Heating device of BGA chip repair equipment

Abstract

The utility model relates to the technical field of chip processing, in particular to a heating device of BGA chip repair equipment. Comprising a mounting base, a diversion assembly, a heating assembly and an adsorption pipe, the flow guide assembly is arranged on the mounting seat, and an air inlet and an air outlet which are communicated with each other are formed in the flow guide assembly; the heating assembly is arranged on one side of the flow guide assembly and comprises an air supply device and a heater which are connected with each other, the heater is communicated with the air inlet, and the air supply device is used for blowing heat generated in the heater to form hot air flow which enters the flow guide assembly along the air inlet; the adsorption pipe is inserted into the flow guide assembly and extends out along the air outlet, and the end, close to the air outlet, of the adsorption pipe is used for adsorbing the BGA chip. According to the structure, the heating assembly, the flow guide assembly and the adsorption pipe are integrated together, so that the BGA chip can be adsorbed and heated, the processing procedures are saved, the welding efficiency of the BGA chip and the PCB is improved, meanwhile, the size of BGA chip repair equipment is reduced, and the BGA chip repair equipment is convenient to use and popularize.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a heating device for BGA chip repair equipment. Background Art

[0002] BGA chip rework equipment can solder the chip to the PCB board to improve the soldering efficiency of the chip on the PCB board.

[0003] When using BGA chip rework equipment for chip soldering, the chip is generally sucked up using a suction tube and moved to the top of the PCB. A heater is then moved above the PCB to heat the chip, melting the solder on the chip and soldering it to the PCB. This structural arrangement results in low efficiency during the production and processing of BGA chip rework equipment, and the overall size is large, which is not conducive to the use and promotion of BGA chip rework equipment. Utility Model Content

[0004] The technical problem to be solved by the embodiment of the present utility model is to provide a heating device for BGA chip repair equipment to solve the problems in the prior art that the automatic chip mounting equipment has low efficiency in the production and processing process and has a large overall volume, which is not conducive to the use and promotion of BGA chip repair equipment.

[0005] The utility model discloses a heating device for BGA chip rework equipment, comprising: a mounting seat, a guide assembly, a heating assembly and an adsorption tube, wherein the guide assembly is arranged on the mounting seat, and an air inlet and an air outlet that are interconnected are formed on the guide assembly; the heating assembly is arranged on one side of the guide assembly, and comprises an air blower and a heater that are interconnected, the heater is connected to the air inlet, the air blower is used to blow the heat generated in the heater to form a hot air flow, and the hot air flow enters the guide assembly along the air inlet; the adsorption tube is inserted into the mounting seat, passes through the guide assembly and extends along the air outlet, and the end of the adsorption tube close to the air outlet is used for adsorbing BGA chips.

[0006] Optionally, the air guide assembly includes a first air guide shell and a second air guide shell that are interconnected, the air inlet is formed on the first air guide shell, the air outlet is formed on the second air guide shell, the first air guide shell is arranged on the mounting seat, and the size of the air outlet matches the size of the BGA chip.

[0007] Optionally, a connecting frame is provided at one end of the first flow guide shell close to the second flow guide shell, a limiting hole is formed on the connecting frame, and the adsorption tube passes through the limiting hole and abuts against the connecting frame.

[0008] Optionally, a first connecting piece is provided between the first flow guide shell and the second flow guide shell, and a first temperature probe is inserted into the first connection, and the first temperature probe is used to detect the temperature of the hot air flow in the flow guide assembly.

[0009] Optionally, the heater includes a heating tube and a bent tube that are interconnected, a heating wire is provided on the inner wall of the heating tube, the bent tube is connected to the air inlet, and the air supply is provided on one end of the heating tube away from the bent tube.

[0010] Optionally, a second connecting piece is provided between the heating tube and the air blower, and a second temperature probe is inserted into the second connecting piece at one end close to the heating tube, and the second temperature probe is used to detect the temperature inside the heating tube.

[0011] Optionally, the adsorption tube includes a connecting tube and a suction nozzle that are interconnected. The connecting tube is inserted into the mounting seat and passes through the first air guide shell and the limiting hole in sequence. The suction nozzle extends from the air outlet. The connecting tube is connected to an external negative pressure device, and the suction nozzle is used to adsorb the BGA chip.

