Multi-size limiting equipment suitable for wafer cleaning

Abstract

The utility model relates to multi-size limiting equipment suitable for wafer cleaning, which comprises a mounting base, a vertical lifting device arranged on the mounting base, an angle driving device arranged on the vertical lifting device, a bearing flange arranged at the driving end of the angle driving device, and a turntable assembly arranged on the bearing flange, a 6-inch limiting device and an 8-inch limiting device are respectively arranged on the turntable assembly, the 6-inch limiting device and the 8-inch limiting device are respectively and annularly arranged to respectively form a 6-inch limiting space and an 8-inch limiting space, and the height of the 6-inch limiting device is lower than that of the 8-inch limiting device. Therefore, the vertical lifting device is arranged, so that the subsequently loaded wafer is located in an effective spraying area in the cleaning equipment as much as possible, the height of the spraying device does not need to be adjusted for the second time, and the use convenience is improved. The angle driving device is adopted and can be matched with the rotating disc assembly, rotation is carried out when the wafer is stably limited, and dead-corner-free cleaning is achieved.

Description

Technical Field

[0001] The utility model relates to a limiting device, in particular to a multi-size limiting device suitable for wafer cleaning. Background Art

[0002] In the existing wafer cleaning process, the surface of the wafer is often cleaned with a chemical solution. During this period, a spray device is needed to spray the wafer with the chemical solution. At the same time, the wafer needs to be effectively positioned. At present, the conventional method is to use a similar tray mechanism to limit the bottom support of the wafer. This method is prone to improper displacement of the wafer during use, causing it to offset or fall off, affecting normal cleaning. At the same time, if placed improperly, the tray mechanism is likely to damage the lower surface of the wafer, affecting the yield rate. In addition, this method is prone to cause cleaning dead corners at the bottom, which often require turning over for processing. This, in turn, is prone to the risk of damage and falling.

[0003] Furthermore, the wafers currently being processed are primarily 6-inch and 8-inch in size. To effectively support these wafers from the bottom, different tray mechanisms are required. Changing wafer models also requires changing the tray mechanism. This requires downtime for maintenance, which is costly.

[0004] In view of the above-mentioned defects, the designer has actively carried out research and innovation in order to create a multi-size limiting device suitable for wafer cleaning, making it more valuable for industrial use. Utility Model Content

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a multi-size limiting device suitable for wafer cleaning.

[0006] The utility model is a multi-size limiting device suitable for wafer cleaning, comprising a mounting base, wherein: a vertical lifting device is provided on the mounting base, an angle driving device is provided on the vertical lifting device, a driving end of the angle driving device is provided with a bearing flange, a turntable assembly is provided on the bearing flange, a 6-inch limiting device and an 8-inch limiting device are respectively provided on the turntable assembly, the 6-inch limiting device and the 8-inch limiting device are respectively arranged in a ring shape, forming a 6-inch limiting space and an 8-inch limiting space respectively, and the height of the 6-inch limiting device is lower than the height of the 8-inch limiting device.

[0007] Furthermore, the above-mentioned multi-size limiting equipment suitable for wafer cleaning, wherein the vertical lifting device includes a plurality of vertically distributed support rods, a plurality of support plates are provided at the upper ends of the support rods, guide holes are provided on the support plates, and the driving end of the angle driving device extends out of the guide holes and is connected to the turntable assembly.

[0008] Furthermore, the above-mentioned multi-size limiting device suitable for wafer cleaning is provided with a limiting groove on the mounting base, the lower end of the support rod is connected to the limiting groove, and the support rod is connected to the mounting base and the support plate by screws.

[0009] Furthermore, in the above-mentioned multi-size limiting device suitable for wafer cleaning, the angle driving device is connected to the support plate through a positioning screw.

[0010] Furthermore, in the above-mentioned multi-size limiting device suitable for wafer cleaning, an auxiliary shaft sleeve is provided on the support plate, and the driving end of the degree driving device is located in the auxiliary shaft sleeve.

[0011] Furthermore, the above-mentioned multi-size limiting device suitable for wafer cleaning, wherein the angle driving device is a servo motor, a mounting shell is provided outside the servo motor, a bearing flange is provided on the driving end of the servo motor, and the bearing flange is connected to the turntable assembly through positioning screws.

