Solar monocrystalline silicon wafer ultrasonic cleaning equipment

Abstract

The utility model discloses solar monocrystalline silicon wafer ultrasonic cleaning equipment, which relates to the technical field of monocrystalline silicon wafers, and comprises a device main body, a side plate, an electric push rod, a linkage block and an auxiliary block, the inner side of the auxiliary block is connected with a bottom plate, the upper part of the bottom plate is connected with a first magnet, and two sides of a fixed block are connected with connecting blocks. A second magnet is connected below the connecting block, a mounting groove is formed above the fixing block, a water inlet is connected below the mounting groove, water outlets are connected to the two sides of the mounting groove, and a partition plate is further connected to the center of the mounting groove. According to the single crystal silicon wafer cleaning device, the mounting groove is formed above the fixing block and matched with the partition plate, water flow enters the mounting groove from the water inlet in the bottom in the cleaning process, double cleaning work of single crystal silicon wafers is achieved, the partition plate is used for separation, different single crystal silicon wafers cannot collide with one another in the cleaning process, and the cleaning efficiency is improved. Therefore, the cleaning effect is ensured, and a plurality of monocrystalline silicon wafers can be cleaned at a time.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon slices, in particular to ultrasonic cleaning equipment for solar single crystal silicon slices. Background Art

[0002] Single-crystal silicon wafers are a key material in the manufacture of integrated circuits and solar cells. Originally developed in the 1950s, they have become a core material in the semiconductor industry. They are grown from extremely pure silicon raw material through multiple meticulous processes into high-purity single-crystal cylinders approximately 300 mm in diameter. Silicon wafers possess highly uniform physical properties and controllable electrical characteristics, making them widely used in the semiconductor industry, solar cells, and other fields. However, existing single-crystal silicon wafers require cleaning during processing.

[0003] An existing patent (Announcement No. CN112259470A) discloses a multi-mode, high-efficiency cleaning device for single-crystal silicon wafers. This device utilizes a serpentine filter channel and a three-stage filter screen to achieve tortuous, efficient filtration of wastewater, facilitating rapid purification and enabling the recyclability of the purified water. During the implementation of this solution, the following problems were discovered in the prior art, which have not been adequately addressed:

[0004] During use, the device directly places the single-crystal silicon wafer on the conveyor belt for cleaning. It can only perform single-side cleaning, which limits the cleaning effect. In addition, only a small number of single-crystal silicon wafers can be cleaned at a time. During the cleaning process, the ultrasonic equipment will continue to vibrate, which can easily cause the single-crystal silicon wafer to separate from the conveyor belt, affecting work efficiency. Utility Model Content

[0005] In order to improve the above-mentioned problem that the single crystal silicon wafer can only be cleaned on one side, the cleaning effect is limited, and it is easy to fall off the conveyor belt during the cleaning process, so only a small amount of cleaning can be performed, the utility model provides a solar single crystal silicon wafer ultrasonic cleaning device.

[0006] The utility model provides an ultrasonic cleaning device for solar single crystal silicon wafers, which adopts the following technical solutions:

[0007] A solar monocrystalline silicon wafer ultrasonic cleaning device comprises a device body and a fixed block, wherein a side plate is connected above the device body, an electric push rod is connected below the side plate, a linkage block is connected below the electric push rod, auxiliary blocks are connected on both sides of the linkage block, a bottom plate is connected inside the auxiliary block, and a first magnet is connected above the bottom plate;

[0008] Connecting blocks are connected to both sides of the fixed block, a second magnet is connected below the connecting block, a mounting groove is provided above the fixed block, a water inlet is connected below the mounting groove, water outlets are connected to both sides of the mounting groove, and a partition is also connected to the center of the mounting groove.

[0009] Through the above technical solution, it is convenient to quickly fix and disassemble the fixed block by cooperating with the linkage block and the first magnet, so that the disassembly and assembly of the single crystal silicon wafer does not affect the cleaning work, thereby improving the cleaning efficiency. In addition, by cooperating with the fixing block and the installation groove, multiple single crystal silicon wafers can be double-cleaned at the same time to ensure the cleaning effect.

[0010] Optionally, in the above-mentioned ultrasonic cleaning equipment for solar monocrystalline silicon wafers, side panels are symmetrically distributed on both sides of the device body, the side panels are in an "L"-shaped structure, the side panels and the electric push rods are in an integrated installation structure, and the electric push rods are symmetrically distributed on both sides of the linkage block.

[0011] The above technical solution makes it easy to fix the electric push rod using the side plate, and at the same time facilitates the lifting and lowering of the linkage block.

[0012] Optionally, in the above-mentioned ultrasonic cleaning equipment for solar monocrystalline silicon wafers, the linkage block and the auxiliary block are connected by hot melt connection, the auxiliary block and the base plate are connected by hot melt connection, and first magnets are symmetrically distributed on both sides above the base plate.

[0013] The above technical solution facilitates the cooperation between the bottom plate and the first magnet, facilitates subsequent auxiliary positioning work, and ensures alignment.

