjacent to the second side wall.

2. The heat dissipation duct according to claim 1, characterized in that: The equipment cavity and the compressor cavity are arranged adjacent to each other in the upper and lower parts, and a third air inlet for the airflow in the equipment cavity to enter the compressor cavity is opened on the cavity top of the compressor cavity.

3. The heat dissipation duct according to claim 2, characterized in that: It also includes a silencer module located below the compressor cavity, and a fourth air inlet is provided on the bottom plate of the compressor cavity for conveying the airflow in the compressor cavity to the silencer module.

4. The heat dissipation duct according to claim 1, characterized in that: An air outlet cavity extending downward is provided on the bottom wall of the shell, and an air outlet for discharging gas is provided on the side wall of the air outlet cavity.

5. The heat dissipation duct according to any one of claims 1 to 4, characterized in that: A first circuit board is provided in the first air duct, and the first circuit board is fixed on the top plate of the equipment cavity.

6. The heat dissipation duct according to claim 5, characterized in that: A second circuit board is provided in the equipment cavity, and the heat dissipation of the plurality of first components provided on the first circuit board is smaller than the heat dissipation of the plurality of second components provided on the second circuit board.

7. The heat dissipation duct according to any one of claims 1 to 4, characterized in that: An inclined panel frame is provided between the top plate and the second side wall of the shell, and a control panel is mounted on the panel frame. The panel frame is inclined upward away from the second side wall; the inner side of the panel frame serves to guide the airflow passing through.

8. The heat dissipation duct according to any one of claims 1 to 4, characterized in that: The plane where the top plate of the equipment cavity is located is lower than the first air inlet.

9. The heat dissipation duct according to claim 2, characterized in that: A compressor is provided in the compressor cavity, and a heat dissipation pipe connected with the compressor and used for conveying compressed gas is provided in the equipment cavity. The heat dissipation pipe is provided on the inner side of the second air inlet.

10. An oxygen concentrator, characterized in that: A heat dissipation duct according to any one of claims 1 to 9.

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