PCB (Printed Circuit Board) for improving mounting levelness and planeness of large-size chip

Abstract

The utility model discloses a PCB for improving the mounting levelness and planeness of a large-size chip, and the PCB comprises a PCB which is horizontally disposed and is provided with a chip mounting region; the ink layer of the PCB at the chip mounting area adopts a distributed ink structure; the distributed printing ink structure comprises a plurality of printing ink supporting points which are arranged at intervals, and the intervals among the printing ink supporting points are coated with self-adaptive dispensing layers; according to the utility model, the chip surface levelness after the oversized chips are mounted and the chip surface planeness when a plurality of oversized chips are mounted at the same time can be effectively improved, and the mounting requirements of high levelness and planeness of the chips can be met; expensive or precise chip mounting equipment and high-performance glue are not needed, the convenience and applicability of chip mounting are improved, the mounting cost is reduced, the mounting efficiency is improved, and the product performance is greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of chip mounting equipment, in particular to a PCB board capable of improving the levelness and flatness of large-size chip mounting. Background Art

[0002] At present, the mounting method for super-large size chips (chips with length*width ≥35*35mm) is: draw the following lines below the chip. Figure 1 The glue shape shown is used, and then the chip is directly mounted. This method is certainly simple, but when the chip mounting levelness is required to be relatively high, more expensive dispensing equipment and mounting equipment are required. Such equipment is not only complex and sophisticated in structure, but also difficult to use in software, and is not suitable for all chip mounting scenarios. Even with the above equipment, it is difficult to control the surface levelness of oversized chips after mounting to within 35um. Utility Model Content

[0003] The main purpose of the present invention is to provide a PCB board that improves the levelness and flatness of large-size chip mounting, thereby solving all or one of the above-mentioned problems existing in the prior art.

[0004] To solve the above technical problems, the present invention adopts a technical solution: to provide a PCB board that improves the levelness and flatness of large-size chip mounting, including:

[0005] The PCB is arranged horizontally and has a chip mounting area on the PCB; the ink layer of the PCB in the chip mounting area adopts a dispersed ink structure;

[0006] The dispersed ink structure includes a plurality of ink support points arranged at intervals, and an adaptive dispensing layer is coated at intervals between the plurality of ink support points.

[0007] In one improved embodiment, the chip mounting area is provided on the upper surface of the PCB, and the upper surface of the PCB is further provided with an SMT area.

[0008] In one of the improved embodiments, the copper surface layer on the PCB located below the dispersed ink structure is a copper surface that has been roughened by laser.

[0009] In one improved embodiment, the ink support point is a columnar ink having a thickness;

[0010] The plurality of columnar inks are evenly distributed at equal intervals.

[0011] In one improved embodiment, at the chip mounting area, the top view shape of the columnar ink includes any one or more of a circle, a triangle, a rectangle and a cross.

[0012] In one improved embodiment, the thickness of the columnar ink ranges from 35 to 55 μm;

[0013] The thickness of the columnar inks ranges from 5 to 10 μm.

[0014] In one improved embodiment, the adaptive dispensing layer includes: a plurality of sub-dispensing layers;

[0015] The plurality of sub-glue layers are evenly coated at intervals between the plurality of ink supporting points.

[0016] In one improved embodiment, the sub-glue layer is in the shape of a long column composed of a plurality of irregularly shaped glue dots;

[0017] The irregular shape includes: a water drop shape.

[0018] In one improved embodiment, the number of the columnar inks and the number of the sub-glue layers are proportional to the size of the chip to be mounted.

[0019] In one improved embodiment, the number of the chip mounting area is at least one.

