Punching equipment for electronic part machining

Abstract

The utility model is applicable to the technical field of electronic part processing, and provides a punching device for electronic part processing, which comprises an operating frame used for punching electronic parts. The mounting frame is arranged on the operation frame; the first telescopic rod is assembled on the mounting frame, a driving motor is fixedly mounted on an output shaft of the first telescopic rod, a drill rod is fixedly mounted on an output shaft of the driving motor, and the drill rod is used for punching the electronic parts; and the air cooling mechanism is assembled on the mounting frame and is used for carrying out air cooling on the punched electronic parts. According to the punching equipment for electronic part machining, provided by the scheme, punching operation can be carried out on electronic parts, meanwhile, air cooling can be carried out on the punched electronic parts, the influence of physical change of the electronic parts caused by high temperature is reduced, and the safety of the electronic parts in the punching operation process is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component processing, and in particular relates to a punching device for electronic component processing. Background Art

[0002] When processing some electronic components, punching operations are required, and corresponding punching equipment is required.

[0003] However, some existing punching equipment for electronic component processing still has certain shortcomings in actual use. When punching electronic components through a drill rod, a large amount of heat is generated, and this heat will be transferred to the processed electronic components. High temperature may cause the physical properties of the electrical component materials to change, such as hardness, strength, conductivity, etc. These changes in physical properties may reduce the reliability of the components, increase the risk of failure, and may even cause equipment failure. However, some common punching equipment for electronic component processing cannot cool the metal parts being punched well, thereby reducing the safety and stability of the overall operation process. Utility Model Content

[0004] The utility model provides a punching device for processing electronic components, aiming to solve the problem raised in the above background technology that the currently used punching device for processing electronic components cannot well cool the metal components during the punching process.

[0005] To solve the above problems, the present invention is implemented as follows: a punching device for processing electronic components, comprising: an operating frame, the operating frame is used to perform punching operations on electronic components; a mounting frame arranged on the operating frame; a first telescopic rod assembled on the mounting frame, a drive motor is fixedly mounted on the output shaft of the first telescopic rod, and a drill rod is fixedly mounted on the output shaft of the drive motor, the drill rod is used to perform punching operations on electronic components; an air cooling mechanism assembled on the mounting frame, the air cooling mechanism is used to air cool the electronic components being punched; a transverse moving mechanism arranged on the mounting frame and the first telescopic rod, the transverse moving mechanism is used to drive the drill rod to move transversely; a longitudinal moving mechanism assembled on the operating frame and the mounting frame, the longitudinal moving mechanism is used to drive the drill rod to move longitudinally; two clamping mechanisms arranged on the operating frame, the clamping mechanisms are used to clamp and fix the electronic components to be processed.

[0006] Preferably, the air cooling mechanism includes: a placement box fixedly mounted on the top of the mounting frame, the placement box is used to place the coolant, the placement box is provided with a semiconductor refrigeration plate, the semiconductor refrigeration plate is used to cool the coolant placed in the placement box; a fan fixedly mounted on the outer wall of one side of the placement box; a cooling pipe arranged in the placement box, one end of the cooling pipe is connected to the air outlet end of the fan; a hose arranged on the mounting frame, one end of the hose is connected to the cooling pipe; a cooling head assembled on one side of the drill rod, the cooling head and the hose are connected.

[0007] Preferably, the lateral movement mechanism includes: a servo motor fixedly mounted on the mounting frame; a screw rod rotatably mounted on the mounting frame, one end of the screw rod being fixedly connected to the output shaft of the servo motor; a mounting block threadedly sleeved on the screw rod, the mounting block being fixedly connected to the first telescopic rod.

[0008] Preferably, the longitudinal movement mechanism includes: a power motor fixedly mounted on the operating frame; a screw fixedly mounted on the output shaft of the power motor; a connecting block threadedly sleeved on the screw, and the connecting block is fixedly connected to the mounting frame.

[0009] Preferably, the clamping mechanism includes: a support plate fixedly mounted on the top of the operating frame; a second telescopic rod fixedly mounted on the support plate; a positioning frame fixedly mounted on the output shaft of the second telescopic rod; a third telescopic rod fixedly mounted on the positioning frame, a positioning block fixedly mounted on the output shaft of the third telescopic rod, and the positioning block is used to fix electronic components that require punching operations.

[0010] Preferably, a mixing mechanism is provided on the placement box, and the mixing mechanism is used to mix the coolant placed in the placement box. The mixing mechanism includes: a motor fixedly mounted on the outer wall of one side of the placement box; and a mixing rack rotatably mounted on the placement box, one end of the mixing rack being fixedly connected to the output shaft of the motor.

