Chip mounter suction nozzle with uniform pressing force

Abstract

The utility model relates to the technical field of chip mounters, and discloses a chip mounter suction nozzle with uniform downward pressure, which comprises a bottom plate, the upper side of the bottom plate is fixedly connected with a motor, one side of the bottom plate is fixedly connected with a telescopic structure, the telescopic structure comprises a first moving shaft and a limiting column, one side of the bottom plate is fixedly connected with the first moving shaft, and the other side of the bottom plate is fixedly connected with the limiting column. And one side of the first moving shaft is fixedly connected with a limiting column. The telescopic structure is arranged, the telescopic structure is firstly connected with the bottom plate through the first moving shaft, then the motor drives the first moving column to move on the outer side of the first moving shaft, and then the second moving column connected with the second moving shaft is driven by the first moving column to drive the telescopic side plate to move towards the outer side. When the telescopic side plates move towards the outer side, the telescopic main plate connected with the telescopic side plates through the connecting shafts and the connecting columns moves front and back, the first suction nozzles and the second suction nozzles reach the positions at the same time, and stress of the suction nozzles is more uniform.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounters, in particular to a chip mounter suction nozzle with uniform downward pressure. Background Art

[0002] Chip mounter: also known as "mounting machine" or "surface mount system" (Surface Mount System). In the production line, it is configured after the dispensing machine or screen printer. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. It is divided into manual and fully automatic types. The chip mounter is a device used to achieve high-speed and high-precision fully automatic placement of components. It is the most critical and complex equipment in the entire semiconductor production. The chip mounter is the main equipment in the semiconductor production line. The chip mounter has developed from the early low-speed mechanical chip mounter to the high-speed optical alignment chip mounter, and has developed towards multi-functional, flexible connection modularization. There are many kinds of chip mounters on the market, but they generally have the disadvantage of uneven nozzle pressure. The existing chip mounter nozzle structure is relatively simple. Relying on a single nozzle can easily lead to insufficient suction of the chip mounter, reducing production efficiency. Therefore, a chip mounter nozzle with uniform downward pressure is proposed to solve the above-mentioned problems.

[0003] The application number is 202021509384.7, which discloses a nozzle for a placement machine with uniform downward pressure, including a base plate, a workbench fixedly installed on the top of the base plate, and a material picking box fixedly installed on the left side of the top of the workbench. The nozzle for a placement machine with uniform downward pressure places the pads of the required patches inside the placement slot when performing placement, and effectively avoids the pads from being offset during the placement process by the anti-slip layer inside the placement slot. At the same time, after the rotating rod rotates the fixed block, the fixed plate is pressed against one side of the pad to fix it, and the cooperation with the anti-slip layer effectively ensures the stability of the pad when it is placed by the nozzle. Through the operation of the horizontal cylinder, the nozzle body moves to the left to absorb the patch inside the material picking box. When the nozzle body reaches the upper side of the pad, the electric push rod is operated to move it downward to stick the patch on the pad, thereby achieving the purpose of uniform pressure.

[0004] However, there are some shortcomings. The device uses the operation of the horizontal cylinder to move the suction nozzle body to the left to suck the patch inside the material box. When the suction nozzle body reaches the upper side of the pad, the electric push rod is operated to move it downward to stick the patch on the pad, thereby achieving the purpose of uniform pressure. However, the suction nozzle structure of the device is relatively simple. Relying on only one suction nozzle can easily lead to insufficient suction of the placement machine, thereby reducing production efficiency. Utility Model Content

[0005] The purpose of the present utility model is to provide a suction nozzle for a placement machine with uniform downward pressure, so as to solve the problem proposed in the above background technology that the device moves the suction nozzle body to the left to suck the patch inside the material box through the operation of the horizontal cylinder. When the suction nozzle body reaches the upper side of the solder pad, the electric push rod is operated to move it downward to stick the patch on the solder pad, thereby achieving the purpose of uniform pressure. However, the suction nozzle structure of the device is relatively simple, and relying on only one suction nozzle can easily lead to insufficient suction of the placement machine, thereby reducing production efficiency.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The utility model is a placement machine suction nozzle with uniform downward pressure, comprising a base plate, the upper side of the base plate is fixedly connected to a motor, one side of the base plate is fixedly connected to a telescopic structure, the telescopic structure comprises a first movable axis and a limiting column, one side of the base plate is fixedly connected to the first movable axis, and one side of the first movable axis is fixedly connected to the limiting column.

[0008] Furthermore, a first movable column is movably connected to the outer side of the first movable shaft, and a second movable shaft is fixedly connected to one side of the first movable column.

[0009] Furthermore, a second movable column is movably connected to the outer side of the second movable shaft, and a telescopic side plate is fixedly connected to one side of the second movable column.

[0010] Furthermore, one side of the telescopic side plate is fixedly connected to a telescopic base, one side of the telescopic base is fixedly connected to a connecting shaft, and the outer side of the connecting shaft is movably connected to a connecting column.

[0011] Furthermore, a first suction nozzle is fixedly connected to one side of the telescopic base.

[0012] Furthermore, one side of the telescopic base is movably connected to a telescopic main board, and one side of the telescopic main board is fixedly connected to a second suction nozzle.

[0013] Furthermore, a third movable column is fixedly connected to the lower side of the telescopic main board, and a third movable shaft is movably connected to the inner side of the third movable column.

[0014] The utility model has the following beneficial effects:

[0015] (1) The utility model is provided with a telescopic structure, which is first connected to the bottom plate through a first movable shaft, and then the motor drives the first movable column to move outside the first movable shaft, and then the second movable column connected through the second movable shaft drives the telescopic side plate to move outward under the drive of the first movable column. When the telescopic side plate moves outward, the telescopic main board connected to the telescopic side plate through the connecting shaft and the connecting column moves back and forth, and makes the first suction nozzle and the second suction nozzle arrive at the position at the same time, so that the force on the suction nozzle is more uniform.