[0012] Optionally, the connecting pipe and the suction nozzle are detachably connected.

[0013] Optionally, the BGA chip rework equipment heating device also includes: a driving component; the driving component includes: a driving motor, a first gear disc and a second gear disc, the driving motor is arranged on the mounting seat, the first gear disc is arranged at the driving end of the driving motor, the first gear disc and the second gear disc are engaged, the adsorption tube is inserted into the second gear disc, and the driving component is used to drive the adsorption tube to rotate in the circumferential direction.

[0014] Optionally, a support frame is provided on the mounting seat, the adsorption tube is inserted into the support frame and movably connected to the support frame; a U-shaped opposing beam photoelectric switch is provided on the support frame, and a blocking disk is also provided on the connecting tube, one end of the blocking disk is located in the U-shaped groove of the U-shaped opposing beam photoelectric switch, and an elastic member is provided on the end of the blocking disk close to the support frame, and the elastic member also abuts against the support frame.

[0015] Compared with the prior art, the beneficial effect of the BGA chip rework equipment heating device provided by the embodiment of the utility model is that: the mounting seat is set to provide a stable installation environment for fixing the guide assembly, and a heating assembly is set on one side of the guide assembly. The heating assembly includes an air blower and a heater that are interconnected. The heater generates heat when it works, and under the action of the air blower, the heat generated in the heater is blown to form a hot air flow, and the hot air flow enters the guide assembly along the air inlet; the adsorption tube is inserted on the mounting seat and extends along the air outlet through the guide assembly. During operation, the end of the adsorption tube close to the air outlet is used to adsorb the BGA chip. When the BGA chip is placed on the PCB board, the heater and the air blower work to generate a hot air flow output from the air outlet, which can heat the BGA chip and melt the solder on the BGA chip so that the BGA chip can be soldered to the PCB board. The above structure integrates the heating component, the guide component and the adsorption tube, which can realize the heating and adsorption of the BGA chip. There is no need for multiple heating components and adsorption tubes to cooperate in sequence, which saves processing steps, improves the welding efficiency of the BGA chip and the PCB board, and reduces the volume of the BGA chip rework equipment, making it easier to use and promote the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 This is one of the overall structural diagrams of the heating device of the BGA chip rework equipment provided by the embodiment of the utility model;

[0018] Figure 2 This is the second overall structural diagram of the heating device of the BGA chip rework equipment provided by the embodiment of the present utility model;

[0019] Figure 3 This is a schematic structural diagram of the adsorption tube and the first flow guide shell provided by an embodiment of the present utility model;

[0020] Figure 4 This is a schematic structural diagram of a mounting base provided by an embodiment of the present utility model;

[0021] Figure 5 This is a schematic structural diagram of the second toothed disc provided in an embodiment of the present utility model;

[0022] Figure 6 This is a schematic structural diagram of a second gear disc and a support frame provided by an embodiment of the present utility model;

[0023] Figure 7 This is a schematic diagram of the arrangement structure of the first temperature probe on the first connecting piece provided by an embodiment of the present utility model.

[0024] The reference numerals in the figures are:

[0025] 10. Mounting seat; 101. Snap-fit ​​groove; 110. Support frame; 120. U-shaped through-beam photoelectric switch; 130. Shielding plate; 140. Elastic member; 201. Air inlet; 202. Air outlet; 210. First air guide shell; 211. Connecting frame; 2101. Limiting hole; 220. Second air guide shell; 230. First connecting member; 231. First temperature probe; 30. Heating assembly; 310. Air blower; 320. Heater; 321. Heating pipe; 322. Bend pipe; 323. Second connecting member; 3231. Second temperature probe; 40. Adsorption tube; 410. Connecting pipe; 411. Card table; 420. Suction nozzle; 510. Drive motor; 520. First gear disc; 530. Second gear disc; 531. Bearing; 532. Annular connecting part; 5301. Snap-fit ​​groove. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, a detailed description of the preferred embodiments of the present utility model will be given.

