Flexible plate rubberizing and pressing mechanism

Abstract

The utility model relates to the technical field of production equipment of flexible printed circuit boards, in particular to a flexible board rubberizing and pressing mechanism which comprises a jig assembly and a workbench, the workbench is divided into a rubberizing area and a material transferring area, and the jig assembly is transferred between the rubberizing area and the material transferring area through a transferring mechanism; the jig assembly comprises a jig plate, a plurality of profiling grooves used for bearing materials are distributed in the surface of the top of the jig plate, an air path connector connected with a negative pressure device is arranged at the bottom of the material transferring area, air path grooves communicated with the profiling grooves are formed in the bottom of the jig plate, and the materials are sucked into the profiling grooves through negative pressure of the negative pressure device. The profiling groove is formed in the jig plate, the negative pressure gas circuit communicating with the profiling groove is arranged at the bottom of the jig plate, the positioning needles capable of ascending and descending are arranged around the profiling groove, feeding positioning is conducted on the flexible plate, the flexible plate is limited in the rubberizing and pressing operation process, material deviation is prevented, and the gum and the flexible plate are bonded more firmly after being pressed.

Description

Technical Field

[0001] The utility model relates to the technical field of production equipment for flexible printed circuit boards, in particular to a flexible board gluing and pressing mechanism. Background Art

[0002] Flexible printed circuit board (FPCB) is a highly reliable and flexible printed circuit board made of polyimide or polyester film. It is also called FPCB for short. It has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in many products such as mobile phones, laptops, PDAs, digital cameras, LCMs, etc.

[0003] In the current production process for reinforcing sheets used in flexible boards, adhesive lamination is usually performed first and then stamping is performed. During the adhesive lamination operation, the flexible board is usually placed on a jig and pressed by the upper mold to firmly bond the flexible board to the adhesive backing.

[0004] However, a single-piece flexo board is small in size and light in weight. When multiple flexo boards are placed on a jig, they are prone to inaccurate positioning and easy deviation during pressing. The adhesive backing is not firmly attached or the adhesive position is offset, which will cause glue overflow after the flexo board and the reinforcement sheet are attached, affecting the appearance and even causing functional problems of the flexo board, resulting in the flexo board being scrapped.

[0005] Based on the problems in the prior art, the utility model provides a flexible plate gluing and pressing mechanism. Utility Model Content

[0006] The utility model aims to provide a flexible board gluing and pressing mechanism to solve the technical problem in the prior art that the flexible board is not accurately positioned when the back adhesive is pasted on the flexible board, resulting in deviation in the gluing and pressing operations.

[0007] The technical solution of the utility model is: a flexible board gluing and pressing mechanism, comprising a jig assembly and a workbench, wherein the workbench is divided into a gluing area and a material transfer area, materials are loaded and unloaded in the material transfer area, the jig assembly is transferred between the gluing area and the material transfer area by a transfer mechanism, and the backing adhesive is pressed on the material in the gluing area;

[0008] The jig assembly includes a jig plate, and a plurality of profiling grooves for carrying materials are distributed on the top surface of the jig plate. An air path joint connected to a negative pressure device is provided at the bottom of the material transfer area. An air path groove connected to the profiling groove is opened at the bottom of the jig plate, and the material is negatively sucked into the profiling groove by negative pressure suction through the negative pressure device.

[0009] Preferably, the jig plate is mounted on the transfer mechanism via a mounting plate, and the mounting plate is fixed to the jig plate at the top in a stacked manner; a limit plate and a lifting member are mounted on the bottom of the jig plate, and the limit plate is fixed to the support plate in a stacked manner and is fixedly connected to the lifting member via the support plate;

[0010] A number of positioning pins are arranged on the top of the limiting plate, and the positioning pins extend through and protrude from the surface of the jig plate; the positioning holes on the sheet-shaped material are correspondingly fitted on the positioning pins, and the supporting plate and the limiting plate are driven up and down by the lifting member, thereby pushing or withdrawing the positioning pins to place or unload the material.

[0011] Preferably, the limiting plate and the supporting plate are embedded in the jig plate and the mounting plate, and a material area on the profiling groove is provided facing the jig plate.

[0012] Preferably, an operating groove is provided outside the material area, and a redundant tear-off label is provided on the sheet-shaped material, and the tear-off label is suspended and overlapped on the notch of the operating groove.

[0013] Preferably, an upper template and an upper driving member are provided above the glue pressing area, and the upper driving member drives the upper template to rise and fall so as to press the material downward.

