Wafer testing device and wafer testing set

Abstract

The utility model discloses a wafer testing device and a wafer testing set. The wafer testing device comprises a vacuum cavity, a carrying table, a first moving part and a second moving part. The vacuum cavity is provided with a containing cavity. The carrying table is arranged in the containing cavity and is configured to carry a wafer. The first moving part can move relative to the carrying table in the first direction. The first moving part is provided with a probe, the probe is located in the containing cavity, and the probe is configured to be in contact with the wafer. The second moving part is located outside the containing cavity, and the second moving part controls the carrying table to move on the plane perpendicular to the first direction in a magnetic attraction mode. Through the first moving part and the second moving part, the carrying table can move relative to the probe in a three-dimensional space, and the probe can be in contact with a wafer carried on the carrying table. And moreover, the second moving part controls the carrying table to move outside the accommodating cavity instead of inside the accommodating cavity in a magnetic attraction manner, so that the accommodating cavity space required by the vacuum cavity is reduced, and the speed and the accuracy of pressure change in the accommodating cavity are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a wafer testing device and a wafer testing kit. Background Art

[0002] Currently, vacuum probe stations are widely used in MEMS (Micro-Electro-Mechanical System) production processes to simulate the operating environment of MEMS devices for testing. The worktable structure is a key component of the vacuum probe station, used to support the device under test. The worktable structure moves along the X, Y, and Z axes to adjust the position of the device under test within the vacuum chamber, facilitating probe penetration testing.

[0003] In the prior art, the workbench structure of the vacuum probe station needs to be placed in a vacuum chamber, resulting in a larger space required for the vacuum chamber. Therefore, when the vacuum chamber is evacuated, the pressure change rate in the vacuum chamber is slow and the accuracy is low. Utility Model Content

[0004] In view of this, the present application provides a wafer testing device and a wafer testing kit, which are beneficial to reducing the accommodating cavity space required for the vacuum chamber and improving the rate and accuracy of pressure changes in the accommodating cavity.

[0005] In a first aspect of the present application, a wafer testing device is provided, comprising a vacuum chamber, a carrier, a first movable member, and a second movable member. The vacuum chamber has a receiving chamber. The carrier is disposed in the receiving chamber, and the carrier is configured to carry a wafer. The first movable member is movable relative to the carrier in a first direction. The first movable member is provided with a probe, which is located in the receiving chamber and is configured to contact the wafer. The second movable member is located outside the receiving chamber, and the second movable member controls the movement of the carrier in a plane perpendicular to the first direction by magnetic attraction.

[0006] The first movable element can move relative to the stage in a first direction, while the second movable element controls the movement of the stage in a plane perpendicular to the first direction. This allows the stage to move relative to the probe in three dimensions, facilitating probe contact with the wafer held on the stage. Furthermore, the second movable element magnetically controls the movement of the stage from outside the chamber, rather than within it. This helps reduce the required space within the vacuum chamber and improves the speed and accuracy of pressure changes within the chamber.

[0007] In one or more of the above embodiments, the wafer testing device includes a first magnetic member and a second magnetic member, the first magnetic member is fixedly arranged on the carrier, the second magnetic member is fixedly arranged on the second movable member, and there is magnetic attraction between the first magnetic member and the second magnetic member.

[0008] In the above embodiment, the magnetic attraction between the first magnetic member and the second magnetic member facilitates the second movable member to control the movement of the carrier in a magnetic attraction manner.

[0009] In one or more of the above embodiments, the first magnetic member and the second magnetic member each include a plurality of magnetic blocks, and the plurality of magnetic blocks of the first magnetic member and the second magnetic member are arranged in the same array. The plurality of magnetic blocks of the first magnetic member correspond one-to-one with the plurality of magnetic blocks of the second magnetic member and are magnetically attracted to each other. In the first magnetic member and the second magnetic member, the magnetic poles of adjacent magnetic blocks are opposite.

[0010] In the above embodiment, through the same array arrangement, when the second movable member controls the first magnetic member through the second magnetic member to move the carrier, it is beneficial to reduce the hysteresis of the movement of the first magnetic member (that is, the first magnetic member is offset relative to the second magnetic member), thereby helping to improve the accuracy of the second movable member in controlling the movement of the carrier.

