Double-channel heating device of BGA chip repair equipment

Abstract

The utility model relates to the technical field of chip processing, in particular to a double-channel heating device of BGA chip repair equipment. Comprising a mounting frame, a heating assembly, a diversion assembly and an adsorption pipe, the heating assembly is arranged on the mounting frame and comprises an air supply assembly and a heater which communicate with each other, and the air supply assembly is used for generating airflow to blow heat generated in the heater to form hot airflow; the flow guide assembly is arranged on the side, close to the heater, of the mounting frame, an air inlet and an air outlet are formed in the flow guide assembly, and the air inlet communicates with the heater; the adsorption pipe sequentially penetrates through the heating assembly and the flow guide assembly and extends out along the air outlet. The end, close to the air outlet, of the adsorption pipe is used for adsorbing the BGA chip. According to the structure, the heating assembly, the flow guide assembly and the adsorption pipe are integrated together, so that the BGA chip can be adsorbed and heated, the processing procedures are saved, the welding efficiency of the BGA chip and the PCB is improved, meanwhile, the size of the BGA chip repair equipment is reduced, and the BGA chip repair equipment is convenient to use and popularize.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a dual-channel heating device for BGA chip repair equipment. Background Art

[0002] BGA chip rework equipment can solder the chip to the PCB board to improve the soldering efficiency of the chip on the PCB board.

[0003] When using BGA chip rework equipment for chip soldering, the chip is typically sucked up using a suction tube and moved to the top of the PCB. A heater is then moved to the top of the PCB to heat the chip, melting the solder on the chip and soldering it to the PCB. This structural setup results in low efficiency during the production and processing of BGA chip rework equipment, and its overall size is large, hindering the use and promotion of automatic chip placement equipment. Utility Model Content

[0004] The technical problem to be solved by the embodiment of the present utility model is to provide a dual-channel heating device for BGA chip repair equipment to solve the problems in the prior art of low efficiency in the production and processing of automatic chip mounting equipment and a large overall size, which is not conducive to the use and promotion of automatic chip mounting equipment.

[0005] The utility model discloses a dual-channel heating device for BGA chip rework equipment, comprising: a mounting frame, a heating component, a flow guide component and an adsorption tube; the heating component is arranged on the mounting frame, comprising an air supply component and a heater that are interconnected, the air supply component is used to generate an air flow to blow the heat generated in the heater to form a hot air flow; the air supply component comprises a second shell, a first air blower and a second air blower, the second shell is arranged on the mounting frame, and a receiving space for a third opening and a fourth opening that are relatively arranged is formed on the second shell, the first air blower is arranged on the third opening, and the second air blower is arranged on the third opening. On the fourth opening, the heater is located between the first air blower and the second air blower and is connected to the accommodating space, the first air blower and the heater form a first channel, and the second air blower and the heater form a second channel; the guide component is provided on the side of the mounting frame close to the heater, and an air inlet and an air outlet are formed on the guide component, and the air inlet is connected to the heater; the adsorption tube is inserted into the mounting frame, passes through the heating component and the guide component in sequence and extends along the air outlet, and the end of the adsorption tube close to the air outlet is used for adsorbing the BGA chip.

[0006] Optionally, the heater includes a first shell, which is arranged on the mounting bracket, and the first shell forms a accommodating cavity having a first opening and a second opening. At least one heating plate is provided on the first shell, and the heating plate has a heating wire embedded therein. The airflow generated by the air supply assembly enters the accommodating cavity along the first opening, and after being heated by the heating plate, a hot airflow is generated, which is output along the second opening, and the second opening is connected to the air inlet.

[0007] Optionally, the air supply assembly includes a second shell, a first air supply and a second air supply, the second shell is arranged on the mounting bracket, and a storage space with a third opening and a fourth opening arranged opposite to each other is formed on the second shell, the first air supply is arranged on the third opening, and the second air supply is arranged on the fourth opening, and the heater is located between the first air supply and the second air supply and is connected to the storage space.

[0008] Optionally, a guide member is provided in the accommodating space, and a first guide surface and a second guide surface are formed on the guide member. The airflow generated by the first blower enters the heater through the first guide surface, and the airflow generated by the second blower enters the heater through the second guide surface.

