Efficient Mini LED repair equipment

Abstract

The utility model discloses efficient Mini LED repair equipment, and relates to the technical field of Mini LED repair. The device comprises a rack and is characterized in that a support is arranged above the middle of the rack in an extending mode in the X-axis direction; on the rack, a first repair table and a first repair mechanism are arranged on the first side of the bracket; a first repair driving piece is arranged below the first repair table; the first repair mechanism is arranged on the bracket and above the first repair table so as to perform primary repair on the repair product on the first repair table; a second repair table and a second repair mechanism are arranged on the rack and on the second side of the bracket; a second repair driving piece is arranged below the second repair table; the second repair mechanism is arranged on the bracket and above the second repair table so as to carry out secondary repair on the repaired product on the second repair table; and a product transfer module is arranged between the first repair table and the second repair table. The technical scheme has the advantages of high repair efficiency, high compatibility and compact space.

Description

Technical Field

[0001] The utility model relates to the field of Mini LED rework technology, and specifically to an efficient Mini LED rework equipment. Background Art

[0002] Currently, small-pitch Mini LED products are increasingly being used in the market due to their advantages such as high efficiency and high brightness. However, due to the small spacing between LED lamp beads, the difficulty of the production process also increases. During the production process, it is easy for the lamp beads to be damaged, offset, missing, or leaking during transportation. As a result, after the lamp board is lit, there will be abnormal lamp display problems such as dead lights, dim lights, bright lights, string lights, color casts, etc. Therefore, these lamp boards with defective lamp beads need to be repaired. Currently, the main repair methods for Mini LED products are manual repair and equipment repair. Manual repair has poor consistency and low repair efficiency. Improving repair efficiency is the key to optimizing equipment repair. Utility Model Content

[0003] The purpose of this utility model is to provide an efficient Mini LED repair equipment to address the defects and shortcomings of the existing technology, which has the advantages of high repair efficiency, high compatibility and compact space.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: an efficient Mini LED rework equipment, comprising a frame, wherein a bracket is provided above the middle portion of the frame extending along the X-axis direction;

[0005] A first rework station and a first rework mechanism are provided on the frame and on a first side of the bracket; a first rework driving member is provided below the first rework station for driving the first rework station to move in the X-axis direction and the Y-axis direction; the first rework mechanism is provided on the bracket and above the first rework station to perform a rework on the reworked product on the first rework station;

[0006] A second rework station and a second rework mechanism are provided on the frame and on the second side of the bracket; a second rework driving member is provided below the second rework station for driving the second rework station to move in the X-axis direction and the Y-axis direction; the second rework mechanism is provided on the bracket and above the second rework station to perform secondary rework on the reworked product on the second rework station;

[0007] A product transfer module is provided between the first rework station and the second rework station to transfer the reworked products on the first rework station to the second rework station.

[0008] The utility model is further provided with the first rework mechanism comprising: a first positioning module for identifying a defective spot of the reworked product on the first rework station, a pad cleaning module for cleaning the pad on the defective spot of the reworked product, and a tinning module for tinning the cleaned pad;

[0009] The second rework mechanism includes: a second positioning module for identifying defective points of the reworked product on the second rework station, a mounting module for mounting a new chip on the reworked product, and a welding module for welding the mounted new chip to the welding pad;

[0010] The placement module comprises: a carrier assembly for holding new chips, and a pick-up and placement assembly for taking new chips from the carrier assembly and placing them on the repaired product.

[0011] The utility model is further configured such that a first linear module is provided above the first side of the bracket along the X-axis direction, and the pad cleaning module and the soldering module are mounted on the first linear module and can move on the first linear module;

[0012] A second linear module is arranged above the second side of the bracket along the X-axis direction.