[0014] Optionally, in the above-mentioned ultrasonic cleaning equipment for solar monocrystalline silicon wafers, the first magnet and the second magnet are attracted to each other, the second magnet is symmetrically distributed on both sides below the connecting block, and the connection between the connecting block and the auxiliary block is a sliding connection.

[0015] The above technical solution facilitates the quick disassembly of the fixed block through the connecting block, ensuring that the cleaning work is not affected when the staff is storing and accessing the single crystal silicon wafers.

[0016] Optionally, in the above-mentioned ultrasonic cleaning equipment for solar monocrystalline silicon wafers, mounting grooves are evenly and equidistantly distributed above the fixed block, the length of the mounting grooves is consistent with the length of the water inlet, and water outlets are symmetrically distributed on both sides of the mounting grooves.

[0017] Through the above technical solution, it is convenient to achieve the limited fixation of the single crystal silicon wafer through the cooperation between the fixing block and the installation groove, and the cleaning work is achieved by using the water inlet.

[0018] Optionally, in the above-mentioned ultrasonic cleaning equipment for solar monocrystalline silicon wafers, partitions are symmetrically distributed on the inner side of the mounting groove, the mounting groove and the partitions are connected by hot melt connection, and the width of the partitions is consistent with the width of the inner wall of the mounting groove.

[0019] Through the above technical solution, it is convenient to use partitions to prevent single crystal silicon wafers from colliding with each other during the cleaning process, thereby protecting the single crystal silicon wafers from double cleaning.

[0020] In summary, the present invention has at least one of the following beneficial effects:

[0021] By connecting the side panels and linkage blocks above the main body of the device, the linkage blocks are driven up and down by an electric push rod, thereby driving multiple single-crystal silicon wafers into the main body of the device for cleaning. At the same time, the auxiliary blocks cooperate with the connection blocks to quickly disassemble multiple single-crystal silicon wafers, so that the installation and cleaning of single-crystal silicon wafers can be carried out separately, thereby improving work efficiency.

[0022] By opening a mounting groove above the fixed block and cooperating with a partition, water flows into the mounting groove from the water inlet at the bottom during the cleaning process, thereby achieving double cleaning of the single crystal silicon wafers. The partition is used to separate different single crystal silicon wafers so that they will not collide with each other during the cleaning process, thereby ensuring the cleaning effect and cleaning multiple single crystal silicon wafers at one time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall front view structure of the utility model;

[0024] Figure 2 This is a schematic diagram of the overall top view of the structure of the utility model;

[0025] Figure 3 This is a schematic diagram of the top view of the fixed block structure of the utility model;

[0026] Figure 4 This utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0027] In the figure: 1. Device body; 2. Side panel; 3. Electric push rod; 4. Linkage block; 5. Auxiliary block; 6. Bottom plate; 7. First magnet; 8. Fixed block; 9. Connecting block; 10. Second magnet; 11. Mounting slot; 12. Partition; 13. Water inlet; 14. Water outlet. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-4 The utility model is described in further detail.

[0029] Please refer to the attached figure in the instruction manual Figure 1-4, the utility model provides an embodiment: a solar single crystal silicon wafer ultrasonic cleaning device, including a device body 1 and a fixed block 8, the device body 1 is connected to the top of the side plate 2, the side plate 2 is connected to the bottom of the electric push rod 3, the electric push rod 3 drives the linkage block 4 to rise and fall, thereby realizing the subsequent single crystal silicon wafer access work, the bottom of the electric push rod 3 is connected to the linkage block 4, the two sides of the linkage block 4 are connected to the auxiliary blocks 5, the auxiliary blocks 5 are connected to the bottom plate 6 by the auxiliary blocks 5, thereby limiting the connection block 9 to prevent it from shaking, the inner side of the auxiliary block 5 is connected to the bottom plate 6, the top of the bottom plate 6 is connected to the first magnet 7, and the first magnet 7 absorbs the second magnet 10 to complete the rapid positioning work;

[0030] Connecting blocks 9 are connected to both sides of the fixed block 8, and a second magnet 10 is connected to the bottom of the connecting block 9. The connecting blocks 9 are used to connect the fixed block 8 for easy cleaning. A mounting groove 11 is provided above the fixed block 8, and a water inlet 13 is connected to the bottom of the mounting groove 11. Water flows through the water inlet 13 to achieve cleaning. Water outlets 14 are connected to both sides of the mounting groove 11, and a partition 12 is also connected to the center of the mounting groove 11. The partition 12 separates the single crystal silicon wafers to prevent them from affecting each other.

[0031] See the attached drawings in the specification Figure 1-4 The side panels 2 are symmetrically distributed on both sides of the device body 1. The side panels 2 are in an "L"-shaped structure. The side panels 2 and the electric push rods 3 are integrated into an installation structure. The electric push rods 3 are symmetrically distributed on both sides of the linkage block 4. The side panels 2 are used to fix the electric push rods 3 and facilitate the lifting and lowering of the linkage block 4.

[0032] See the attached drawings in the specification Figure 1-4 The linkage block 4 and the auxiliary block 5 are connected by hot melt connection, and the auxiliary block 5 and the base plate 6 are connected by hot melt connection. The first magnets 7 are symmetrically distributed on both sides above the base plate 6. The base plate 6 cooperates with the first magnet 7 to facilitate subsequent auxiliary positioning work and ensure alignment.