[0011] Preferably, a cooling fan is provided on one side of the placement box, and the cooling fan is located on one side of the semiconductor refrigeration plate.

[0012] Compared with the related art, the punching equipment for electronic component processing provided by the present invention has the following beneficial effects:

[0013] Compared with the existing technology, the punching equipment for electronic component processing provided by this solution;

[0014] The punching equipment for electronic component processing is formed by an operating frame, a mounting frame, a first telescopic rod, a driving motor, a drill rod, an air cooling mechanism, a horizontal moving mechanism, a longitudinal moving mechanism, a clamping mechanism and a mixing mechanism. The electronic components can be punched and the electronic components being punched can be cooled by air at the same time, thereby reducing the impact of high temperature on the electronic components and improving the safety during the punching operation of the electronic components. At the same time, when cold air is blown onto the electronic components for air cooling, the punching area on the electronic components can also be cleaned well to avoid the residue of debris, thereby preventing the debris from wearing the drill rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main structure of a punching device for processing electronic components provided by the utility model;

[0016] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0017] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of part A shown in FIG;

[0018] Figure 4 for Figure 2 Schematic diagram of the enlarged structure of part B shown in FIG;

[0019] Figure 5 for Figure 2 Schematic diagram of the enlarged structure of part C shown in FIG.

[0020] Figure numerals: 1. operating frame; 2. mounting frame; 3. first telescopic rod; 4. driving motor; 5. drill rod; 6. air cooling mechanism; 601. placement box; 602. semiconductor refrigeration plate; 603. fan; 604. cooling pipe; 605. hose; 606. cooling head; 7. servo motor; 8. screw; 9. mounting block; 10. power motor; 11. screw; 12. connecting block; 13. support plate; 14. second telescopic rod; 15. positioning frame; 16. third telescopic rod; 17. positioning block; 18. motor; 19. mixing frame. DETAILED DESCRIPTION

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the description of the above-mentioned drawings, as well as any variations thereof, are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order; the terms "inside", "outside", "left", and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention.

[0022] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0023] The present invention provides a punching device for processing electronic components. Figure 1-5 As shown, the punching equipment for processing electronic components includes: an operating frame 1, which is used to perform punching operations on electronic components; a mounting frame 2 arranged on the operating frame 1; a first telescopic rod 3 mounted on the mounting frame 2, a drive motor 4 is fixedly mounted on the output shaft of the first telescopic rod 3, and a drill rod 5 is fixedly mounted on the output shaft of the drive motor 4, and the drill rod 5 is used for punching operations on electronic components; an air cooling mechanism 6 mounted on the mounting frame 2, and the air cooling mechanism 6 is used to air cool the electronic components being punched; a horizontal moving mechanism arranged on the mounting frame 2 and the first telescopic rod 3, and the horizontal moving mechanism is used to drive the drill rod 5 to move horizontally; a longitudinal moving mechanism mounted on the operating frame 1 and the mounting frame 2, and the longitudinal moving mechanism is used to drive the drill rod 5 to move longitudinally; two clamping mechanisms arranged on the operating frame 1, and the clamping mechanisms are used to clamp and fix electronic components to be processed.

[0024] In this embodiment, the electronic components to be processed (such as motherboards) are placed on the clamping mechanism, and the driving motor 4 is started by the controller (the controller is provided on the mounting frame 2, and the control operation is performed by the controller) to drive the drill rod 5 to rotate, and then the first telescopic rod 3 is started to drive the rotating drill rod 5 to move downward and contact the electronic components, thereby performing a drilling operation on the electronic components. After the drilling operation at one position is completed, the horizontal moving mechanism and the vertical moving mechanism are started by the controller to adjust the horizontal and vertical use positions of the drill rod 5, thereby facilitating the drilling operation at different positions on the electronic components, and the use is more flexible. At the same time, during the drilling process, the air cooling mechanism 6 is started by the controller, so that the electronic components undergoing the drilling operation can be cooled by air, reducing the impact of high temperature on the electronic components and improving the safety of the electronic components during the drilling operation. At the same time, when the cold air blows on the electronic components for air cooling, the drilling area on the electronic components can also be cleaned well to avoid the residue of debris, thereby preventing the debris from causing wear on the drill rod 5.

