Thermal trip assembly for switching device and switching device

Abstract

The embodiment of the utility model provides a thermal tripping assembly for a switching device and the switching device. The thermal tripping assembly comprises a heating element which is electrically connected to a circuit of a switching device and is suitable for enabling current to flow through and enabling the temperature to rise; the connecting piece comprises a coupling part coupled to the heating piece, a hanging part which is coupled to one end of the coupling part and forms a non-zero angle with the coupling part and a containing groove, and the containing groove is formed in the coupling part and the hanging part and located on the side close to the heating piece; one end of the thermal deformation piece is coupled to the hanging part, and the other end of the thermal deformation piece is coupled to a moving contact of the switching device; and the heat conduction piece is coupled in the accommodating groove and is adjacent to the heating piece, so that the heat of the heating piece is transferred to the thermal deformation piece through the connecting piece, the thermal deformation piece is deformed, and a moving contact of the switching device is triggered to release when the circuit is in an overload state. Therefore, the heat transfer efficiency can be improved through the heat pipe, and the switch device is prevented from being overheated.

Description

Technical Field

[0001] Example embodiments of the present disclosure generally relate to the field of switchgear, and more particularly to a thermal trip assembly for a switchgear and the switchgear. Background Art

[0002] In electrical systems, switching devices such as overload protection releases are used to protect circuits from damage due to excessive current. Existing overload protection releases rely on bimetallic strips or other temperature-sensitive components to detect overload conditions and mechanically disconnect the circuit. However, the response speed of existing switching devices is limited by their heat transfer efficiency. Furthermore, to ensure that the switching devices do not overheat under high currents, existing switching devices require larger moving contacts or use complex moving contact structures. Utility Model Content

[0003] An object of the present disclosure is to provide a thermal trip assembly for a switch device and a switch device, so as to at least partially solve the above-mentioned problems and / or other potential problems existing in traditional switch devices.

[0004] In a first aspect of the present disclosure, a thermal trip assembly for a switch device is provided. The thermal trip assembly includes: a heating element electrically connected to a circuit of the switch device, adapted to allow current to flow through and cause the temperature to rise; a connecting element including a coupling portion coupled to the heating element, a hanging portion coupled to one end of the coupling portion and forming a non-zero angle with the coupling portion, and a receiving groove, wherein the receiving groove is formed on the coupling portion and the hanging portion and is located on a side close to the heating element; a thermal deformation element, one end of which is coupled to the hanging portion and the other end of which is coupled to a moving contact of the switch device; and a heat conducting element coupled in the receiving groove and adjacent to the heating element to transfer the heat of the heating element to the thermal deformation element via the connecting element, thereby deforming the thermal deformation element and triggering the moving contact of the switch device to trip when the circuit is in an overload state.

[0005] In an embodiment according to the present disclosure, a heating element is electrically connected to the circuit of the switching device. When current flows through the circuit, the temperature of the heating element rises, providing a heat source for the subsequent thermal tripping action. The accommodating groove of the connector is arranged on the side close to the heating element, so that the heat pipe can efficiently transfer the heat of the heating element to the thermal deformation element via the connector. The heat pipe can improve the heat transfer efficiency and ensure that the thermal deformation element can quickly respond to the temperature change of the heating element. When the circuit is in an overload state, the thermal deformation element can be deformed quickly, thereby triggering the moving contact of the switching device to trip, thereby achieving timely protection of the circuit. As a result, the response speed and accuracy of the thermal trip assembly can be improved, the safety and reliability of the circuit are enhanced, and damage to electrical equipment caused by overload can be effectively prevented. Other benefits will be described in detail below in conjunction with the corresponding embodiments.

[0006] In some embodiments, the connecting member includes: a bending portion coupled between the coupling portion and the hanging portion, and the accommodating groove is also formed on the bending portion, and the bottom of the accommodating groove is in an arc shape.

[0007] In some embodiments, the heat conductor includes a heat pipe, which includes: a closed tube body filled with a working medium; an evaporation section, arranged adjacent to the heating element to absorb heat generated by the heating element; a condensation section, arranged adjacent to the thermal deformation element to transfer the absorbed heat to the thermal deformation element; and a reflux section, arranged between the evaporation section and the condensation section, for returning the condensed working medium to the evaporation section through capillary action.

