Liquid cooling plate

Abstract

The utility model discloses a liquid cooling plate, which comprises a plate body, a cooling plate and a cooling pipe, and is characterized in that the plate body is used for bearing a heating element; the cooling plate is arranged on the plate body and located at the projection position of the heating element on the plate body. The cooling pipe is arranged on the plate body and is in butt joint with the cooling plate; a snakelike micro-channel is formed in the cooling plate, the cooling pipe and the micro-channel are communicated and combined to form a cooling channel, and the cooling channel is used for circulation of cooling liquid. By arranging the cooling plate with the micro-channel, the local heat exchange efficiency on the liquid cooling plate is improved, and the heating element is rapidly cooled, so that the uniformity of overall temperature distribution on the liquid cooling plate is better.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a liquid cooling plate. Background Art

[0002] With the rapid development of the electronics industry and the continuous upgrading of electronic devices, the information processing capabilities of current electronic devices are constantly increasing, and with them, the operating power density is also constantly increasing, which can lead to severe heating of electronic devices. In particular, data processing modules such as chips generate large amounts of localized heat, which easily leads to heat accumulation in electronic devices, reducing their electrical performance. Therefore, heat dissipation devices are essential functional modules in existing electronic devices. Commonly, buried tube liquid cooling plates are used as cooling devices. By welding them to the electronic device, they cool the entire device.

[0003] However, traditional liquid cooling plates only dissipate heat on the surface of the entire electronic device, and have limited cooling effect on high-heat-consuming heat-generating components such as chips. This results in low overall temperature uniformity on the liquid cooling plate, low convective heat transfer efficiency between the liquid cooling plate and the electronic device, and heat cannot be effectively removed by the coolant.

[0004] Therefore, the existing technology still needs to be improved and developed. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a liquid cooling plate, aiming to solve the problems of low heat exchange efficiency and unreliable cooling effect between the existing liquid cooling plate and electronic equipment.

[0006] The technical solution of the utility model is as follows:

[0007] A liquid cooling plate, comprising a plate body, a cooling plate and a cooling tube, wherein the plate body is used to carry a heating element; the cooling plate is arranged on the plate body, located at the position where the heating element is projected on the plate body; the cooling tube is arranged on the plate body and docked with the cooling plate; a serpentine microchannel is formed in the cooling plate, and the inner cavity of the cooling tube is connected to the microchannel and combined into a cooling channel, and the cooling channel is used to circulate cooling liquid.

[0008] The liquid cooling plate includes a base and a cover plate, the base is provided with a plurality of serpentine grooves; the cover plate is connected to the base and covers the serpentine grooves to form the microchannel.

[0009] The liquid cooling plate, wherein the cooling plate is rectangular in shape, and a liquid inlet port and a liquid outlet port are provided on the cooling plate along the length direction, and the liquid inlet port and the liquid outlet port are connected through the microchannel; the serpentine groove extends along the width direction of the cooling plate, and several of the serpentine grooves are arranged sequentially along the length direction of the cooling plate.

[0010] The liquid cooling plate, wherein the base is provided with a plurality of connection holes, and the plurality of connection holes are arranged at intervals at the edge of the base; the connection holes are used to insert bolts to connect the plate body.

[0011] The liquid cooling plate, wherein a first accommodating groove and a second accommodating groove are formed on the plate body, the second accommodating groove is arranged at the position where the heating element is projected on the plate body, and is used to arrange the cooling plate; the first accommodating groove is connected to the second accommodating groove for arranging the cooling pipe.

[0012] The liquid cooling plate, wherein the diameter of the cooling tube is less than or equal to the depth of the first receiving groove; and / or the thickness of the cooling plate is less than or equal to the depth of the second receiving groove.

[0013] The liquid cooling plate, wherein the cooling tubes and the cooling plates are both provided in plurality, and the cooling tubes and the cooling plates are alternately arranged on the plate body.

[0014] The liquid cooling plate, wherein the cooling tube is any one of a copper metal tube, an aluminum alloy tube, and a stainless steel tube; and / or the cooling plate is any one of a copper plate, an aluminum alloy plate, and a stainless steel plate.

[0015] The liquid cooling plate further comprises a water nozzle, which is arranged on the plate body; the water nozzle is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole is connected to the inlet of the cooling channel, and the liquid outlet hole is connected to the outlet of the cooling channel.

[0016] The liquid cooling plate, wherein the cooling pipe is welded to the cooling plate.