[0013] The utility model is further provided with the following configuration: the material loading assembly comprises: a material loading turntable, a turntable drive assembly, a plurality of crystal trays and a chip recognition camera; each of the crystal trays is arranged along the circumference of the material loading turntable; the chip recognition camera is located above the material loading turntable; the turntable drive assembly comprises: a turntable rotation drive member for driving the material loading turntable to rotate, and a turntable movement drive member for driving the material loading turntable to move in the X-axis direction and the Y-axis direction; the chip recognition camera cooperates with the turntable drive assembly to move a new chip required in one of the crystal trays to be directly below the chip recognition camera;

[0014] The material picking and placement assembly includes: an adsorption head located directly below the chip recognition camera and on the lower side of the loading turntable, which is used to adsorb the crystal disk; an adsorption lifting part used to drive the adsorption head to move on the Z axis and bring the adsorption head close to the crystal disk; a pin arranged in the adsorption head and capable of protruding upward to lift the new chip on the crystal disk; and a material picking and placement head assembly arranged on the upper side of the loading turntable.

[0015] The present invention is further configured such that the placement module further comprises: a transfer table located between the material loading assembly and the material taking and placement assembly;

[0016] The material picking and placement head assembly includes: a material picking head for transferring the new chip on the carrier assembly to the turntable, a placement head for placing the new chip on the turntable onto the reworked product, a material picking drive for driving the material picking head to move, and a placement drive for driving the placement head to move.

[0017] The utility model is further configured such that the material loading assembly is arranged below the bracket, the material taking head is arranged on the second linear module, and the transfer table and the placement head are arranged in the same X-axis direction;

[0018] The material retrieving driving member includes: a third linear module for driving the material retrieving head to move between the material loading assembly and the turntable, and a material retrieving lifting member for driving the material retrieving head to move in the Z-axis direction;

[0019] The placement driving component includes: the second linear module, and a placement lifting component that drives the placement head to move in the Z-axis direction.

[0020] The utility model is further provided with a chip detection module for detecting the quality of new chips at the transfer table, the chip detection module comprising: a first detection camera arranged directly above the transfer table, a second detection camera arranged beside the transfer table and below the pick-up and placement head to detect the bottom of the new chip, and a waste bin arranged beside the transfer table;

[0021] The placement drive component further includes: a rotation drive component for driving the placement head to rotate to correct the angle of the new chip.

[0022] The utility model is further provided with chip cleaning modules for cleaning unqualified chips on both sides of the transfer table, including a transfer blowing member and a transfer suction member provided on the opposite side of the transfer blowing member, so as to suck away and remove unqualified chips on the transfer table;

[0023] A cleaning brush is vertically arranged upward in the waste bin, and the cleaning brush can move in the waste bin to clean the mounting head back and forth.

[0024] The present invention is further provided with that the product transfer module comprises: a first conveyor belt assembly arranged on the first rework station, and a second conveyor belt assembly arranged on the second rework station.

[0025] The utility model is further provided with a glue removal module on the frame and the first side of the bracket for removing glue, film or adhesive layer from defective spots of the reworked product on the first rework station.

[0026] After adopting the above technical solution, the beneficial effects of the utility model are:

[0027] 1. In the present invention, the rework steps are divided into two parts. The rework product is completed with the first rework mechanism on the first rework station for the first rework part, and the second rework mechanism on the second rework station for the second rework part. This not only avoids mutual interference between the first rework mechanism and the second rework mechanism on both sides of the bracket, affecting the rework process and rework effect; but also the rework mechanisms on both sides can perform rework at different stages on different rework products at the same time, so that the rework time of the two rework products in the rework equipment partially overlaps, thereby improving the rework efficiency of the rework equipment.