[0009] Optionally, the air guide assembly includes: a first air guide shell and a second air guide shell that are interconnected, the air inlet is formed on the first air guide shell, the air outlet is formed on the second air guide shell, the first air guide shell is arranged on the mounting frame and is connected to the second opening of the heater; a connecting shell is arranged between the heater and the first air guide shell, a first air guide plate and a second air guide plate are arranged in the connecting shell, a plurality of first blades are formed on the first air guide plate, a plurality of second blades are formed on the second air guide plate, and the first blades and the second blades are arranged in opposite directions so that the hot air flow output by the heater flows along the inner wall of the first air guide shell.

[0010] Optionally, a first temperature probe is inserted on the first guide surface to detect the temperature of the hot air flow near one end of the heater near the first guide surface; a second temperature probe is inserted on the second guide surface to detect the temperature of the hot air flow near one end of the heater near the second guide surface.

[0011] Optionally, a third temperature probe is inserted into the first air guide housing, and the third temperature probe is used to detect the temperature of the hot air flow in the first air guide housing.

[0012] Optionally, the adsorption tube includes a connecting tube and a suction nozzle that are interconnected. The connecting tube is inserted into the mounting frame and passes through the second shell, the first shell, the first flow guide shell and the second flow guide shell in sequence. The suction nozzle extends from the air outlet. The connecting tube is connected to an external negative pressure device, and the suction nozzle is used to adsorb the BGA chip.

[0013] Optionally, the connecting pipe and the suction nozzle are detachably connected.

[0014] Optionally, the dual-channel heating device of the BGA chip rework equipment further includes: a driving assembly; the driving assembly includes a driving motor, a first gear disc and a second gear disc, the driving motor is arranged on the mounting frame, the first gear disc is arranged at the driving end of the driving motor, the first gear disc and the second gear disc are engaged, the second gear disc is arranged on the mounting frame and is rotatably connected to the mounting frame, the adsorption tube is inserted into the second gear disc, and the driving assembly is used to drive the adsorption tube to rotate in the circumferential direction.

[0015] Optionally, a first support frame and a second support frame are provided on the mounting frame, the adsorption tube is inserted into the first support frame and movably connected to the first support frame; a U-shaped opposing-beam photoelectric switch is provided on the second support frame, and a blocking disk, a first elastic member and a second elastic member are also sleeved on the connecting tube, the blocking disk is located between the first elastic member and the second elastic member, the first elastic member also abuts against the top of the first support frame, and the second elastic member also abuts against the second toothed disk; one end of the blocking disk is located in the U-shaped groove of the U-shaped opposing-beam photoelectric switch; a clamping groove is formed on the mounting frame, an annular connecting part is provided on one side of the second toothed disk, a bearing is provided on the outer periphery of the annular connecting part, and the bearing is provided in the clamping groove, a clamping platform is provided on the adsorption tube, a clamping groove is formed on the inner ring of the annular connecting part, the clamping platform is clamped into the clamping groove, and is provided at the bottom of the clamping groove.

[0016] Compared with the prior art, the beneficial effects of the dual-channel heating device for BGA chip rework equipment provided by the embodiment of the present invention are as follows: the setting of the mounting frame is used to provide a stable supporting environment for fixing the heating component and the guide component; the heating component includes an air supply component and a heater that are interconnected; the air supply component is used to generate an air flow to blow the heat generated in the heater to form a hot air flow; the hot air flow enters the guide component along the air inlet; the adsorption tube is inserted into the mounting frame and sequentially passes through the heating component and the guide component and extends along the air outlet; during operation, the end of the adsorption tube close to the air outlet is used to adsorb the BGA chip and place the BGA chip on the PC When the BGA chip is on the PCB board, the heating component generates a hot air flow. Specifically, the first blower and the heater form a first channel. The air flow generated by the first blower enters the storage space along the third opening and reaches the heater. The generated hot air flow flows along the guide component and is output from the air outlet, which can heat the BGA chip. The second blower and the heater form a second channel. The air flow generated by the second blower enters the storage space along the fourth opening 2 and reaches the heater. The generated hot air flow flows along the guide component and is output from the air outlet, which can heat the BGA chip, melt the solder on the BGA chip, and solder the BGA chip to the PCB board. The above dual-channel structure of the first channel and the second channel can ensure uniform heating temperature of the BGA chip, fast temperature compensation, and no damage to the BGA chip. The dual-channel heating device of the BGA chip rework equipment of the embodiment of the utility model integrates the heating component, the guide component and the adsorption tube, which can realize the adsorption and heating of the BGA chip. There is no need to successively cooperate the heating component and the adsorption tube to heat and adsorb the BGA chip, which saves processing steps, improves the welding efficiency of the BGA chip and the PCB board, and at the same time reduces the volume of the BGA chip rework equipment, which facilitates the use and promotion of the BGA chip rework equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0018] Figure 1 This is a schematic diagram of the overall structure of a dual-channel heating device for BGA chip rework equipment provided by an embodiment of the utility model;