[0011] In one or more of the above embodiments, the array arrangement is a three-row and three-column arrangement.

[0012] In the above embodiment, when the second movable member controls the first magnetic member through the second magnetic member to move the carrier in a plane perpendicular to the first direction, it is beneficial to reduce the hysteresis of the movement of the first movable member in any direction parallel to the plane, thereby helping to further improve the accuracy of the second movable member in controlling the movement of the carrier.

[0013] In one or more of the above embodiments, the first movable member includes a movable portion and a mounting portion. The movable portion is parallel to a first direction and movable relative to the vacuum chamber along the first direction. The movable portion is partially located within the accommodating chamber. The mounting portion is connected to the movable portion and is perpendicular to the first direction. The mounting portion is provided with a plurality of probes.

[0014] In the above embodiment, the movable portion is parallel to the first direction, which helps reduce the opening required in the vacuum chamber to enable the movable portion to move relative to the vacuum chamber along the first direction, thereby improving the sealing of the vacuum chamber. Furthermore, the mounting portion is perpendicular to the first direction and is provided with multiple probes, which helps improve the efficiency of contacting the wafer.

[0015] In one or more of the above embodiments, the moving portion and the vacuum chamber are sealed together via a sealing member.

[0016] The above embodiment is conducive to further improving the sealing performance of the vacuum chamber.

[0017] In a second aspect, the present application provides a wafer testing kit comprising a wafer testing apparatus, a carrier, and a transport unit. The vacuum chamber of the wafer testing apparatus is provided with an openable and closable opening. The carrier is configured to rotate and align the wafer. The transport unit is configured to transport the wafer from the carrier through the opening to a carrier stage of the wafer testing apparatus.

[0018] The second movable part in the wafer testing device controls the movement of the carrier outside the containing chamber rather than inside the containing chamber by magnetic attraction, which is beneficial to reducing the containing chamber space required for the vacuum chamber and improving the rate and accuracy of pressure change in the containing chamber.

[0019] In one or more of the above embodiments, the carrier includes a carrying surface and a convex portion, the carrying surface is configured to carry the wafer, and the convex portion is retractable relative to the carrying surface. The transport member is provided with a concave portion that can accommodate a portion of the convex portion.

[0020] In the above embodiment, the cooperation between the protrusion and the recess facilitates the convenient placement of the transport member between the wafer and the carrying surface, and the removal of the wafer from the carrying member.

[0021] In one or more of the above embodiments, there are multiple convex portions, and the multiple convex portions are distributed at intervals.

[0022] In the above embodiment, when the wafer is placed on the protrusion and separated from the carrying surface, it is beneficial to improve the stability of the wafer placed on the protrusion.

[0023] In one or more of the above embodiments, along the extending direction of the convex portion, the size of the concave portion is smaller than the maximum extendable size of the convex portion.

[0024] In the above embodiment, when the protrusion extends out of the carrying surface and supports the wafer, and the transport member moves toward the protrusion so that the recess accommodates the protrusion, it is beneficial to reduce the possibility of the transport member pushing the wafer along the moving direction and improve the stability of the wafer in maintaining a straight posture. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic structural diagram of a wafer testing device provided in one embodiment of the present application.

[0026] Figure 2 A schematic structural diagram of a first magnetic component provided in one embodiment of the present application.

[0027] Figure 3 A schematic structural diagram of a second magnetic component provided in one embodiment of the present application.

[0028] Figure 4 A schematic diagram of the cooperation between a carrier and a transport member provided in one embodiment of the present application.

[0029] Description of main component symbols

[0030] 10. Wafer testing device; 101. Probe; 102. Magnetic block; 103. Movable port; 11. Vacuum chamber; 111. Accommodating chamber; 112. Bottom plate; 113. Side plate; 114. Top plate; 12. Carrier; 13. First moving member; 131. Moving portion; 132. Mounting portion; 133. Driving portion; 14. Second moving member; 15. Cavity bracket; 16. First magnetic member; 17. Second magnetic member; 20. Carrying member; 21. Carrying surface; 22. Protrusion; 30. Transport member; 31. Recess; 32. Connecting portion; 40. First observation module; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0032] It should be noted that when an element is considered to be “connected” to another element, it may be directly connected to the other element or there may be a centrally disposed element. When an element is considered to be “disposed on” another element, it may be directly disposed on the other element or there may be a centrally disposed element.