[0012] Furthermore, the above-mentioned multi-size limiting equipment suitable for wafer cleaning, wherein the turntable assembly includes a spoke-type wheel, a plurality of mounting holes are provided at the center of the spoke-type wheel, and a plurality of positioning grooves are also provided on the spoke-type wheel, and the 6-inch limiting device and the 8-inch limiting device are connected to the corresponding positioning grooves.

[0013] Furthermore, in the above-mentioned multi-size limiting device suitable for wafer cleaning, the outer edge of the strip-shaped wheel and the edge of the strip are both provided with arc chamfers.

[0014] Furthermore, the above-mentioned multi-size limiting equipment suitable for wafer cleaning, wherein the 6-inch limiting device and the 8-inch limiting device both include a clamping rod vertically arranged, a limiting groove is arranged at the upper end of the clamping rod, and a circular arc end is arranged at the top of the limiting groove.

[0015] Furthermore, in the above-mentioned multi-size limiting device suitable for wafer cleaning, a contact rubber ring is provided in the limiting groove.

[0016] By means of the above solution, the present invention has at least the following advantages:

[0017] 1. A vertical lifting device is provided to ensure that the subsequently loaded wafers are placed as close as possible to the effective spraying area of ​​the cleaning equipment. There is no need to adjust the height of the spraying device a second time, which improves the convenience of use.

[0018] 2. The angle drive device can be used in conjunction with the turntable assembly to rotate when the wafer is stable and limited, achieving cleaning without dead angles.

[0019] 3. The turntable assembly can have both a 6-inch limit device and an 8-inch limit device at the same time, without the need for disassembly and switching, thus achieving lossless limit of 6-inch wafers and 8-inch wafers.

[0020] 4. The overall structure is simple and has better watertight protection effect, which can meet the service life in the wafer cleaning spray environment.

[0021] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a multi-size limit device suitable for wafer cleaning.

[0023] Figure 2 This is a partially enlarged schematic diagram of a multi-size limit device suitable for wafer cleaning.

[0024] The meanings of the reference numerals in the figures are as follows.

[0025] 1 Mounting base 2 Angle drive unit

[0026] 3 Loading flange 4 Turntable assembly

[0027] 5 6-inch limit device 6 8-inch limit device

[0028] 7 Support rod 8 Support plate

[0029] 9 Auxiliary sleeve 10 Clamping rod

[0030] 11 Limiting groove 12 Arc end DETAILED DESCRIPTION

[0031] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] like Figures 1 to 2The multi-size limiting device suitable for wafer cleaning includes a mounting base 1, and its uniqueness lies in that a vertical lifting device is provided on the mounting base 1 to facilitate raising the height of the final limiting wafer. At the same time, an angle driving device 2 is provided on the vertical lifting device, and a bearing flange 3 is provided on the driving end of the angle driving device 2, and a turntable assembly 4 is provided on the bearing flange 3. In this way, the stable installation of the turntable assembly 4 is met, and during maintenance, the characteristics of the bearing flange 3 can be used to achieve convenient disassembly and assembly, and to replace turntable assemblies 4 of other models. Of course, if the convenience of replacement is not considered later, the turntable assembly 4 can also be directly installed on the driving end of the angle driving device 2. During use, after the limiting wafer is loaded, the cooperation between the turntable assembly 4 and the angle driving device 2 can be used to allow the wafer to rotate appropriately according to the needs of the cleaning process, and there will be no cleaning dead corners. Moreover, considering that the sizes of conventional wafer products at present are mainly 6 inches and 8 inches, in order to meet the better versatility of limiting, a 6-inch limiting device 5 and an 8-inch limiting device 6 are respectively provided on the turntable assembly 4 to achieve better compatibility. Specifically, the 6-inch limiting device 5 and the 8-inch limiting device 6 adopted by the present invention are respectively arranged in a ring shape, forming a 6-inch limiting space and an 8-inch limiting space respectively. In this way, during actual use, the 6-inch wafer and the 8-inch wafer can be properly clamped and limited respectively. Furthermore, the height of the 6-inch limiting device 5 adopted is lower than the height of the 8-inch limiting device 6. In this way, there will be no interference in the placement of 6-inch wafers and 8-inch wafers, which meets the special needs of the synchronous placement of certain 6-inch wafers and 8-inch wafers.