[0019] Figure 2 This is a schematic structural diagram of a heating assembly provided by an embodiment of the present utility model;

[0020] Figure 3 This is one of the structural diagrams of the second housing provided by an embodiment of the present utility model;

[0021] Figure 4 This is the second structural diagram of the second shell provided by the embodiment of the present utility model;

[0022] Figure 5 This is a schematic structural diagram of a heater provided by an embodiment of the present utility model;

[0023] Figure 6 This is a structural diagram of a heater and a connecting shell provided by an embodiment of the present utility model;

[0024] Figure 7 This is a schematic diagram of the arrangement structure of the drive assembly provided by an embodiment of the utility model on the mounting frame;

[0025] Figure 8 This is a schematic diagram of the arrangement structure of the clamping slot provided in an embodiment of the present utility model;

[0026] Figure 9 This is a structural diagram of the adsorption tube and the second toothed disc provided in an embodiment of the present utility model;

[0027] Figure 10 It is a structural schematic diagram of the second toothed disc provided in an embodiment of the present utility model.

[0028] The reference numerals in the figures are:

[0029] 10. Mounting frame; 110. First support frame; 120. Second support frame; 121. U-shaped through-beam photoelectric switch; 130. Shielding plate; 140. First elastic member; 150. Second elastic member; 101. Snap-fit ​​groove; 160. Third support frame; 20. Heating assembly; 210. Air supply assembly; 211. Second housing; 212. First air blower; 213. Second air blower; 214. Air guide member; 2141. First air guide surface; 2142. Second air guide surface; 2101. Third opening; 2102. Fourth opening; 220. Heater; 221. First housing; 2211. Heating plate; 2201. First opening; 2202, second opening; 30, air guide assembly; 301, air inlet; 302, air outlet; 310, first air guide shell; 320, second air guide shell; 40, adsorption tube; 410, connecting tube; 420, suction nozzle; 510, first temperature probe; 520, second temperature probe; 530, third temperature probe; 610, driving motor; 620, first gear disc; 630, second gear disc; 631, annular connecting part; 6301, slot; 632, bearing; 70, connecting shell; 710, first air guide plate; 711, first blade; 720, second air guide plate; 721, second blade. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, a detailed description of the preferred embodiments of the present utility model will be given.

[0031] The present invention provides a dual-channel heating device for BGA chip rework equipment. Figures 1 to 5 As shown, it includes a mounting frame 10, a heating component 20, a guide component 30 and an adsorption tube 40. The heating component 20 is arranged on the mounting frame 10, and includes an air supply component 210 and a heater 220 that are interconnected. The air supply component 210 is used to generate an air flow to blow the heat generated in the heater 220 to form a hot air flow; the air supply component 210 includes a second shell 211, a first air blower 212 and a second air blower 213. The second shell 211 is arranged on the mounting frame 10, and the second shell 211 is formed with a third opening 2101 and a fourth opening 2102 that are relatively arranged to accommodate space. The first air blower 212 is arranged on the third opening 2101, and the second air blower 213 is arranged on the third opening 2101. On the fourth opening 2102, the heater 220 is located between the first air blower 212 and the second air blower 213 and is connected to the accommodating space. The first air blower and the heater form a first channel, and the second air blower and the heater form a second channel. The guide component 30 is provided on the side of the mounting frame 10 close to the heater 220. An air inlet 301 and an air outlet 302 are formed on the guide component 30, and the air inlet 301 is connected to the heater 220. The adsorption tube 40 is inserted into the mounting frame 10, passes through the heating component 20 and the guide component 30 in sequence and extends along the air outlet 302. The end of the adsorption tube 40 close to the air outlet 302 is used to adsorb the BGA chip.