[0017] Compared with the prior art, the embodiment of the present invention has the following advantages:

[0018] The liquid cooling plate disclosed by the present invention is used to cool heating elements such as chips, printed circuit boards, and resistors. The plate body contacts the heating element, generating heat transfer, and then the heat on the plate body is taken away by the cooling liquid in the cooling pipe or the cooling plate to achieve a cooling effect. In particular, in view of the situation where the heat of the heating element is concentrated, a cooling plate is set at the position of the corresponding heating element. A serpentine microchannel is set in the cooling plate. Compared with the cooling pipes arranged in a straight line, the internal space of the cooling plate is large, the coolant stays in the cooling plate for a long time, the convective heat exchange efficiency is high, and it has the characteristics of good cooling effect.

[0019] In summary, the present invention improves the local heat exchange efficiency of the liquid cooling plate and the cooling efficiency of the heat-generating components, so that the heat from all parts of the electronic equipment can be quickly removed, thereby improving the uniformity of the temperature distribution on the surface of the liquid cooling plate and the entire electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 This is a schematic diagram of the structure of the liquid cooling plate in the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of the plate body in the utility model;

[0023] Figure 3 This is a partial structural diagram of the cooling plate and cooling pipe in the present invention in an assembled state;

[0024] Figure 4 It is a structural schematic diagram of the substrate in the present utility model.

[0025] Among them, 100, plate body; 110, first receiving tank; 120, second receiving tank; 200, cooling plate; 210, microchannel; 220, base; 221, serpentine groove; 222, connecting hole; 230, cover plate; 240, liquid inlet port; 250, liquid outlet port; 300, cooling pipe; 400, water nozzle. DETAILED DESCRIPTION

[0026] In order to help those skilled in the art better understand the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The use of electronic devices in the existing technology is increasing, such as mobile phones, computers, servers, etc. With the continuous updating and iteration of electronic devices, there are more and more heat-generating components (such as chips, image processors, capacitors, resistors, etc.) on electronic devices. In order to ensure the safe use of electronic devices, it is necessary to assemble cooling devices on electronic devices, such as fans, water cooling devices, etc. Since the water cooling effect is better than the air cooling effect, water cooling devices are gradually replacing cooling fans and are increasingly used in electronic devices.

[0028] Current water-cooling systems often achieve cooling by coiling water-cooling pipes around heat-generating components to absorb heat, with the coolant inside the pipes removing the heat. However, during use, electrical components in different locations on electronic devices have different power levels and generate varying amounts of heat. Therefore, water-cooling systems can only remove heat from low-temperature areas, while areas with concentrated high temperatures are unable to effectively dissipate heat.

[0029] See Figure 1 、 Figure 2 and Figure 3 In one embodiment of the utility model application, a liquid cooling plate is disclosed, which includes a plate body 100, a cooling plate 200 and a cooling tube 300, wherein the plate body 100 is used to carry a heating element; the cooling plate 200 is arranged on the plate body 100, and is located at a position where the heating element is projected on the plate body 100; the cooling tube 300 is arranged on the plate body 100, and is connected to the cooling plate 200; a serpentine microchannel 210 is formed in the cooling plate 200, and the inner cavity of the cooling tube 300 is connected to the microchannel 210 and combined into a cooling channel, and the cooling channel is used to circulate cooling liquid.

[0030] The liquid cooling plate disclosed in this embodiment can be used to cool heating elements such as chips, printed circuit boards, and resistors. The liquid cooling plate can be assembled to electronic devices by welding, bonding, screwing, snapping, etc. It should be noted that the types of heating elements are only listed in this embodiment, but the protection scope of the present invention is not limited to this. Other types of heating elements, such as insulated gate bipolar transistors (IGBTs), can also use the liquid cooling plate disclosed in this embodiment for heat dissipation. As an equivalent replacement of the concept of the present invention, it should also be within the scope of protection of this application.

[0031] Specifically, during use, the plate 100 is in close contact with the electronic device. Heat from the electronic device is conducted through the plate 100 and carried away by the cooling tube 300 and the coolant within the cooling plate 200, achieving a heat dissipation function. The plate 100 contacts the heating element, generating heat transfer, which is then carried away by the coolant within the cooling plate 200, achieving a cooling effect. To address the concentrated heat from the heating element, the cooling plate 200 is equipped with serpentine microchannels 210.

[0032] Compared to linearly arranged cooling tubes 300, the interior of the cooling plate 200 is narrow and elongated, providing a longer liquid flow path and extending the coolant's residence time within the cooling plate 200. This results in high convective heat transfer efficiency and excellent cooling performance. For heating components with demanding heat dissipation requirements, the cooling plate 200 disclosed in this embodiment offers the advantages of high heat dissipation efficiency and reliable heat dissipation.