[0027] The present invention provides a heating device for BGA chip rework equipment. Figures 1 to 3 As shown, it includes a mounting base 10, a guide assembly, a heating assembly 30 and an adsorption tube 40. The guide assembly is arranged on the mounting base 10, and an air inlet 201 and an air outlet 202 that are interconnected are formed on the guide assembly; the heating assembly 30 is arranged on one side of the guide assembly, and includes an air blower 310 and a heater 320 that are interconnected, and the heater 320 is connected to the air inlet 201. The air blower 310 is used to blow the heat generated in the heater 320 to form a hot air flow, and enter the guide assembly along the air inlet 201; the adsorption tube 40 is inserted on the mounting base 10, and passes through the guide assembly and extends along the air outlet 202. The end of the adsorption tube 40 close to the air outlet 202 is used to adsorb the BGA chip.

[0028] In this embodiment, the mounting base 10 is configured to provide a stable mounting environment for fixing the guide assembly. A heating assembly 30 is provided on one side of the guide assembly. The heating assembly 30 includes an air blower 310 and a heater 320 that are interconnected. The heater 320 generates heat when it operates, and under the action of the air blower 310, the heat generated in the heater 320 is blown to form a hot air flow, and the hot air flow enters the guide assembly along the air inlet 201; the adsorption tube 40 is inserted into the mounting base 10 and extends along the air outlet 202 through the guide assembly. During operation, one end of the adsorption tube 40 close to the air outlet 202 is used to adsorb the BGA chip, and when the BGA chip is placed on the PCB board, the heater 320 and the air blower 310 operate to generate a hot air flow output from the air outlet 202, which can heat the BGA chip and melt the solder on the BGA chip so that the BGA chip can be soldered to the PCB board. The above structure integrates the heating component 30, the guide component and the adsorption tube 40, which can realize the adsorption and heating of the BGA chip. There is no need to cooperate with the heating component 30 and the adsorption tube 40 to heat and adsorb the BGA chip in sequence, which saves processing steps, improves the welding efficiency of the BGA chip and the PCB board, and reduces the volume of the BGA chip rework equipment, making it easier to use and promote the BGA chip rework equipment.

[0029] The air blower 310 in this embodiment may be a fan.

[0030] In this embodiment, the mounting base 10 is mounted on a linear module. Driven by the linear module, the heating device of the BGA chip rework equipment reaches above the PCB, thereby achieving soldering between the BGA chip and the PCB. The linear module can adjust the position of the heating device of the BGA chip rework equipment along the X, Y, or Z directions, without specific limitations herein.

[0031] As a preferred solution of this embodiment, Figure 1 and Figure 3 As shown, the air guide assembly includes a first air guide shell 210 and a second air guide shell 220 that are interconnected. An air inlet 201 is formed on the first air guide shell 210, and an air outlet 202 is formed on the second air guide shell 220. The first air guide shell 210 is arranged on the mounting seat 10, and the size of the air outlet 202 matches the size of the BGA chip.

[0032] Among them, a structural example of a guide component is given here. Specifically, the guide component includes a first guide shell 210 and a second guide shell 220. An air inlet 201 is formed on the first guide shell 210, and an air outlet 202 is formed on the second guide shell 220. The hot air flow enters the first guide shell 210 through the air inlet 201, and enters the second guide shell 220 along the first guide shell 210, and is transported to the end of the adsorption tube 40 along the air outlet 202 of the second guide shell 220, thereby achieving the purpose of heating the BGA chip adsorbed on the end of the adsorption tube 40. The size of the air outlet 202 is set to match the size of the BGA chip to improve the efficiency of heating the BGA chip.

[0033] As a preferred solution of this embodiment, Figure 1 and Figure 3 As shown, a connecting frame 211 is provided at one end of the first flow guide housing 210 close to the second flow guide housing 220 , and a limiting hole 2101 is formed on the connecting frame 211 . The adsorption tube 40 passes through the limiting hole 2101 and abuts against the connecting frame 211 .

[0034] Among them, the setting of the connecting frame 211 can improve the installation stability of the adsorption tube 40 on the first guide shell 210, and under the action of the limiting hole 2101, prevent the adsorption tube 40 from shaking due to the flow of hot air flow, thereby improving the matching efficiency of the BGA chip and the PCB board after the adsorption tube 40 adsorbs the BGA chip, thereby improving the welding efficiency of the BGA chip and the PCB board.