[0032] In this embodiment, the mounting frame 10 is provided to provide a stable supporting environment for fixing the heating component 20, the guide component 30 and the adsorption tube 40. The heating component 20 includes an air supply component 210 and a heater 220 that are interconnected. The air supply component 210 is used to generate an air flow to blow the heat generated in the heater 220 to form a hot air flow; the hot air flow enters the guide component 30 along the air inlet 301; the adsorption tube 40 is inserted into the mounting frame and sequentially passes through the heating component 20 and the guide component 30 and extends along the air outlet 302. During operation, the end of the adsorption tube 40 close to the air outlet 302 is used to adsorb the BGA chip, and when the BGA chip is placed on the PCB board, the heating component 20 generates hot air when it works. Specifically, the first air blower 212 and the heater 220 form a first channel, the air flow generated by the operation of the first air blower 212 enters the accommodation space along the third opening 2101 and reaches the heater 220, and the generated hot air flow flows along the guide component 30 and is output from the air outlet 302, which can heat the BGA chip, and the second air blower 213 and the heater 220 form a second channel, the air flow generated by the operation of the second air blower 213 enters the accommodation space along the fourth opening 2102 and reaches the heater 220, and the generated hot air flow flows along the guide component 30 and is output from the air outlet 302, which can heat the BGA chip, melt the solder on the BGA chip, and allow the BGA chip to be soldered to the PCB board. The above dual-channel structure of the first channel and the second channel can make the heating temperature of the BGA chip uniform, the temperature compensation fast, and no damage to the BGA chip. The dual-channel heating device of the BGA chip rework equipment of this embodiment integrates the heating component 20, the guide component 30 and the adsorption tube 40, which can realize the adsorption and heating of the BGA chip. There is no need to successively cooperate the heating component 20 and the adsorption tube 40 to heat and adsorb the BGA chip, which saves processing steps, improves the welding efficiency of the BGA chip and the PCB board, and reduces the volume of the BGA chip rework equipment, facilitating the use and promotion of the BGA chip rework equipment.

[0033] In this embodiment, both the first air blower 212 and the second air blower 213 can be fans.

[0034] In this embodiment, the mounting frame 10 is mounted on a linear module. Driven by the linear module, the dual-channel heating device of the BGA chip rework equipment reaches above the PCB, thereby achieving soldering between the BGA chip and the PCB. The linear module can adjust the position of the dual-channel heating device in the BGA chip rework equipment along the X, Y, or Z directions, without further limitation.

[0035] As a preferred solution of this embodiment, refer to Figures 3 to 5The heater 220 includes a first shell 221, which is arranged on the mounting frame 10. The first shell 221 forms a accommodating cavity with a first opening 2201 and a second opening 2202. At least one heating plate 2211 is provided on the first shell 221, and a heating wire is embedded in the heating plate 2211. The airflow generated by the air supply component 210 enters the accommodating cavity along the first opening 2201, and is heated by the heating plate 2211 to generate a hot air flow, which is output along the second opening 2202. The second opening 2202 is connected to the air inlet 301.

[0036] Among them, a structural example of a heater 220 is given here, and the heater 220 includes a first shell 221. The heater 220 is fixed on the mounting frame 10. The first opening 2201 and the second opening 2202 formed on the first shell 221 are used to allow air flow to pass through. In actual operation, the first opening 2201 is used to communicate with the air supply component 210. The air flow enters the accommodating cavity along the first opening 2201, and the heating wire embedded in the heating plate 2211 generates and releases heat, heating the air flow in the accommodating cavity to generate hot air flow. The hot air flow is output along the second opening 2202, enters the guide component 30 through the air inlet 301, and under the action of the guide component 30, the hot air flow is transported to the BGA chip, thereby melting the solder on the BGA chip and welding it to the PCB board.

[0037] The arrangement and number of the heating plates 2211 are not specifically limited. Figure 5 There are four heating plates 2211 , which are arranged in pairs in opposite directions within the first shell 221 .

[0038] The arrangement of the heating wires in the heating plate 2211 is not specifically limited here. For example, the heating wires are arranged in an S-shaped structure on the heating plate 2211. The above arrangement can improve the heating efficiency of the heating wires.

[0039] As a preferred solution of this embodiment, refer to Figures 3 and 4 A guide member 214 is provided in the accommodating space, and a first guide surface 2141 and a second guide surface 2142 are formed on the guide member 214. The airflow generated by the first blower 212 enters the heater 220 through the first guide surface 2141, and the airflow generated by the second blower 213 enters the heater 220 through the second guide surface 2142.