[0020] The beneficial effects of the utility model are:

[0021] The utility model discloses a PCB board for improving the levelness and flatness of large-size chip mounting, which can effectively improve the chip surface levelness after the ultra-large-size chip is mounted, as well as the chip surface flatness when multiple ultra-large-size chips are mounted simultaneously, and can meet the mounting requirements of chips with high levelness and flatness. It does not require expensive or sophisticated chip mounting equipment and high-performance glue, improves the convenience and applicability of chip mounting, reduces mounting costs, improves mounting efficiency, and significantly improves product performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the top view of the chip mounting area in the existing mounting solution in the background art;

[0023] Figure 2 This is a front view structural diagram of a PCB board for improving the levelness and flatness of large-size chip mounting according to an embodiment of the present utility model;

[0024] Figure 3 This is a schematic diagram of the front view of a PCB board after chip mounting, which improves the levelness and flatness of large-size chip mounting according to an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of a PCB board in a side view when not coated with glue, which improves the levelness and flatness of large-size chip mounting in an embodiment of the present invention;

[0026] Figure 5 This is a schematic top view of a PCB board for improving the levelness and flatness of large-size chip mounting in an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of a top view of a PCB board before gluing, which is used to improve the levelness and flatness of large-size chip mounting in an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of another cross-sectional shape of the columnar ink in a PCB board for improving the levelness and flatness of large-size chip mounting in an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of another arrangement of the dispersed ink structure in a PCB board for improving the levelness and flatness of large-size chip mounting in an embodiment of the present invention;

[0030] The markings of the components in the accompanying drawings are as follows:

[0031] 1. PCB; 2. SMT area; 3. Chip mounting area; 4. Copper surface layer; 5. Distributed ink structure; 6. Adaptive dispensing layer; 7. Sub-glue layer; 8. Glue cross-section shape; 9. Glue; 10. Chip; 11. Ink support point. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0036] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0038] See also Figures 1 to 8 , the embodiments of the present utility model include:

[0039] A PCB board for improving the levelness and flatness of large-size chip mounting, comprising: a PCB 1, arranged horizontally, with a chip mounting area 3 provided on its upper surface;

[0040] In one embodiment, one side of the PCB 1 is the SMT area 2 and the other side is the chip mounting area 3;

[0041] Optionally, the size and specific position of the chip mounting area 3 are not limited and can be set at any position of the PCB according to specific usage requirements and PCB design requirements. The improvement of the present invention lies in the improvement of the PCB board structure at the chip mounting area 3.

[0042] In one of the improved methods, the ink layer of the PCB board at the chip mounting area 3 adopts a dispersed ink structure 5. The dispersed ink structure 5 is composed of a plurality of spaced-apart columns of ink having a certain thickness. The columns of ink serve as ink support points 11. The columns of ink can support the chip and control the flatness of the chip mounting. At the same time, they can also support the stress distribution and voids caused by glue curing, thereby improving the glue coverage.

[0043] Optionally, at the chip mounting area 3, the top view shape of the columnar ink is any one or more of a circle, a triangle, a rectangle and a cross;

[0044] Optionally, the thickness of each columnar ink is 35~55um, and the ink thickness range is 5~10um, such as Figure 4 As shown; In addition, Figure 4 The ink height in the middle is only an example and is not a limitation.

[0045] Optionally, the composite layer includes but is not limited to being coated on the chip mounting area 3 of the PCB using ink coating equipment used in the production of medical or communication HDI PCB boards, and then being achieved by etching in a specific shape, thereby improving the flatness and glue thickness consistency after chip mounting;

[0046] Optionally, the columnar ink includes but is not limited to the PSR-4000 series ink of the Japanese TAIYO brand, thereby ensuring high-precision etching and roller coating quality;

[0047] Optionally, the number of columnar inks includes but is not limited to 9 (the arrangement diagram of other columnar inks is as follows Figure 8 The number of columnar inks can also be 2, 4, 5 or 8, depending on the specific situation). The 9 columnar inks are evenly and equidistantly distributed on the copper surface layer 4 of the PCB board, and the spacing between the columnar inks is the aforementioned spacing;

[0048] In one of the improved methods, an adaptive dispensing layer 6 is coated at the intervals between the ink supporting points 11;

[0049] Optionally, the adaptive dispensing layer 6 is formed of a plurality of sub-dispensing shapes of arbitrary shapes, and is applied at the intervals between 9 (following the above example) columnar inks;

[0050] Optionally, the sub-glue shape can be a long cylindrical glue shape, each sub-glue shape is composed of a number of irregular three-dimensional glue dots (such as water drop-shaped glue dots), and the sub-glue shape is set between each group of adjacent cylindrical inks. The glue amount of the adaptive glue layer 6 is sufficient to ensure that the chip is fully fitted without overflowing the outer glue layer of the chip.

