IC binding device of LCD screen
By designing the IC binding device of the LCD screen, the stable connection between the IC and the LCD screen is achieved using components such as ITO glass and flexible conductive paper, solving the problem of insufficient space in the LCD screen, realizing the function of COG packaging, and improving installation efficiency and adaptability.
Patent Information
- Application Number
- CN202422818756.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-11-19
AI Technical Summary
In the prior art, due to overall structural limitations, there is not enough space to place an IC on the LCD screen, resulting in the inability to realize the function of COG packaging, and the device that increases costs may be uneconomical.
An IC binding device for LCD screen is designed, including the entire machine housing, LCD screen main body, ITO glass, electrode wire, flexible conductive paper and fixing components. The connection between the IC and the LCD screen is achieved through the flexible conductive paper and fixing components, and the return spring and guide rod are used to ensure the stable installation of the IC.
Without significantly increasing costs, an IC binding area is provided and a stable connection between the IC and the LCD screen is realized, which simplifies the installation process, improves installation efficiency and stability, and adapts to the flexibility and versatility of different LCD screens.
Smart Images

Figure CN223308506U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of IC binding, in particular to an IC binding device for an LCD screen. Background Art
[0002] As the name suggests, COG packaging in LCD technology reduces system costs by directly mounting the LCD driver on the display. This technology, essentially chip-on-glass, directly packages the driver IC onto the LCD glass using anisotropic conductive adhesive (ACF), interconnecting and encapsulating the driver IC's conductive bumps with the transparent ITO conductive pads on the LCD glass to illuminate the screen. The main advantage of this technology over COB technology is that it reduces the number of traces and layers on the PCB, thereby reducing the size and complexity of the board. Compared to traditional packaging methods, LCD products are thinner, more reliable, more flexible, and have a simpler production process, making it an economical and reliable technology for LCD displays.
[0003] The unique feature of COG packaging is that the driver IC is bonded to the LCD screen. This requires more space on the LCD screen to bond the IC. However, some products lack sufficient space for IC placement due to their overall structure. In this case, a device is needed that can provide an IC bonding area and connect the IC to the LCD screen so that the IC can drive the screen, thus fulfilling the COG packaging function without significantly increasing costs. Therefore, an IC bonding device for LCD screens is proposed to address this problem. Utility Model Content
[0004] In order to make up for the above shortcomings, the utility model provides an IC binding device for an LCD screen, which aims to improve the problem in the prior art that is affected by the overall structure and there is not enough space to place the IC. At this time, a device is needed that can provide a binding area for the IC and realize the connection between the IC and the LCD screen so that the IC drives the screen, that is, to meet the function of COG packaging without significantly increasing the cost.
[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: an IC binding device for an LCD screen, comprising a complete machine housing, the inner wall of the complete machine housing is fixedly connected to an LCD screen body, the connection end of the LCD screen body extends to the outside of the complete machine housing, the connection end of the LCD screen body is provided with an external component, the external component comprises ITO glass, an electrode line 1 is provided on the surface of the ITO glass, the electrode line 1 and the connection end of the LCD screen body are fixedly connected via flexible conductive paper, a conductive pad is provided on the surface of the ITO glass, the conductive pad is fixedly connected to the end of the electrode line 1, and the IC body is provided on the surface of the conductive pad.
[0006] As a further description of the above technical solution:
[0007] The surface of the ITO glass is provided with two groups of symmetrically arranged mounting grooves, and fixing components are arranged inside the mounting grooves.
[0008] As a further description of the above technical solution:
[0009] The fixing assembly includes a slide plate, which is elastically connected to the inner wall of the mounting groove through a return spring.
[0010] As a further description of the above technical solution:
[0011] The side walls of the slide are fixedly connected with connecting rods, and the ends of the connecting rods are fixedly connected with clamping plates.
[0012] As a further description of the above technical solution:
[0013] A groove is provided on the bottom surface of the splint, and the inner wall of the top of the groove is arranged in an inclined shape.
[0014] As a further description of the above technical solution:
[0015] A driving pad is fixedly connected to the surface of the ITO glass, and the driving pad is fixedly connected to the conductive pad via a second electrode line.
[0016] As a further description of the above technical solution:
[0017] The second electrode line is fixedly connected to the surface of the ITO glass, and the surface of the driving pad is fixedly connected to an FPC.
[0018] As a further description of the above technical solution:
[0019] A guide rod is fixedly connected to the interior of the mounting groove, and the guide rod passes through and is slidably connected to the side wall of the slide plate.