[0040] Among them, the first guide surface 2141 and the second guide surface 2142 formed on the guide member 214 are used to adjust the flow direction of the airflow so that the airflow of the first blower 212 and the second blower 213 enters the heater 220 in an orderly manner, prevent interference between the airflows of the first blower 212 and the second blower 213, and improve the stability of the airflow.

[0041] As a preferred solution of this embodiment, refer to Figure 1 、 Figure 3 、 Figure 4 and Figure 6 The air guide assembly 30 includes: a first air guide shell 310 and a second air guide shell 320 that are connected to each other, an air inlet 301 is formed on the first air guide shell 310, and an air outlet 302 is formed on the second air guide shell 320. The first air guide shell 310 is arranged on the mounting frame and is connected to the second opening 2202 of the heater 220.

[0042] A connecting shell 70 is arranged between the heater 220 and the first air guide shell 310, and a first air guide plate 710 and a second air guide plate 720 are arranged in the connecting shell 70. A plurality of first blades 711 are formed on the first air guide plate 710, and a second blade 721 is formed on the second air guide plate 720. The first blades 711 and the second blades 721 are arranged in opposite directions so that the hot air flow output by the heater 220 flows along the inner wall of the first air guide shell 310.

[0043] Here, a structural example of a flow guide assembly 30 is given. Specifically, the flow guide assembly 30 includes a first flow guide shell 310 and a second flow guide shell 320. The first flow guide shell 310 is provided with the above-mentioned air inlet 301, and the second flow guide shell 320 is provided with the above-mentioned air outlet 302. The hot air flow enters the first flow guide shell 310 through the air inlet 301, and enters the second flow guide shell 320 along the first flow guide shell 310, and is transported to the end of the adsorption tube 40 along the air outlet 302 of the second flow guide shell 320, thereby achieving the purpose of heating the BGA chip adsorbed on the end of the adsorption tube 40. In the above structure, the size of the air outlet 302 can be set to match the size of the BGA chip, thereby improving the efficiency of heating the BGA chip and further improving the welding efficiency of the BGA chip and the PCB board. The above-mentioned first air guide plate 710 is connected to the first channel, and the second air guide plate 720 is connected to the second channel.

[0044] In this embodiment, the setting of the connecting shell 70 can enhance the connection stability between the first guide shell 310 and the second guide shell 320. At the same time, the first air guide plate 710 and the second air guide plate 720 are set in the connecting shell 70. When the hot air flow passes through the first air guide plate 710 and the second air guide plate 720, it flows along the inner wall of the first guide shell 310 under the action of the first blade 711 and the second blade 721, so that the hot air flow can be continuously and stably output from the air outlet 302, thereby improving the stability of the air flow.

[0045] As a preferred solution of this embodiment, refer to Figure 3 and Figure 4A first temperature probe 510 is inserted into the first guide surface 2141 for detecting the temperature of the hot air flow at one end of the heater 220 close to the first guide surface 2141; a second temperature probe 520 is inserted into the second guide surface 2142 for detecting the temperature of the hot air flow at one end of the heater 220 close to the second guide surface 2142; a third temperature probe 530 is inserted into the first guide shell 310 for detecting the temperature of the hot air flow in the first guide shell 310.

[0046] Among them, the first temperature probe 510 is set to detect the temperature of the heat generated in the heater 220 near the end of the first air supply 212, so as to know the working status of the first air supply 212 according to the temperature information fed back by the first temperature probe 510. When the temperature fed back by the first temperature probe 510 rises abnormally, it indicates that the first air supply 212 stops rotating or the wind force is too small during the heating process of the heater 220. At this time, the heater 220 is stopped to prevent the local temperature from being too high due to the continuous operation of the heater 220. Similarly, the second temperature probe 520 is set to detect the temperature of the heat generated in the heater 220 near the end of the second air supply 213, so as to know the working status of the second air supply 213 according to the temperature information fed back by the second temperature probe 520. When the temperature fed back rises abnormally, it indicates that the second air supply 213 stops rotating or the wind force is too small during the heating process of the heater 220. At this time, the heater 220 stops working to prevent the local temperature from being too high due to the continuous operation of the heater 220; the above-mentioned setting of the first temperature probe 510 and the second temperature probe 520 can reduce the safety hazards of the dual-channel heating device of the BGA chip rework equipment, and play a role in protecting the chip heating and adsorption module; the third temperature probe 530 is set to detect the temperature of the hot air flow in the first guide shell 310, so as to adjust the working state of the heater 220 according to the temperature information fed back by the third temperature probe 530, so that the temperature of the hot air flow output along the air outlet 302 meets the temperature required for heating the BGA chip, thereby improving the welding efficiency of the BGA chip and the PCB board.