[0008] In some embodiments, the reflux section of the heat pipe is provided with a capillary structure to promote the reflux of the working medium.

[0009] In some embodiments, the receiving groove is arranged to penetrate the hanging portion to allow the heat conducting member to abut against the thermally deformable member.

[0010] In some embodiments, a triggering member is coupled to an end of the thermal deformation member away from the connecting member, and the triggering member is adapted to trigger the tripping of the moving contact of the switching device when the thermal deformation member deforms.

[0011] In some embodiments, the connector is integrally formed.

[0012] In a second aspect of the present disclosure, a switch device is provided. The switch device includes: a movable contact adapted to move between a closed position and an open position, wherein in the closed position, the movable contact contacts a stationary contact of the switch device, and in the open position, the movable contact and the stationary contact are separated; and a thermal trip assembly according to the first aspect, coupled to the movable contact and adapted to trigger the thermal trip assembly to separate the movable contact from the stationary contact when the switch device detects an overload.

[0013] In some embodiments, the movable contact includes a pair of contact fingers coupled to the thermal trip assembly for making contact with and separating from the contact points of the stationary contact to connect and disconnect the circuit of the switching device.

[0014] In some embodiments, the switching device further includes: a handle for manually controlling the contact and separation of the moving contact and the static contact.

[0015] It should be understood that the content described in this summary section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0017] Figure 1 A schematic structural diagram of a switch device in a closed state according to an embodiment of the present disclosure is shown;

[0018] Figure 2 A schematic structural diagram of a switch device in an open state according to an embodiment of the present disclosure is shown;

[0019] Figure 3 A schematic structural diagram of a thermal trip assembly according to an embodiment of the present disclosure is shown;

[0020] Figure 4 A cross-sectional view illustrating a thermal trip assembly according to an embodiment of the present disclosure; and

[0021] Figure 5 A schematic structural diagram of the connecting member and the thermal deformation member of an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0022] The following describes embodiments of the present disclosure in more detail with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of protection of the present disclosure.

[0023] In the description of the embodiments of the present disclosure, the term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The term "some embodiments" should be understood as "at least some embodiments". Other explicit and implicit definitions may be included below. The terms "first", "second", etc. may refer to different or the same objects. Other explicit and implicit definitions may be included below.

[0024] As briefly mentioned above, the response speed of existing switchgear is limited by the efficiency of heat conduction. When the current exceeds the rated value, existing thermally deformable components (such as bimetallic strips) are heated by heating tapes. It takes time for them to absorb sufficient heat and deform, triggering the tripping action. This delay can cause the switchgear to be subjected to excessive current for a short period of time, increasing the risk of damage.

[0025] For example, existing switch devices use heating tape to heat bimetallic strips. For example, copper is used as the material of the heating tape. Since copper has a relatively low heat dissipation coefficient, when the bimetallic strip is heated and deflected, the heating tape shortens, resulting in reduced heating efficiency. Secondly, the existing heating tape needs to be bent multiple times, and in the actual production process, it is difficult to ensure precise control of the size of the bending angle. This will not only affect the consistency of the position of the bimetallic strip, but also have an adverse effect on the consistency of the heating length, which may lead to inaccurate or unstable thermal tripping action. Furthermore, when the switch device needs to be expanded and a thicker heating tape needs to be replaced, the bending of the heating tape becomes impractical because cracking is likely to occur at the corners, which will affect the upgrade and improvement of the switch device and cannot meet the growing requirements of electrical equipment for thermal tripping performance and reliability.

[0026] In addition, in order to ensure that the switching device does not overheat under high current, increasing the size of the moving contact or adopting a complex moving contact structure will not only increase the manufacturing cost, but also increase the size of the switching device, which is not conducive to compact design and space-constrained application scenarios, thereby causing installation difficulties.

