Device for testing heat-conducting property of flaky material

Abstract

The utility model provides a heat-conducting property testing device for flaky materials. The heat-conducting property testing device comprises a power supply, a power resistor, a heat-conducting block and a temperature acquisition module, the power supply is electrically connected with the power resistor, and the power resistor is attached to one side of the heat conduction block and transfers heat to the heat conduction block; the other surface of the heat conduction block is used for placing a sample to be tested; and the temperature acquisition module is used for being connected with a to-be-tested sample. In the device for testing the heat-conducting property of the flaky material, the power supply is electrically connected with the power resistor, so that the temperature of the power resistor is increased in a power-on state, the power resistor transfers heat to the heat-conducting block, the temperature of the heat-conducting block is increased, one surface of the heat-conducting block is attached to the power resistor, and the other surface of the heat-conducting block is used for placing a sample to be tested; the temperature acquisition module is used for being connected with the to-be-detected sample so as to detect the heat conduction performance, operation is easy and convenient, and whether the to-be-detected object is qualified or not is visually recognized.

Description

Technical Field

[0001] The utility model belongs to the technical field of mobile equipment, and particularly relates to a device for testing the thermal conductivity of sheet materials. Background Art

[0002] In mobile device design, heat sinks are often in the form of sheet materials, such as graphite sheets, copper foil, and vapor chambers. For products in the pilot production phase, the stability of incoming materials is crucial. Because pilot production runs are limited in quantity, the raw materials available are relatively limited, leading to potential variations in the raw materials used for each pilot run. To ensure consistent performance across pilot runs and avoid impacting product production, performance testing of small batches of sheet heat sink materials is necessary. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings and deficiencies in the prior art and to provide a thermal conductivity testing device for sheet materials, which can detect the thermal conductivity of sheet-shaped items to be tested, is easy to operate, and can intuitively identify whether the items to be tested are qualified.

[0004] The utility model is realized through the following technical solutions:

[0005] A device for testing the thermal conductivity of sheet materials comprises a power supply, a power resistor, a thermal block, and a temperature acquisition module; the power supply is electrically connected to the power resistor, the power resistor is attached to one side of the thermal block and transfers heat to the thermal block; the other side of the thermal block is used to place a sample to be tested; and the temperature acquisition module is connected to the sample to be tested.

[0006] In the thermal conductivity testing device for sheet materials provided by the utility model, a power supply is electrically connected to a power resistor, causing the power resistor to increase in temperature when powered. The power resistor then transfers heat to a heat conductive block, causing the block to increase in temperature. One side of the heat conductive block is in contact with the power resistor, while the other side is used to place a sample to be tested, allowing heat from the power resistor to be transferred to the sample. A temperature acquisition module is connected to the heat conductive block and the sample to be tested to detect the sample's temperature. The thermal conductivity testing device for sheet materials provided by the utility model can test the thermal conductivity of the test item, is easy to operate, and allows intuitive identification of whether the test item is qualified.

[0007] Furthermore, the thermal conductivity testing device for sheet materials further comprises a support base, and the heat conductive block is mounted on the support base, and the support base is used to provide support for the heat conductive block.

[0008] Furthermore, the support base includes a low thermal conductivity platform, the low thermal conductivity platform having a thermal block mounting slot, and the thermal block is disposed within the thermal block mounting slot. The thermal block is mounted on the low thermal conductivity platform via the thermal block mounting slot, thereby providing support and reducing the impact of the low thermal conductivity platform's own temperature on the sample to be tested.

[0009] Furthermore, the thermal block mounting slot extends through the low thermal conductivity platform, and the power resistor is located outside the thermal block mounting slot. The power resistor is attached to one side of the thermal block, facing the sample to be tested, and is located outside the thermal mounting slot to minimize its impact on the temperature of the low thermal conductivity platform and the sample to be tested.

[0010] Furthermore, a thermal paste layer is provided between the power resistor and the heat conducting block, and the power resistor transfers heat to the heat conducting block through the thermal paste layer.

[0011] Furthermore, the power resistor is fixedly connected to the heat conducting block by screws.

[0012] Furthermore, the support base further includes a mounting seat; the low thermal conductivity platform is disposed on the mounting seat, and the mounting seat is provided with a power resistor mounting slot, the power resistor mounting slot corresponding to the position of the thermal block mounting slot, and the power resistor is located within the power resistor mounting slot. The power resistor mounting slot corresponds to the position of the thermal block mounting slot, so that a power resistor located outside the thermal block mounting slot can be accommodated in the power resistor mounting slot.