[0051] In one of the improved methods, in order to further enhance the bonding strength of the PCB board to the glue and reduce the probability of interface delamination, the copper surface layer 4 of the PCB board below the dispersed ink structure 5 is laser roughened after ink etching.

[0052] It should be noted that the super-large size chip used in the present invention refers to a chip with a chip size of length*width≥35*35mm.

[0053] As a preferred embodiment of the present invention, the manufacturing method of the present invention is as follows: first, using an ink coating device, a dry film with a thickness of 35-55um is covered on the chip mounting area 3 of the PCB, forming an ink coverage surface with an ink thickness range of 5-10um and an ink thickness of 30-50um on the PCB surface; then, according to the requirements of the etching pattern, a specific ink pattern is etched on the chip mounting area 3 of the PCB; then, a laser is used to roughen the copper surface of the chip mounting area 3, at which time the remaining ink layer forms a number of columnar inks; then, a chip mounter is used to draw a glue shape of any shape between the columnar inks in the chip mounting area 3, and the amount of glue is controlled, and then mounting is started; the chip mounter is used to place the oversized chip in the required position using a pressure mounting mode; when the mounting pressure increases but the Z-direction position of the chip does not change, it is judged that the chip has completed ultra-high horizontal bonding in the glue and ink layers, and then the present invention is sent to an oven to cure the glue, completely fix the chip, and complete the entire mounting process.

[0054] It should be noted that all the above examples are only for explaining the present invention and are not intended to limit the scope of protection of the present invention.

[0055] In summary, the PCB board of the present invention can effectively improve the chip surface levelness after the oversized chip is mounted, as well as the chip surface flatness when multiple oversized chips are mounted simultaneously, and can meet the chip mounting requirements of high levelness and high flatness; it does not require expensive or sophisticated chip mounting equipment and high-performance glue, improves the convenience and applicability of chip mounting, reduces mounting costs, improves mounting efficiency, and significantly improves product performance.

[0056] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure made using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A PCB board for improving the levelness and flatness of large-size chip mounting, characterized in that: include: A PCB (1), wherein the PCB (1) is arranged horizontally and a chip mounting area (3) is provided on the PCB (1); the ink layer of the PCB (1) at the chip mounting area (3) adopts a dispersed ink structure (5); The dispersed ink structure (5) comprises a plurality of ink support points (11) arranged at intervals, and an adaptive dispensing layer (6) is applied at intervals between the plurality of ink support points (11).

2. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 1, characterized in that: The chip mounting area (3) is arranged on the upper surface of the PCB (1), and the upper surface of the PCB (1) is also provided with an SMT area (2).

3. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 1, characterized in that: On the PCB (1), the copper surface layer (4) located below the dispersed ink structure (5) is a copper surface that has been roughened by laser.

4. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 1, characterized in that: The ink supporting point (11) is a columnar ink with thickness; The plurality of columnar inks are evenly distributed at equal intervals.

5. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 4, characterized in that: At the chip mounting area (3), the top view shape of the columnar ink includes any one or more of a circle, a triangle, a rectangle and a cross.

6. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 4, characterized in that: The thickness of the columnar ink ranges from 35 to 55 μm. The thickness of the columnar inks ranges from 5 to 10 μm.

7. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 4, characterized in that: The adaptive dispensing layer (6) comprises: a plurality of sub-glue layers (7); The plurality of sub-glue layers (7) are evenly coated at intervals between the plurality of ink support points (11).

8. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 7, characterized in that: The number of the columnar inks and the number of the sub-glue layers (7) are proportional to the size of the chip to be mounted.

9. The PCB board for improving the levelness and flatness of large-size chip mounting according to claim 1, characterized in that: The number of the chip mounting area (3) is at least one.

Images