Intelligent household appliance temperature and humidity adaptive sensor

Abstract

The utility model relates to the field of intelligent household electrical appliance monitoring equipment, and discloses an intelligent household electrical appliance temperature and humidity self-adaptive sensor, which comprises a substrate, an integrated chip board is arranged at the upper part of the center of the front end surface of the substrate, and a heat conduction board is arranged on the rear end surface of the substrate at the rear end of the integrated chip board. The front end of the heat conduction plate penetrates through the rear end face of the substrate to reach the front end face of the substrate, the end portion of the heat conduction plate is attached to the rear end face of the integrated chip board, a frame is arranged on the upper portion of the front end face of the substrate, and a protection structure is arranged on the front end face of the frame. According to the temperature and humidity monitoring sensor, the integrated chip board is isolated through the partition board, the substrate, the protection structure and the plugging structure, and the influence of heat generated by the integrated chip board in the long-time use process on the temperature and humidity monitoring sensor is reduced, so that the monitoring precision of the temperature and humidity monitoring sensor is improved; and the heat generated by the integrated chip board is conducted to the wall surface through the heat conducting plate for heat dissipation.

Description

Technical Field

[0001] The utility model relates to the field of intelligent home appliance monitoring equipment, in particular to an intelligent home appliance temperature and humidity self-adapting sensor. Background Art

[0002] Smart appliances refer to home appliances that integrate Internet connectivity, sensors, artificial intelligence and other technologies. They can be remotely controlled and automatically operated through devices such as smartphones, tablets or voice assistants. The emergence of smart appliances has greatly improved the convenience, comfort and energy efficiency of family life. The smart appliance temperature and humidity adaptive sensor is a high-tech device integrated into smart appliances. It can monitor the temperature and humidity of the environment in real time, and automatically adjust the working status of the appliance based on this data to adapt to environmental changes.

[0003] There are still some problems in the use of existing smart home appliance temperature and humidity adaptive sensors, because smart home appliances need to adjust the working status of the appliances in real time according to the temperature and humidity of the environment. The smart home appliance temperature and humidity adaptive sensors need to work at all times. During long-term operation, the heat generated by the electronic components inside the device can easily affect the temperature monitoring accuracy of the temperature and humidity monitoring sensor. Therefore, those skilled in the art provide a smart home appliance temperature and humidity adaptive sensor to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the present utility model is to solve the shortcomings of the prior art and to propose an intelligent household appliance temperature and humidity adaptive sensor. When used for a long time, the integrated chip board is isolated by a partition, a substrate, a heat-insulating layer and a rubber seat made of heat-insulating rubber material, thereby reducing the influence of the heat generated by the integrated chip board during long-term use on the temperature and humidity monitoring sensor, thereby improving the monitoring accuracy of the temperature and humidity monitoring sensor.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a temperature and humidity adaptive sensor for smart home appliances, comprising a substrate, an integrated chip board is provided at the upper center of the front end surface of the substrate, a heat conducting plate is provided on the rear end surface of the substrate located at the rear end of the integrated chip board, the front end of the heat conducting plate passes through the rear end surface of the substrate and reaches the front end surface of the substrate, and the end portion is attached to the rear end surface of the integrated chip board, a frame is provided at the upper part of the front end surface of the substrate, a protective structure is provided on the front end surface of the frame, a temperature and humidity monitoring sensor is provided at one side of the center of the lower end surface of the protective structure, a blocking structure is provided at the upper end of the temperature and humidity monitoring sensor, the lower end of the blocking structure passes through the upper end surface of the temperature and humidity monitoring sensor and reaches the interior of the temperature and humidity monitoring sensor, and the upper end of the blocking structure passes through the lower end surface of the protective structure and reaches the interior of the protective structure;

[0006] Through the above technical solution, the integrated chip board is isolated by partitions, substrates, protective structures and sealing structures, reducing the impact of heat generated by the integrated chip board during long-term use on the temperature and humidity monitoring sensor, thereby improving the monitoring accuracy of the temperature and humidity monitoring sensor, and then conducting the heat generated by the integrated chip board to the wall through the heat conduction plate for heat dissipation, thereby increasing the service life of the integrated chip board.