[0028] 2. In the present invention, there is a suspended space between the lower part of the bracket and the frame, and the loading assembly is arranged below the bracket, located in the suspended space between the bracket and the frame, so as to improve the internal space utilization rate of the rework equipment, reduce the space occupied on both sides of the bracket, and further optimize the volume of the rework equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0030] Figure 1 It is a structural diagram of the utility model;

[0031] Figure 2 It is a structural schematic diagram of the utility model from another perspective;

[0032] Figure 3 It is a structural schematic diagram of the utility model from another perspective;

[0033] Figure 4 This is a schematic diagram of the exploded structure of the mounting module of the utility model;

[0034] Figure 5 yes Figure 4 , an enlarged schematic diagram of the structure at A;

[0035] Figure 6 This is a schematic structural diagram of the material loading assembly of the utility model;

[0036] Figure 7 It is a structural diagram of the rack and bracket of the utility model;

[0037] Figure 8 This is a structural diagram of the rework station and rework drive component of the utility model;

[0038] Figure 9It is a structural schematic diagram of the adsorption head of the utility model.

[0039] Explanation of reference numerals: 100, frame; 110, bracket; 200, first rework station; 300, second rework station; 410, first positioning module; 420, pad cleaning module; 430, tinning module; 510, second positioning module; 520, welding module; 111, first linear module; 112, second linear module; 800, loading assembly; 810, loading turntable; 820, crystal plate; 830, chip recognition camera; 840, turntable drive assembly; 910, adsorption head; 920, adsorption lifting member; 911, ejector pin; 912, adsorption hole; 930, material removal head; 940, placement head; 950, placement lifting component; 960, third linear module; 970, material picking lifting component; 600, turntable; 610, first inspection camera; 620, second inspection camera; 630, waste bin; 980, rotary drive component; 640, transfer blowing component; 650, transfer suction component; 631, cleaning brush; 440, heating blowing module; 210, first X-axis drive component; 220, Y-axis drive component; 310, second X-axis drive component; 230, first conveyor belt assembly; 320, second conveyor belt assembly; 240, sensing device; 250, lifting cylinder. DETAILED DESCRIPTION

[0040] The present invention will be described in further detail below with reference to the accompanying drawings.

[0041] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

[0042] This embodiment relates to an efficient Mini LED repair equipment, such as Figure 1-9 As shown, it includes a frame 100 and a bracket 110 .

[0043] The bracket 110 is disposed above the middle portion of the frame 100 . The bracket 110 extends along the x-axis direction to divide the frame 100 into two parts.

[0044] Among them, a first rework station 200 and a first rework mechanism are arranged on the frame 100 and the first side of the bracket 110; the first rework station 200 is the part for placing the reworked product, and the reworked product can be placed on the first rework station 200 by a loading device or manually, and a first rework driving component for driving the first rework station 200 to move in the X-axis direction and the Y-axis direction is arranged below the first rework station 200, and the first rework mechanism is arranged on the bracket 110 and above the first rework station 200, and is used to perform a rework on the reworked product on the first rework station 200. A second rework station 300 and a second rework mechanism are provided on the frame 100 and on the second side of the bracket 110; the second rework station 300 is also the part where the reworked products are placed, and a second rework driving member for driving the second rework station 300 to move in the X-axis direction and the Y-axis direction is provided below the second rework station 300. The second rework mechanism is provided on the bracket 110 and above the second rework station 300, and is used to perform secondary rework on the reworked products on the second rework station 300.

[0045] A product transfer module is provided between the first rework station 200 and the second rework station 300, which can transfer the reworked product on the first rework station 200 to the second rework station 300. After the reworked product completes one rework on the first rework station 200, it is transferred to the second rework station 300 to continue the second rework to complete the complete rework steps. This rework equipment divides the rework steps into two parts. The rework product completes the first rework part through the first rework mechanism on the first rework station 200, and completes the second rework part through the second rework mechanism on the second rework station 300. This can not only avoid mutual interference between the first rework mechanism and the second rework mechanism on both sides of the bracket 110, affecting the rework process and rework effect; but also the rework mechanisms on both sides can perform rework at different stages on different rework products at the same time, so that the rework time of the two rework products in the rework equipment partially overlaps, thereby improving the rework efficiency of the rework equipment.

