Heat dissipation copper block temperature sensing probe point tool

By designing the heat-sinking copper block temperature sensing point tooling, multiple temperature sensor probe components are used to detect the surface temperature of the temperature equalizer plate, solving the problems of large manual detection errors and damage, and achieving high-precision and accurate temperature detection.

CN223295556UActive Publication Date: 2025-09-02HUIZHOU CHUYUE THERMAL TECH CO LTD
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Patent Information

Application Number
CN202422800630.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-18
Publication Date
2025-09-02
Estimated Expiration
2034-11-18

AI Technical Summary

Technical Problem

In the prior art, the surface temperature detection of the temperature equalizing plate relies on manual temperature sticking, and there is a problem of large error, low efficiency and easy damage to the temperature equalizing plate.

Method used

Design a heat-sinking copper block temperature probe tool to simulate the heat dissipation end through the upper and lower heat-sinking copper block shells, and use multiple temperature-sensing probe components to detect the surface temperature of the temperature equalizer plate to avoid human error and improve detection accuracy.

Benefits of technology

It realizes high-precision and accurate temperature detection of the temperature equalization plate, simplifies operation, avoids human error and protects the integrity of the temperature equalization plate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat dissipation copper block temperature sensing probe point tool which comprises an upper heat dissipation copper block shell, a lower heat dissipation copper block shell and a plurality of temperature sensing probe assemblies, the upper heat dissipation copper block shell and the lower heat dissipation copper block shell are fixedly connected to form a closed shell, a through hole is formed in the lower heat dissipation copper block shell, and the temperature sensing probe assemblies are arranged in the through hole. According to the heat dissipation copper block temperature sensing probe point tool, the heat dissipation end of a heat dissipation device is simulated through the upper heat dissipation copper block shell and the lower heat dissipation copper block shell, meanwhile, the heat dissipation end of the heat dissipation device is simulated through the upper heat dissipation copper block shell and the lower heat dissipation copper block shell, and the temperature sensing probe assemblies are arranged in the through holes and do not make contact with one another. The plurality of temperature sensing probe assemblies are in contact with the upper surface of the temperature-uniforming plate to be detected and are used for detecting the temperature of the upper surface of the temperature-uniforming plate at different positions and at different heat dissipation time and judging whether the heat dissipation power and the heat dissipation temperature-uniforming performance of the temperature-uniforming plate meet the requirements or not, operation is simple, personal errors of temperature detection at the present stage are eliminated, and the detection efficiency is improved. The temperature detection precision is higher, and the accuracy is higher.
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Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a temperature sensing probe tool for a heat dissipation copper block. Background Art

[0002] A vapor chamber (VC) is a common mechanism for rapid heat conduction and dissipation. Its operating principle is that a working medium circulates in a closed, plate-like cavity, evaporating and condensing, achieving rapid heat conduction and diffusion, and rapidly achieving uniform temperature. As a new two-phase flow heat dissipation technology, the vapor chamber offers advantages such as high thermal conductivity, excellent temperature uniformity, and reversible heat flow. It overcomes the limitations of traditional heat pipes, such as small contact area, high thermal resistance, and uneven heat flux density. It has become an effective solution for dissipating high-heat-density electronic devices in the future electronics industry.

[0003] Before R&D testing or product shipment, the vapor chamber must undergo performance testing to determine whether the heat dissipation power of the vapor chamber meets the requirements. With the rapid development of electronic integrated circuits, the heat dissipation power is getting higher and higher, and the performance testing requirements of the vapor chamber are also getting higher and higher. The surface temperature change of the vapor chamber is one of the most important indicators of its performance testing. At present, the surface temperature of the vapor chamber is mainly obtained by fitting the vapor chamber to the heat dissipation copper block and manually attaching temperature sensing wires on the surface of the vapor chamber. Since the attachment point position is not standardized, the manual error is large and the efficiency is low. At the same time, the vapor chamber is easily damaged by the heat dissipation copper block. Utility Model Content

[0004] In response to the above-mentioned problems, the purpose of the present invention is to provide a heat dissipation copper block temperature sensing probe tooling, which simulates the heat dissipation end of the radiator through the upper heat dissipation copper block shell and the lower heat dissipation copper block shell, and detects the temperature of the upper surface of the temperature equalizing plate at different positions and different heat dissipation times through multiple temperature sensing probe components to determine whether the heat dissipation power and heat dissipation temperature equalization performance of the temperature equalizing plate meet the requirements. The operation is simple, eliminates the human errors in temperature detection at this stage, and has higher temperature detection precision and accuracy.