[0013] In order to better understand and implement the present invention, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of a device for testing the thermal conductivity of sheet materials.

[0015] Figure 2 It is a structural diagram of the heat conducting block.

[0016] Figure 3 This is a connection diagram of the power resistor and the thermal block.

[0017] Figure 4 It is a test schematic diagram of the sample to be tested.

[0018] Figure 5 It is a structural diagram of the low thermal conductivity platform.

[0019] Figure 6 It is a cross-sectional view of the support base. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions of the embodiments of the present invention, rather than all structures.

[0021] Furthermore, the terms "first," "second," "third," etc., in the specification and claims are used solely for descriptive purposes to distinguish between identical technical features. They are not to be construed as indicating or implying relative importance, or as implicitly specifying the number of technical features, nor do they necessarily describe a sequential or chronological order. The terms are interchangeable where appropriate. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one of those features.

[0022] Similarly, the terms "fixed" and "connected" used in the specification and claims should not be construed as limited to direct connections. Thus, the expression "device A is connected to device B" should not be limited to devices or systems in which device A is directly connected to device B. Rather, it means that a path exists between device A and device B, which may include other devices or tools.

[0023] Example 1

[0024] This embodiment provides a device for testing the thermal conductivity of sheet materials. Figure 1 This is a schematic diagram of the thermal conductivity test device for sheet materials. Figure 1 The thermal conductivity testing device for sheet materials includes a power supply 4, a power resistor 1, a thermal block 2 and a temperature acquisition module (not shown); the power supply 4 is electrically connected to the power resistor 1, the power resistor 1 is attached to one side of the thermal block 2, and transfers heat to the thermal block 2; the other side of the thermal block 2 is used to place a sample 5 to be tested; the temperature acquisition module is used to connect to the sample 5 to be tested.

[0025] In the thermal conductivity testing device for sheet materials provided in this embodiment, a power supply 4 is electrically connected to a power resistor 1, causing the temperature of the power resistor 1 to rise when powered. The power resistor 1 transfers heat to a thermal block 2, causing the temperature of the thermal block 2 to rise. One side of the thermal block 2 is in contact with the power resistor 1, while the other side is used to place a sample 5 to be tested. Heat from the power resistor 1 is transferred to the sample 5 to be tested. A temperature acquisition module is connected to the sample 5 to detect its temperature. The thermal conductivity testing device for sheet materials provided in this embodiment can test the thermal conductivity of the test object, is easy to operate, and allows intuitive identification of the qualified test object. It is suitable for testing the thermal conductivity of sheet materials such as graphite sheets, copper foil, and VC heat spreaders.

[0026] Figure 2 It is a schematic diagram of the structure of the heat conduction block. Figure 3 This is a schematic diagram of the connection between the power resistor and the thermal block. Figure 4 This is a test diagram of sample 5 to be tested. Figure 2-4 In one embodiment, the thermal block 2 is a cubic copper block or a rectangular copper block with a flat surface, suitable for bonding with sheet materials to achieve heat transfer. An adhesive layer can be provided on the side of the thermal block 2 facing away from the power resistor 1, for attaching the sheet-shaped sample 5 to be tested. The power resistor 1 and the sample 5 to be tested are located on opposite sides of the thermal block 2. The power resistor 1 transfers heat to the thermal block 2, and the thermal block 2, as a heat source, transfers heat to the sample 5 to be tested. The temperature of the sample 5 to be tested is detected by a temperature acquisition module. By sampling and detecting the center position 51 of the sample 5 close to the heat source and the edge position 52 away from the heat source, and comparing the temperature difference, it is determined whether the performance of the sample 5 to be tested meets the standard.

[0027] See also Figure 1 In this embodiment, the thermal conductivity testing device for sheet materials further includes a support base 3, and the heat conducting block 2 is mounted on the support base 3. The support base 3 is used to provide support for the heat conducting block 2.

[0028] Figure 5 This is a schematic diagram of the low thermal conductivity platform. Figure 5 In this embodiment, the support base 3 includes a low thermal conductivity platform 31, which defines a thermal block mounting slot 32. The thermal block 2 is disposed within the thermal block mounting slot 32. The thermal block 2 is mounted to the low thermal conductivity platform 31 via the thermal block mounting slot 32. The low thermal conductivity platform 31 provides support while minimizing the effect of its own temperature on the sample 5 to be tested.