[0027] In order to solve or at least partially solve the above-mentioned problems or other potential problems of the switch device of the traditional solution, an embodiment of the present disclosure provides a thermal trip assembly solution for the switch device. In the thermal trip assembly, the heating element is electrically connected to the circuit of the switch device. When current flows through the circuit, the temperature of the heating element rises due to the flow of current, and becomes the heat source of the thermal trip assembly. The connecting member includes a coupling portion tightly coupled to the heating element, a hanging portion coupled to one end of the coupling portion and forming a non-zero angle with the coupling portion, and a receiving groove. The receiving groove is formed on the coupling portion and the hanging portion, and is arranged along the extension direction of the hanging portion and close to one side of the heating element. One end of the thermal deformation element is coupled to the hanging portion, and the other end is coupled to the moving contact of the switch device. The heat conductive element is coupled in the receiving groove and is adjacent to the heating element. During the operation of the circuit, the heat conductive element can efficiently transfer the heat generated by the heating element to the thermal deformation element via the connecting member. When the circuit is in an overload state, the thermal deformation part can deform rapidly, thereby triggering the moving contact of the switching device to trip, cutting off the circuit in time, and effectively preventing damage to the circuit and equipment due to overload.

[0028] Thus, the heat pipe utilizes the phase-change heat transfer principle of heat pipes to achieve efficient heat transfer even with very small temperature differences. Integrating heat pipes into switchgear, such as overload protection releases, can improve heat transfer efficiency, shorten the switchgear's response time, and reduce the heat dissipation area required for the moving contact. This not only increases the switchgear's current carrying capacity but also reduces its overall size, lowers costs, and improves its stability and reliability.

[0029] Figure 1A schematic structural diagram of the switch device 100 in a closed state according to an embodiment of the present disclosure is shown. Figure 2 The schematic diagram of the structure of the switch device 100 in the open state according to the embodiment of the present disclosure is shown. Figures 1 to 2 The exemplary structure and operation of the thermal trip assembly of a switch device 100 are described below. According to embodiments of the present disclosure, a switch device 100, such as an overload protection release, may include a circuit breaker, or may include any other suitable switch device 100 other than a circuit breaker, including a movable contact 160 and a stationary contact 170. The concepts of the present disclosure will be primarily described below using a circuit breaker as an example. It should be understood that similar applications exist for other devices, and will not be further described below.

[0030] like Figure 1 and Figure 2 As shown, the switch device 100 according to the embodiment of the present disclosure includes a static contact 170, a thermal trip assembly, and a moving contact 160. The static contact 170 is arranged to be electrically connected to the power supply side or the power consumption side of the switch device 100, respectively. The moving contact 160 in the switch device 100 is a movable component that is connected to or separated from the static contact 170 and has the ability to move between the closed position and the open position. When the circuit breaker is in a closed state (such as a closed state), the moving contact 160 is connected to the static contact 170 to form a path so that the current can flow normally, thereby connecting the power supply side and the power consumption side.

[0031] Furthermore, the thermal trip assembly is coupled to the movable contact 160. During operation of the switch device 100, when a circuit overload is detected, the thermal trip assembly can be triggered. When the thermal trip assembly of the switch device 100 is in an open state (e.g., an open state), the movable contact 160 rapidly separates, severing the current path.

[0032] Specifically, the thermal trip assembly senses the heat generated by the overload current and uses its own thermal trip mechanism to prompt the relevant components to operate, thereby driving the moving contact 160 to move, separating the moving contact 160 from the static contact 170, and quickly cutting off the circuit to protect the entire switch device 100 and the connected circuit from damage by the overload current, thereby ensuring the safe and stable operation of the electrical equipment.

[0033] Figure 3 A schematic structural diagram of a thermal trip assembly according to an embodiment of the present disclosure is shown. Figure 4 A cross-sectional view of a thermal trip assembly according to an embodiment of the present disclosure is shown. Figure 5 The structural diagram of the connecting member 120 and the thermal deformation member 130 of the embodiment of the present disclosure is shown. Figures 3 to 5The specific structure of the thermal trip assembly is described below. In the embodiment of the present disclosure, the thermal trip assembly generally includes a heating element 110, a connecting element 120, a thermal deformation element 130, and a heat conducting element. The heating element 110 is electrically connected to the circuit of the switch device 100.