[0046] In this embodiment, the first rework mechanism includes: a first positioning module 410 for identifying defective points of the reworked product on the first rework station 200, a pad cleaning module 420 for cleaning the pads on the defective points of the reworked product, and a tinning module 430 for tinning the cleaned pads; the first rework station 200 is driven by the first rework drive to move to the bottom of each rework module of the first rework mechanism, so as to perform a rework on the product. Specifically, the reworked product on the first rework station 200 will first move to the bottom of the first positioning module 410 under the action of the first rework driver, and the defective points of the reworked product on the first rework station 200 will be positioned by the first positioning module 410 to facilitate the first rework mechanism to process the reworked product; thereafter, the reworked product will move to the bottom of the pad cleaning module 420 under the drive of the first rework driver, and the pad cleaning module 420 will be used to clean the defective chips and solder residues on the pads at the defective points, so that the pads at the defective points are exposed for replacement of new chips; then the reworked product will move to the bottom of the tinning module 430 under the drive of the first rework driver, and the tinning module 430 will be used to tin the cleaned pads, so as to facilitate the subsequent soldering of new chips to the pads to complete a rework of the reworked product.

[0047] The second rework mechanism includes: a second positioning module 510 for identifying defective points of the reworked product on the second rework station 300 after one rework, a mounting module for mounting a new chip on the reworked product, and a welding module 520 for welding the mounted new chip to the welding pad; the second rework station 300 is driven by the second rework drive to move to the bottom of each rework module of the second rework mechanism, so as to perform a second rework on the product and complete the complete rework process of the product. Specifically, the repaired product on the second rework station 300 will first move to the bottom of the second positioning module 510 under the action of the second rework drive, and the second positioning module 510 will perform a second positioning on the defective points of the repaired product on the second rework station 300 to facilitate the second rework mechanism to continue to perform secondary repair processing on the repaired product; after that, the repaired product will be driven by the second rework drive to move to the bottom of the mounting module to mount the new chip on the repaired product to replace the chip at the defective point; finally, the repaired product with the new chip mounted will be driven by the second rework drive to move to the bottom of the welding module 520, and the welding module 520 will weld the mounted new chip to the soldering pad of the repaired product to ensure that the new chip is well connected and fixed on the repaired product, completing the secondary repair of the repaired product, so as to smoothly complete the complete rework process.

[0048] As a preferred solution, a first linear module 111 is provided above the first side of the bracket 110 along the X-axis direction, and a second linear module 112 is provided above the second side of the bracket 110 along the X-axis direction. The pad cleaning module 420 and the tinning module 430 are respectively mounted on the first linear module 111. The pad cleaning module 420 and the tinning module 430 can be independently moved on the first linear module 111, which not only facilitates the rework operation of the pad cleaning module 420 and the tinning module 430, but also allows some rework modules to be moved to one side when not in use to avoid interference with other modules. This eliminates the need to reserve too much space between the rework modules, thereby optimizing the overall volume of the equipment.

[0049] In this embodiment, the mounting module includes: a carrier component 800 and a pick-up and placement component; wherein, the carrier component 800 is used to hold the new chip to be replaced, and the pick-up and placement component will pick up the required type of new chip from the carrier component 800, and transfer and place the new chip on the solder pad after tinning of the returned product.

[0050] The loading assembly 800 includes: a loading turntable 810, a turntable drive assembly 840, several crystal disks 820 and a chip recognition camera 830; wherein, multiple crystal disks 820 are arranged circumferentially along the loading turntable 810; the turntable drive assembly 840 includes: a turntable rotation drive component for driving the loading turntable 810 to rotate so as to select different crystal disks 820 on the loading turntable 810 for material retrieval; and a turntable movement drive component for driving the loading turntable 810 to move in the X-axis direction and the Y-axis direction so as to select chips at different positions on the crystal disk 820 for material retrieval; the chip recognition camera 830 is located above the loading turntable 810 and can be used to identify chips on the loading turntable 810. The chip recognition camera 830 will select chips on the loading turntable 810 that meet the defective point repair requirements based on the defective point information, and cooperate with the turntable drive assembly 840 to move the required new chips to the bottom of the chip recognition camera 830 for material retrieval. Of course, in other embodiments, the carrier assembly 800 may also be configured in other structural forms to meet the needs of the rework equipment for new chips.