[0014] Preferably, the transfer mechanism is provided using a linear module.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] The present application provides a profiling groove on the jig plate, and provides a negative pressure air path connected to the profiling groove at the bottom of the jig plate, and provides a positioning pin that can be raised and lowered around the profiling groove to position the flexible board for loading, limit the position of the flexible board during the gluing and pressing operations to prevent material deviation, and firmly bond the back glue to the flexible board after pressing. Since the back glue and the flexible board have been pressed together, the possibility of glue overflow during the subsequent bonding of the flexible board to the reinforcement sheet is reduced, thereby improving the appearance and quality, thereby reducing the scrapping of the flexible board caused by glue overflow during production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the flexible plate gluing mechanism of the present invention;

[0019] Figure 2 This is a schematic diagram of the partial structure of the lifting member lifting the positioning pin of the utility model;

[0020] Figure 3 It is a schematic diagram of the partial structure of the workbench surface of the utility model;

[0021] Figure 4 This is a schematic diagram of the partial explosion structure of the fixture assembly of the present invention;

[0022] Figure 5This is a schematic diagram of the partial structure of the material area on the surface of the jig plate of the present invention;

[0023] Figure 6 This is a structural diagram of the air path groove at the bottom of the fixture plate of the utility model;

[0024] Figure 7 This is a partial structural diagram of the upper mold assembly of the present invention;

[0025] Among them: 1. Fixture components;

[0026] 11. Jig plate, 12. Mounting plate, 13. Limit plate, 14. Support plate, 15. Lifting piece, 16. Positioning pin;

[0027] 101, profiling slot, 102, air path slot, 103, operation slot;

[0028] 2. Workbench;

[0029] 21. Gluing area, 22. Material transfer area, 51. Upper template, 52. Upper driving part;

[0030] 3. Transfer mechanism; 4. Air line connector; 5. Upper mold assembly; 6. Easy-tear label. DETAILED DESCRIPTION

[0031] The following is a further detailed description of the present invention in conjunction with specific embodiments:

[0032] To facilitate understanding, let's first explain the application scenario of this application. Usually, a flexible board (flexible circuit board, generally in sheet form) is loaded onto a jig, and the upper mold is pressed together to firmly bond the flexible board to the adhesive backing. However, a one-piece flexible board is small in size and light in weight. When multiple flexible boards are placed on the jig board, it is easy to position them inaccurately. The adhesive backing is one-piece, and multiple pieces of one-piece adhesive backing are covered and pasted on the flexible board surface on the jig board. There are many pieces of adhesive backing, and the adhesive positioning is inaccurate, which is more likely to cause pressing deviation and adhesive overflow. This application uses a combination of negative pressure air circuit and positioning pin limit groove to limit the position of the flexible board.

[0033] like Figure 1 As shown, a flexible board gluing and pressing mechanism includes a jig assembly 1 and a workbench 2, and an upper mold assembly 5 is arranged above the jig assembly 1. Figure 3 The workbench 2 is divided into a glue pressing area 21 and a material transfer area 22. The material is loaded onto the jig plate 11 of the jig assembly 1 in the material transfer area 22. The jig assembly 1 is transferred between the glue pressing area 21 and the material transfer area 22 through the transfer mechanism 3. The back glue is pressed onto the material in the glue pressing area 21, and then moved to the material transfer area 22 for unloading.

[0034] The transfer mechanism 3 is configured using a linear module. The fixture plate 11 is mounted on the transfer mechanism 3 through a mounting plate 12. The mounting plate 12 and the top fixture plate 11 are stacked up and down. The area of ​​the top fixture plate 11 is not larger than the supporting area of ​​the bottom mounting plate 12.

[0035] The material is in sheet form and is laid flat on the jig plate 11. Since the gluing and pressing are completed in the local material area on the jig plate 11, in order to accurately position the material, a positioning pin 16 is set on the jig plate 11. Considering the contact pressing operation, the positioning pin is set to a liftable and retractable form.

[0036] Furthermore, in order to improve the positioning effect, a plurality of contoured grooves 101 for carrying materials are distributed on the top surface of the fixture plate 11, such as Figure 5 A schematic diagram of sheet materials being placed on a jig plate 11 is provided. An air path connector 4 for connecting to a negative pressure device is provided at the bottom of the transfer area 22. An air path groove 102 communicating with the profiling groove 101 is provided at the bottom of the jig plate 11. Figure 2 Combined with attachment Figure 4 The negative pressure device (in the attached figure) is used to suck the material into the profiling groove 101 under negative pressure. The shape and structure of the air path groove 102 on the bottom of the fixture plate 11 refer to the attached figure. Figure 6 As shown, multiple contoured grooves 101 in the same row use connected gas path grooves 102.

[0037] The positioning needle 16, the profiling groove 101 and the negative pressure air path at the bottom of the profiling groove 101 can jointly accurately position and limit the material to prevent the material from moving during gluing and pressing.

