Wafer clamping mechanism

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer clamping mechanism which comprises a clamping bin, a clamping claw connected with the clamping bin and a clamping driving mechanism in driving connection with the clamping claw, the clamping claw is provided with an adsorption area, and the clamping driving mechanism drives the clamping claw to move. The clamping claw is close to or far away from the clamping bin; when the wafer is clamped, the clamping driving mechanism drives the clamping claws to approach the wafer, and the wafer is adsorbed to the adsorption area by negative pressure; after the wafer is clamped, the clamping driving mechanism drives the clamping claw to get close to the clamping bin, so that the clamping claw moves to the upper part or the lower part of the clamping bin; according to the utility model, the wafer can be moved out of the wafer loading space after being clamped, so that the wafer can be clamped in a narrow space, the clamping bin can smoothly move in the wafer loading space, and the wafer loading efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer clamping mechanism. Background Art

[0002] A wafer is a regular cylindrical silicon wafer used in the manufacture of semiconductor circuits. It is made of silicon. Wafers are one of the most critical raw materials in the production of semiconductor integrated circuits. During semiconductor processing, wafer trimming is necessary to ensure a smooth and intact edge for subsequent processing and to ensure the high performance of the finished chip. Once wafer trimming is complete, a specialized gripping device is used to remove the wafer from the wafer stage and transfer it to the next processing station.

[0003] The existing clamping device occupies the loading space after clamping the wafer, and the clamped wafer cannot be smoothly moved out of the loading space. It is difficult to clamp the wafer in a narrow space, which affects the wafer loading efficiency. Utility Model Content

[0004] In response to the deficiencies of the prior art, the utility model provides a wafer clamping mechanism. After the wafer is clamped, the wafer is moved out of the wafer loading space, thereby realizing wafer clamping in a narrow space. The clamping bin can move smoothly in the wafer loading space, thereby improving wafer loading efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The utility model provides a wafer clamping mechanism, comprising a clamping bin, a clamping claw connected to the clamping bin, and a clamping drive mechanism connected to the clamping claw. The clamping claw is provided with an adsorption area, and the clamping drive mechanism drives the clamping claw to move so that the clamping claw approaches or moves away from the clamping bin.

[0007] When clamping the wafer, the clamping drive mechanism drives the clamping claws to approach the wafer, and the wafer is adsorbed in the adsorption area by negative pressure;

[0008] After the wafer is clamped, the clamping drive mechanism drives the clamping claws to approach the clamping bin, so that the clamping claws move to the top or bottom of the clamping bin.

[0009] The clamping bin is provided with an active space, the clamping claw is connected to a moving part, the clamping claw is slidably connected to the active space through the moving part, the moving part is connected to a dust shield, and the clamping drive mechanism is drivingly connected to the moving part;

[0010] The clamping drive mechanism drives the moving part to move back and forth in the activity space, so that the dust shielding part blocks the activity space.

[0011] Among them, the wafer clamping mechanism also includes a lifting mechanism, which is driven by the clamping bin. The lifting mechanism drives the clamping bin to move up and down, so that the clamping claws move up and down. The clamping bin is equipped with a collection camera for photographing wafers.

[0012] The clamping claw comprises a clamping claw body and a clamping seat connected to the clamping claw body, the clamping seat is connected to the moving part, the clamping claw body is provided with an adsorption channel, the adsorption area is provided on the clamping claw body, and the adsorption channel is connected to the adsorption area.

[0013] The wafer clamping mechanism further includes a locking mechanism. The clamping seat is slidably connected to the movable member. After the clamping seat moves to a desired position relative to the movable member, the locking mechanism locks the clamping claw and the movable member.

[0014] The middle portion of the adsorption channel passes through the side of the clamp body away from the adsorption area, and the clamping seat covers the middle portion of the adsorption channel;

[0015] The movable member is provided with a threading channel running through the upper and lower parts, the inner end of the threading channel is located in the clamping bin, and the side of the movable member is provided with a threading opening, which is communicated with the threading channel.

[0016] Among them, the clamping bin is installed with at least two installation shafts, the dust shield is sleeved on the installation shaft, both ends of the dust shield are connected to the moving part, the clamping drive mechanism is driven and connected to the clamping drive frame, and the clamping drive frame is connected to the moving part.