[0035] As a preferred solution of this embodiment, Figure 1 and Figure 7 As shown, a first connector 230 is provided between the first air guide housing 210 and the second air guide housing 220 , and a first temperature probe 231 is inserted into the first connector. The first temperature probe 231 is used to detect the temperature of the hot air flow in the air guide assembly.

[0036] Among them, the first connecting member 230 connects the first air guide shell 210 and the second air guide shell 220, strengthens the connection strength of the first air guide shell 210 and the second air guide shell 220, and thereby improves the stability of the air guide component itself; a first temperature probe 231 is provided to detect the temperature of the hot air flow in the air guide component, so as to adjust the working state of the heater 320 according to the temperature information feedback from the first temperature probe 231, so that the temperature of the hot air flow output along the air outlet 202 meets the temperature required for heating the BGA chip, thereby improving the welding efficiency of the BGA chip and the PCB board.

[0037] As a preferred solution of this embodiment, Figure 2As shown, the heater 320 includes a heating tube 321 and a bend tube 322 that are interconnected. A heating wire is provided on the inner wall of the heating tube 321. The bend tube 322 is connected to the air inlet 201. The air supply device 310 is provided on one end of the heating tube 321 away from the bend tube 322.

[0038] Among them, a structural example of the heater 320 is given here. The heater 320 includes a heating tube 321 and a bent tube 322 that are interconnected. A heating wire is provided on the inner wall of the heating tube 321, and the heating wire generates heat when energized. The air blower 310 blows the heat generated in the heating tube 321 to form a hot air flow. The hot air flow passes through the bent tube 322 and enters the first guide shell 210 along the air inlet 201. The above setting of the heater 320 improves the connection integration between the heater 320 and the guide component, thereby reducing the volume of the heating device of the BGA chip rework equipment.

[0039] As a preferred solution of this embodiment, Figure 1 and Figure 2 As shown, a second connecting piece 323 is provided between the heating tube 321 and the air blower 310 , and a second temperature probe 3231 is inserted into the end of the second connecting piece 323 close to the heating tube 321 . The second temperature probe 3231 is used to detect the temperature inside the heating tube 321 .

[0040] Among them, the second connecting member 323 connects the heating tube 321 and the air blower 310, strengthens the connection strength between the two, and thereby improves the stability of the heater 320 itself; a second temperature probe 3231 is set to detect the temperature of the heat generated in the heating tube 321, so as to know the working status of the air blower 310 according to the temperature information fed back by the second temperature probe 3231. When the temperature fed back by the second temperature probe 3231 rises abnormally, it indicates that the air blower 310 stops rotating or the wind force is too small during the heating process of the heating barrel. At this time, the heating barrel is stopped to prevent the local temperature from being too high due to the continuous operation of the heating barrel, thereby reducing the safety hazards of the heating device of the BGA chip rework equipment and protecting the heating device of the BGA chip rework equipment.

[0041] As a preferred solution of this embodiment, Figure 3 As shown, the adsorption tube 40 includes a connecting tube 410 and a suction nozzle 420 that are interconnected. The connecting tube 410 is inserted into the first air guide shell 210 and passes through the limiting hole 2101. The suction nozzle 420 extends from the air outlet 202. The connecting tube 410 is connected to the external negative pressure equipment, and the suction nozzle 420 is used to adsorb the BGA chip; wherein, the connecting tube 410 and the suction nozzle 420 are detachably connected.

[0042] Here, a structural example of an adsorption tube 40 is given. Specifically, the adsorption tube 40 includes a connecting tube 410 and a suction nozzle 420 that are interconnected. The connecting tube 410 is inserted into the mounting base 10 to fix the adsorption tube 40. After the connecting tube 410 passes through the first air guide shell 210 and the limiting hole 2101, the suction nozzle 420 extends from the air outlet 202 to adsorb the BGA chip. In actual use, the connecting tube 410 is connected to an external negative pressure device to generate negative pressure at the suction nozzle 420 to adsorb the BGA chip on the suction nozzle 420. The connecting tube 410 and the suction nozzle 420 are detachably connected, and the model of the suction nozzle 420 can be replaced so that the suction nozzle 420 can adapt to BGA chips of different sizes, thereby improving the applicability of the heating device of the BGA chip rework equipment of this embodiment, and further improving the welding efficiency of the chip and the PCB board.