[0033] In summary, the liquid cooling plate disclosed in this embodiment achieves heat conduction by contacting the electronic device, thereby dissipating heat from the electronic device. Cooling plates 200 are placed in high-temperature areas where heat is concentrated for efficient heat dissipation. Other locations are connected via cooling pipes 300, also performing simultaneous heat exchange, completing the heat dissipation function with relatively low heat exchange efficiency. The overall structure is compact, the process is simple, and the processing cost is low.

[0034] Overall, the coolant in the cooling plate 200 equipped with the microchannel 210 flows slowly, but has a high heat exchange efficiency. The coolant in the cooling tube 300 flows quickly, but has a low heat exchange efficiency. Therefore, the cooling tube 300 is connected to the cooling plate 200 and arranged reasonably so that the heat in each area of ​​the electronic device can be quickly removed, thereby improving the uniformity of the temperature distribution on the surface of the liquid cooling plate and the entire electronic device.

[0035] Specifically, the coolant disclosed in this embodiment can be water or oil, and can be driven by an external water pump or oil pump so that the coolant circulates in the cooling channel to continuously dissipate heat.

[0036] like Figure 1 As shown, as an implementation of this embodiment, it is disclosed that a plurality of cooling pipes 300 and a plurality of cooling plates 200 are provided, and the cooling pipes 300 and the cooling plates 200 are alternately arranged on the plate body 100 .

[0037] The liquid cooling plate disclosed in this embodiment can be configured with a number of cooling plates 200 according to the actual usage scenario. For example, if an electronic device has four high-power heating elements, four cooling plates 200 can be installed, corresponding to the positions of the four heating elements, to improve local heat dissipation efficiency. The four cooling plates 200 can be connected by three cooling pipes 300. In addition, along the direction of coolant flow, a cooling pipe 300 connected to an external pump body is provided before the first cooling plate 200, and another cooling pipe 300 connected to an external pump body is provided after the last cooling plate 200.

[0038] In this embodiment, the number of cooling plates 200 is flexibly set to accommodate more usage scenarios, thereby increasing the adaptability of the liquid cooling plate and facilitating use in multiple occasions.

[0039] Specifically, as another embodiment of this invention, the cooling pipe 300 is any one of a copper metal pipe, an aluminum alloy pipe, and a stainless steel pipe. By utilizing the excellent thermal conductivity and heat resistance of metals such as copper, aluminum, and iron, the cooling pipe 300 can be manufactured to provide long-term and stable use.

[0040] Specifically, as another implementation of this embodiment, it is disclosed that the cooling plate 200 is any one of a copper plate, an aluminum alloy plate, and a stainless steel plate.

[0041] The cooling plate 200 disclosed in this embodiment can be manufactured from the same material as the cooling tube 300, thereby reducing the number of raw materials used in the liquid cooling plate and lowering production costs. Preferably, the plate 100, cooling plate 200, and cooling tube 300 can all be manufactured from copper metal blocks, which offers a low-cost raw material and a stable product structure and performance, ensuring long-term use.

[0042] For example Figure 1 As shown, as another implementation of this embodiment, the liquid cooling plate further includes a water nozzle 400, which is provided on the plate body 100. The water nozzle 400 is provided with a liquid inlet and a liquid outlet, the liquid inlet being connected to the inlet of the cooling channel, and the liquid outlet being connected to the outlet of the cooling channel. In this embodiment, by providing the water nozzle 400 to connect to the cooling tube 300, the position of the cooling tube 300 is fixed, which improves stability when connected to the external pump body and in use, and facilitates assembly.

[0043] Specifically, the water nozzle 400 disclosed in this embodiment can be processed from a copper block, connected to the cooling pipe 300 by welding, and fixed on the plate body 100, so that the overall structure of the liquid cooling plate is connected into one, remains stable, and is convenient for transportation and use.

[0044] like Figure 2 As shown, as another implementation of this embodiment, a first accommodating groove 110 and a second accommodating groove 120 are formed on the plate body 100, and the second accommodating groove 120 is arranged at the position where the heating element is projected on the plate body 100, and is used to arrange the cooling plate 200; the first accommodating groove 110 is connected to the second accommodating groove 120, and is used to arrange the cooling pipe 300.

[0045] In this embodiment, the plate body 100 is pre-fabricated, and contoured tube grooves are machined on a CNC lathe to form recessed first and second receiving grooves 110 and 120, conforming to the shapes of the cooling tube 300 and cooling plate 200. This facilitates the positioning and assembly of the cooling tube 300 and cooling plate 200. After assembly, the first and second receiving grooves 110 and 120 provide a stable and reliable structure for the liquid cooling plate, facilitating long-term, reliable operation.