[0017] Wherein, the clamping drive frame is arranged on the inner side of the dust shield, the clamping drive frame is provided with a clamping accommodating groove, and the dust shield is arranged on the clamping accommodating groove.

[0018] Beneficial effects of the utility model:

[0019] In actual application, the clamping drive mechanism drives the clamping claws close to the wafer, so that the wafer is adsorbed in the adsorption area by negative pressure, and the wafer is stably adsorbed; after the wafer is clamped, the clamping drive mechanism drives the clamping claws close to the clamping bin, and drives the clamping claws and wafer to move to the top or bottom of the clamping bin, and moves the wafer out of the wafer loading space, realizing wafer clamping in a narrow space. The clamping bin can move smoothly in the wafer loading space, thereby improving wafer loading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the explosion structure of the wafer clamping mechanism Figure 1 .

[0021] Figure 2 Schematic diagram of the explosion structure of the wafer clamping mechanism Figure 2 .

[0022] Figure 3 It is a structural diagram of the lifting mechanism, the clamping chamber and the acquisition camera.

[0023] Figure 4 Schematic diagram of the explosion structure of the gripping claw.

[0024] Figure 5 Schematic diagram of the fracture structure of the gripping claw.

[0025] Figure 6 It is a schematic diagram of the explosion structure with locking mechanism, clamping claws and moving parts.

[0026] Figure 7 It is a schematic diagram of the explosion structure with a clamping claw body, an adsorption channel and a clamping seat.

[0027] Figure 8 Schematic diagram of the three-dimensional structure of the moving parts.

[0028] Figure 9 It is a structural cross-sectional view of the moving parts.

[0029] Figure 10 It is a schematic diagram of the three-dimensional structure of the clamping bin, mounting shaft, dust shield, moving parts and clamping drive mechanism.

[0030] Figure 11 It is a schematic diagram of the three-dimensional structure of the clamping drive frame, dust shield and moving parts. DETAILED DESCRIPTION

[0031] To facilitate understanding by those skilled in the art, the present invention is further described below with reference to examples and drawings. Specific implementation methods of the present invention will be described below. It should be noted that in the specific description of these implementation methods, for the sake of clarity and clarity, it is impossible for this specification to provide a detailed description of all features of the actual implementation methods.

[0032] refer to Figures 1 to 11 As shown, the utility model provides a wafer clamping mechanism, including a clamping bin 1, a clamping claw 2 connected to the clamping bin 1, and a clamping drive mechanism 300 driven and connected to the clamping claw 2, wherein the clamping claw 2 is provided with an adsorption area 201, and the clamping drive mechanism 300 drives the clamping claw 2 to move so that the clamping claw 2 approaches or moves away from the clamping bin 1.

[0033] refer to Figure 1 、 2As shown, in actual application, the clamping drive mechanism 300 is a linear motor. The clamping drive mechanism 300 drives the clamping claw 2 to approach the wafer, so that the inside and outside of the adsorption area 201 are connected to negative pressure, and the adsorption area 201 generates negative pressure. The wafer is adsorbed in the adsorption area 201 by the negative pressure, and the wafer is stably adsorbed; after the wafer is clamped, the clamping drive mechanism 300 drives the clamping claw 2 to approach the clamping bin 1, and drives the clamping claw 2 and the wafer to move to the top or bottom of the clamping bin 1, and moves the wafer out of the wafer loading space, thereby realizing wafer clamping in a narrow space. The clamping bin 1 can move smoothly in the wafer loading space, thereby improving the wafer loading efficiency.

[0034] refer to Figure 2 As shown, in this embodiment, the clamping bin 1 is provided with an active space 101, the clamping claw 2 is connected to a movable part 3, the clamping claw 2 is slidably connected to the active space 101 through the movable part 3, the movable part 3 is connected to a dust shield 4, and the clamping drive mechanism 300 is driven and connected to the movable part 3; the clamping drive mechanism 300 drives the movable part 3 to move back and forth in the active space 101, so that the dust shield 4 blocks the active space 101.

[0035] In actual application, the clamping drive mechanism 300 drives the movable part 3 to move, so that the clamping claw 2 switches between clamping and resetting. When not grabbing the wafer, the clamping claw 2 moves to the top or bottom of the clamping bin 1, saving space; when the movable part 3 moves, it drives the dust shield 4 to block the active space 101, effectively blocking the gap between the active space 101 and the movable part 3, preventing dust from entering the clamping bin 1, and reducing the impact of dust on the clamping bin 1.