[0034] During normal circuit operation, current flows through the heating element 110. Due to the thermal effect of the current, the temperature of the heating element 110 gradually rises as the current in the circuit passes through it. The heating element 110 is made of a material with electrical resistance, capable of converting electrical energy into heat energy. It operates stably within a preset current range and is highly responsive to temperature changes.

[0035] Furthermore, the connecting member 120 includes a coupling portion 1201, a hanging portion 1202 and a receiving groove 121. The coupling portion 1201 is tightly coupled to the heating element 110 to ensure that the heat generated by the heating element 110 can be effectively received. The hanging portion 1202 is coupled to one end of the coupling portion 1201 and is at a non-zero angle with the coupling portion 1201, providing a stable connection point for the thermal deformation member 130. The receiving groove 121 is formed on the coupling portion 1201 and the hanging portion 1202 and is located on a side close to the heating element 110. The receiving groove 121 is used to place a heat-conducting member so that the heat-conducting member can better exchange heat with the heating element 110 and the thermal deformation member 130. By connecting the heating element 110 and the thermal deformation member 130 through the connecting member 120, it is possible to avoid limiting the width of the heating element 110, that is, the width of the heating element 110 can be increased. In some embodiments, the connecting member can be integrally formed, which is not specifically limited in the embodiments of the present disclosure.

[0036] Furthermore, one end of the thermal deformation member 130 is coupled to the hook portion 1202 of the connector 120, and the other end is coupled to the movable contact 160 of the switch device 100. The thermal deformation member 130 is made of a bimetallic strip or other temperature-sensitive material with deformation properties. When the heat generated by the heating element 110 is transferred to the thermal deformation member 130 through the connector 120, the thermal deformation member 130 deforms as the temperature rises. In some embodiments, the thermal deformation member 130 may include a bimetallic strip.

[0037] Furthermore, the heat conducting member is coupled in the receiving groove 121 of the connecting member 120 and is closely adjacent to the heating member 110. The heat conducting member utilizes the evaporation and condensation process of the working medium inside it to efficiently and quickly transfer the heat of the heating member 110 to the thermal deformation member 130. When the heat of the heating member 110 is transferred to the heat conducting member, the working medium inside the heat conducting member absorbs the heat and evaporates. The vapor flows inside the heat conducting member to an area with a lower temperature and then condenses to release heat. The condensed working medium then returns to the heating end through capillary action. This cycle repeats, thereby achieving efficient heat transfer.

[0038] The heat from the heating element 110 is quickly transferred to the thermally deformable element 130 via the connector 120 through the heat conductor. For example, the heat dissipation coefficient of the heat conductor can be more than 12 times that of copper. Therefore, the high thermal conductivity of the heat conductor can be used to replace the copper heating tape, providing stable heat to the bimetallic strip while reducing the resistance and power consumption of other components.

[0039] When the circuit is in an overload state, the current increases and the heat generated by the heating element 110 increases sharply. The heat conducting element quickly transfers this heat to the thermal deformation element 130, causing the temperature of the thermal deformation element 130 to rise rapidly and deform. The deformation of the thermal deformation element 130 can generate mechanical force, which can trigger the tripping action of the moving contact 160 of the switching device 100. Under the action of the thermal deformation element 130, the moving contact 160 is separated from the static contact 170, thereby cutting off the circuit and achieving overload protection for the switching device 100 and the entire circuit, preventing equipment damage or safety accidents caused by overload current.

[0040] In the embodiments disclosed herein, there are no specific limitations on the dimensions, materials, or interconnection methods of the heating element 110, connector 120, thermally deformable element 130, and thermally conductive element. For example, the resistance of the heating element 110 can be selected based on the rated current of the circuit and the overload protection requirements; the material of the connector 120 can have good thermal conductivity and mechanical strength to ensure effective heat transfer and structural stability; the material and shape of the thermally deformable element 130 can accurately deform within a suitable temperature range and generate sufficient force to trigger a tripping action; and the internal structure and working medium of the thermally conductive element can be selected based on the heat transfer requirements.

[0041] like Figure 3 and Figure 4 As shown, in some embodiments, the thermal deformation member 130 is coupled to a trigger member 140 at one end thereof away from the connecting member 120 , for achieving a tripping action of the moving contact 160 of the switch device 100 .