[0051] The material picking and placement assembly includes: an adsorption head 910 located directly below the chip recognition camera 830 and on the lower side of the material loading turntable 810, and an adsorption lifting component 920 for driving the adsorption head 910 to move along the Z axis, a pin 911 arranged in the adsorption head 910 and protruding upward, and a material picking and placement head assembly arranged on the upper side of the material loading turntable 810. After the turntable drive assembly 840 drives the loading platform to move the required new chip to the position directly below the chip recognition camera 830, the adsorption lifting member 920 can drive the adsorption head 910 to rise to contact the crystal plate 820, and the crystal plate 820 is adsorbed and fixed by the adsorption head 910. At this time, the ejector pin 911 will protrude upward and the adsorption head 910, pushing the required new chip upward. Since the crystal plate 820 has been firmly sucked by the adsorption head 910, the new chip will be separated from the crystal plate 820 under the action of the ejector pin 911; the material picking and placement head assembly will pick up the lifted chip and place the picked up new chip on the reworked product, completing the placement of the new chip to achieve a good placement effect. In this embodiment, the ejector pin 911 is set in the middle of the adsorption head 910, and a plurality of adsorption holes 912 are set around the ejector pin 911 on the adsorption head 910. The provision of multiple suction holes 912 not only enhances the suction and fixation force on the wafer tray 820, but also allows the new chip to be suctioned and fixed to the wafer tray 820 around its perimeter. This allows the new chip to be lifted up by the ejector pins 911, making it easier to separate the new chip from the wafer tray 820, facilitating subsequent material removal. Of course, in other embodiments, the suction holes 912 and ejector pins 911 can also be arranged in other ways to accommodate different types of wafer trays 820 for chip lifting.

[0052] In this embodiment, the placement module also includes: a transfer table 600 located between the carrier assembly 800 and the pick-up and placement assembly; the pick-up and placement head assembly includes: a pick-up head 930 for transferring the new chip on the carrier assembly 800 to the transfer table 600, a placement head 940 for placing the new chip on the transfer table 600 onto the reworked product, a pick-up drive for driving the pick-up head 930 to move, and a placement drive for driving the placement head 940 to move. The pick-up head 930 and the placement head 940 can also work simultaneously. While the placement head 940 is placing the chip onto the reworked product, the pick-up head 930 can work to transfer the next required new chip to the transfer table 600, thereby improving the placement speed of the placement module and optimizing the rework efficiency of the rework equipment.

[0053] As a preferred solution, the bracket 110 is arranged above the frame 100 through an arch structure, T-shaped or other supporting structure. There is a suspended space between the lower part of the bracket 110 and the frame 100. The loading assembly 800 is arranged below the bracket 110, located in the suspended space between the bracket 110 and the frame 100, so as to improve the internal space utilization of the rework equipment, reduce the space occupied on both sides of the bracket 110, and further optimize the volume of the rework equipment. The turntable 600 and the mounting head 940 are arranged in the same X-axis direction, and the mounting drive component includes: a second linear module 112, and a mounting lifting component 950 that drives the mounting head 940 to move in the Z-axis direction. The mounting head 940 can be moved to the top of the turntable 600 by the drive of the second linear module 112 to obtain the new chip on the turntable 600 for mounting. The retrieving drive system includes a third linear module 960, which drives the retrieving head 930 between the carrier assembly 800 and the turntable 600, and a retrieving lift 970, which drives the retrieving head 930 in the Z-axis direction, enabling rapid placement. In this embodiment, the turntable 600 and the retrieving head 930 are positioned along the same Y-axis, and the third linear module 960 is positioned along the Y-axis, ensuring optimal retrieving performance and a more streamlined interior of the rework equipment.