[0047] As a preferred solution of this embodiment, refer to Figure 1 and Figure 9 The adsorption tube 40 includes a connecting tube 410 and a suction nozzle 420 that are interconnected. The connecting tube 410 is inserted into the mounting frame 10 and passes through the first air guide shell 310 and the second air guide shell 320 in sequence. The suction nozzle 420 extends from the air outlet 302. The connecting tube 410 is connected to an external negative pressure device. The suction nozzle 420 is used to adsorb the BGA chip; wherein, the connecting tube 410 and the suction nozzle 420 are detachably connected.

[0048] Here, an example of an adsorption tube 40 is given. Specifically, the adsorption tube 40 includes a connecting tube 410 and a suction nozzle 420 that are interconnected. The connecting tube 410 is inserted into the mounting frame 10 to fix the adsorption tube 40. After the connecting tube 410 passes through the second shell 211, the first shell 221, the first flow guide shell 310, and the second flow guide shell 320 in sequence, the suction nozzle 420 extends from the air outlet 302 to adsorb the BGA chip. During actual use, the connecting tube 410 is connected to an external negative pressure device to generate negative pressure at the suction nozzle 420 to adsorb the BGA chip on the suction nozzle 420, thereby moving the BGA chip to the top of the PCB board. The connecting tube 410 and the suction nozzle 420 are detachably connected, and the model of the suction nozzle 420 can be replaced so that the suction nozzle 420 can adapt to BGA chips of different sizes, thereby improving the applicability of the dual-channel heating device of the BGA chip repair equipment of this embodiment, and thereby improving the welding efficiency of the BGA chip and the PCB board.

[0049] As a preferred solution of this embodiment, refer to Figure 7 The dual-channel heating device of the BGA chip rework equipment also includes: a driving component; the driving component includes a driving motor 610, a first gear disc 620 and a second gear disc 630, the driving motor 610 is arranged on the mounting frame 10, the first gear disc 620 is arranged at the driving end of the driving motor 610, the first gear disc 620 and the second gear disc 630 are engaged, the second gear disc 630 is arranged on the mounting frame 10 and is rotatably connected to the mounting frame 10, the adsorption tube 40 is inserted into the second gear disc 630, and the driving component is used to drive the adsorption tube 40 to rotate along the circumferential direction.

[0050] Among them, a driving component is provided for driving the adsorption tube 40 to rotate, thereby adjusting the rotation angle of the adsorption tube 40, so that the adsorption tube 40 is adapted to the BGA chip and the adsorption efficiency of the BGA chip is improved. Specifically, the driving component includes: a driving motor 610, a first gear disc 620 and a second gear disc 630. The driving end of the driving motor 610 can drive the first gear disc 620 to rotate, and the first gear disc 620 is engaged with the second gear disc 630 to rotate the second gear disc 630, and the adsorption tube 40 rotates axially under the drive of the second gear disc 630. The driving motor 610 of this embodiment can adopt an electric motor, and the angle of the adsorption tube 40 can be adjusted by the forward or reverse rotation of the motor.

[0051] In this embodiment, a third support frame 160 is also provided on the mounting frame 10, and the drive motor 610 is arranged on the mounting frame 10 through the third support frame 160, so as to improve the setting stability of the drive motor 610 on the mounting frame 10, ensure the working stability of the dual-channel heating device of the BGA chip rework equipment in this embodiment, and improve the welding efficiency of the BGA chip and the PCB board.

[0052] As a preferred solution of this embodiment, refer to Figures 7 to 10 , a first support frame 110 and a second support frame 120 are provided on the mounting frame 10, the adsorption tube 40 is inserted into the first support frame 110 and is movably connected to the first support frame 110; a U-shaped beam-type photoelectric switch 121 is provided on the second support frame 120, and a shielding plate 130, a first elastic member 140 and a second elastic member 150 are also sleeved on the connecting tube 410, the shielding plate 130 is located between the first elastic member 140 and the second elastic member 150, the first elastic member 140 also abuts against the top of the first support frame 110, and the second elastic member 1 50 also abuts against the second toothed disc 630; one end of the shielding disc 130 is located in the U-shaped groove of the U-shaped opposing photoelectric switch 121; a snap-in groove 101 is formed on the mounting frame 10, and an annular connecting portion 631 is provided on one side of the second toothed disc 630, and a bearing 632 is provided on the outer periphery of the annular connecting portion 631, and the bearing 632 is provided in the snap-in groove 101, and a clamping platform (not shown in the figure) is provided on the adsorption tube 40, and a clamping groove 6301 is formed on the inner ring of the annular connecting portion 631, and the clamping platform is clamped into the clamping groove 6301 and is provided at the bottom of the clamping groove 101.