[0020] The utility model has the following beneficial effects:
[0021] 1. In the present invention, one end of the FPC is crimped onto the driving electrode of the driving pad, and the other end is connected to the external driving device. The electrode line 2 connects the FPC and the IC body together to transmit signals. The IC body is connected to the connection end of the LCD screen body through the conductive pad, the electrode line 1, and the flexible conductive paper, thereby realizing external driving of the LCD screen similar to the COG mode under the condition of small host space.
[0022] 2. In the present invention, a return spring is used to provide elastic support for the slide, so that the slides in the two sets of mounting grooves move toward each other, the clamping plates contact the two sides of the IC body, and the two sides of the IC body enter the grooves. The surface of the IC body is squeezed by the inside of the inclined groove, providing a downward force on the IC body, so that the IC body is stably installed on the conductive pad, which facilitates the installation of the IC body. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a schematic diagram of the overall structure of an IC binding device for an LCD screen proposed by the present invention;
[0024] Figure 2 This is a schematic diagram of the external component structure of an IC binding device for an LCD screen proposed by the present invention;
[0025] Figure 3 This is a schematic diagram of the fixing component structure of an IC binding device for an LCD screen proposed by the present invention.
[0026] Legend:
[0027] 1. Complete housing; 2. LCD screen body; 3. External components; 31. ITO glass; 32. Electrode line 1; 33. Flexible conductive paper; 34. Conductive pad; 35. IC body; 36. Drive pad; 37. FPC; 38. Mounting slot; 39. Electrode line 2; 4. Fixing assembly; 41. Slide plate; 42. Reset spring; 43. Guide rod; 44. Connecting rod; 45. Clamp; 46. Groove. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] Reference Figure 1 The present invention provides an embodiment of an IC binding device for an LCD screen, comprising a whole machine housing 1, an LCD screen body 2 fixedly connected to the inner wall of the whole machine housing 1, and a connection end of the LCD screen body 2 extending to the outside of the whole machine housing 1. By following the logical relationship of the LCD screen, the electrode terminals for driving the internal pixels are led out to the outside of the whole machine housing 1, so that the connection end of the LCD screen body 2 can be accessed from the outside.
[0030] Reference Figure 1 - Figure 2The connection end of the LCD screen body 2 is provided with an external component 3, which includes an ITO glass 31. An electrode line 32 is provided on the surface of the ITO glass 31. The electrode line 32 is fixedly connected to the connection end of the LCD screen body 2 via a flexible conductive paper 33. The ITO glass 31 is transparent conductive glass. The number of electrode lines 32 is arranged according to the logic requirements of the LCD screen. The flexible conductive paper 33 is used to connect the connection end of the LCD screen body 2 to the electrode line 32, and the flexible conductive paper 33 is bendable.
[0031] Reference Figure 1 - Figure 2 A conductive pad 34 is provided on the surface of the ITO glass 31, and the conductive pad 34 is fixedly connected to the end of the electrode line 1 32. An IC body 35 is provided on the surface of the conductive pad 34, and the conductive bumps of the IC body 35 are bound according to the position of the corresponding conductive pad 34. A driving pad 36 is fixedly connected to the surface of the ITO glass 31, and the driving pad 36 is fixedly connected to the conductive pad 34 through the electrode line 2 39. The electrode line 2 39 is fixedly connected to the surface of the ITO glass 31, and an FPC 37 is fixedly connected to the surface of the driving pad 36. One end of the FPC 37 is crimped on the driving electrode of the driving pad 36, and the other end is connected to the external driving device. The electrode line 2 39 connects the FPC 37 and the IC body 35 together for signal transmission. The IC body 35 is connected to the connection end of the LCD screen body 2 through the conductive pad 34, the electrode line 1 32, and the flexible conductive paper 33, thereby realizing external driving of the LCD screen similar to the COG mode under the condition of small host space.
[0032] Reference Figure 2 - Figure 3The surface of the ITO glass 31 is provided with two groups of symmetrically arranged mounting grooves 38, which are used to accommodate and install subsequent fixing components 4. The interior of the mounting groove 38 is provided with a fixing component 4, which includes a slide 41. The slide 41 is elastically connected to the inner wall of the mounting groove 38 through a return spring 42. The return spring 42 is used to provide elastic support for the slide 41, so that the slides 41 in the two groups of mounting grooves 38 move toward each other. The interior of the mounting groove 38 is fixedly connected to a guide rod 43, which passes through and is slidably connected to the side wall of the slide 41. The guide rod 43 is used to guide the slide 41, and the Shudie slide 41 moves stably inside the mounting groove 38. The side wall of the slide 41 is fixedly connected to a connecting rod 44, and the end of the connecting rod 44 is fixedly connected to a clamping plate 45. The bottom surface of the clamping plate 45 is provided with a groove 46, and the inner wall of the top of the groove 46 is set to an inclined shape. The connecting rod 44 connects the clamping plate 45 and the slide 41 together so that the two move synchronously. The universal clamping plate 45 contacts both sides of the IC body 35 and allows both sides of the IC body 35 to enter the groove 46. The surface of the IC body 35 is squeezed by the inside of the inclined groove 46, providing the IC body 35 with a downward force, so that the IC body 35 is stably installed on the conductive pad 34, which is convenient for the installation of the IC body 35.