[0033] Unless otherwise specified, the term "plurality" as used herein means two or more than two.

[0034] The terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implying the quantity, specific order or primary and secondary relationship of the technical features indicated.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] It should be understood that, considering the actual processing tolerance factors, in the technical solution of the present application, when the two elements are arranged parallel / vertically and in the same direction, there may be a certain angle between the two elements, and a tolerance of 0-±10% is allowed between the two elements. A tolerance of 0-±10% is allowed when the two elements are greater than, equal to or less than.

[0037] According to a first aspect of an embodiment of the present application, there is provided a wafer testing device comprising a vacuum chamber, a carrier, a first movable member, and a second movable member. The vacuum chamber has a receiving chamber. The carrier is disposed in the receiving chamber, and the carrier is configured to carry a wafer. The first movable member is movable relative to the carrier along a first direction. The first movable member is provided with a probe, the probe being located in the receiving chamber, and the probe being configured to contact the wafer. The second movable member is located outside the receiving chamber, and the second movable member controls the carrier to move in a plane perpendicular to the first direction by magnetic attraction.

[0038] The first movable element can move relative to the stage in a first direction, while the second movable element controls the movement of the stage in a plane perpendicular to the first direction. This allows the stage to move relative to the probe in three dimensions, facilitating probe contact with the wafer held on the stage. Furthermore, the second movable element magnetically controls the movement of the stage from outside the chamber, rather than within it. This helps reduce the required space within the vacuum chamber and improves the speed and accuracy of pressure changes within the chamber.

[0039] The following will describe some embodiments of the present application in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0040] See also Figure 1 An embodiment of the present application provides a wafer testing device 10 , including a vacuum chamber 11 , a stage 12 , a first moving member 13 , and a second moving member 14 .

[0041] The vacuum chamber 11 includes a receiving chamber 111. The interior of the receiving chamber 111 can be evacuated to facilitate wafer testing in a vacuum environment. During the evacuation process, the pressure in the receiving chamber 111 changes. It is understood that, at the same pumping rate, a smaller volume in the receiving chamber 111 results in a higher rate of pressure change within the receiving chamber 111, and greater precision in controlling the pressure change within the receiving chamber 111 to a predetermined value.

[0042] In some embodiments, the vacuum chamber 11 is made of stainless steel, which is beneficial for improving the airtightness of the accommodating chamber 111 .

[0043] In some embodiments, the vacuum chamber 11 includes a bottom plate 112, side plates 113, and a top plate 114. The bottom plate 112 and the top plate 114 are arranged relative to each other along a first direction X, with the side plates 113 disposed between the bottom plate 112 and the top plate 114. The bottom plate 112, the side plates 113, and the top plate 114 collectively enclose the accommodating chamber 111. In some embodiments, the first direction X is parallel to the direction of gravity.

[0044] In some embodiments, see Figure 1The wafer testing device 10 includes a cavity support 15, which is connected to the vacuum cavity 11 and supports the vacuum cavity 11, thereby facilitating the stability of the vacuum cavity 11.

[0045] In some embodiments, the chamber support 15 is connected to the side plate 113 of the vacuum chamber 11. In other embodiments, the chamber support 15 is connected to the bottom plate 112 of the vacuum chamber 11. Along the first direction X, the chamber support 15 is lower than the bottom plate 112.

[0046] The carrier 12 is disposed in the receiving chamber 111 and is configured to carry a wafer. The carrier 12 can move in the receiving chamber 111 to adjust the position of the wafer in the receiving chamber 111 .

[0047] In some embodiments, the carrier 12 is disposed on a side of the bottom plate 112 close to the accommodating cavity 111 .

[0048] In some embodiments, the surface of the carrier 12 for supporting the wafer is perpendicular to the first direction X. This helps keep the wafer on the carrier 12 as it moves within the accommodating cavity 111 , thereby improving the stability of the wafer within the wafer testing apparatus 10 .

[0049] In some embodiments, the carrier 12 is disk-shaped.

[0050] The first moving member 13 can move relative to the stage 12 along the first direction X. In some embodiments, the first moving member 13 can move relative to the stage 12 in the opposite direction of the first direction X.