[0007] Furthermore, the protective structure includes a thermal insulation layer and an electromagnetic shielding layer, the electromagnetic shielding layer is sleeved on the outside of the thermal insulation layer, the rear end surfaces of the thermal insulation layer and the electromagnetic shielding layer are fixedly connected to the front end surface of the frame, the thermal insulation layer and the electromagnetic shielding layer are both in the shape of a rectangular parallelepiped, and the thermal insulation layer and the electromagnetic shielding layer are fixedly connected;

[0008] Through the above technical solution, the heat generated by the integrated chip board is prevented from dissipating through the heat insulation layer, and the electromagnetic shielding layer is used to reduce external electromagnetic interference on the integrated chip board.

[0009] Furthermore, the blocking structure includes a rubber seat, an opening and a through hole, wherein the through hole is provided at the center of the upper end surface of the rubber seat, the opening is provided on an inner side wall of the through hole, and the opening sequentially passes through the inner side wall of the through hole and the rubber seat to the outer side wall of the rubber seat;

[0010] Through the above technical solution, the connection wires between the temperature and humidity monitoring sensor and the integrated chip board are clamped through the through hole, which will not affect the connection and can achieve a sealing effect.

[0011] Furthermore, the rubber seat and the through hole are both in the shape of a truncated cone, and the rubber seat is made of heat-insulating rubber;

[0012] Through the above technical solution, it is convenient to insert the rubber seat into the upper end of the temperature and humidity monitoring sensor for sealing, and the rubber seat made of heat-insulating rubber material can also provide heat insulation.

[0013] Furthermore, a partition is provided at the lower part of the interior of the protective structure, and the materials of the substrate and the partition are both heat-insulating materials;

[0014] Through the above technical solution, the heat generated by the integrated chip board is isolated by the partition, substrate and protective structure, preventing the heat generated by the integrated chip board from affecting the monitoring accuracy of the temperature and humidity monitoring sensor.

[0015] Furthermore, a storage groove is provided on the front end surface of the rear end substrate of the frame, and a sealing gasket is provided inside the storage groove;

[0016] With the above technical solution, the gap between the substrate and the frame is filled with the sealing gasket, thereby improving the sealing performance.

[0017] Furthermore, mounting plates are provided at the upper and lower ends of the center of both side walls of the base plate;

[0018] The above technical solution makes it easy to install the equipment through the installation plate.

[0019] The utility model has the following beneficial effects:

[0020] 1. In the present invention, when the temperature and humidity adaptive sensor for smart home appliances is used for a long time, the integrated chip board is isolated by a partition, a substrate, a heat-insulating layer and a rubber seat made of a heat-insulating rubber material, thereby reducing the influence of the heat generated by the integrated chip board during long-term use on the temperature and humidity monitoring sensor, thereby improving the monitoring accuracy of the temperature and humidity monitoring sensor.

[0021] 2. In the present invention, the base plate is fixed to the wall during installation, and the heat conducting plate is attached to the wall. During long-term use, the heat generated by the integrated chip board is transferred to the heat conducting plate, thereby conducting the heat to the wall, and dissipating the heat energy generated by the integrated chip board, thereby improving the service life of the integrated chip board. The temperature and humidity monitoring sensor is separated from the wall by the base plate, and there is no need to worry about the heat from the wall affecting the temperature and humidity monitoring sensor.

[0022] 3. In the present invention, the heat insulation layer prevents the heat generated by the integrated chip board from affecting the temperature and humidity monitoring sensor. At the same time, the electromagnetic shielding layer also shields the electromagnetic signal to a certain extent to prevent the influence of other electromagnetic signals. The integrated chip board transmits the signal through the signal line, so there is no need to worry about the output of the signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a three-dimensional diagram of a temperature and humidity adaptive sensor for smart home appliances proposed in the present invention;

[0024] Figure 2 This is a side sectional view of a temperature and humidity adaptive sensor for smart home appliances proposed in the present invention;

[0025] Figure 3 This is a three-dimensional diagram of the sealing structure of a temperature and humidity adaptive sensor for smart home appliances proposed in the utility model;

[0026] Figure 4 for Figure 2 Enlarged schematic diagram of point A in the middle.