[0043] As a preferred solution of this embodiment, Figure 1 As shown, the heating device of the BGA chip rework equipment further includes: a driving component;

[0044] The driving assembly includes: a driving motor 510, a first gear disc 520 and a second gear disc 530. The driving motor 510 is arranged on the mounting seat 10, and the first gear disc 520 is arranged at the driving end of the driving motor 510. The first gear disc 520 and the second gear disc 530 are engaged, and the adsorption tube 40 is inserted into the second gear disc 530. The driving assembly is used to drive the adsorption tube 40 to rotate in the circumferential direction.

[0045] Among them, a driving component is provided for driving the adsorption tube 40 to rotate, thereby adjusting the rotation angle of the adsorption tube 40, so that the adsorption tube 40 is adapted to the BGA chip and the adsorption efficiency of the BGA chip is improved. Specifically, the driving component includes: a driving motor 510, a first gear disc 520 and a second gear disc 530. The driving end of the driving motor 510 can drive the first gear disc 520 to rotate, and the first gear disc 520 is engaged with the second gear disc 530 to rotate the second gear disc 530, and the adsorption tube 40 rotates axially under the drive of the second gear disc 530. The driving motor 510 of this embodiment can adopt an electric motor, and the angle of the adsorption tube 40 can be adjusted by the forward or reverse rotation of the motor.

[0046] As a preferred solution of this embodiment, Figures 4 to 6 As shown, a support frame 110 is provided on the mounting base 10, and the adsorption tube 40 is inserted into the support frame 110 and movably connected to the support frame 110; a U-shaped opposing-beam photoelectric switch 120 is provided on the support frame 110, and a blocking plate 130 is also sleeved on the connecting tube 410, and one end of the blocking plate 130 is located in the U-shaped groove of the U-shaped opposing-beam photoelectric switch 120, and an elastic member 140 is provided on the end of the blocking plate 130 close to the support frame 110, and the elastic member 140 is also in contact with the support frame 110.

[0047] In actual application, the BGA chip rework equipment heating device needs to adjust its height along the Z direction through the linear module to drive the BGA chip adsorbed by the end of the adsorption tube 40 to fall directly above the PCB board and contact the PCB board. Different BGA chips have different thicknesses. Therefore, the section height of the BGA chip rework equipment heating device along the Z direction is also different. In the process of adjusting the height, in the initial state, one end of the blocking plate 130 is located in the U-shaped groove of the U-shaped opposing photoelectric switch 120. The U-shaped opposing photoelectric switch 120 is in a working state, which can correspond to the linear module for adjusting the Z direction to work, so that the adsorption tube 40 moves close to the PCB board. When the adsorption When the BGA chip on the tube 40 contacts the PCB board, the adsorption tube 40 will be subjected to a vertical upward feedback force, and the card platform 411 on the adsorption tube 40 will slide upward along the card slot 5301, driving the blocking plate 130 to move upward, so that the position of the blocking plate 130 in the U-shaped groove in the U-shaped photoelectric switch 120 changes. The U-shaped photoelectric switch 120 is in another working state, which can correspondingly stop the linear module for adjusting the Z direction from working, so as to achieve different descending heights of the adsorption tube 40 according to different chip thicknesses. Among them, the setting of the elastic member 140 can make the BGA chip and the PCB board elastically contact, protecting the BGA chip from damage.

[0048] In this embodiment, the adsorption tube 40 can slide upward in the vertical direction based on the following principle: Figures 4 to 6 The second gear disc 530 is provided with an annular connecting portion 532 on the side close to the mounting seat 10, and a clamping groove 101 is formed on the mounting seat 10. A bearing 531 is provided on the outer periphery of the annular connecting portion 532, and the bearing 531 is arranged in the clamping groove 101. When the driving motor 510 works to rotate the first gear disc 520, the first gear disc 520 drives the second gear disc 530 to rotate, and the annular connecting portion 532 rotates with the second gear disc 530. The clamping platform 411 provided on one side of the connecting tube 410 is clamped into the clamping groove 5301 of the annular connecting portion 532, thereby achieving the purpose of driving the connecting tube 410 to rotate when the driving component works. At the same time, the setting of the bearing 531 realizes the rotation of the annular connecting portion 532 in the clamping groove 101.