[0038] Specifically, the positioning pins 16 are arranged around each profiling groove 101, and the positioning pins 16 are fixedly mounted on the limiting plate 13. The mounting plate 12, the fixture plate 11 and the sheet material are provided with corresponding positioning holes for the positioning pins 16 to be inserted and positioned. Figure 4 Combined with attachment Figure 2 The limiting plate 13 is fixedly connected to the lifting member 15 via the supporting plate 14. The limiting plate 13 and the supporting plate 14 are laminated and fixed together, and the entire assembly is embedded within the fixture plate 11 and the mounting plate 12. The lifting member 15 is fixedly connected to the mounting plate via a bracket. The limiting plate 13 and the supporting plate 14 are embedded directly in the material area on the fixture plate 11 where the contoured groove 101 is provided. A sealing strip (seal ring) is provided on the internal embedding edge to maintain the air path seal.

[0039] When loading the material in the transfer area 22, the positioning pin 16 is lifted upward and protrudes from the jig plate 11, and the sheet material is positioned on the positioning pin 16. Before the glue pressing area 21 presses the material, the lifting part 15 lowers the positioning pin 16 so that the material fits the bottom wall of the profiling groove 101 and is subjected to force.

[0040] Refer to the attached Figure 7The upper mold assembly 5 includes an upper mold plate 51 and an upper driving member 52 for driving the upper mold plate 51 to rise and fall. The upper driving member 52 adopts a telescopic cylinder. The bottom surface of the upper mold plate 51 is provided with a concave and convex silicone sheet. The protruding part is pressed against the gluing part on the material. After the material is glued and pressed, the jig plate 11 is moved to the transfer area 22 for unloading.

[0041] To facilitate access to materials and removal of the adhesive film, an operating slot 103 is provided outside the material area. A redundant easy-tear tab 6 is provided on the sheet material, suspended and overlapping the notch of the operating slot 103. The release paper, which carries the adhesive, can be attached to the flexible plate as a whole. The release paper can be removed after lamination or torn off before attachment. In this case, the tear tab 6 is an extra corner of the release paper.

[0042] When loading, gluing and pressing, the flexible board material is positioned and placed on the jig plate 11, pre-pressed in the glue pressing area 21 so that the flexible board fits the contoured groove 101, returned to the material transfer area 22 to load the back glue, and then transferred to the glue pressing area 21 again to press the back glue and the flexible board, and finally returned to the material transfer area 22 to unload.

[0043] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they are not intended to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A flexible board gluing and pressing mechanism, characterized in that: The jig assembly comprises a jig assembly and a workbench, wherein the workbench is divided into a glue pressing area and a material transfer area, materials are loaded and unloaded in the material transfer area, the jig assembly is transferred between the glue pressing area and the material transfer area by a transfer mechanism, and the adhesive is pressed onto the material in the glue pressing area; The jig assembly includes a jig plate, and a plurality of profiling grooves for carrying materials are distributed on the top surface of the jig plate. An air path joint connected to a negative pressure device is provided at the bottom of the material transfer area. An air path groove connected to the profiling groove is opened at the bottom of the jig plate, and the material is negatively sucked into the profiling groove by negative pressure suction through the negative pressure device.

2. The flexible board gluing and pressing mechanism according to claim 1, characterized in that: The jig plate is mounted on the transfer mechanism via a mounting plate, and the mounting plate is fixed to the top jig plate in a stacked manner; a limit plate and a lifting member are mounted on the bottom of the jig plate, and the limit plate is fixed to the support plate in a stacked manner and is fixedly connected to the lifting member via the support plate; A number of positioning pins are arranged on the top of the limiting plate, and the positioning pins extend through and protrude from the surface of the jig plate; the positioning holes on the sheet-shaped material are correspondingly fitted on the positioning pins, and the supporting plate and the limiting plate are driven up and down by the lifting member, thereby pushing or withdrawing the positioning pins to place or unload the material.

3. The flexible board gluing and pressing mechanism according to claim 2, characterized in that: The limiting plate and the supporting plate are embedded in the jig plate and the mounting plate and are directly opposite to the material area on the jig plate where the profiling groove is provided.

4. The flexible board gluing and pressing mechanism according to claim 3, characterized in that: An operating groove is arranged outside the material area, and a redundant easy-tear label is arranged on the sheet-shaped material, and the easy-tear label is suspended and overlapped on the notch of the operating groove.

5. The flexible board gluing and pressing mechanism according to claim 1, characterized in that: An upper template and an upper driving member are provided above the glue pressing area, and the upper driving member drives the upper template to rise and fall so as to press the material downward.

6. The flexible board gluing and pressing mechanism according to claim 1, characterized in that: The transfer mechanism adopts a linear module.

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