Conductive copper bar structure for lead electrolytic refining tank

Abstract

The utility model discloses a conductive copper bar structure for a lead electrolysis refining tank, which comprises a base plate with a convex structure on the surface, the convex structure comprises convex grooves uniformly arranged on the base plate, convex blocks are embedded in the convex grooves, limiting grooves are arranged outside the convex grooves, and an insulating plate connected with the limiting grooves is arranged in the middle of the base plate. According to the utility model, the protruding structure is arranged, the bottom of the substrate is firstly stamped upwards to form the protruding groove by using a stamping process, and then the protruding groove is filled with the protruding block to increase the strength of the protruding groove, so that compared with the prior art, the solid protruding structure formed by cutting the substrate by using a milling machine is not needed, on one hand, the waste of copper plate materials is reduced, and the cost is reduced; and on the other hand, the substrate can be processed by using a stamping process used before, so that the equipment replacement cost is reduced, the processing cost is reduced, and the production is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of lead electrolytic refining, in particular to a conductive copper busbar structure for a lead electrolytic refining tank. Background Art

[0002] An existing patent (Announcement No. CN210200332U) discloses a conductive copper busbar assembly. This utility model employs a solid protrusion on a base plate and mills the corresponding protrusions onto the copper plate using a milling machine. This makes the solid protrusions less susceptible to electrolyte corrosion than the deformed protrusions directly stamped using traditional processes, extending service life and reducing processing costs. However, in practice, direct milling of the copper plate results in significant copper consumption, significantly increasing copper usage and costs, making it unsuitable for practical application. Therefore, we propose a conductive copper busbar structure for lead electrolytic refining cells. Utility Model Content

[0003] In order to solve the above problems, the utility model provides a conductive copper busbar structure for a lead electrolytic refining tank.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A conductive copper busbar structure for a lead electrolytic refining tank is designed, comprising a substrate with a raised structure on the surface. The raised structure comprises raised grooves uniformly arranged on the substrate, each of which has a raised block embedded in it, and each of which has a limiting groove outside it. An insulating plate connected to the limiting groove is installed in the middle of the substrate.

[0006] In the above solution, an embedding groove is provided at the bottom of the base plate, a bottom plate is installed in the embedding groove, and the protrusion is connected to the bottom plate.

[0007] In the above solution, both ends of the bottom plate are assembled and connected to the base plate by bolts.

[0008] In the above solution, a connecting portion is provided at the bottom of the protrusion, and an inserting groove that fits with the connecting portion is provided on the upper surface of the bottom plate.

[0009] In the above solution, positioning plates are provided at both ends of the insulating plate to abut against the insulating plate, and the positioning plates are fixed on the base plate and connected to the insulating plate via fasteners.

[0010] In the above solution, a clamping mechanism is provided between adjacent limiting grooves, and the clamping mechanism comprises a cylinder vertically fixed on the limiting groove, a movable rod is connected in the cylinder, and a clamping plate is fixed to the end of the movable rod.

[0011] In the above solution, a connecting plate is fixed between the back of the limiting groove and the insulating plate, and support plates are provided on both sides of the connecting plate. The support plates and the insulating plate form a triangle.

[0012] The advantages and beneficial effects of the present invention are as follows: by setting a convex structure, first, a stamping process is used to stamp upward from the bottom of the substrate to form a convex groove, and then a convex block is filled into the convex groove to increase the strength of the convex groove. Compared with the existing technology, there is no need to use a milling machine to cut the substrate to form a solid convex structure. On the one hand, the waste of copper plate material is reduced and the material cost is reduced. On the other hand, the stamping process used before can be used to process the substrate, which reduces the cost of equipment replacement, reduces the processing cost, and is beneficial to production. By setting a bottom plate, a convex block, a connecting part, an inserting groove and an embedded groove, the bottom plate is used to receive the convex block. By placing the bottom plate in the embedded groove, the convex block and the convex groove can be docked, thereby making the convex structure complete. Compared with the existing technology, the connection part and the inserting groove are used to cooperate with convex blocks of different sizes to connect them to the bottom plate so that they can cooperate with convex grooves of different sizes, which is more flexible in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0014] Figure 1 This is a partial structural diagram of a conductive copper busbar structure for a lead electrolytic refining tank proposed by the present invention;

[0015] Figure 2 This is a partial cross-sectional view of a substrate of a conductive copper busbar structure for a lead electrolytic refining tank proposed in the present invention;

[0016] Figure 3 This is a schematic structural diagram of a conductive copper busbar structure for a lead electrolytic refining tank proposed in the present invention;

[0017] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle.