[0033] In view of a preferred embodiment of the present invention, the vertical lifting device used includes a plurality of vertically distributed support rods 7. An accommodating space can be formed between each support rod 7, and the angle drive device 2 can be arranged in the accommodating space to avoid occupying the clean space. At the same time, a plurality of support plates 8 are provided at the upper end of the support rod 7, and a guide hole is provided on the support plate 8. The driving end of the angle drive device 2 is connected to the turntable assembly 4 after extending out of the guide hole. In this way, the stable installation of the angle drive device 2 can be met, and unnecessary shaking and resonance during operation can be avoided. During implementation, the present invention provides a limiting groove 11 on the mounting base 1, and the lower end of the support rod 7 is connected to the limiting groove 11. In this way, appropriate bottom limiting can be achieved during assembly. Finally, the support rod 7 is screwed to the mounting base 1 and the support plate 8. In addition, in order to meet the stable combination of the angle drive device 2, it can be connected to the support plate 8 by a positioning screw.

[0034] Looking further, the support plate 8 used in the present invention is provided with an auxiliary sleeve 9, and the driving end of the angle drive device is located in the auxiliary sleeve 9. In this way, during use, the water flow during cleaning or the cleaning liquid can be isolated from directly penetrating into the angle drive device 2 through the driving end, thereby effectively isolating and protecting the drive shaft. During implementation, the angle drive device 2 used is a servo motor, and a mounting shell is provided outside the servo motor. In this way, it can be ensured to be isolated from the outside, and water stains will not penetrate, thereby improving the service life. At the same time, considering the convenience of maintenance and disassembly, the present invention is also provided with a load-bearing flange 3 on the driving end of the servo motor, and the load-bearing flange 3 is connected to the turntable assembly 4 through positioning screws.

[0035] In view of actual implementation, the turntable assembly 4 used includes a spoke-type wheel, and a number of mounting holes are provided at the center of the spoke-type wheel. In this way, a stable and effective connection can be made with the bearing flange 3 or the driving end of the angle drive device 2 through the corresponding positioning screws. At the same time, the utility model is also provided with a number of positioning grooves on the spoke-type wheel, and the 6-inch limiting device 5 and the 8-inch limiting device 6 are connected to the corresponding positioning grooves. During implementation, the 6-inch limiting device 5 and the 8-inch limiting device 6 can be connected to the corresponding positioning groove screws, or they can be threaded connections. Of course, other stable connection methods can also be used, which will not be repeated here. In addition, the outer edge of the spoke-type wheel and the edge of the banner are provided with arc chamfers. In this way, possible sharp edges are avoided from scratching the wafer.

[0036] Taking a closer look, the 6-inch limiting device 5 and the 8-inch limiting device 6 adopted by the present invention both include a clamping rod 10 vertically arranged, a limiting groove 11 is provided at the upper end of the clamping rod 10, and an arc end 12 is provided at the top of the limiting groove 11. In this way, the limiting groove 11 is used to make appropriate limiting contact on the edge of the wafer, and stable supporting and limiting is achieved through the mutual cooperation of multiple supporting rods. During implementation, a contact rubber ring (not shown in the figure) can be provided in the limiting groove 11. In this way, the friction force of the contact end face can be effectively improved, and the wafer can be better limited.

[0037] The working principle of this utility model is as follows:

[0038] Take 8-inch wafers as an example.

[0039] The external feeding device delivers the wafer to the top of the turntable assembly 4. After that, the wafer is fed downward, and the wafer is guided by the arc end 12 at the top of the clamping rod 10 that constitutes the 8-inch limit device 6 and moves downward.

[0040] The edge of the wafer contacts the limiting groove 11 and is clamped and limited.

[0041] Then, according to the cleaning needs, the angle drive device 2 drives the turntable assembly 4 to rotate at an appropriate angle to achieve coverage of the wafer surface with the corresponding cleaning liquid. If a three-dimensional spraying device is used, the upper and lower surfaces of the wafer can be sprayed and covered synchronously.