[0033] Working Principle: To install the IC body 35, the operator simply pushes the clamps 45 in the two mounting grooves 38 toward each other. The clamps 45 drive the connecting rod 44 and the slide 41 to slide along the guide rod 43 within the mounting groove 38. This compresses the return spring 42 and accumulates elastic potential energy. When the two clamps 45 are close together, the top inner wall of the groove 46 no longer exerts pressure on the IC body 35. The operator can now place the IC body 35 on the conductive pad 34, aligning the conductive bumps of the IC body 35 with the conductive pad 34. The operator then releases the force on the clamps 45. The return spring 42 releases its elastic potential energy and pushes the slide 41 along the guide rod 43 away from its initial position, thereby driving the connecting rod 44 and clamps 45. Because the top inner wall of the groove 46 is inclined, as the clamps 45 move, the top inner wall of the groove 46 exerts downward pressure on the IC body 35, ensuring a stable installation on the conductive pad 34. The installation process of the IC body 35 is made simple and quick, and no additional fixing tools or materials are required, thereby greatly improving the installation efficiency and stability.
[0034] Furthermore, the presence of flexible conductive paper 33 makes the connection between the connection end of LCD screen body 2 and electrode line 1 32 more reliable. Flexible conductive paper 33 not only has excellent electrical conductivity but can also bend and deform to accommodate LCD screen bodies 2 of varying shapes and sizes. This design allows the device to be highly flexible and versatile in adapting to various LCD screens. By connecting FPC 37 and IC body 35 together via electrode line 2 39, fast and stable signal transmission is achieved. Simultaneously, one end of FPC 37 is crimped onto the drive electrode of drive pad 36, while the other end is connected to an external drive device, allowing the external drive device to conveniently control the display content and effects of LCD screen body 2.
[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. An IC binding device for an LCD screen, comprising a housing (1), characterized in that: The inner wall of the whole machine housing (1) is fixedly connected to an LCD screen body (2), the connection end of the LCD screen body (2) extends to the outside of the whole machine housing (1), the connection end of the LCD screen body (2) is provided with an external component (3), the external component (3) comprises an ITO glass (31), an electrode line 1 (32) is provided on the surface of the ITO glass (31), the electrode line 1 (32) and the connection end of the LCD screen body (2) are fixedly connected via a flexible conductive paper (33), a conductive pad (34) is provided on the surface of the ITO glass (31), the conductive pad (34) is fixedly connected to the end of the electrode line 1 (32), and an IC body (35) is provided on the surface of the conductive pad (34).
2. The IC binding device for an LCD screen according to claim 1, characterized in that: The surface of the ITO glass (31) is provided with two groups of symmetrically arranged mounting grooves (38), and a fixing assembly (4) is arranged inside the mounting grooves (38).
3. The IC binding device for an LCD screen according to claim 2, wherein: The fixing assembly (4) comprises a slide plate (41), and the slide plate (41) is elastically connected to the inner wall of the mounting groove (38) via a return spring (42).
4. The IC binding device for an LCD screen according to claim 3, characterized in that: The side wall of the slide plate (41) is fixedly connected to a connecting rod (44), and the end of the connecting rod (44) is fixedly connected to a clamping plate (45).
5. The IC binding device for an LCD screen according to claim 4, characterized in that: A groove (46) is provided on the bottom surface of the clamping plate (45), and the inner wall of the top of the groove (46) is arranged in an inclined shape.
6. The IC binding device for an LCD screen according to claim 1, characterized in that: A driving pad (36) is fixedly connected to the surface of the ITO glass (31), and the driving pad (36) is fixedly connected to the conductive pad (34) via a second electrode line (39).
7. The IC binding device for an LCD screen according to claim 6, characterized in that: The second electrode line (39) is fixedly connected to the surface of the ITO glass (31), and the surface of the driving pad (36) is fixedly connected to an FPC (37).
8. The IC binding device for an LCD screen according to claim 3, characterized in that: A guide rod (43) is fixedly connected to the interior of the installation groove (38), and the guide rod (43) passes through and is slidably connected to the side wall of the slide plate (41).