[0005] To achieve the above-mentioned purpose, the utility model provides a heat dissipation copper block temperature sensing probe point tooling, comprising an upper heat dissipation copper block shell, a lower heat dissipation copper block shell, and multiple temperature sensing probe assemblies. The upper heat dissipation copper block shell and the lower heat dissipation copper block shell are fixedly connected to form a closed shell. A through hole is provided on the lower heat dissipation copper block shell, and a temperature sensing probe assembly is installed in the through hole. The multiple temperature sensing probe assemblies do not contact each other.

[0006] Preferably, the temperature sensing probe assembly includes a temperature sensing probe, a spring, a temperature sensing wire and an insulating sleeve. The temperature sensing probe is connected to the temperature sensing wire through a spring. The insulating sleeve is covered on the outside of the temperature sensing probe and the spring. In the natural state, the temperature sensing probe is higher than the lower surface of the lower heat dissipating copper block shell. In the working state, the temperature sensing probe is flush with the lower surface of the lower heat dissipating copper block shell.

[0007] Preferably, the upper heat dissipation copper block shell is provided with an upper column, the lower heat dissipation copper block shell is provided with a lower column matched with the upper column, the upper and lower columns are provided with through holes, and the through holes are equipped with temperature probe components.

[0008] Preferably, a flow channel is provided in the closed shell, and liquid is provided in the flow channel, and the liquid does not contact the temperature sensing probe assembly.

[0009] Preferably, at least one liquid inlet and at least one liquid outlet are provided on the outer wall of the closed shell.

[0010] Preferably, the flow channel is configured to be S-shaped, and the flow channel is communicated with the liquid inlet and the liquid outlet.

[0011] Preferably, a heat dissipation plate is provided in the closed shell, and the heat dissipation plate is fixedly connected between the upper heat dissipation copper block shell and the lower heat dissipation copper block shell.

[0012] The beneficial effects of the present invention are as follows: the present invention provides a heat dissipation copper block temperature sensing probe tooling, which simulates the heat dissipation end of the radiator through the upper heat dissipation copper block shell and the lower heat dissipation copper block shell. At the same time, multiple temperature sensing probe assemblies are in contact with the upper surface of the temperature equalizing plate to be measured, and are used to detect the temperature of the upper surface of the temperature equalizing plate at different positions and at different heat dissipation times, thereby calculating the temperature changes and trends at different positions on the upper surface of the temperature equalizing plate, and judging whether the heat dissipation power and heat dissipation temperature equalization performance of the temperature equalizing plate meet the requirements. The operation is simple, and the human error of temperature detection at this stage is eliminated, and the temperature detection precision and accuracy are higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description, are used to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention, and are included in and constitute a part of this specification.

[0014] Figure 1 Schematic diagram of the external structure of the heat dissipation copper block temperature sensing probe tooling embodiment;

[0015] Figure 2 A schematic structural diagram of the lower heat dissipation copper block housing in the embodiment;

[0016] Figure 3Schematic diagram of the internal structure of the heat dissipation copper block temperature sensing probe tooling in the embodiment. DETAILED DESCRIPTION

[0017] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are intended only to illustrate the relevant content and are not intended to limit the present invention. It should also be noted that, for ease of description, only the portions relevant to the present invention are shown in the accompanying drawings.

[0018] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0019] Example: See Figure 1-3 A heat dissipation copper block temperature sensing probe point tooling includes an upper heat dissipation copper block shell 1, a lower heat dissipation copper block shell 2, and multiple temperature sensing probe assemblies 3. The upper heat dissipation copper block shell 1 and the lower heat dissipation copper block shell 2 are fixedly connected to form a closed shell. A through hole 21 is provided on the lower heat dissipation copper block shell 2, and a temperature sensing probe assembly 3 is installed in the through hole 21. The multiple temperature sensing probe assemblies 3 do not contact each other.