[0036] refer to Figure 3 As shown, in this embodiment, the wafer clamping mechanism also includes a lifting mechanism 5, which is driven by the clamping chamber 1. The lifting mechanism 5 drives the clamping chamber 1 to move up and down, so that the clamping claws 2 move up and down. The clamping chamber 1 is equipped with a collection camera 102 for photographing wafers.

[0037] In actual application, the lifting mechanism 5 is a screw motor module, a cylinder or an electric cylinder. The lifting mechanism 5 drives the clamping bin 1 to move up and down, and can take and place wafers of different heights. It has a wide range of applications. The acquisition camera 102 is set to follow the clamping claw 2 to shoot the wafer and obtain the wafer status in real time.

[0038] refer to Figure 4 As shown, in this embodiment, the clamping claw 2 includes a clamping claw body 21 and a clamping seat 22 connected to the clamping claw body 21, the clamping seat 22 is connected to the moving part 3, the clamping claw body 21 is provided with an adsorption channel 211, the adsorption area 201 is provided on the clamping claw body 21, and the adsorption channel 211 is connected to the adsorption area 201.

[0039] refer to Figure 4 、5 As shown, in actual application, the outer end of the adsorption channel 211 is connected to the negative pressure, and the negative pressure fills the adsorption channel 211 and the adsorption area 201. The wafer is adsorbed by the negative pressure of the adsorption area 201, and the negative pressure access point is set at the outer end of the adsorption channel 211. The negative pressure is connected to the outer end of the adsorption channel 211 to achieve adsorption of the wafer, thereby meeting the wafer adsorption requirements in narrow spaces.

[0040] refer to Figure 6 As shown, in this embodiment, the wafer clamping mechanism also includes a locking mechanism 6, and the clamping seat 22 is slidably connected to the moving part 3. After the clamping seat 22 moves to the desired position relative to the moving part 3, the locking mechanism 6 locks the clamping claw 2 and the moving part 3.

[0041] In actual application, the locking mechanism 6 adopts a screw and a nut. After the installation position of the clamping seat 22 on the moving part 3 is determined, the screw is passed through the clamping jaw body 21, the clamping seat 22 and the moving part 3, and the nut is rotated to lock the clamping jaw body 21, the clamping seat 22 and the moving part 3. It is easy to disassemble and assemble, and it is convenient to adjust the relative installation position between the clamping jaw 2 and the moving part 3.

[0042] refer to Figure 7 As shown, in this embodiment, the middle part of the adsorption channel 211 passes through the side of the clamping jaw body 21 away from the adsorption area 201, and the clamping seat 22 covers the middle part of the adsorption channel 211. After the clamping jaw body 21 is separated from the clamping seat 22, the adsorption channel 211 can be cleaned directly, which is conducive to cleaning and maintenance of the adsorption channel 211 and improving the use quality of the adsorption channel 211.

[0043] refer to Figure 8 As shown, the movable member 3 is provided with a threading channel 31 running through from top to bottom, the inner end of the threading channel 31 is located in the clamping bin 1, and a threading opening 32 is provided on the side of the movable member 3, and the threading opening 32 is communicated with the threading channel 31; Figure 8 、 9 As shown, in actual application, the open end of the adsorption channel 211 is connected to the negative pressure joint, and the relevant pipelines used for connecting the negative pressure joint are extended into the clamping bin 1 along the threading channel 31 and the threading port 32. When the movable part 3 moves relative to the clamping bin 1, the pipeline is passed between the threading channel 31 and the threading port 32. The pipeline is clearly arranged to prevent the pipeline from being entangled when the movable part 2 moves, and it is convenient to repair and detect the pipeline.

[0044] refer to Figure 10 As shown, in this embodiment, the clamping bin 1 is installed with at least two mounting shafts 103, the dust shield 4 is sleeved on the mounting shaft 103, both ends of the dust shield 4 are connected to the moving part 3, the clamping drive mechanism 300 is driven and connected to the clamping drive frame 310, and the clamping drive frame 310 is connected to the moving part 3.