[0054] In this utility model, a chip inspection module for inspecting the quality of new chips is installed on the transfer table 600. This prevents poor-quality new chips from being replaced with reworked products, preventing them from achieving the desired repair results and improving the success rate of product rework. The chip inspection module includes a first inspection camera 610 located directly above the transfer table 600, a second inspection camera 620 located to the side of the transfer table 600 and below the pick-and-place head to inspect the bottom of the new chips, and a waste bin 630 located to the side of the transfer table 600.

[0055] After the pick-up and placement head transfers the new chip to the transfer table 600, it will first identify and detect the new chip through the first detection camera 610 above the transfer table 600; if the chip is qualified, the chip will be moved to the top of the second detection camera 620 by the placement head 940. The second detection camera 620 will detect the bottom of the chip, especially the electrodes at the bottom of the chip. Only chips that pass the second detection will be mounted on the pads of the defective points by the pick-up and placement module to ensure that the new chip is a normal and qualified chip, thereby improving the success rate of rework. The waste bin 630 is set next to the transfer table 600. Chips that fail the first detection camera 610 or the second detection camera 620 will be discarded into the waste bin 630 by the placement head 940. The pick-up head 930 will return to the carrier assembly 800 to obtain new chips for continued placement. The placement drive also includes: a rotary drive 980 for driving the placement head 940 to rotate. When the placement head 940 transfers the chip to the top of the second detection camera 620 to detect the bottom of the chip, the second detection camera 620 will also identify the angle of the chip. The rotary drive 980 will drive the placement head 940 to rotate according to the chip angle information required for the defective point, and cooperate with the second detection camera 620 to match the angle of the chip on the placement head 940 with the required chip angle, so that the placement head 940 can place the new chip on the defective point pad to achieve a good placement effect. The placement head 940 and the material removal head 930 both fix the chip by negative pressure adsorption. Of course, in other embodiments, the placement head 940 and the material removal head 930 can also fix the chip by other means to achieve chip retrieval, transfer and placement.

[0056] As a preferred solution, chip waste components for cleaning unqualified chips are set on both sides of the transfer table 600, including: a transfer blowing member 640, and a transfer suction member 650 set on the opposite side of the transfer blowing member 640. When the first detection camera 610 detects that the camera on the transfer table 600 is unqualified or does not meet the repair requirements of the defective point, the transfer blowing member 640 will blow air, and the transfer blowing member 640 will generate negative pressure to suck away and remove the unqualified chips on the transfer table 600, quickly processing the unqualified chips with higher efficiency. Avoid the material placement head from continuing to place unqualified chips on the returned products. In this embodiment, a cleaning brush 631 is vertically arranged in the waste bin 630. The cleaning brush 631 can move in the waste bin 630, and the placement head 940 can be extended into the waste bin 630. The placement head 940 is cleaned by the movement of the cleaning brush 631 to ensure a good working effect of the placement head 940.

[0057] In this embodiment, the first rework mechanism also includes a heating and blowing module 440. The heating and blowing module 440 can heat the surface of the rework product by blowing hot air toward the rework product, thereby facilitating the cleaning of defective spots on the rework product to achieve a good rework effect. In other embodiments, a degumming module is further provided on the first side of the rack 100 and the bracket 110 to remove glue, film, or adhesive layer from defective spots on the rework product on the first rework station 200, so that the rework equipment can rework finished Mini LED products that have been coated with glue, thereby improving the compatibility of the rework equipment. The degumming module can remove glue by laser vaporization or physical degumming.

[0058] As a preferred solution, both the first positioning module 410 and the second positioning module 510 are equipped with a height measurement component. This module measures the height of the defective spot, providing a comprehensive understanding of the defective spot. This height information is then transmitted to other modules, enabling them to accurately address the defective spot on the reworked product, achieving optimal rework results. The height measurement component can be either contact-based or using a distance sensor.