[0053] In actual application, the dual-channel heating device of the BGA chip rework equipment needs to adjust its height along the Z direction through the linear module to drive the BGA chip adsorbed at the end of the adsorption tube 40 to fall directly above the PCB board and contact the PCB board. Different BGA chips have different thicknesses. Therefore, the height of the dual-channel heating device of the BGA chip rework equipment along the Z direction is also different. In the process of adjusting the height, in the initial state, one end of the blocking plate 130 is located in the U-shaped groove of the U-shaped opposing photoelectric switch 121. The U-shaped opposing photoelectric switch 121 is in a working state, which can correspond to the linear module for adjusting the Z direction to work, so that the adsorption tube 40 moves close to the PCB board. When the adsorption When the BGA chip on the tube 40 contacts the PCB board, the adsorption tube 40 will be subjected to a vertical upward feedback force, and the card platform on the adsorption tube 40 will slide upward along the card slot 6301, driving the blocking plate 130 to move upward, so that the position of the blocking plate 130 in the U-shaped groove in the U-shaped photoelectric switch 121 changes. The U-shaped photoelectric switch 121 is in another working state, which can correspondingly stop the linear module for adjusting the Z direction from working, so as to achieve different descending heights of the adsorption tube 40 according to different chip thicknesses. Among them, the setting of the first elastic member 140 and the second elastic member 150 can make the BGA chip and the PCB board elastically contact, protecting the BGA chip from damage.

[0054] In this embodiment, the adsorption tube 40 can slide upward in the vertical direction based on the following principle: Figures 8 to 10, an annular connecting portion 631 is provided on the side of the second gear disc 630 close to the mounting frame, a clamping groove 101 is formed on the mounting frame 10, and a bearing 632 is provided on the outer periphery of the annular connecting portion 631, and the bearing 632 is arranged in the clamping groove 101. When the driving motor 610 works to rotate the first gear disc 620, the first gear disc 620 drives the second gear disc 630 to rotate, and the annular connecting portion 631 rotates together with the second gear disc 630. The card platform provided on one side of the connecting pipe 410 is clamped into the clamping groove 6301 of the annular connecting portion 631, thereby achieving the purpose of driving the connecting pipe 410 to rotate. At the same time, the setting of the bearing 632 realizes the rotation of the annular connecting portion 631 in the clamping groove 101, thereby realizing the rotation setting of the second gear disc 630 and the mounting frame 10.

[0055] When the BGA chip contacts the PCB board, the adsorption tube 40 is forced to move upward, and the card table moves upward on the annular connection part 631, realizing the movement of the adsorption tube 40 in the vertical direction. In the initial state, when the dual-channel heating device of the BGA chip rework equipment adjusts the height along the Z direction as a whole, the card table abuts against the bottom of the card slot 101 to realize the fixation of the adsorption tube 40 in the vertical direction.

[0056] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Those skilled in the art may modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A dual-channel heating device for BGA chip rework equipment, characterized in that: include: Mounting rack; A heating assembly is provided on the mounting frame and includes an air supply assembly and a heater that are interconnected, wherein the air supply assembly is used to generate an air flow to blow the heat generated in the heater to form a hot air flow; The air supply assembly includes a second shell, a first air blower and a second air blower, the second shell being arranged on the mounting frame, a receiving space having a third opening and a fourth opening which are arranged opposite to each other being formed on the second shell, the first air blower being arranged on the third opening, the second air blower being arranged on the fourth opening, the heater being located between the first air blower and the second air blower and being connected to the receiving space, the first air blower and the heater forming a first channel, and the second air blower and the heater forming a second channel; a flow guide assembly, disposed on a side of the mounting frame close to the heater, the flow guide assembly being formed with an air inlet and an air outlet, the air inlet being in communication with the heater; An adsorption tube is inserted into the mounting frame, passes through the heating component and the guide component in sequence and extends along the air outlet. An end of the adsorption tube close to the air outlet is used for adsorbing the BGA chip.

