Light-emitting assembly and backlight module

Abstract

The utility model discloses a light-emitting assembly, which comprises a printed circuit board (PCB), a light-emitting diode (LED) wafer and a lens, the LED wafer is welded on the PCB, the PCB is provided with an annular frame-shaped bonding pad which is arranged around the LED wafer, a welding layer is electroplated at the bottom of the lens, the welding layer is in an annular frame shape, and the LED wafer is welded on the welding layer. The welding layer is welded with the annular frame-shaped bonding pad, so that the lens and the PCB are enclosed to form a sealing cavity for accommodating the LED wafer; and a quantum dot diaphragm arranged corresponding to the LED wafer is arranged in the sealing cavity, or quantum dot packaging glue is arranged on the LED wafer. The light-emitting assembly is novel in structure, the welding layer is electroplated at the bottom of the lens, the lens can be welded to the annular frame-shaped bonding pad on the PCB through the welding layer to form the sealing cavity, the air tightness of connection between the lens and the PCB is greatly improved, then external air and water are isolated, the external air and water are prevented from invading the quantum dot diaphragm / quantum dot packaging adhesive, and the service life of the light-emitting assembly is prolonged. And the service life of the light-emitting component is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED optoelectronics, in particular to a light-emitting component and a backlight module. Background Art

[0002] LED light sources are widely used in LCD TVs, other display industries, lighting, and advertising light boxes. To achieve more uniform light output and higher efficiency, the industry currently generally adopts a solution combining LEDs (light-emitting diodes) with lenses. Quantum dot technology is also employed to improve the purity of the three primary colors: red, green, and blue.

[0003] The light-emitting components of the backlight module include a PCB board and LED chips and lenses respectively arranged on the PCB board. Among them, the LED chips of some light-emitting components are provided with quantum dot encapsulation glue (i.e., encapsulation glue doped with quantum dot powder), and the lens covers the LED chip. However, in the prior art, the lens is generally fixed to the PCB board by gluing, so that the airtightness of the light-emitting component is poor. After a period of use, external water vapor and oxygen will enter the interior of the lens and invade the quantum dot encapsulation glue, thereby causing the quantum dots to fail. Another part of the light-emitting components will choose to set up a double-layer lens and set a quantum dot film (QD film) in the interlayer of the double-layer lens. Although this solves the problem of the QD film failing due to water vapor and oxygen invasion, the processing process is relatively cumbersome and the manufacturing cost is relatively high. Utility Model Content

[0004] The technical problem solved by the utility model is to provide a light-emitting component with good airtightness and easy manufacturing, and a backlight module having the light-emitting component.

[0005] In order to solve the above technical problems, the first technical solution adopted by the present invention is: a light-emitting component, including a PCB board, an LED chip and a lens, the LED chip is welded on the PCB board, the PCB board has a ring-frame-shaped pad arranged around the LED chip, the bottom of the lens is electroplated with a welding layer, the welding layer is in the shape of a ring frame, the welding layer is welded to the ring-frame-shaped pad so that the lens and the PCB board are enclosed to form a sealed cavity for accommodating the LED chip; the sealed cavity has a quantum dot diaphragm arranged corresponding to the LED chip, or the LED chip is provided with quantum dot encapsulation glue.

[0006] In one embodiment, the bottom of the lens has a convex ring, and the welding layer is located on the bottom surface of the convex ring.

[0007] In one embodiment, the welding layer is in an overall ring shape.

[0008] In one embodiment, the ring-shaped pad is in a circular ring shape.

[0009] In one embodiment, the PCB board is in a strip shape as a whole, a plurality of LED chips are provided on the PCB board, and each of the LED chips is provided with a corresponding lens.

[0010] In one embodiment, the welding layer is inorganically welded to the ring-shaped welding pad.

[0011] In one embodiment, when the quantum dot membrane is provided in the sealed cavity, the quantum dot membrane is fixed on the LED chip, or the inner surface of the lens has a mounting platform corresponding to the LED chip, and the quantum dot membrane is fixed on the mounting platform.

[0012] In order to solve the above technical problems, the second technical solution adopted by the present invention is: a backlight module, including the above light-emitting component.

[0013] The beneficial effects of this utility model are as follows: the light-emitting assembly has a novel structure, with a solder layer electroplated on the bottom of the lens. The lens can be welded to the ring-shaped pad on the PCB through the solder layer to form a sealed cavity, greatly improving the airtightness of the connection between the lens and the PCB, thereby isolating the lens from external air and water, preventing the intrusion of external air and water on the quantum dot membrane and causing quantum dot failure, thereby improving the service life of the light-emitting assembly. Compared with the design of a double-layer lens with a quantum dot membrane sandwiched between them, the light-emitting assembly has a simpler structure and is more convenient to manufacture, which helps to control production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0015] Figure 1 This is a schematic structural diagram of a light-emitting assembly according to a first embodiment of the present invention;

[0016] Figure 2 This is a structural diagram of the PCB board in the light-emitting assembly of the first embodiment of the present utility model;

[0017] Figure 3 This is a schematic structural diagram of a lens in a light-emitting assembly according to a first embodiment of the present invention.