[0042] As a component sensitive to temperature changes, the thermally deformable member 130 may deform when the circuit is overloaded due to the heat transferred from the heating element 110 through the heat conducting member and the connecting member 120. Furthermore, the thermally deformable member 130 may be made of a material with a predetermined thermal expansion coefficient to ensure sufficient deformation within a certain temperature range, which is not specifically limited in the embodiments of the present disclosure.

[0043] Furthermore, the trigger member 140 is tightly coupled to the thermal deformation member 130, and is used to convert the deformation of the thermal deformation member 130 into a mechanical action that can trigger the movable contact 160 of the switching device 100 to trip. When the thermal deformation member 130 is deformed due to an increase in temperature, this deformation can be transmitted to the trigger member 140 coupled thereto. The trigger member 140 can include various forms, for example, it can be a push rod with a specific shape and structure. When the deformation of the thermal deformation member 130 pushes the trigger member 140, the trigger member 140 can apply a force to the movable contact 160 of the switching device 100 based on its own movement mode and mechanical principles. This force can prompt the movable contact 160 to overcome the force that keeps it in the closed position, thereby achieving a tripping action, separating the movable contact 160 from the static contact 170, and cutting off the circuit.

[0044] Furthermore, the coupling between the thermally deformable member 130 and the trigger member 140 can be achieved through a suitable connection method, such as mechanical connection, welding, or other reliable connection methods, to ensure that when the thermally deformable member 130 deforms, force can be accurately and effectively transmitted to the trigger member 140. Furthermore, the materials, dimensions, and shapes of the thermally deformable member 130 and the trigger member 140 can be sufficient to achieve effective thermal deformation and triggering within a given space, and are not specifically limited in the embodiments of the present disclosure.

[0045] like Figure 5 As shown, in some embodiments, the bent portion 1203 of the connector 120 is coupled between the coupling portion 1201 and the hanging portion 1202 , thereby achieving a connection between the two portions and forming a connector 120 with a bent structure.

[0046] Furthermore, the accommodating groove 121 is also formed on the bent portion 1203, which can ensure that the heat conductor can be in close contact with the connector 120 at multiple locations, thereby more effectively transferring heat. It is worth noting that the bottom of the accommodating groove 121 on the bent portion 1203 is in an arc shape, which can ensure the fit with the heat conductor and avoid the situation where the heat conductor has creases at the bend due to an inappropriate shape of the bottom of the groove, which affects the flow of the working medium inside it and reduces the heat transfer efficiency of the heat conductor. Secondly, from the perspective of heat transfer, the arc-shaped surface can make the contact area between the heat conductor and the accommodating groove 121 larger, thereby improving the heat transfer efficiency.

[0047] When the heat generated by the heating element 110 is transferred to the connecting element 120, the arc-shaped groove bottom can transfer the heat to the heat conductor more evenly, so that the working medium in the heat conductor can absorb heat more quickly and undergo evaporation and condensation cycles, and then efficiently transfer the heat to the thermally deformable element 130, thereby ensuring that when the circuit is overloaded, the thermal trip assembly can promptly and reliably trigger the tripping action of the moving contact 160, thereby achieving effective protection for the switching device 100 and the circuit.

[0048] In some embodiments, the heat conducting element includes a heat pipe 150, which includes a closed tube body, an evaporation section, a condensation section, and a reflux section. The closed tube body is sealed and filled with a specific working medium. This closed structure ensures that the working medium can undergo a stable cyclic phase change process within the closed tube body without leaking into the external environment.

[0049] Furthermore, one end of the heat pipe 150 is an evaporation section, which is in close contact with or close to the heating element 110. In other words, the evaporation section is arranged adjacent to the heating element to absorb the heat generated by the heating element 110. When the heating element 110 generates heat, the evaporation section can quickly absorb this heat. As the temperature of the evaporation section increases, the working medium in the pipe is heated and evaporated in this area, changing from liquid to gas. The working medium can absorb a large amount of heat during the evaporation process, thereby achieving efficient heat absorption.