[0027] Legend:

[0028] 1. Substrate; 2. Temperature and humidity monitoring sensor; 3. Protective structure; 301. Thermal insulation layer; 302. Electromagnetic shielding layer; 4. Frame; 5. Mounting plate; 6. Sealing structure; 601. Rubber seat; 602. Opening; 603. Through hole; 7. Partition; 8. Heat conduction plate; 9. Integrated chip board; 10. Sealing gasket; 11. Storage tank. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Reference Figure 1-4 The present invention provides an embodiment of a temperature and humidity adaptive sensor for smart home appliances, comprising a substrate 1, an integrated chip board 9 being provided at the upper center of the front end surface of the substrate 1, a heat conducting plate 8 being provided on the rear end surface of the substrate 1 located behind the integrated chip board 9, the front end of the heat conducting plate 8 passing through the rear end surface of the substrate 1 to the front end surface of the substrate 1, and the end portion being attached to the rear end surface of the integrated chip board 9, a frame 4 being provided at the upper part of the front end surface of the substrate 1, a protective structure 3 being provided at the front end surface of the frame 4, a temperature and humidity monitoring sensor 2 being provided at the center of the lower end surface of the protective structure 3, and a blocking structure being provided at the upper end of the temperature and humidity monitoring sensor 2 6, and then conducts the heat generated by the integrated chip board 9 to the wall through the heat conducting plate 8 for heat dissipation, thereby improving the service life of the integrated chip board 9, the lower end of the blocking structure 6 penetrates the upper end surface of the temperature and humidity monitoring sensor 2 and passes into the interior of the temperature and humidity monitoring sensor 2, the upper end of the blocking structure 6 penetrates the lower end surface of the protective structure 3 and passes into the interior of the protective structure 3, and the integrated chip board 9 is isolated by the partition 7, the substrate 1, the protective structure 3 and the blocking structure 6, thereby reducing the influence of the heat generated by the integrated chip board 9 during long-term use on the temperature and humidity monitoring sensor 2, thereby improving the monitoring accuracy of the temperature and humidity monitoring sensor 2.

[0031] The protective structure 3 includes a thermal insulation layer 301 and an electromagnetic shielding layer 302. The electromagnetic shielding layer 302 is sleeved on the outside of the thermal insulation layer 301. The rear end faces of the thermal insulation layer 301 and the electromagnetic shielding layer 302 are fixedly connected to the front end face of the frame 4. The thermal insulation layer 301 and the electromagnetic shielding layer 302 are both in the shape of a rectangular parallelepiped. The thermal insulation layer 301 is used to prevent the heat generated by the integrated chip board 9 from dissipating, and the electromagnetic shielding layer 302 is used to reduce the interference of external electromagnetic radiation on the integrated chip board 9.

[0032] The sealing structure 6 includes a rubber seat 601, an opening 602 and a through hole 603. The through hole 603 is arranged at the center of the upper end surface of the rubber seat 601, and the opening 602 is arranged on an inner wall of the through hole 603. The opening 602 passes through the inner wall of the through hole 603 and the rubber seat 601 in sequence and reaches the outer wall of the rubber seat 601. The connecting wire between the temperature and humidity monitoring sensor 2 and the integrated chip board 9 is clamped through the through hole 603, which will not affect the connection and can achieve a sealing effect. The shape of the rubber seat 601 and the through hole 603 are both truncated cones. The material of the rubber seat 601 is heat-insulating rubber, which makes it easy to insert the rubber seat 601 into the upper end of the temperature and humidity monitoring sensor 2 for sealing. At the same time, the rubber seat 601 made of heat-insulating rubber can also provide heat insulation.

[0033] A partition 7 is provided at the lower part of the protective structure 3. The materials of the substrate 1 and the partition 7 are both heat-insulating materials. The heat generated by the integrated chip board 9 is isolated by the partition 7, the substrate 1 and the protective structure 3 to prevent the heat generated by the integrated chip board 9 from affecting the monitoring accuracy of the temperature and humidity monitoring sensor 2. A storage groove 11 is provided on the front end surface of the substrate 1 at the rear end of the frame 4. A sealing gasket 10 is provided inside the storage groove 11. The gap between the substrate 1 and the frame 4 is filled with the sealing gasket 10 to improve the sealing performance. Mounting plates 5 are provided at the upper and lower ends of the center of the two side walls of the substrate 1 to facilitate the installation of equipment through the mounting plates 5.