[0042] During this period, since the wafer is only contacted at the edge, its upper and lower surfaces are not covered and there are no dead corners for spraying. It can be combined with corresponding cleaning equipment to achieve dead-angle cleaning.

[0043] It can be seen from the above text description and the accompanying drawings that the present invention has the following advantages:

[0044] 1. A vertical lifting device is provided to ensure that the subsequently loaded wafers are placed as close as possible to the effective spraying area of ​​the cleaning equipment. There is no need to adjust the height of the spraying device a second time, which improves the convenience of use.

[0045] 2. The angle drive device can be used in conjunction with the turntable assembly to rotate when the wafer is stable and limited, achieving cleaning without dead angles.

[0046] 3. The turntable assembly can have both a 6-inch limit device and an 8-inch limit device at the same time, without the need for disassembly and switching, thus achieving lossless limit of 6-inch wafers and 8-inch wafers.

[0047] 4. The overall structure is simple and has better watertight protection effect, which can meet the service life in the wafer cleaning spray environment.

[0048] In addition, the indicated orientations or positional relationships described in the present invention are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or structure referred to must have a specific orientation or be operated in a specific orientation structure. Therefore, they cannot be understood as a limitation on the present invention.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A multi-size position limiting device suitable for wafer cleaning, including a mounting base, characterized by: A vertical lifting device is provided on the mounting base, an angle driving device is provided on the vertical lifting device, a bearing flange is provided on the driving end of the angle driving device, a turntable assembly is provided on the bearing flange, a 6-inch limiting device and an 8-inch limiting device are respectively provided on the turntable assembly, the 6-inch limiting device and the 8-inch limiting device are respectively arranged in a ring shape, forming a 6-inch limiting space and an 8-inch limiting space respectively, and the height of the 6-inch limiting device is lower than the height of the 8-inch limiting device.

2. The multi-size limiting device suitable for wafer cleaning according to claim 1, characterized in that: The vertical lifting device includes a plurality of vertically distributed support rods, a plurality of support plates are provided at the upper ends of the support rods, and guide holes are provided on the support plates. The driving end of the angle driving device extends out of the guide holes and is connected to the turntable assembly.

3. The multi-size limiting device suitable for wafer cleaning according to claim 2, characterized in that: A limiting slot is provided on the mounting base, the lower end of the support rod is connected to the limiting slot, and the support rod is screwed to the mounting base and the support plate.

4. The multi-size limiting device suitable for wafer cleaning according to claim 2, characterized in that: The angle driving device is connected to the support plate via a positioning screw.

5. The multi-size limiting device suitable for wafer cleaning according to claim 2, characterized in that: An auxiliary shaft sleeve is provided on the support plate, and the driving end of the degree driving device is located in the auxiliary shaft sleeve.

6. The multi-size limiting device suitable for wafer cleaning according to claim 1, characterized in that: The angle driving device is a servo motor, a mounting housing is provided outside the servo motor, a bearing flange is provided on the driving end of the servo motor, and the bearing flange is connected to the turntable assembly through positioning screws.

7. The multi-size limiting device suitable for wafer cleaning according to claim 1, characterized in that: The turntable assembly includes a spoke-type wheel disc, a plurality of mounting holes are provided at the center of the spoke-type wheel disc, and a plurality of positioning grooves are also provided on the spoke-type wheel disc. The 6-inch limiting device and the 8-inch limiting device are connected to the corresponding positioning grooves.

8. The multi-size limiting device suitable for wafer cleaning according to claim 7, characterized in that: The outer edge of the strip-shaped wheel disc and the edge of the strip are both provided with arc chamfers.

9. The multi-size limiting device suitable for wafer cleaning according to claim 1, characterized in that: The 6-inch limiting device and the 8-inch limiting device both include a clamping rod vertically arranged, a limiting groove is arranged at the upper end of the clamping rod, and an arc end is arranged at the top of the limiting groove.

10. The multi-size limiting device suitable for wafer cleaning according to claim 9, characterized in that: A contact rubber ring is provided in the limiting groove.

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