[0025] In a further preferred embodiment of the present invention, the air cooling mechanism 6 includes: a placement box 601 fixedly mounted on the top of the mounting frame 2, the placement box 601 is used to place the coolant, and a semiconductor refrigeration plate 602 is provided on the placement box 601, and the semiconductor refrigeration plate 602 is used to cool the coolant placed in the placement box 601; a fan 603 fixedly mounted on the outer wall of one side of the placement box 601; a cooling pipe 604 arranged in the placement box 601, one end of the cooling pipe 604 is connected to the air outlet end of the fan 603; a hose 605 arranged on the mounting frame 2, one end of the hose 605 is connected to the cooling pipe 604; a cooling head 606 assembled on one side of the drill rod 5, and the cooling head 606 is connected to the hose 605.

[0026] In this embodiment, when the air cooling mechanism 6 is used, the semiconductor refrigeration plate 602 is started by the controller to cool the coolant in the placement box 601, and the fan 603 is started at the same time, and the air enters the cooling tube 604. According to the principle of heat exchange, the high-temperature air and the low-temperature coolant come into contact, so that the air in the cooling tube 604 can be cooled. The low-temperature air is blown onto the drill rod 5 through the cooling head 606, so that the drill rod 5 can cool down the electronic components when drilling holes, and then the electronic components undergoing the drilling operation can be cooled by air, reducing the impact of high temperature on the electronic components and improving the safety of the electronic components during the drilling operation. At the same time, when the cold air is blown onto the electronic components for air cooling, the drilling area on the electronic components can also be cleaned well to avoid the residue of debris, thereby preventing the debris from causing wear on the drill rod 5.

[0027] In a further preferred embodiment of the present invention, the lateral movement mechanism includes: a servo motor 7 fixedly mounted on the mounting frame 2; a screw rod 8 rotatably mounted on the mounting frame 2, one end of the screw rod 8 is fixedly connected to the output shaft of the servo motor 7; a mounting block 9 threadedly sleeved on the screw rod 8, and the mounting block 9 is fixedly connected to the first telescopic rod 3.

[0028] In this embodiment, when using the lateral movement mechanism, the servo motor 7 is started by the controller to drive the screw rod 8 to rotate, and a limit rod is fixedly installed on the mounting frame 2. The limit rod and the mounting block 9 are slidably connected. The limit rod limits the mounting block 9, so that the screw rod 8 drives the mounting block 9 to move, and then the lateral use position of the drill rod 5 is adjusted, thereby facilitating the drilling operation at different positions on the electronic components.

[0029] In a further preferred embodiment of the present invention, the longitudinal moving mechanism includes: a power motor 10 fixedly mounted on the operating frame 1; a screw 11 fixedly mounted on the output shaft of the power motor 10; a connecting block 12 threadedly sleeved on the screw 11, and the connecting block 12 is fixedly connected to the mounting frame 2.

[0030] In this embodiment, when the longitudinal mechanism is used, the power motor 10 is started by the controller to drive the screw 11 to rotate, and a limit rod is fixedly installed on the operating frame 1. The limit rod and the connecting block 12 are slidably connected. The limit rod limits the connecting block 12, so that the screw 11 drives the connecting block 12 to move, and then the longitudinal use position of the drill rod 5 is adjusted, thereby facilitating the drilling operation at different positions on the electronic components.

[0031] In a further preferred embodiment of the present invention, the clamping mechanism includes: a support plate 13 fixedly mounted on the top of the operating frame 1; a second telescopic rod 14 fixedly mounted on the support plate 13; a positioning frame 15 fixedly mounted on the output shaft of the second telescopic rod 14; a third telescopic rod 16 fixedly mounted on the positioning frame 15, and a positioning block 17 is fixedly mounted on the output shaft of the third telescopic rod 16, and the positioning block 17 is used to fix the electronic components that need to be punched.

[0032] In this embodiment, when clamping and placing electronic components, first, according to the size of the electronic components, the second telescopic rod 14 is activated by the controller to drive the positioning frame 15 to move and adjust the position, and then the electronic components are placed on the positioning frame 15, and the third telescopic rod 16 is activated by the controller to drive the positioning block 17 to move downward, so as to clamp and fix the electronic components, thereby facilitating the punching operation of the electronic components.

[0033] In a further preferred embodiment of the present invention, a mixing mechanism is provided on the placement box 601, and the mixing mechanism is used to mix the coolant placed in the placement box 601. The mixing mechanism includes: a motor 18 fixedly mounted on the outer wall of one side of the placement box 601; a mixing rack 19 rotatably mounted on the placement box 601, and one end of the mixing rack 19 is fixedly connected to the output shaft of the motor 18.

[0034] In this embodiment, when the semiconductor refrigeration plate 602 cools the coolant in the placement box 601, the controller starts the motor 18 to drive the mixing rack 19 to rotate, thereby mixing the coolant and then evenly cooling the coolant.