[0034] Working principle: During installation, the substrate 1 is fixed to the wall, and the heat conducting plate 8 is attached to the wall. During long-term use, the heat generated by the integrated chip board 9 is transferred to the heat conducting plate 8, thereby conducting the heat to the wall, and dissipating the heat energy generated by the integrated chip board 9, thereby improving the service life of the integrated chip board 9. The temperature and humidity monitoring sensor 2 is separated from the wall by the substrate 1, and there is no need to worry about the heat from the wall affecting the temperature and humidity monitoring sensor 2. When in use, the integrated chip board 9 is isolated by the partition 7 made of heat-insulating material, the substrate 1, the heat-insulating layer 301 and the rubber seat 601 made of heat-insulating rubber material, thereby reducing the heat generated by the integrated chip board 9 during long-term use and affecting the temperature and humidity monitoring sensor 2, thereby improving the monitoring accuracy of the temperature and humidity monitoring sensor 2.

[0035] While the heat insulation layer 301 prevents the heat generated by the integrated chip board 9 from affecting the temperature and humidity monitoring sensor 2, the electromagnetic shielding layer 302 also shields the electromagnetic signal to a certain extent to prevent the influence of other electromagnetic signals. The integrated chip board 9 transmits the signal through the signal line, so there is no need to worry about the output of the signal.

[0036] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A temperature and humidity adaptive sensor for intelligent household appliances, comprising a substrate (1), characterized in that: An integrated chip board (9) is provided at the center of the front end surface of the substrate (1), and a heat conducting plate (8) is provided on the rear end surface of the substrate (1) located at the rear end of the integrated chip board (9). The front end of the heat conducting plate (8) passes through the rear end surface of the substrate (1) and reaches the front end surface of the substrate (1), and the end portion is attached to the rear end surface of the integrated chip board (9). A frame (4) is provided at the top of the front end surface of the substrate (1), and a protective structure (3) is provided on the front end surface of the frame (4). A temperature and humidity monitoring sensor (2) is provided at one side of the center of the lower end surface of the protective structure (3). A blocking structure (6) is provided at the upper end of the temperature and humidity monitoring sensor (2), and the lower end of the blocking structure (6) passes through the upper end surface of the temperature and humidity monitoring sensor (2) and reaches the interior of the temperature and humidity monitoring sensor (2). The upper end of the blocking structure (6) passes through the lower end surface of the protective structure (3) and reaches the interior of the protective structure (3).

2. The temperature and humidity adaptive sensor for smart home appliances according to claim 1, characterized in that: The protective structure (3) comprises a heat insulation layer (301) and an electromagnetic shielding layer (302); the electromagnetic shielding layer (302) is sleeved on the outside of the heat insulation layer (301); the rear end surfaces of the heat insulation layer (301) and the electromagnetic shielding layer (302) are fixedly connected to the front end surface of the frame (4); the heat insulation layer (301) and the electromagnetic shielding layer (302) are both in the shape of a rectangular parallelepiped; the heat insulation layer (301) and the electromagnetic shielding layer (302) are fixedly connected.

3. The temperature and humidity adaptive sensor for smart home appliances according to claim 1, characterized in that: The blocking structure (6) comprises a rubber seat (601), an opening (602) and a through hole (603), wherein the through hole (603) is arranged at the center of the upper end surface of the rubber seat (601), and the opening (602) is arranged on an inner side wall of the through hole (603), and the opening (602) sequentially passes through the inner side wall of the through hole (603) and the rubber seat (601) and reaches the outer side wall of the rubber seat (601).

4. The temperature and humidity adaptive sensor for smart home appliances according to claim 3, characterized in that: The rubber seat (601) and the through hole (603) are both in the shape of a truncated cone, and the material of the rubber seat (601) is heat-insulating rubber.

5. The temperature and humidity adaptive sensor for smart home appliances according to claim 1, characterized in that: A partition (7) is provided at the lower part of the interior of the protective structure (3), and the materials of the substrate (1) and the partition (7) are both heat-insulating materials.

6. The temperature and humidity adaptive sensor for smart home appliances according to claim 1, characterized in that: A storage groove (11) is provided on the front end surface of the rear end substrate (1) of the frame (4), and a sealing gasket (10) is provided inside the storage groove (11).

7. The temperature and humidity adaptive sensor for smart home appliances according to claim 1, characterized in that: Mounting plates (5) are provided at the upper and lower ends of the center of both side walls of the base plate (1).

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