[0045] refer to Figure 1 、 10 As shown, in actual application, the clamping drive mechanism 300 drives the clamping drive frame 310 to move, and drives the moving part 3 and the dust shield 4 to move. Specifically, the dust shield 4 is made of PE100-3 material and the cleanliness can reach Class 1. The dust shield 4 is supported by the mounting shaft 103 to ensure that the dust shield 4 stably blocks the activity space 101.

[0046] refer to Figure 11 As shown, in this embodiment, the clamping drive frame 310 is arranged on the inner side of the dust shield 4, the clamping drive frame 310 is provided with a clamping accommodating groove 311, and the dust shield 4 is arranged in the clamping accommodating groove 311, which saves space and has a compact structure.

[0047] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention is disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the above-disclosed technical contents without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention, which do not depart from the content of the technical solution of the present invention, are within the scope of the technical solution of the present invention.

Claims

1. A wafer clamping mechanism, characterized in that: The invention comprises a clamping bin (1), a clamping claw (2) connected to the clamping bin (1), and a clamping drive mechanism (300) connected to the clamping claw (2), wherein the clamping claw (2) is provided with an adsorption area (201), and the clamping drive mechanism (300) drives the clamping claw (2) to move so that the clamping claw (2) approaches or moves away from the clamping bin (1); When clamping a wafer, the clamping drive mechanism (300) drives the clamping claw (2) to approach the wafer, and the wafer is adsorbed on the adsorption area (201) by negative pressure; After the wafer is clamped, the clamping drive mechanism (300) drives the clamping claw (2) to approach the clamping bin (1), so that the clamping claw (2) moves to the top or bottom of the clamping bin (1).

2. The wafer clamping mechanism according to claim 1, characterized in that: The clamping bin (1) is provided with an active space (101), the clamping claw (2) is connected to a moving part (3), the clamping claw (2) is slidably connected to the active space (101) via the moving part (3), the moving part (3) is connected to a dust shield (4), and the clamping drive mechanism (300) is drivingly connected to the moving part (3); The clamping drive mechanism (300) drives the moving part (3) to move back and forth in the activity space (101), so that the dust shielding part (4) blocks the activity space (101).

3. The wafer clamping mechanism according to claim 1, wherein: The wafer clamping mechanism further comprises a lifting mechanism (5), wherein the lifting mechanism (5) is drivingly connected to the clamping chamber (1), and the lifting mechanism (5) drives the clamping chamber (1) to move up and down, so that the clamping claws (2) move up and down, and the clamping chamber (1) is equipped with a collection camera (102) for photographing wafers.

4. The wafer clamping mechanism according to claim 2, characterized in that: The clamping claw (2) comprises a clamping claw body (21) and a clamping seat (22) connected to the clamping claw body (21); the clamping seat (22) is connected to the moving part (3); the clamping claw body (21) is provided with an adsorption channel (211); the adsorption area (201) is provided on the clamping claw body (21); and the adsorption channel (211) is communicated with the adsorption area (201).

5. The wafer clamping mechanism according to claim 4, characterized in that: The wafer clamping mechanism further includes a locking mechanism (6), wherein the clamping seat (22) is slidably connected to the movable member (3), and after the clamping seat (22) moves to a desired position relative to the movable member (3), the locking mechanism (6) locks the clamping claw (2) and the movable member (3).

6. The wafer clamping mechanism according to claim 5, characterized in that: The middle portion of the adsorption channel (211) passes through the side of the clamp body (21) facing away from the adsorption area (201), and the clamping seat (22) covers the middle portion of the adsorption channel (211); The movable member (3) is provided with a threading channel (31) running through it from top to bottom, the inner end of the threading channel (31) is located in the clamping bin (1), and a threading opening (32) is provided on the side of the movable member (3), and the threading opening (32) is communicated with the threading channel (31).

7. The wafer clamping mechanism according to claim 2, characterized in that: The clamping bin (1) is installed with at least two installation shafts (103), the dust shield (4) is sleeved on the installation shafts (103), both ends of the dust shield (4) are connected to the moving part (3), the clamping drive mechanism (300) is driven and connected to the clamping drive frame (310), and the clamping drive frame (310) is connected to the moving part (3).

8. The wafer clamping mechanism according to claim 7, characterized in that: The clamping drive frame (310) is arranged on the inner side of the dust shield (4), the clamping drive frame (310) is provided with a clamping accommodating groove (311), and the dust shield (4) is arranged on the clamping accommodating groove (311).

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