[0035] In a further preferred embodiment of the present invention, a cooling fan is provided on one side of the placement box 601 , and the cooling fan is located on one side of the semiconductor cooling plate 602 .

[0036] In this embodiment, the heat dissipation fan is located corresponding to the heat dissipation surface of the semiconductor refrigeration chip 602. When the semiconductor refrigeration chip 602 is in use, the heat dissipation fan is started to dissipate heat from the semiconductor refrigeration chip 602.

[0037] To sum up, compared with the relevant technology, the punching equipment for electronic component processing is formed by the operating frame 1, the mounting frame 2, the first telescopic rod 3, the drive motor 4, the drill rod 5, the air cooling mechanism 6, the horizontal moving mechanism, the longitudinal moving mechanism, the clamping mechanism and the mixing mechanism. The electronic components can be punched and the electronic components undergoing the punching operation can be cooled by air at the same time, thereby reducing the impact of physical changes on the electronic components caused by high temperature and improving the safety of the electronic component punching operation. At the same time, when the cold air is blown onto the electronic components for air cooling, the punching area on the electronic components can also be cleaned well to avoid residual debris, thereby preventing the debris from causing wear to the drill rod 5.

[0038] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0039] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope to be protected by the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making any creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope to be protected by the present invention.

Claims

1. A punching device for processing electronic components, characterized in that: include: An operating frame, the operating frame is used to perform punching operations on electronic components; a mounting frame provided on the operating frame; A first telescopic rod mounted on the mounting frame, wherein a drive motor is fixedly mounted on an output shaft of the first telescopic rod, and a drill rod is fixedly mounted on an output shaft of the drive motor, wherein the drill rod is used for drilling holes in electronic components; An air cooling mechanism mounted on the mounting frame, the air cooling mechanism being used to cool the electronic components undergoing punching; A transverse movement mechanism provided on the mounting frame and the first telescopic rod, the transverse movement mechanism being used to drive the drill rod to move transversely; A longitudinal movement mechanism mounted on the operating frame and the mounting frame, the longitudinal movement mechanism being used to drive the drill rod to move longitudinally; Two clamping mechanisms are arranged on the operating frame, and the clamping mechanisms are used to clamp and fix the electronic components that need to be processed.

2. The punching device for electronic component processing according to claim 1, wherein: The air cooling mechanism comprises: A placement box fixedly mounted on the top of the mounting frame, the placement box is used to place the coolant, and a semiconductor refrigeration sheet is provided on the placement box, the semiconductor refrigeration sheet is used to cool the coolant placed in the placement box; A fan fixedly mounted on an outer wall of one side of the storage box; A cooling pipe is provided in the storage box, one end of the cooling pipe is connected to the air outlet end of the fan; A hose is provided on the mounting frame, one end of the hose being connected to the cooling pipe; A cooling head is assembled on one side of the drill pipe, and the cooling head is connected to the hose.

3. The punching device for electronic component processing according to claim 1, wherein: The lateral movement mechanism comprises: A servo motor fixedly mounted on the mounting frame; Rotate a screw rod mounted on the mounting bracket, wherein one end of the screw rod is fixedly connected to the output shaft of the servo motor; A mounting block is threadedly sleeved on the screw rod, and the mounting block is fixedly connected to the first telescopic rod.

4. The punching device for electronic component processing according to claim 1, wherein: The longitudinal movement mechanism comprises: A power motor fixedly mounted on the operating frame; A screw fixedly mounted on the output shaft of the power motor; A connecting block is threadedly sleeved on the screw rod, and the connecting block is fixedly connected to the mounting bracket.

5. The punching device for electronic component processing according to claim 1, wherein: The clamping mechanism comprises: A support plate fixedly mounted on the top of the operating frame; a second telescopic rod fixedly mounted on the support plate; A positioning bracket fixedly mounted on the output shaft of the second telescopic rod; A third telescopic rod is fixedly mounted on the positioning frame, and a positioning block is fixedly mounted on the output shaft of the third telescopic rod. The positioning block is used to fix electronic components that require punching operations.

6. The punching device for electronic component processing according to claim 2, wherein: The placement box is provided with a mixing mechanism, which is used to mix the coolant placed in the placement box. The mixing mechanism includes: A motor fixedly mounted on an outer wall of one side of the placement box; A mixing rack is rotatably mounted on the placement box, and one end of the mixing rack is fixedly connected to the output shaft of the motor.

7. The punching device for electronic component processing according to claim 2, wherein: A heat dissipation fan is provided on one side of the placement box, and the heat dissipation fan is located on one side of the semiconductor refrigeration plate.

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