[0029] See also Figure 5 In this embodiment, a thermal block mounting slot 32 extends through the low thermal conductivity platform 31, and the power resistor 1 is located outside the thermal block mounting slot 32. The power resistor 1 is attached to one side of the thermal block 2, facing the sample 5 under test. Furthermore, the power resistor 1 is located outside the thermal mounting slot to minimize its impact on the temperature of the low thermal conductivity platform 31 and the sample 5 under test.

[0030] In one embodiment, the low thermal conductivity platform 31 is an acrylic plate, and a thermal conductive block mounting groove 32 is opened through the acrylic plate. The thermal conductive block 2 is embedded in the thermal conductive block mounting groove 32, and its two end surfaces are flush with the low thermal conductivity platform 31; the area of ​​the thermal conductive block 2 is not less than the area of ​​the material to be tested.

[0031] Figure 6 is a cross-sectional view of the support base, see Figure 6In this embodiment, the support base 3 further includes a mounting base 33; the low thermal conductivity platform 31 is disposed on the mounting base 33, which is provided with a power resistor mounting groove 34. The power resistor mounting groove 34 corresponds to the position of the thermal block mounting groove 32, and the power resistor 1 is located in the power resistor mounting groove 34. The power resistor mounting groove 34 corresponds to the position of the thermal block mounting groove 32, so that the power resistor 1 located outside the thermal block mounting groove 32 can be accommodated in the power resistor mounting groove 34.

[0032] In one embodiment, the mounting base 33 is further provided with a power supply accommodating groove that is in communication with the power resistor mounting groove 34 .

[0033] In this embodiment, a thermal paste layer is provided between the power resistor 1 and the heat conducting block 2. The power resistor 1 transfers heat to the heat conducting block 2 through the thermal paste layer.

[0034] See also Figure 3 In this embodiment, the power resistor 1 is fixedly connected to the heat conducting block 2 by screws. In one embodiment, a layer of thermal paste is applied to the side of the power resistor 1 facing the heat conducting block 2. Mounting ears 11 are provided on both sides of the power resistor 1. The mounting ears 11 have screw holes, through which the screws pass and are fixed to the copper block.

[0035] The present invention is not limited to the above-mentioned embodiments. If various changes or modifications to the present invention do not depart from the spirit and scope of the present invention, and if these changes and modifications fall within the scope of the claims and equivalent technologies of the present invention, the present invention is also intended to include these changes and modifications.

Claims

1. A device for testing the thermal conductivity of sheet materials, characterized by: Including power supply, power resistor, thermal block and temperature acquisition module; The power supply is electrically connected to the power resistor, the power resistor is attached to one side of the heat conductive block and transfers heat to the heat conductive block; the other side of the heat conductive block is used to place the sample to be tested; the temperature acquisition module is used to connect to the sample to be tested.

2. The thermal conductivity testing device for sheet materials according to claim 1, characterized in that: It also includes a support base, and the heat conducting block is installed on the support base.

3. The thermal conductivity testing device for sheet materials according to claim 2, characterized in that: The support base includes a low thermal conductivity platform, the low thermal conductivity platform is provided with a thermal conductive block installation groove, and the thermal conductive block is arranged in the thermal conductive block installation groove.

4. The thermal conductivity testing device for sheet materials according to claim 3, characterized in that: A surface of the heat conducting block facing away from the power resistor is flush with the low thermal conductivity platform.

5. The thermal conductivity testing device for sheet materials according to claim 3, characterized in that: The heat conducting block installation groove is arranged through the low heat conducting platform, and the power resistor is located outside the heat conducting block installation groove.

6. The thermal conductivity testing device for sheet materials according to claim 5, characterized in that: A thermal conductive paste layer is provided between the power resistor and the thermal conductive block.

7. The thermal conductivity testing device for sheet materials according to claim 6, characterized in that: The power resistor is fixedly connected to the heat conducting block by screws.

8. The thermal conductivity testing device for sheet materials according to claim 5, characterized in that: The support base also includes a mounting seat; the low thermal conductivity platform is arranged on the mounting seat, and the mounting seat is provided with a power resistor mounting groove, the power resistor mounting groove corresponds to the position of the thermal block mounting groove, and the power resistor is located in the power resistor mounting groove.

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