[0050] The condensation section, located opposite the evaporation section and adjacent to the thermally deformable element 130, transfers heat absorbed from the evaporation section to the thermally deformable element 130. In the condensation section, the gaseous working medium, due to the relatively low ambient temperature, releases heat and recondenses into the working medium. During this process, heat is transferred to the thermally deformable element 130, providing the energy source for its deformation.

[0051] Heat pipe 150 also includes a reflux section, located between the evaporation section and the condensation section. This section uses capillary action to return the condensed working medium to the evaporation section. Capillary structures, such as wicks, can be arranged on the inner walls or internal structures of heat pipe 150. When the condensed working medium is in the reflux section, these capillary structures draw the working medium back to the evaporation section through capillary force. This capillary force overcomes the working medium's gravity and flow resistance, allowing the working medium to return from the condensation section to the evaporation section, thus completing a complete heat transfer cycle.

[0052] In this way, the heat pipe 150 can continuously transfer heat from the heating element 110 to the thermally deformable element 130, ensuring that when the circuit is overloaded, the thermally deformable element 130 can promptly receive sufficient heat to deform, triggering the movable contact 160 of the switch device 100 to trip, thereby achieving overload protection for the circuit. In the embodiments of the present disclosure, no specific restrictions are placed on the material selection of the enclosed tube body, the type and filling amount of the working medium, the length ratio of the evaporation section and the condensation section, or the capillary structure, in order to ensure that the heat pipe 150 has good heat transfer performance and reliability, meeting the efficient heat transfer requirements of the thermal trip assembly under different operating conditions.

[0053] In some embodiments, the receiving groove 121 is arranged to penetrate the hanging portion 1202. When the heat conductive member is placed in the receiving groove 121, since the receiving groove 121 penetrates the hanging portion 1202, the heat conductive member can be arranged and positioned at a predetermined position on the hanging portion 1202. With this through-type arrangement, the heat conductive member can establish a more direct heat transfer path with the thermally deformable member 130.

[0054] Specifically, the heat conducting member can be adjacent to the thermal deformation member 130 at the penetration position of the accommodating groove 121, thereby realizing efficient heat transfer. When the circuit is operating normally, the heat generated by the heating element 110 is transferred through the heat conducting member, and the heat conducting member uses its efficient heat transfer characteristics to quickly conduct the heat to the portion adjacent to the thermal deformation member 130. When the circuit is in an overload state, the heat generated by the heating element 110 increases, and the heat conducting member can transfer a large amount of heat to the thermal deformation member 130 adjacent thereto. After receiving enough heat, the thermal deformation member 130 can be deformed according to its own thermal deformation characteristics, thereby triggering the tripping action of the moving contact 160 of the switching device 100, thereby realizing overload protection for the circuit.

[0055] Continue to see Figure 1 and Figure 2 In some embodiments, the movable contact 160 includes a pair of contact fingers coupled to a thermal trip assembly for contacting and separating with the contact point 1701 of the stationary contact 170, thereby connecting and disconnecting the circuit of the switch device 100. In existing solutions, a three-finger contact structure is typically used to meet the current carrying capacity requirements of the circuit and prevent excessive heating of the contact fingers due to the current passing through. However, in this embodiment, the heat transfer efficiency can be improved due to the efficient heat transfer of the thermal conductive member, allowing heat to be transferred more quickly and evenly.

[0056] Therefore, reducing the number of contact fingers from three to two not only reduces material costs and structural complexity, but also reduces overall weight to a certain extent. Furthermore, the efficient heat transfer of the heat conducting member ensures stable operation of the switch device 100 under normal operating currents. In the event of an overload, the thermal trip assembly can be triggered promptly and effectively, ensuring circuit safety.

[0057] In some embodiments, the switch device 100 further includes a handle 180 for manually manipulating the moving contact 160 and the static contact 170 to make contact and separate, thereby achieving manual control of the on-off of the circuit.

[0058] In terms of operating mechanism, when the user grasps the handle 180 and performs the corresponding action, the handle 180 is connected to the moving contact 160 via a mechanical connection structure. For example, the movement of the handle 180 may be converted into linear or rotational motion of the moving contact 160 via a connecting rod, gear transmission, or other suitable transmission device. When the user pushes the handle 180 in the closing direction, the handle 180 drives the transmission device, causing the moving contact 160 to move toward the static contact 170 until the two are in close contact, thus achieving circuit conduction. Conversely, when the circuit needs to be disconnected, the user pulls the handle 180 in the opening direction. At this time, the handle 180 drives the moving contact 160 away from the static contact 170 through the transmission device, separating the two and thus disconnecting the circuit.