[0018] In the figure: base plate 1, bolt 2, bottom plate 3, protrusion 4, clamping plate 5, protruding groove 6, connecting part 7, insertion groove 8, embedding groove 9, insulating plate 10, positioning plate 11, limiting groove 12, connecting plate 13, support plate 14, cylinder 15, movable rod 16. DETAILED DESCRIPTION

[0019] The following embodiments are used to further describe the specific embodiments of the present invention in conjunction with the accompanying drawings and examples. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.

[0020] See also Figure 1-4 The utility model provides a technical solution: a conductive copper busbar structure for a lead electrolytic refining tank, comprising a substrate 1 having a raised structure on its surface, the raised structure comprising raised grooves 6 uniformly arranged on the substrate 1, and each of the raised grooves 6 having a raised block 4 embedded therein; wherein the raised block 4 and the substrate 1 are made of the same material, and the raised block 4 is used to improve the strength of the raised groove 6;

[0021] Furthermore, the bottom of the base plate 1 is provided with an embedding groove 9, in which the bottom plate 3 is mounted, and the protrusion 4 is connected to the bottom plate 3; the protrusion 4 can be fixed to the bottom plate 3 by an adhesive, or connected to the bottom plate 3 by a mortise and tenon connection;

[0022] Specifically, such as Figure 2 As shown, the bottom opening of the embedding groove 9 is smaller than the actual length of the bottom plate 3. The bottom plate 3 is made of elastic material, so that when the bottom plate 3 is embedded in the embedding groove 9, it is squeezed into the embedding groove 9 by elastic deformation. After installation, it can also effectively prevent the bottom plate 3 from being separated from the embedding groove 9 at will, thereby improving the tightness of the connection.

[0023] Furthermore, both ends of the bottom plate 3 are assembled and connected to the base plate 1 by bolts 2; the base plate 1 is provided with mounting holes that penetrate into the embedded grooves 9, and both ends of the bottom plate 3 are also provided with assembly holes that dock with the mounting holes to facilitate the installation of the bolts 2.

[0024] Furthermore, the bottom of the protrusion 4 is integrally formed with a connecting portion 7, and the upper surface of the bottom plate 3 is provided with an insertion groove 8 that fits with the connecting portion 7; the protrusion 4 and the bottom plate 3 are connected by a concave-convex fit, and then a special adhesive is used to fix the surface of the connecting portion 7 and the inner wall of the insertion groove 8;

[0025] Specifically, by setting a raised structure, first, a stamping process is used to stamp upward from the bottom of the substrate 1 to form a raised groove 6, and then the protrusion 4 is filled into the raised groove 6 to increase the strength of the raised groove 6. Compared with the existing technology, there is no need to use a milling machine to cut the substrate 1 to form a solid raised structure. On the one hand, the waste of copper plate materials is reduced and the material cost is reduced. On the other hand, the stamping process used before can be used to process the substrate 1, reducing the cost of equipment replacement, reducing processing costs, and facilitating production.

[0026] A limiting groove 12 is provided outside the convex groove 6, and an insulating plate 10 connected to the limiting groove 12 is installed in the middle of the base plate 1;

[0027] Furthermore, positioning plates 11 are provided at both ends of the insulating plate 10 to abut against the insulating plate 10. The positioning plates 11 clamp the insulating plate 10. The positioning plates 11 are vertically fixed to the base plate 1 and connected to the insulating plate 10 by fasteners, so as to facilitate disassembly and assembly.