[0046] Specifically, as another implementation of this embodiment, it is disclosed that the diameter of the cooling pipe 300 is less than or equal to the depth value of the first receiving groove 110. The cooling pipe 300 is assembled into the first receiving groove 110 in a concealed manner, which can reduce collision and contact, improve the concealment of the cooling pipe 300 during the use of the liquid cooling plate, and avoid damage or breakage. In the actual processing process, the cooling pipe 300 is first placed in the first receiving groove 110. If part of the cooling pipe 300 protrudes outside the first receiving groove 110, it can be appropriately squeezed to transform the cooling pipe 300 from a round tube into a flat tube, so that it is completely hidden in the first receiving groove 110 to keep the surface of the liquid cooling plate flat.

[0047] Specifically, as another implementation of this embodiment, the thickness of the cooling plate 200 is disclosed to be less than or equal to the depth of the second receiving groove 120. The cooling plate 200 is completely accommodated in the second receiving groove 120, which can reduce bumps and damage. Furthermore, during use, the sidewalls of the second receiving groove 120 limit the position of the cooling plate 200, reducing shaking and making the overall structure of the liquid cooling plate more stable.

[0048] Specifically, in another implementation of this embodiment, the diameter of the cooling tube 300 is less than or equal to the depth of the first receiving groove 110, and the thickness of the cooling plate 200 is less than or equal to the depth of the second receiving groove 120. The surface of the liquid cooling plate has no protrusions, so both sides are relatively flat. Heat generating elements can be installed on both sides of the liquid cooling plate, thereby improving the efficiency of the liquid cooling plate.

[0049] In the actual manufacturing process, in order to completely hide the cooling pipe 300 and the cooling plate 200, a CNC lathe can be used to dig out contoured grooves on the plate body 100 to improve the matching degree between the first accommodating groove 110 and the cooling pipe 300, as well as the matching degree between the second accommodating groove 120 and the cooling plate 200, thereby further improving the compactness of the liquid cooling plate structure.

[0050] like Figure 3 As shown, as another implementation of this embodiment, the cooling plate 200 is disclosed to include a base 220 and a cover plate 230, and the base 220 is provided with a plurality of serpentine grooves 221; the cover plate 230 is connected to the base 220 and covers the serpentine grooves 221 to form the microchannel 210.

[0051] The cooling plate 200 disclosed in this embodiment can be processed by a CNC machine tool to form a serpentine groove 221 on the base 220, and then covered with a cover plate 230, and sealed by welding or bonding to form a microchannel 210. The processing process is simple and the precision is high, and the structure is compact.

[0052] For example Figure 3 As shown, as another implementation of this embodiment, it is disclosed that the shape of the cooling plate 200 is rectangular, and the cooling plate 200 is provided with a liquid inlet port 240 and a liquid outlet port 250 along the length direction, and the liquid inlet port 240 and the liquid outlet port 250 are connected through the microchannel 210; the serpentine groove 221 extends along the width direction of the cooling plate 200, and several of the serpentine grooves 221 are arranged sequentially along the length direction of the cooling plate 200.

[0053] In this embodiment, the cooling plate 200 is configured in a rectangular shape for ease of manufacturing, positioning, and assembly onto the plate body 100. During assembly, the front and rear cooling tubes 300 are connected in an extended direction, so that the inner cavity of the front cooling tube 300 communicates with the microchannel 210 through the liquid inlet port 240, and the microchannel 210 communicates with the rear cooling tube 300 through the liquid outlet port 250. Specifically, the serpentine groove 221 extends along the width of the cooling plate 200, perpendicular to the flow direction of the coolant on the cooling plate 200. Therefore, when the coolant flows into the serpentine groove 221, it encounters multiple corners, generating turbulence at the corners, promoting heat convection and conduction, and thus improving heat dissipation efficiency.

[0054] In addition, the liquid flow rate in the serpentine groove 221 is uniform, and there will be no heat short circuit or backflow. During operation, the vibration of the cooling plate 200 is reduced, and the stability is good.

[0055] Specifically, setting up multiple serpentine grooves 221 can further increase the heat transfer efficiency. Multiple serpentine grooves 221 are arranged sequentially along the length direction of the cooling plate 200, and try to cover the entire cooling plate 200, thereby further improving the heat dissipation efficiency of the cooling plate 200 and enhancing the local heat dissipation performance.

[0056] Specifically, as another implementation of this embodiment, the cooling pipe 300 is welded to the cooling plate 200. In this embodiment, by pre-welding the cooling pipe 300 and the cooling plate 200, the cooling plate 200 and the cooling pipe 300 are firmly connected, allowing for integrated transportation and installation, making them convenient to use.