[0020] The working principle of the temperature equalizing plate 5 is as follows: the bottom of the temperature equalizing plate 5 is in contact with the heat source, and the top is in contact with the heat dissipation end. The temperature of the heat source is transferred to the temperature equalizing plate 5, so that the working medium in the closed plate-shaped cavity inside the temperature equalizing plate 5 changes phase. The working medium circulates in the evaporation and condensation state, quickly conducts heat to the heat dissipation end, and the heat dissipation end quickly diffuses the heat to achieve the characteristic of rapid temperature uniformity. During the temperature detection process of the temperature equalizing plate 5, the actual working process of the temperature equalizing plate 5 and the heat dissipation end is simulated. The upper heat dissipation copper block shell 1 and the lower heat dissipation copper block shell 2 are fixedly connected to form a closed shell. The upper heat dissipation copper block shell 1, the lower heat dissipation copper block shell 2 and the closed shell are connected. At the heat dissipation end, the heat dissipation end is in contact with the temperature equalizing plate 5, that is, the lower surface of the lower heat dissipating copper block shell 2 is in contact with the upper surface of the temperature equalizing plate 5, and the heat of the heat source is transferred to the temperature equalizing plate 5. The temperature equalizing plate 5 uses two-phase phase change heat absorption to transfer the heat to the lower heat dissipating copper block shell 2. Multiple temperature sensing probe assemblies 3 are in contact with the upper surface of the temperature equalizing plate 5 to detect (collect) the temperature of the upper surface of the temperature equalizing plate 5 at different positions and different heat dissipation times, thereby calculating the temperature changes and trends at different positions on the upper surface of the temperature equalizing plate 5, and judging whether the heat dissipation power and heat dissipation temperature equalization performance of the temperature equalizing plate 5 meet the requirements, with higher temperature detection precision and higher accuracy.

[0021] The temperature sensing probe assembly 3 includes a temperature sensing probe 31, a spring 32, a temperature sensing wire 33 and an insulating sleeve 34. The temperature sensing probe 31 is connected to the temperature sensing wire 33 through the spring 32. The insulating sleeve 34 is covered on the outside of the temperature sensing probe 31 and the spring 32. In the natural state, the temperature sensing probe 31 is higher than the lower surface of the lower heat dissipation copper block shell 2. In the working state, the temperature sensing probe 31 is flush with the lower surface of the lower heat dissipation copper block shell 2. The insulating sleeve 34 insulates the temperature sensing probe assembly 3 from the upper heat dissipating copper block shell 1 and the lower heat dissipating copper block shell 2, preventing the temperatures of the upper heat dissipating copper block shell 1 and the lower heat dissipating copper block shell 2 from affecting the temperature data collected by the temperature sensing probe 31. In the working state, that is, when detecting the temperature of the temperature averaging plate 5, the temperature averaging plate 5 is located below the lower heat dissipating copper block shell 2. Under the action of gravity, the temperature sensing probe 31 is pressed into the lower heat dissipating copper block shell 2 as the spring 32 expands and contracts, and the lower end of the temperature sensing probe 31 contacts the upper surface of the temperature averaging plate 5, which is used to detect and collect the instantaneous temperature of the upper surface of the temperature averaging plate 5. During the detection process, the temperature sensing probe 31 does not cause any damage to the temperature averaging plate 5. Without damaging the temperature averaging plate 5, it can be used as a mass production jig for repeated testing to output key temperature data with higher accuracy and precision.

[0022] The upper heat sink copper block housing 1 is provided with an upper column, while the lower heat sink copper block housing 2 is provided with a lower column 22 that mates with the upper column. Both the upper and lower columns 22 are provided with through-holes 21, into which a temperature probe assembly 3 is mounted. The fixed fit of the upper and lower columns 22 enhances the strength of the enclosed housing's inner wall while increasing the heat dissipation area. The temperature probe assembly 3 is fixedly connected to the through-hole 21 and is insulated from the upper and lower heat sink copper block housings 1 and 2, preventing the temperatures of the upper and lower heat sink copper block housings 1 and 2 from affecting the temperature data collected by the temperature probe 31, thereby ensuring data accuracy.

[0023] A flow channel 41 is provided in the closed shell, and liquid (not shown in the figure) is provided in the flow channel 41. The liquid does not contact the temperature sensing probe assembly 3. The liquid fills the flow channel 41. The flow of the liquid diffuses the heat on the temperature equalizing plate 5, thereby increasing the heat dissipation efficiency of the heat dissipation end.