[0059] In this embodiment, the first rework drive assembly includes: a first X-axis drive member 210 and a Y-axis drive member 220, wherein the first X-axis drive member 210 is disposed on the Y-axis drive member 220, and the first rework station 200 is disposed on the first X-axis drive member 210 to achieve movement of the first rework station 200. The Y-axis drive member 220 runs through both sides of the bracket 110. The second rework drive assembly includes: a second X-axis drive member 310 and the Y-axis drive member 220; the first X-axis drive member 210 is disposed on the Y-axis drive member 220, and the Y-axis drive member 220 can respectively drive the first X-axis drive member 210 and the second X-axis drive member 310 to move, and the second rework station 300 is disposed on the second X-axis drive member 310 to achieve movement of the second rework station 300.

[0060] As a preferred solution, the product transfer module includes: a first conveyor belt assembly 230 provided on the first rework station 200, and a second conveyor belt assembly 320 provided on the second rework station 300. The first rework drive assembly and the second rework drive assembly cooperate to bring the first drive station and the second drive station closer together. The first conveyor belt assembly 230 and the second conveyor belt assembly 320 cooperate to transfer the reworked products from the first rework station 200 to the second rework station 300, thereby facilitating the first rework station 200 and the second rework station 300 to receive the reworked products and complete satisfactory rework on the reworked products. In this embodiment, a sensing device 240 is provided on the first rework station 200 and the second rework station 300 to sense the arrival and removal of the reworked products, thereby cooperating with the first conveyor belt assembly 230 and the second conveyor belt assembly 320 to achieve a satisfactory and accurate transfer effect. A lifting cylinder 250 is also provided on the first rework station 200 and the second rework station 300. After the rework product is in place on the first rework station 200 or the second rework station 300, the lifting cylinder 250 can lift and fix the rework product to prevent the rework product from accidentally moving during the rework process and affecting the rework effect.

[0061] The above is only used to illustrate the technical solution of the present invention and is not intended to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. An efficient Mini LED rework device, comprising a rack (100), characterized in that: A bracket (110) is provided above the middle portion of the frame (100) and extends along the X-axis direction; A first rework station (200) and a first rework mechanism are provided on the frame (100) and on a first side of the bracket (110); a first rework driving member for driving the first rework station (200) to move in the X-axis direction and the Y-axis direction is provided below the first rework station (200); the first rework mechanism is provided on the bracket (110) and above the first rework station (200) to perform a rework on the reworked product on the first rework station (200); A second rework station (300) and a second rework mechanism are provided on the frame (100) and on the second side of the bracket (110); a second rework driving member for driving the second rework station (300) to move in the X-axis direction and the Y-axis direction is provided below the second rework station (300); the second rework mechanism is provided on the bracket (110) and above the second rework station (300) to perform secondary rework on the reworked product on the second rework station (300); A product transfer module is provided between the first rework station (200) and the second rework station (300) to transfer the reworked products of the first rework station (200) to the second rework station (300).

2. The efficient Mini LED rework equipment according to claim 1, characterized in that: The first rework mechanism comprises: a first positioning module (410) for identifying a defective spot of a reworked product on the first rework station (200), a pad cleaning module (420) for cleaning the pad on the defective spot of the reworked product, and a tinning module (430) for tinning the cleaned pad. The second rework mechanism comprises: a second positioning module (510) for identifying defective points of the reworked product on the second rework station (300), a mounting module for mounting a new chip on the reworked product, and a welding module (520) for welding the mounted new chip to the welding pad; The mounting module comprises: a carrier component (800) for holding new chips, and a pick-up and mount component for taking new chips from the carrier component (800) and mounting them on a repaired product.

3. The efficient Mini LED rework equipment according to claim 2, characterized in that: A first linear module (111) is provided above a first side of the bracket (110) along the X-axis direction, and the pad cleaning module (420) and the soldering module (430) are mounted on the first linear module (111) and can move on the first linear module (111); A second linear module (112) is provided above the second side of the bracket (110) along the X-axis direction.