[0028] Furthermore, a connecting plate 13 is vertically fixed between the back of the limiting groove 12 and the insulating plate 10. Support plates 14 are provided on both sides of the connecting plate 13. The support plates 14 are arranged obliquely. The support plates 14 and the insulating plate 10 form a triangle. The support plates 14 provide sufficient support for the insulating plate 10 to prevent the insulating plate 10 from bending after long-term use. The triangular structure improves the stability of the insulating plate 10.

[0029] Furthermore, a clamping mechanism is provided between adjacent limiting grooves 12, and the clamping mechanism includes a cylinder 15 vertically fixed on the limiting groove 12, a movable rod 16 is connected inside the cylinder 15, and a clamping plate 5 is fixed to the end of the movable rod 16; in actual application, there are two ways to connect the cylinder 15 and the movable rod 16, the first is to connect the cylinder 15 and the movable rod 16 by a thread, and the movable rod 16 can be adjusted by simply rotating the movable rod 16. The second is to elastically connect the movable rod 16 to the inner wall of the cylinder 15, and use the rebound force generated by the deformation spring to make the movable rod 16 adapt to the width of the conductive beam, thereby flexibly adjusting the spacing between adjacent clamping plates 5;

[0030] Specifically, in actual applications, the gaps between adjacent limiting slots 12 are used to place the conductive beams. By controlling the length of the movable rod 16, the distance between adjacent clamping plates 5 can be adjusted, thereby clamping the conductive beams and improving the stability of the conductive beam installation.

[0031] Specifically, by setting the base plate 3, the protrusion 4, the connecting portion 7, the insertion groove 8 and the embedding groove 9, the base plate 3 is used to receive the protrusion 4, and by placing the base plate 5 into the embedding groove 9, the protrusion 4 can be docked with the protruding groove 6, so that the raised structure is complete. Compared with the existing technology, by utilizing the cooperation of the connecting portion 7 and the insertion groove 8, by connecting protrusions 4 of different sizes to the base plate 3, they can be matched with protruding grooves 6 of different sizes, which is more flexible in use.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A conductive copper busbar structure for a lead electrolytic refining tank, comprising a substrate (1) having a protruding structure on its surface, characterized in that: The raised structure comprises raised grooves (6) uniformly arranged on the base plate (1), the raised grooves (6) are each embedded with a raised block (4), the raised grooves (6) are each externally provided with a limiting groove (12), and an insulating plate (10) connected to the limiting groove (12) is installed in the middle of the base plate (1).

2. The conductive copper busbar structure for a lead electrolytic refining tank according to claim 1, characterized in that: An embedding groove (9) is provided at the bottom of the base plate (1), a bottom plate (3) is installed in the embedding groove (9), and the protrusion (4) is connected to the bottom plate (3).

3. The conductive copper busbar structure for a lead electrolytic refining tank according to claim 2, characterized in that: Both ends of the bottom plate (3) are assembled and connected to the base plate (1) via bolts (2).

4. The conductive copper busbar structure for a lead electrolytic refining tank according to claim 2, characterized in that: A connecting portion (7) is provided at the bottom of the protrusion (4), and an inserting groove (8) that fits with the connecting portion (7) is provided on the upper surface of the bottom plate (3).

5. The conductive copper busbar structure for a lead electrolytic refining tank according to claim 1, characterized in that: Positioning plates (11) abutting against the insulating plate (10) are provided on both ends of the insulating plate (10); the positioning plates (11) are fixed on the base plate (1) and connected to the insulating plate (10) via fasteners.

6. The conductive copper busbar structure for a lead electrolytic refining tank according to claim 1, characterized in that: A clamping mechanism is provided between adjacent limiting grooves (12), the clamping mechanism comprising a cylinder (15) vertically fixed to the limiting groove (12), a movable rod (16) connected inside the cylinder (15), and a clamping plate (5) fixed to the end of the movable rod (16).

7. The conductive copper busbar structure for a lead electrolytic refining tank according to claim 1, characterized in that: A connecting plate (13) is fixed between the back of the limiting groove (12) and the insulating plate (10), and support plates (14) are provided on both sides of the connecting plate (13), and the support plates (14) and the insulating plate (10) form a triangle.

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