2. The dual-channel heating device for BGA chip rework equipment according to claim 1, characterized in that: The heater includes a first shell, which is arranged on the mounting bracket. The first shell forms a accommodating cavity having a first opening and a second opening. At least one heating plate is provided on the first shell, and a heating wire is embedded in the heating plate. The airflow generated by the air supply component enters the accommodating cavity along the first opening, and after being heated by the heating plate, a hot airflow is generated, which is output along the second opening. The second opening is connected to the air inlet.

3. The dual-channel heating device for BGA chip rework equipment according to claim 2, characterized in that: A guide member is provided in the accommodating space, and a first guide surface and a second guide surface are formed on the guide member. The airflow generated by the first blower enters the heater through the first guide surface, and the airflow generated by the second blower enters the heater through the second guide surface.

4. The dual-channel heating device for BGA chip rework equipment according to claim 3, characterized in that: The air guide assembly includes: a first air guide housing and a second air guide housing that are connected to each other, the air inlet is formed on the first air guide housing, the air outlet is formed on the second air guide housing, and the first air guide housing is provided on the mounting frame and connected to the second opening of the heater; A connecting shell is provided between the heater and the first air guide shell, and a first air guide plate and a second air guide plate are provided in the connecting shell. A plurality of first blades are formed on the first air guide plate, and a plurality of second blades are formed on the second air guide plate. The first blades and the second blades are arranged in opposite directions so that the hot air flow output by the heater flows along the inner wall of the first air guide shell.

5. The dual-channel heating device for BGA chip rework equipment according to claim 4, characterized in that: A first temperature probe is inserted on the first guide surface to detect the temperature of the hot air flow of the heater near one end of the first guide surface; a second temperature probe is inserted on the second guide surface to detect the temperature of the hot air flow of the heater near one end of the second guide surface.

6. The dual-channel heating device for BGA chip rework equipment according to claim 4, characterized in that: A third temperature probe is inserted into the first air guide housing, and the third temperature probe is used to detect the temperature of the hot air flow in the first air guide housing.

7. The dual-channel heating device for BGA chip rework equipment according to claim 6, characterized in that: The adsorption tube includes a connecting tube and a suction nozzle that are interconnected. The connecting tube is inserted into the mounting frame and passes through the second shell, the first shell, the first flow guide shell and the second flow guide shell in sequence. The suction nozzle extends from the air outlet. The connecting tube is connected to an external negative pressure device. The suction nozzle is used to adsorb BGA chips.

8. The dual-channel heating device for BGA chip rework equipment according to claim 7, characterized in that: The connecting pipe and the suction nozzle are detachably connected.

9. The dual-channel heating device for BGA chip rework equipment according to claim 8, characterized in that: The dual-channel heating device of the BGA chip rework equipment further includes: a driving component; The driving assembly includes a driving motor, a first gear disc and a second gear disc. The driving motor is arranged on the mounting frame. The first gear disc is arranged at the driving end of the driving motor. The first gear disc and the second gear disc are engaged. The second gear disc is arranged on the mounting frame and is rotatably connected to the mounting frame. The adsorption tube is inserted into the second gear disc. The driving assembly is used to drive the adsorption tube to rotate in the circumferential direction.

10. The dual-channel heating device for BGA chip rework equipment according to claim 9, characterized in that: The mounting frame is provided with a first supporting frame and a second supporting frame, and the adsorption tube is inserted into the first supporting frame and movably connected to the first supporting frame; The second support frame is provided with a U-shaped through-beam photoelectric switch, and the connecting tube is also sleeved with a shielding disk, a first elastic member, and a second elastic member. The shielding disk is located between the first elastic member and the second elastic member. The first elastic member also abuts against the top of the first support frame, and the second elastic member also abuts against the second gear disk. One end of the shielding disk is located in the U-shaped groove of the U-shaped beam-type photoelectric switch; A snap-fit ​​groove is formed on the mounting frame, an annular connecting portion is provided on one side of the second gear disc, a bearing is provided on the outer periphery of the annular connecting portion, the bearing is arranged in the snap-fit ​​groove, a clamping platform is provided on the adsorption tube, a clamping groove is formed on the inner ring of the annular connecting portion, the clamping platform is clamped into the clamping groove, and is arranged at the bottom of the clamping groove.

Images