4. The efficient Mini LED rework equipment according to claim 3, characterized in that: The loading assembly (800) includes: a loading turntable (810), a turntable drive assembly (840), a plurality of crystal disks (820) and a chip recognition camera (830); each of the crystal disks (820) is arranged along the circumference of the loading turntable (810); the chip recognition camera (830) is located above the loading turntable (810); the turntable drive assembly (840) includes: a turntable rotation drive member for driving the loading turntable (810) to rotate, and a turntable movement drive member for driving the loading turntable (810) to move in the X-axis direction and the Y-axis direction; the chip recognition camera (830) cooperates with the turntable drive assembly (840) to move a new chip required in one of the crystal disks (820) to be directly below the chip recognition camera (830); The material picking and placement assembly includes: an adsorption head (910) located directly below the chip recognition camera (830) and on the lower side of the material loading turntable (810) for adsorbing the crystal disk (820); an adsorption lifting member (920) for driving the adsorption head (910) to move along the Z axis so that the adsorption head (910) is close to the crystal disk (820); a pin (911) is arranged in the adsorption head (910) and can protrude upward to lift the new chip on the crystal disk (820); and a material picking and placement head assembly is arranged on the upper side of the material loading turntable (810).

5. The efficient Mini LED rework equipment according to claim 4, characterized in that: The placement module further comprises: a transfer table (600) located between the material loading component (800) and the material picking and placement component; The material picking and placement head assembly includes: a material picking head (930) for transferring the new chip on the carrier assembly (800) to the transfer table (600), a placement head (940) for placing the new chip on the transfer table (600) on the repaired product, a material picking drive for driving the material picking head (930) to move, and a placement drive for driving the placement head (940) to move.

6. The efficient Mini LED rework equipment according to claim 5, characterized in that: The material loading assembly (800) is arranged below the bracket (110), the material taking head (930) is arranged on the second linear module (112), and the transfer table (600) and the placement head (940) are arranged in the same X-axis direction; The material taking driving member includes: a third linear module (960) for driving the material taking head (930) to move between the material loading assembly (800) and the transfer table (600), and a material taking lifting member (970) for driving the material taking head (930) to move in the Z-axis direction; The placement drive component comprises: the second linear module (112), and a placement lifting component (950) that drives the placement head (940) to move in the Z-axis direction.

7. The efficient Mini LED rework equipment according to claim 5, characterized in that: A chip inspection module for inspecting the quality of new chips is provided at the transfer table (600), the chip inspection module comprising: a first inspection camera (610) provided directly above the transfer table (600), a second inspection camera (620) provided beside the transfer table (600) and below the pick-up and placement head for inspecting the bottom of the new chips, and a waste bin (630) provided beside the transfer table (600); The placement drive component further includes a rotation drive component (980) for driving the placement head (940) to rotate to correct the angle of the new chip.

8. The efficient Mini LED rework equipment according to claim 7, characterized in that: Chip cleaning modules for cleaning unqualified chips are provided on both sides of the transfer table (600). It comprises a transfer blowing member (640) and a transfer suction member (650) arranged on the opposite side of the transfer blowing member (640) to suck away and remove unqualified chips on the transfer table (600); A cleaning brush (631) is vertically arranged in the waste bin (630), and the cleaning brush (631) can move in the waste bin (630) to clean the mounting head (940) back and forth.

9. The efficient Mini LED rework equipment according to claim 1, characterized in that: The product transfer module comprises: a first conveyor belt assembly (230) arranged on the first rework station (200), and a second conveyor belt assembly (320) arranged on the second rework station (300).

10. The efficient Mini LED rework equipment according to claim 1, characterized in that: A glue removal module is also provided on the frame (100) and the first side of the bracket (110) for removing glue, glue film or adhesive layer from defective spots of the reworked product on the first rework station (200).

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