[0033] See the attached drawings in the specification Figure 1-4 The first magnet 7 and the second magnet 10 are attracted to each other, and the second magnet 10 is symmetrically distributed on both sides below the connecting block 9. The connection between the connecting block 9 and the auxiliary block 5 is a sliding connection. The fixed block 8 is quickly disassembled through the connecting block 9 to ensure that the staff will not affect the cleaning work when accessing the single crystal silicon wafer.

[0034] See the attached drawings in the specification Figure 1-4 There are mounting grooves 11 evenly and equidistantly distributed above the fixed block 8. The length of the mounting grooves 11 is consistent with the length of the water inlet 13. Water outlets 14 are symmetrically distributed on both sides of the mounting grooves 11. The fixing block 8 cooperates with the mounting grooves 11 to achieve limited fixation of the single crystal silicon wafer, and the water inlet 13 is used to achieve cleaning.

[0035] See the attached drawings in the specification Figure 1-4 There are partitions 12 symmetrically distributed on the inner side of the mounting groove 11. The mounting groove 11 and the partition 12 are connected by hot melt connection. The width of the partition 12 is consistent with the width of the inner wall of the mounting groove 11. The partition 12 is used to prevent the single crystal silicon wafers from colliding with each other during the cleaning process, protecting the single crystal silicon wafers for double cleaning.

[0036] Working principle: When in use, first, place the single crystal silicon wafer into the installation groove 11 in sequence, so that the two sides of the single crystal silicon wafer are on the left and right sides of the installation groove 11, separated by the partition 12. After installation, pull the fixing block 8 and insert it under the linkage block 4. At this time, the connecting block 9 slides on the top of the bottom plate 6. When the first magnet 7 and the second magnet 10 are attracted to each other, the staff will know that they are in the aligned state. Then the electric push rod 3 drives the linkage block 4 to descend, so that the fixing block 8 sinks into the interior of the device body 1 for cleaning.

[0037] As mentioned above, during cleaning, the ultrasonic equipment continuously affects the water ions inside the mounting groove 11 through the water inlet 13, thereby shaking off the debris and separating it from the single crystal silicon wafer. At the same time, the debris is discharged from the fixed block 8 along the water inlet 13, and the water outlet 14 at the top is used for water circulation. When the cleaning is completed, the electric push rod 3 drives the fixed block 8 to rise, and then the fixed block 8 is pulled out and a new fixed block 8 is inserted, and the work is repeated.

[0038] The above are all preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. An ultrasonic cleaning device for solar monocrystalline silicon wafers, comprising a device body (1) and a fixing block (8), characterized in that: The upper portion of the device body (1) is connected to a side plate (2), the lower portion of the side plate (2) is connected to an electric push rod (3), the lower portion of the electric push rod (3) is connected to a linkage block (4), both sides of the linkage block (4) are connected to auxiliary blocks (5), the inner side of the auxiliary block (5) is connected to a bottom plate (6), and the upper portion of the bottom plate (6) is connected to a first magnet (7); Connecting blocks (9) are connected to both sides of the fixing block (8), a second magnet (10) is connected below the connecting block (9), a mounting groove (11) is provided above the fixing block (8), a water inlet (13) is connected below the mounting groove (11), water outlets (14) are connected to both sides of the mounting groove (11), and a partition (12) is also connected to the center of the mounting groove (11).

2. The ultrasonic cleaning device for solar single crystal silicon wafers according to claim 1, characterized in that: Side panels (2) are symmetrically distributed on both sides of the device body (1); the side panels (2) are in an "L"-shaped structure; the side panels (2) and the electric push rods (3) are in an integrated mounting structure; the electric push rods (3) are symmetrically distributed on both sides of the linkage block (4).

3. The ultrasonic cleaning device for solar single crystal silicon wafers according to claim 1, characterized in that: The linkage block (4) and the auxiliary block (5) are connected by hot melt connection, and the auxiliary block (5) and the bottom plate (6) are connected by hot melt connection. First magnets (7) are symmetrically distributed on both sides above the bottom plate (6).

4. The ultrasonic cleaning device for solar single crystal silicon wafers according to claim 1, characterized in that: The first magnet (7) and the second magnet (10) are attracted to each other, and the second magnet (10) is symmetrically distributed on both sides below the connecting block (9). The connecting block (9) and the auxiliary block (5) are connected in a sliding manner.

5. The ultrasonic cleaning device for solar single crystal silicon wafers according to claim 1, characterized in that: Mounting grooves (11) are evenly and equidistantly distributed above the fixing block (8); the length of the mounting grooves (11) is consistent with the length of the water inlet (13); and water outlets (14) are symmetrically distributed on both sides of the mounting grooves (11).

6. The ultrasonic cleaning device for solar single crystal silicon wafers according to claim 1, characterized in that: The partitions (12) are symmetrically distributed on the inner side of the installation groove (11), and the installation groove (11) and the partitions (12) are connected by hot melt connection. The width of the partitions (12) is consistent with the width of the inner wall of the installation groove (11).

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