[0051] The first movable member 13 is provided with a probe 101, which is located in the accommodating cavity 111 and is configured to contact the wafer. When the first movable member 13 moves relative to the carrier 12 along the first direction X or the opposite direction of the first direction X, the probe 101 can follow the movement of the first movable member 13 to contact the wafer.

[0052] In some embodiments, the first movable member 13 includes a movable portion 131 and a mounting portion 132. The movable portion 131 is parallel to the first direction X and is movable relative to the vacuum chamber 11 along the first direction X. The movable portion 131 being parallel to the first direction X helps reduce the opening required in the vacuum chamber 11 to enable the movable portion 131 to move relative to the vacuum chamber 11 along the first direction X, thereby improving the sealing performance of the vacuum chamber 11. The movable portion 131 being parallel to the first direction X means that the longitudinal direction of the movable portion 131 is parallel to the first direction X.

[0053] In some embodiments, the moving portion 131 is sealed with the vacuum chamber 11 via a sealing member (not shown), which is beneficial for further improving the sealing performance of the vacuum chamber 11 .

[0054] In some embodiments, the moving portion 131 can move along the first direction X relative to the top plate 114 , and the top plate 114 has an opening.

[0055] In some embodiments, a portion of the movable portion 131 is located within the accommodating cavity 111. The mounting portion 132 is connected to the movable portion 131 and is perpendicular to the first direction X. The mounting portion 132 is provided with a plurality of probes 101. The mounting portion 132 is perpendicular to the first direction X and is provided with a plurality of probes 101. The plurality of probes 101 facilitates improving the efficiency of contacting the wafer. The mounting portion 132 being perpendicular to the first direction X means that the length direction of the mounting portion 132 is perpendicular to the first direction X. It is understood that the mounting portion 132 is connected to the portion of the movable portion 131 located within the accommodating cavity 111 so that the probes 101 are located within the accommodating cavity 111.

[0056] In some embodiments, along the first direction X, the tips of the plurality of probes 101 contacting the wafer are at the same height.

[0057] In some embodiments, the first moving member 13 includes a driving portion 133 , which is connected to the moving portion 131 and is located outside the accommodating cavity 111 . The driving portion 133 is configured to drive the moving portion 131 .

[0058] In some embodiments, the moving portion 131 is a moving screw, the mounting portion 132 is a mounting platform, and the driving portion 133 is a motor. The motor drives the moving screw to drive the mounting platform to move along the first direction X.

[0059] In some embodiments, the moving portion 131 is a moving screw, and the sealing member is a sealing flange. The moving portion 131 is movably mounted on the vacuum chamber 11 via the sealing flange.

[0060] The second moving member 14 is positioned outside the accommodating chamber 111, and the second moving member 14 controls the stage 12 to move on a plane perpendicular to the first direction X. The plane perpendicular to the first direction X refers to a plane defined by the second direction Y and the third direction Z, wherein the first direction X, the second direction Y and the third direction Z are perpendicular to each other in pairs. In other words, the second moving member 14 controls the stage 12 to move along the second direction Y or its opposite direction and the third direction Z or its opposite direction. The second moving member 14 controls the stage 12 to move in a magnetically attracted manner.

[0061] In some embodiments, the second moving member 14 is disposed on a side of the bottom plate 112 away from the accommodating cavity 111 .

[0062] In some embodiments, along the first direction X, the projection of the second moving member 14 is located within the projections of the bottom plate 112 and the cavity support 15 . In this case, the cavity support 15 is helpful in protecting the second moving member 14 .

[0063] The first movable member 13 can move relative to the carrier 12 along a first direction X, and the second movable member 14 controls the movement of the carrier 12 in a plane perpendicular to the first direction X. This enables the carrier 12 to move relative to the probe 101 in three dimensions, facilitating contact between the probe 101 and the wafer carried on the carrier 12. Furthermore, the second movable member 14 controls the movement of the carrier 12 by magnetic attraction outside the accommodating chamber 111 rather than within the accommodating chamber 111, which helps reduce the space required by the vacuum chamber 111 and improves the rate and accuracy of pressure changes within the accommodating chamber 111.