[0057] like Figure 4 As shown, as another implementation of this embodiment, a plurality of connection holes 222 are provided on the base 220, and the plurality of connection holes 222 are spaced apart at the edge of the base 220; the connection holes 222 are used to insert bolts to connect the plate body 100.

[0058] The liquid cooling plate disclosed in this embodiment can be secured via connection holes 222 provided in the base 220. Multiple bolts secure the cooling plate 200 to the plate body 100, while the cooling tubes 300 are integrally connected to the cooling plate 200, thereby achieving securement. This embodiment eliminates the need for welding the tubes along the piping path; instead, bolting is performed at key points. This improves assembly and disassembly efficiency and optimizes the processing and manufacturing of the liquid cooling plate.

[0059] In summary, the present application discloses a liquid cooling plate, which includes a plate body 100, a cooling plate 200 and a cooling tube 300, wherein the plate body 100 is used to carry a heating element; the cooling plate 200 is provided on the plate body 100, and is located at the position where the heating element is projected on the plate body 100; the cooling tube 300 is provided on the plate body 100, and is docked with the cooling plate 200; a serpentine microchannel 210 is formed in the cooling plate 200, and the inner cavity of the cooling tube 300 is connected with the microchannel 210 and combined into a cooling channel, and the cooling channel is used to circulate cooling liquid. This embodiment improves the cooling efficiency of the heating element by improving the local heat exchange efficiency of the liquid cooling plate, so that the heat from all parts of the electronic device can be quickly taken away, thereby improving the uniformity of the temperature distribution of the liquid cooling plate surface and the electronic device as a whole.

[0060] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0061] It should be noted that the present invention takes a liquid cooling plate as an example to introduce the specific structure and working principle of the present invention, but the application of the present invention is not limited to the liquid cooling plate, and can also be applied to the production and use of other similar workpieces.

[0062] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A liquid cooling plate, characterized in that: include: The plate body is used to carry the heating element; a cooling plate, provided on the plate body and located at a position where the heating element is projected on the plate body; A cooling pipe is provided on the plate body and docked with the cooling plate; Wherein, a serpentine microchannel is formed in the cooling plate, the inner cavity of the cooling tube is connected to the microchannel and combined into a cooling channel, and the cooling channel is used to circulate the cooling liquid; A first accommodating groove and a second accommodating groove are formed on the plate body. The second accommodating groove is located at the position where the heating element is projected on the plate body and is used to arrange the cooling plate. The first accommodating groove is connected to the second accommodating groove and is used to arrange the cooling pipe.

2. The liquid cooling plate according to claim 1, wherein: The cooling plate comprises: A base, wherein the base is provided with a plurality of serpentine grooves; The cover plate is connected to the base and covers the serpentine groove to form the microchannel.

3. The liquid cooling plate according to claim 2, wherein: The cooling plate is rectangular in shape, and is provided with a liquid inlet port and a liquid outlet port along the length direction of the cooling plate, and the liquid inlet port and the liquid outlet port are connected through the microchannel; The serpentine groove extends along the width direction of the cooling plate, and a plurality of the serpentine grooves are arranged in sequence along the length direction of the cooling plate.

4. The liquid cooling plate according to claim 2, wherein: The base is provided with a plurality of connection holes, which are spaced apart at the edge of the base; the connection holes are used to insert bolts to connect the plate bodies.

5. The liquid cooling plate according to claim 1, wherein: The diameter of the cooling pipe is less than or equal to the depth of the first receiving groove; and / or the thickness of the cooling plate is less than or equal to the depth of the second receiving groove.

6. The liquid cooling plate according to any one of claims 1 to 5, characterized in that: A plurality of cooling pipes and a plurality of cooling plates are provided, and the cooling pipes and the cooling plates are alternately arranged on the plate body.

7. The liquid cooling plate according to any one of claims 1 to 5, characterized in that: The cooling tube is any one of a copper metal tube, an aluminum alloy tube, and a stainless steel tube; and / or the cooling plate is any one of a copper plate, an aluminum alloy plate, and a stainless steel plate.

8. The liquid cooling plate according to any one of claims 1 to 5, characterized in that: The liquid cooling plate further includes a water nozzle, which is arranged on the plate body; the water nozzle is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole is connected to the inlet of the cooling channel, and the liquid outlet hole is connected to the outlet of the cooling channel.

9. The liquid cooling plate according to any one of claims 1 to 5, characterized in that: The cooling pipe is welded to the cooling plate.

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