[0016] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the connection of the first movable axis of the telescopic structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the connection of the telescopic base of the telescopic structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the connection of the first suction nozzle of the telescopic structure of the utility model;

[0022] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0023] In the figure: 1. Bottom plate; 2. Motor; 3. Telescopic structure; 301. First movable axis; 302. Limiting column; 303. First movable column; 304. Second movable axis; 305. Second movable column; 306. Telescopic side panel; 307. Telescopic base; 308. Connecting shaft; 309. Connecting column; 310. First suction nozzle; 311. Telescopic main plate; 312. Second suction nozzle; 313. Third movable column; 314. Third movable axis; DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] See also Figures 1-4 As shown, the utility model is a placement machine suction nozzle with uniform downward pressure, including a base plate 1, a motor 2 is fixedly connected to the upper side of the base plate 1, a telescopic structure 3 is fixedly connected to one side of the base plate 1, the telescopic structure 3 includes a first movable axis 301 and a limiting column 302, one side of the base plate 1 is fixedly connected to the first movable axis 301, and one side of the first movable axis 301 is fixedly connected to the limiting column 302.

[0026] By adopting the above technical solution, this solution provides a first movable column 303 movably connected to the outer side of the first movable shaft 301 , and a second movable shaft 304 is fixedly connected to one side of the first movable column 303 .

[0027] By adopting the above technical solution, the second movable column 305 is movably connected to the outer side of the second movable shaft 304 in this solution, and a telescopic side plate 306 is fixedly connected to one side of the second movable column 305 .

[0028] By adopting the above technical solution, this solution sets a telescopic side panel 306 with one side fixedly connected to a telescopic base 307, one side of the telescopic base 307 is fixedly connected to a connecting shaft 308, and the outer side of the connecting shaft 308 is movably connected to a connecting column 309.

[0029] By adopting the above technical solution, this solution provides a first suction nozzle 310 fixedly connected to one side of the telescopic base 307 .

[0030] By adopting the above technical solution, this solution is configured such that one side of the telescopic base 307 is movably connected to the telescopic main board 311 , and one side of the telescopic main board 311 is fixedly connected to the second suction nozzle 312 .

[0031] The telescopic base 307 and the telescopic main board 311 are connected via a connecting column 309 .

[0032] During operation, the motor 2 drives the first movable column 303 to move outside the first movable axis 301, and then the second movable column 305 connected through the second movable axis 304 drives the telescopic side panel 306 to move outward under the drive of the first movable column 303. When the telescopic side panel 306 moves outward, the telescopic main board 311 connected to the telescopic side panel 306 through the connecting shaft 308 and the connecting column 309 moves back and forth, and makes the first suction nozzle 310 and the second suction nozzle 312 arrive at the position at the same time, so that the force on the suction nozzle is more uniform.

[0033] By adopting the above technical solution, in this solution, the lower side of the telescopic main board 311 is fixedly connected to the third movable column 313 , and the inner side of the third movable column 313 is movably connected to the third movable shaft 314 .

[0034] When in use, the telescopic structure 3 is first set up. The telescopic structure 3 is first connected to the bottom plate 1 through the first movable shaft 301, and then the motor 2 drives the first movable column 303 to move outside the first movable shaft 301, and then the second movable column 305 connected through the second movable shaft 304 drives the telescopic side plate 306 to move outward under the drive of the first movable column 303. When the telescopic side plate 306 moves outward, the telescopic main board 311 connected to the telescopic side plate 306 through the connecting shaft 308 and the connecting column 309 moves back and forth, and makes the first suction nozzle 310 and the second suction nozzle 312 arrive at the position at the same time, so that the force on the suction nozzle is more uniform.

[0035] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments do not describe all details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A nozzle for a placement machine with uniform downward pressure, comprising a bottom plate (1), characterized in that: The upper side of the base plate (1) is fixedly connected to a motor (2); one side of the base plate (1) is fixedly connected to a telescopic structure (3); the telescopic structure (3) comprises a first movable shaft (301) and a limiting column (302); one side of the base plate (1) is fixedly connected to the first movable shaft (301); and one side of the first movable shaft (301) is fixedly connected to the limiting column (302).

2. The nozzle for a placement machine with uniform downward pressure according to claim 1, characterized in that: The outer side of the first movable shaft (301) is movably connected to a first movable column (303), and one side of the first movable column (303) is fixedly connected to a second movable shaft (304).

3. The nozzle for a chip mounter with uniform downward pressure according to claim 2, characterized in that: The outer side of the second movable shaft (304) is movably connected to a second movable column (305), and one side of the second movable column (305) is fixedly connected to a telescopic side plate (306).

4. The nozzle for a chip mounter with uniform downward pressure according to claim 3, characterized in that: One side of the telescopic side plate (306) is fixedly connected to a telescopic base (307), one side of the telescopic base (307) is fixedly connected to a connecting shaft (308), and the outer side of the connecting shaft (308) is movably connected to a connecting column (309).

5. The chip placement machine nozzle with uniform downward pressure according to claim 4, characterized in that: A first suction nozzle (310) is fixedly connected to one side of the telescopic base (307).

6. The chip placement machine nozzle with uniform downward pressure according to claim 5, characterized in that: One side of the telescopic base (307) is movably connected to a telescopic main board (311), and one side of the telescopic main board (311) is fixedly connected to a second suction nozzle (312).

7. The nozzle for a placement machine with uniform downward pressure according to claim 6, characterized in that: A third movable column (313) is fixedly connected to the lower side of the telescopic main plate (311), and a third movable shaft (314) is movably connected to the inner side of the third movable column (313).

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