[0024] A liquid inlet 42 and a liquid outlet 43 are provided on the outer wall of the closed shell. The liquid inlet 42 and the liquid outlet 43 can transport the liquid into the flow channel 41 and form a flow circulation of the liquid, thereby transferring heat more quickly and improving the heat dissipation efficiency of the heat dissipation end. The tooling is used to simulate and detect the temperature of the upper surface of the temperature equalizing plate 5 with a flowing liquid heat dissipation end.

[0025] The flow channel 41 is configured to be S-shaped, and the flow channel 41 communicates with the liquid inlet 42 and the liquid outlet 43 . Of course, the flow channel 41 can also be designed into other shapes according to actual needs.

[0026] A heat sink 44 is provided in the closed shell and is fixedly connected between the upper heat sink copper block shell 1 and the lower heat sink copper block shell 2. The heat sink 44 improves the strength of the inner wall of the closed shell and increases the heat dissipation area.

[0027] To sum up, the heat dissipation copper block temperature sensing probe point tooling provided by the utility model simulates the heat dissipation end of the radiator through the upper heat dissipation copper block shell and the lower heat dissipation copper block shell. At the same time, multiple temperature sensing probe components are used to detect the temperature of the upper surface of the temperature equalizing plate at different positions and different heat dissipation times, thereby calculating the temperature changes and trends at different positions on the upper surface of the temperature equalizing plate, and judging whether the heat dissipation power and heat dissipation temperature equalization performance of the temperature equalizing plate meet the requirements. The operation is simple, and the human errors in temperature detection at this stage are eliminated, and the temperature detection precision and accuracy are higher.

[0028] Those skilled in the art will appreciate that the above embodiments are merely intended to clearly illustrate the present invention and are not intended to limit the scope of the present invention. Other variations or modifications may be made based on the above-described utility model, and such variations or modifications are still within the scope of the present invention.

Claims

1. A heat dissipation copper block temperature sensing probe tool, characterized by: It includes an upper heat dissipation copper block shell, a lower heat dissipation copper block shell, and multiple temperature sensing probe assemblies. The upper heat dissipation copper block shell and the lower heat dissipation copper block shell are fixedly connected to form a closed shell. The lower heat dissipation copper block shell is provided with a through hole, and the temperature sensing probe assembly is installed in the through hole. The multiple temperature sensing probe assemblies do not contact each other.

2. The heat dissipation copper block temperature sensing probe tooling according to claim 1, characterized in that: The temperature sensing probe assembly includes a temperature sensing probe, a spring, a temperature sensing wire and an insulating sleeve. The temperature sensing probe is connected to the temperature sensing wire through the spring. The insulating sleeve is covered on the outside of the temperature sensing probe and the spring. In the natural state, the temperature sensing probe is higher than the lower surface of the lower heat dissipating copper block shell. In the working state, the temperature sensing probe is flush with the lower surface of the lower heat dissipating copper block shell.

3. The heat dissipation copper block temperature sensing probe tooling according to claim 1, characterized in that: The upper heat dissipation copper block shell is provided with an upper column, and the lower heat dissipation copper block shell is provided with a lower column matched with the upper column. The upper and lower columns are provided with through holes, and the through holes are equipped with temperature probe components.

4. The heat dissipation copper block temperature sensing probe tool according to claim 1, characterized in that: A flow channel is provided in the closed shell, and liquid is provided in the flow channel. The liquid does not contact the temperature sensing probe assembly.

5. The heat dissipation copper block temperature sensing probe tooling according to claim 4, characterized in that: At least one liquid inlet and at least one liquid outlet are provided on the outer wall of the closed shell.

6. The heat dissipation copper block temperature sensing probe tooling according to claim 5, characterized in that: The flow channel is configured to be S-shaped, and the flow channel is communicated with the liquid inlet and the liquid outlet.

7. The heat dissipation copper block temperature sensing probe tool according to claim 1, characterized in that: A heat dissipation plate is provided in the closed shell, and the heat dissipation plate is fixedly connected between the upper heat dissipation copper block shell and the lower heat dissipation copper block shell.