[0064] In some embodiments, see Figure 1 The wafer testing device 10 includes a first magnetic member 16 and a second magnetic member 17. The first magnetic member 16 is fixed to the carrier 12, and the second magnetic member 17 is fixed to the second movable member 14. There is a magnetic attraction between the first magnetic member 16 and the second magnetic member 17. The magnetic attraction between the first magnetic member 16 and the second magnetic member 17 facilitates the second movable member 14 to control the movement of the carrier 12 by magnetic attraction.

[0065] In some embodiments, the first magnetic member 16 is disposed on a side of the bottom plate 112 that is close to the accommodating cavity 111 and connects to and supports the carrier 12. The second magnetic member 17 is disposed on a side of the bottom plate 112 that is away from the accommodating cavity 111 and is disposed on the second movable member 14. In this case, the bottom plate 112 is disposed between the first magnetic member 16 and the second magnetic member 17.

[0066] In some embodiments, the material of the bottom plate 112 does not include magnetic materials, which is beneficial for reducing interference with the magnetic attraction between the first magnetic member 16 and the second magnetic member 17. Magnetic materials include but are not limited to iron, cobalt, and nickel.

[0067] See also Figure 2 and Figure 3 , Figure 2 The structure of the first magnetic member 16 shown and Figure 3 The structure of the second magnetic member 17 shown is a structure in which the first magnetic member 16 and the second magnetic member 17 are on opposite sides of each other.

[0068] In some embodiments, both the first magnetic member 16 and the second magnetic member 17 have a groove (not shown), in which a magnetic block 102 is disposed. On the side where the first magnetic member 16 and the second magnetic member 17 face each other, the magnetic poles of the magnetic blocks 102 of the first magnetic member 16 and the second magnetic member 17 are opposite. For example, on the side where the two magnetic members face each other, when the magnetic pole of the magnetic block 102 of the first magnetic member 16 is at the south pole, the magnetic pole of the magnetic block 102 of the second magnetic member 17 is at the north pole; when the magnetic pole of the magnetic block 102 of the first magnetic member 16 is at the north pole, the magnetic pole of the magnetic block 102 of the second magnetic member 17 is at the south pole.

[0069] In some embodiments, the first magnetic member 16 and the second magnetic member 17 each include a plurality of magnetic blocks 102, and the plurality of magnetic blocks 102 of the first magnetic member 16 and the second magnetic member 17 have the same array arrangement. The plurality of magnetic blocks 102 of the first magnetic member 16 correspond one-to-one to the plurality of magnetic blocks 102 of the second magnetic member 17 and are magnetically attracted. In the first magnetic member 16 and the second magnetic member 17, the magnetic poles of two adjacent magnetic blocks 102 are opposite. Through the same array arrangement, when the second movable member 14 controls the first magnetic member 16 through the second magnetic member 17 to move the carrier 12, it is beneficial to reduce the hysteresis of the movement of the first magnetic member 16 (that is, the first magnetic member 16 is offset relative to the second magnetic member 17), thereby helping to improve the accuracy of the second movable member 14 in controlling the movement of the carrier 12.

[0070] The same array arrangement means that the multiple magnetic blocks 102 of the first magnetic member 16 and the second magnetic member 17 are all arranged in an array, and the number of rows and columns of the multiple magnetic blocks 102 of the first magnetic member 16 and the second magnetic member 17 are equal. For example, the multiple magnetic blocks 102 of the first magnetic member 16 and the second magnetic member 17 are all arranged in a row and two columns, two rows and one column, two rows and two columns, or other array arrangements not listed.

[0071] In some embodiments, the array arrangement is a three-row, three-column arrangement. When the second movable member 14 controls the first magnetic member 16 via the second magnetic member 17 to move the carrier 12 in a plane perpendicular to the first direction X, any direction parallel to the plane can help reduce the hysteresis of the movement of the first magnetic member 16, thereby further improving the accuracy of the second movable member 14 in controlling the movement of the carrier 12.

[0072] In some embodiments, the material of the first magnetic member 16 and the second magnetic member 17 includes polytetrafluoroethylene, which is beneficial to improving the thermal insulation and electrical insulation capabilities of the first magnetic member 16 and the second magnetic member 17, thereby improving the stability of the magnetic block 102 in the groove.