[0059] While various implementations of the present disclosure have been described above, the foregoing description is intended to be illustrative, not exhaustive, and not limited to the disclosed implementations. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described implementations. The terminology used herein is selected to best explain the principles of the implementations, their practical applications, or improvements to existing technologies, or to enable others skilled in the art to understand the various implementations disclosed herein.

Claims

1. A thermal trip assembly for a switchgear, characterized in that: include: A heating element (110) is electrically connected to the circuit of the switch device and is suitable for allowing current to flow through and causing the temperature to rise; A connecting member (120), comprising a coupling portion (1201) coupled to the heating member (110), a hanging portion (1202) coupled to one end of the coupling portion (1201) and forming a non-zero angle with the coupling portion (1201), and a receiving groove (121), wherein the receiving groove (121) is formed on the coupling portion (1201) and the hanging portion (1202), and is located on a side close to the heating member (110); a thermal deformation member (130), one end of which is coupled to the hanging portion (1202) and the other end of which is coupled to the moving contact (160) of the switch device; and A heat-conducting member is coupled in the accommodating groove (121) and is adjacent to the heating member (110) to transfer the heat of the heating member (110) to the thermal deformation member (130) via the connecting member (120), thereby deforming the thermal deformation member (130) and triggering the movable contact (160) of the switching device to trip when the circuit is in an overload state.

2. The thermal trip assembly according to claim 1, characterized in that: The connecting member (120) comprises: The bending portion (1203) is coupled between the coupling portion (1201) and the hanging portion (1202), and the accommodating groove (121) is also formed on the bending portion (1203), and the bottom of the accommodating groove (121) is in an arc shape.

3. The thermal trip assembly according to claim 1, characterized in that: The heat conducting member comprises a heat pipe (150), and the heat pipe (150) comprises: The tube body is closed and filled with working medium; an evaporation section, arranged adjacent to the heating element (110) to absorb heat generated by the heating element (110); a condensation section, arranged adjacent to the thermal deformation member (130) to transfer the absorbed heat to the thermal deformation member (130); and The reflux section is arranged between the evaporation section and the condensation section, and is used to return the condensed working medium to the evaporation section through capillary action.

4. The thermal trip assembly according to claim 3, characterized in that: The reflux section of the heat pipe (150) is provided with a capillary structure for promoting the reflux of the working medium.

5. The thermal trip assembly according to any one of claims 1 to 4, characterized in that: The accommodating groove (121) is arranged to penetrate the hanging portion (1202) to allow the heat conducting member to abut against the thermal deformation member (130).

6. The thermal trip assembly according to any one of claims 1 to 4, characterized in that: The thermal deformation member (130) is coupled with a trigger member at one end away from the connecting member (120), and the trigger member is suitable for triggering the movable contact (160) of the switch device to trip when the thermal deformation member (130) deforms.

7. The thermal trip assembly according to any one of claims 1 to 4, characterized in that: The connecting piece (120) is integrally formed.

8. A switch device, characterized in that: include: A movable contact (160) adapted to move between a closing position and an opening position, wherein in the closing position the movable contact (160) contacts a stationary contact (170) of the switch device, and in the opening position the movable contact (160) and the stationary contact (170) are separated; and The thermal trip assembly according to any one of claims 1 to 7 is coupled to the moving contact (160) and is suitable for triggering the thermal trip assembly to separate the moving contact (160) from the static contact (170) when the switching device detects an overload.

9. The switch device according to claim 8, characterized in that The movable contact (160) includes a pair of contact fingers coupled to the thermal trip assembly and configured to make contact with and separate from the contact point (1701) of the stationary contact (170) to connect and disconnect the circuit of the switching device.

10. The switch device according to claim 8 or 9, characterized in that: Also includes: A handle (180) is used for manually manipulating the moving contact (160) and the static contact (170) to make contact and separate.

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