[0018] Description of Figure Numbers:

[0019] 1. PCB board; 11. Ring-shaped pad;

[0020] 2. LED chip; 21. Quantum dot film;

[0021] 3. Lens; 31. Welding layer; 32. Convex ring;

[0022] 4. Seal the cavity. DETAILED DESCRIPTION

[0023] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments.

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indications will also change accordingly.

[0026] In addition, if the embodiments of the present invention include descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of such features.

[0027] In addition, if the word "and / or" appears throughout the text, it means that three parallel solutions are included. For example, "and / or" includes solutions, or solutions, or solutions that are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. If the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0028] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0029] Example 1

[0030] Please refer to Figures 1 to 3 The first embodiment of the present invention is as follows: a light-emitting assembly includes a PCB board 1, an LED chip 2 and a lens 3. The LED chip 2 is a packaged LED light-emitting device. The LED chip 2 is soldered to the PCB board 1. The PCB board 1 has a ring-shaped solder pad 11 arranged around the LED chip 2. The bottom of the lens 3 is electroplated with a solder layer 31. The solder layer 31 is in the shape of a ring frame. The solder layer 31 is soldered to the ring-shaped solder pad 11 so that the lens 3 and the PCB board 1 enclose a sealed cavity 4 for accommodating the LED chip 2.

[0031] In this embodiment, the sealed cavity 4 has a quantum dot membrane 21 arranged corresponding to the LED chip 2. When the quantum dot membrane 21 is provided in the sealed cavity 4, the quantum dot membrane 21 is fixed on the LED chip 2, or the inner surface of the lens 3 has a mounting platform corresponding to the LED chip 2, and the quantum dot membrane 21 is fixed on the mounting platform. In this case, it is acceptable whether there is a gap between the quantum dot membrane 21 and the LED chip 2.

[0032] As a parallel technical solution, in other embodiments, a quantum dot encapsulation glue is provided on the LED chip 2, and the quantum dot encapsulation glue refers to an encapsulation glue doped with quantum dot phosphor. The encapsulation glue doped with quantum dot phosphor is used for the encapsulation of the LED chip 2, and the encapsulation glue doped with quantum dot phosphor can replace the quantum dot membrane 21.

[0033] Preferably, the welding layer 31 and the ring-shaped welding pad 11 are inorganically welded using an inorganic welding process.

[0034] In order to facilitate the positioning of the lens 3 and the ring-shaped pad 11 , the bottom of the lens 3 has a convex ring 32 , and the welding layer 31 is located on the bottom surface of the convex ring 32 .

[0035] In this embodiment, the welding layer 31 is in an annular shape as a whole, and the ring-shaped welding pad 11 is in an annular shape.

[0036] In an actual product, optionally, the PCB board 1 is in a strip shape as a whole, and a plurality of the LED chips 2 are provided on the PCB board 1 , and each of the LED chips 2 is correspondingly provided with the lens 3 .

[0037] This embodiment further provides a backlight module, which includes the above-mentioned light-emitting component.

[0038] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the practical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A light-emitting component, characterized in that: The device comprises a PCB, an LED chip, and a lens. The LED chip is soldered to the PCB. The PCB has a ring-shaped solder pad arranged around the LED chip. The bottom of the lens is electroplated with a solder layer. The solder layer is in the shape of a ring frame. The solder layer is soldered to the ring-shaped solder pad so that the lens and the PCB enclose a sealed cavity for accommodating the LED chip. The sealed cavity is provided with a quantum dot membrane arranged corresponding to the LED chip, or the LED chip is provided with quantum dot encapsulation glue.

2. The light-emitting assembly according to claim 1, wherein: The bottom of the lens is provided with a convex ring, and the welding layer is located on the bottom surface of the convex ring.

3. The light emitting assembly according to claim 1, wherein: The welding layer is in a circular ring shape as a whole.

4. The light-emitting assembly according to claim 1, wherein: The ring-shaped welding pad is in a circular ring shape.

5. The light emitting assembly according to claim 1, wherein: The PCB board is in a strip shape as a whole. A plurality of LED chips are arranged on the PCB board, and each LED chip is correspondingly provided with the lens.

6. The light emitting assembly according to claim 1, wherein: The welding layer is inorganically welded to the ring-shaped welding pad.

7. The light-emitting assembly according to claim 1, wherein: When the quantum dot membrane is provided in the sealed cavity, the quantum dot membrane is fixed on the LED chip, or the inner surface of the lens has a mounting platform corresponding to the LED chip, and the quantum dot membrane is fixed on the mounting platform.

8. A backlight module, characterized in that: The light-emitting component comprises the light-emitting component according to any one of claims 1 to 7.

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