[0073] Please refer to Figure 1 and Figure 4 A second aspect of an embodiment of the present application provides a wafer testing kit, including a wafer testing device 10 , a carrier 20 and a transport member 30 .

[0074] See Figure 1 The vacuum chamber 11 of the wafer testing device 10 is provided with a movable port 103 , and the movable port 103 can be opened and closed.

[0075] In some embodiments, the movable port 103 is disposed on the side panel 113 of the vacuum chamber 11 , which is beneficial for improving the convenience of transporting wafers.

[0076] The carrier 20 is configured to rotate and align the wafer. In some embodiments, the carrier 20 aligns the wafer by rotating.

[0077] The transport member 30 is configured to transport the wafer from the carrier 20 to the carrier 12 of the wafer testing apparatus 10 through the movable opening 103 . In some embodiments, after the wafer is aligned on the carrier 20 , the transport member 30 removes the wafer from the carrier 20 and transports it to the carrier 12 through the movable opening 103 .

[0078] In some embodiments, see Figure 4 The carrier 20 includes a carrying surface 21 and a protrusion 22 . The carrying surface 21 carries the wafer, and the protrusion 22 is retractable relative to the carrying surface 21 .

[0079] When the wafer is aligned on the carrier 20, the protrusion 22 retracts back into the carrier surface 21, allowing the wafer to rest on the carrier surface 21. When the wafer is removed from the carrier 20 by the transport member 30, the protrusion 22 first extends out of the carrier surface 21, allowing the wafer to rest on the protrusion 22 and then to clear the carrier surface 21. When the transport member 30 is positioned between the wafer and the carrier surface 21, the protrusion 22 retracts back into the carrier surface 21, allowing the wafer to rest on the transport member 30 and then to clear the protrusion 22. This facilitates the transfer of the wafer to the transport member 30 while maintaining its aligned position.

[0080] In some embodiments, see Figure 4 The transport member 30 is provided with a recessed portion 31, which can accommodate part of the convex portion 22. The cooperation between the convex portion 22 and the recessed portion 31 facilitates the transport member 30 to be conveniently placed between the wafer and the carrying surface 21, and the wafer is removed from the carrying member 20.

[0081] In some embodiments, there are multiple protrusions 22 , which are spaced apart. When a wafer is placed on the protrusions 22 and separated from the supporting surface 21 , the stability of the wafer placed on the protrusions 22 is improved.

[0082] In some embodiments, the plurality of convex portions 22 are distributed in an array and spaced apart from each other. In the opposite direction of the concave direction of the concave portion 31 , both ends of the concave portion 31 may pass through the spaces between adjacent convex portions 22 .

[0083] In some embodiments, the size of the recess 31 along the extension direction of the protrusion 22 is smaller than the maximum extension dimension of the protrusion 22. When the protrusion 22 extends out of the support surface 21 and supports the wafer, the transport member 30 moves toward the protrusion 22 so that the recess 31 accommodates the protrusion 22. This helps reduce the possibility of the transport member 30 pushing against the wafer along the movement direction, thereby improving the stability of the wafer in maintaining a straight position.

[0084] In some embodiments, the transport member 30 is electrically driven, which is beneficial to improving the stability of the transport member 30 during movement.

[0085] In some embodiments, see Figure 4 The transport member 30 includes a connecting portion 32, and the connecting portion 32 is connected to the recessed portion 31. In some embodiments, the recessed portion 31 is connected to the electric device through the connecting portion 32.

[0086] In some embodiments, the wafer test kit includes a first observation module 40, which is configured to observe the interior of the accommodating cavity 111. The first observation module 40 is used to improve the accuracy of the alignment between the probe 101 and the wafer.

[0087] In some embodiments, the first observation module 40 is located outside the accommodating chamber 111 and is disposed above the top plate 114 along the first direction X.

[0088] In some embodiments, the wafer testing kit includes a second observation module (not shown). The second observation module is configured to observe the carrier surface 21. The second observation module helps improve the accuracy of wafer alignment on the carrier 20.

[0089] In some embodiments, the first observation module 40 and the second observation module are CCD cameras.

[0090] The use process of the wafer inspection kit of this application is as follows:

[0091] The wafer is placed on the carrying surface 21 of the carrier 20 , and the alignment of the wafer on the carrying surface 21 is observed by the second observation module, and the carrier 20 is rotated to align the wafer.