[0049] When the BGA chip contacts the PCB board, the adsorption tube 40 is forced to move upward, and the clamping platform 411 moves upward on the annular connecting portion 532, thereby realizing the movement of the adsorption tube 40 in the vertical direction. In the initial state, the clamping platform 411 abuts against the bottom of the clamping groove 101 to realize the fixation of the adsorption tube 40 in the vertical direction.

[0050] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Those skilled in the art may modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A BGA chip rework equipment heating device, characterized in that: include: Mounting seat; A flow guide assembly is provided on the mounting seat, and is formed with an air inlet and an air outlet that are interconnected; a heating assembly, disposed on one side of the guide assembly, comprising an air blower and a heater that are in communication with each other, the heater being in communication with the air inlet, the air blower being used to blow heat generated in the heater to form a hot air flow, and the hot air flow enters the guide assembly along the air inlet; An adsorption tube is inserted into the mounting seat and extends through the guide assembly along the air outlet. One end of the adsorption tube close to the air outlet is used for adsorbing the BGA chip.

2. The BGA chip rework equipment heating device according to claim 1, characterized in that: The air guide assembly includes a first air guide shell and a second air guide shell that are interconnected. The air inlet is formed on the first air guide shell, and the air outlet is formed on the second air guide shell. The first air guide shell is arranged on the mounting seat, and the size of the air outlet matches the size of the BGA chip.

3. The BGA chip rework equipment heating device according to claim 2, characterized in that: A connecting frame is provided at one end of the first flow guide housing close to the second flow guide housing. A limiting hole is formed on the connecting frame. The adsorption tube passes through the limiting hole and abuts against the connecting frame.

4. The BGA chip rework equipment heating device according to claim 3, characterized in that: A first connecting piece is provided between the first flow guide housing and the second flow guide housing. A first temperature probe is inserted into the first connection. The first temperature probe is used to detect the temperature of the hot air flow in the flow guide assembly.

5. The BGA chip rework equipment heating device according to claim 4, characterized in that: The heater includes a heating tube and a bend tube that are interconnected. A heating wire is provided on the inner wall of the heating tube. The bend tube is connected to the air inlet. The air supply device is provided on one end of the heating tube away from the bend tube.

6. The BGA chip rework equipment heating device according to claim 5, characterized in that: A second connecting piece is provided between the heating tube and the air blower. A second temperature probe is inserted into one end of the second connecting piece close to the heating tube. The second temperature probe is used to detect the temperature inside the heating tube.

7. The BGA chip rework equipment heating device according to claim 6, characterized in that: The adsorption tube includes a connecting tube and a suction nozzle that are interconnected. The connecting tube is inserted into the mounting seat and passes through the first air guide shell and the limiting hole in sequence. The suction nozzle extends from the air outlet. The connecting tube is connected to an external negative pressure device. The suction nozzle is used to adsorb the BGA chip.

8. The BGA chip rework equipment heating device according to claim 7, characterized in that: The connecting pipe and the suction nozzle are detachably connected.

9. The BGA chip rework equipment heating device according to claim 8, characterized in that: The BGA chip rework equipment heating device further includes: a driving component; The driving assembly includes: a driving motor, a first gear disc and a second gear disc. The driving motor is arranged on the mounting seat. The first gear disc is arranged at the driving end of the driving motor. The first gear disc and the second gear disc are engaged. The adsorption tube is inserted into the second gear disc. The driving assembly is used to drive the adsorption tube to rotate in the circumferential direction.

10. The BGA chip rework equipment heating device according to claim 9, characterized in that: A support frame is provided on the mounting seat, and the adsorption tube is inserted into the support frame and movably connected to the support frame; A U-shaped opposing-beam photoelectric switch is provided on the support frame, and a blocking plate is also sleeved on the connecting tube. One end of the blocking plate is located in the U-shaped groove of the U-shaped opposing-beam photoelectric switch. An elastic member is provided at one end of the blocking plate close to the support frame, and the elastic member also abuts against the support frame.

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