[0092] The protrusion 22 is extended out of the carrying surface 21 , so that the wafer is separated from the carrying surface 21 and placed on the protrusion 22 .

[0093] The transport member 30 is moved toward the carrier 20 until the recess 31 partially accommodates the protrusion 22 . At this time, the transport member 30 is placed between the wafer and the carrier surface 21 .

[0094] The protrusion 22 is retracted to the carrying surface 21 . During the retraction of the protrusion 22 , the wafer is transferred from being placed on the protrusion 22 to being placed on the transport member 30 .

[0095] The movable opening 103 is opened, and the transport member 30 transports the wafer to the carrier 12 through the movable opening 103 . During the process of transporting the wafer to the carrier 12 , the second moving member 14 can control the carrier 12 to move toward the transport member 30 .

[0096] The transport member 30 is withdrawn and the movable opening 103 is closed to evacuate the accommodating chamber 111. After the evacuation is completed, the position of the carrier 12 is adjusted by the second movable member 14, and the position of the probe 101 is adjusted by the first movable member 13.

[0097] The probe 101 is aligned with the wafer to test the wafer with the aid of the first observation module 40. It is understood that before testing the wafer, parameters such as temperature or pressure in the accommodating chamber 111 may be changed to provide a corresponding environment for testing the wafer.

[0098] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the substantive scope of the present application, appropriate changes and modifications to the above embodiments are within the scope disclosed in the present application.

Claims

1. A wafer testing device, characterized in that: include: A vacuum chamber, wherein the vacuum chamber has a receiving cavity; a carrier, the carrier being disposed in the accommodating cavity and configured to carry a wafer; a first movable member, the first movable member being movable relative to the carrier along a first direction; the first movable member being provided with a probe, the probe being located in the accommodating cavity, the probe being configured to contact the wafer; A second movable member is located outside the accommodating cavity, and the second movable member controls the platform to move on a plane perpendicular to the first direction in a magnetic manner.

2. The wafer testing device according to claim 1, wherein: The wafer testing device includes a first magnetic component and a second magnetic component. The first magnetic component is fixedly arranged on the carrier, and the second magnetic component is fixedly arranged on the second movable component. There is magnetic attraction between the first magnetic component and the second magnetic component.

3. The wafer testing device according to claim 2, wherein: The first magnetic member and the second magnetic member each include a plurality of magnetic blocks, and the plurality of magnetic blocks of the first magnetic member and the second magnetic member have the same array arrangement; the plurality of magnetic blocks of the first magnetic member correspond one-to-one with the plurality of magnetic blocks of the second magnetic member and are magnetically attracted to each other; in the first magnetic member and the second magnetic member, the magnetic poles of two adjacent magnetic blocks are opposite.

4. The wafer testing device according to claim 3, wherein: The array arrangement is a three-row and three-column arrangement.

5. The wafer testing device according to claim 1, wherein: The first movable part includes a moving part and a mounting part; the moving part is parallel to the first direction and can move relative to the vacuum chamber along the first direction; part of the moving part is located in the accommodating chamber; the mounting part is connected to the moving part and is perpendicular to the first direction; the mounting part is provided with a plurality of the probes.

6. The wafer testing device according to claim 5, wherein: The moving part and the vacuum chamber are sealed together via a sealing member.

7. A wafer test kit, characterized in that: include: The wafer testing device according to any one of claims 1 to 6, wherein the vacuum chamber of the wafer testing device is provided with an openable and closable movable port; a carrier configured to rotate the wafer and align the wafer; The transporting member is configured to transport the wafer from the carrier to the carrier of the wafer testing device through the movable port.

8. The wafer testing kit according to claim 7, wherein: The carrier includes a carrying surface and a convex portion, the carrying surface is configured to carry a wafer, and the convex portion is retractable on the carrying surface; the transport member is provided with a concave portion that can accommodate a portion of the convex portion.

9. The wafer testing kit according to claim 8, wherein: There are multiple convex portions, and the multiple convex portions are distributed at intervals.

10. The wafer testing kit according to claim 8, wherein: Along the extending direction of the convex portion, the size of the concave portion is smaller than the maximum extendable size of the convex portion.

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