Chip jig for automatic laser solder ball welding equipment

Abstract

The utility model provides a chip jig for automatic laser solder ball welding equipment. The chip jig comprises a first rotating assembly, a second rotating assembly, an adsorption assembly and a gradienter. The second rotating assembly is installed on the first rotating assembly and driven by the first rotating assembly to rotate in the first direction. And the adsorption assembly is mounted on the second rotating assembly, rotates around the second direction under the driving of the second rotating assembly, and is used for adsorbing the chip. The gradienter is installed on the second rotating assembly and used for detecting the levelness of the adsorption assembly. According to the chip jig for the automatic laser solder ball welding equipment, when the welding device moves relative to the chip, the distance between the welding device and the chip is kept consistent all the time, and the welding quality of solder balls can be improved.

Description

Technical Field

[0001] The present application relates to the field of welding equipment, and in particular to a chip fixture for automatic laser solder ball welding equipment. Background Art

[0002] Ball Grid Array (BGA) is a packaging technology used for integrated circuits (ICs). It connects to the circuit board by soldering a series of balls to the bottom of the chip. BGA packaging offers high density and a low package height, making it suitable for high-performance ICs.

[0003] During the packaging process, due to the large number of solder balls, automatic soldering equipment is usually used to solder a series of solder balls to improve soldering efficiency. During the soldering process, since the welder needs to solder a series of solder balls on the surface of the chip, the welder needs to be mounted on a linear module so that the welder can move relative to the chip. However, in actual applications, the linear module is usually fixed to the frame, making it difficult for the linear module to remain parallel to the chip. When the linear module drives the welder to move relative to the chip, it is easy to cause the distance between the welder and the chip to change, which can easily lead to poor welding quality. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a chip fixture for automatic laser solder ball welding equipment to solve the technical problem in the prior art that the distance between the welder and the chip changes, resulting in poor welding quality.

[0005] To achieve the above objectives, the technical solution adopted in this application is to provide a chip fixture for automatic laser solder ball welding equipment, comprising:

[0006] a first rotating assembly;

[0007] a second rotating assembly, the second rotating assembly being mounted on the first rotating assembly and being driven by the first rotating assembly to rotate in a first direction;

[0008] an adsorption component, which is mounted on the second rotating component and rotates in a second direction driven by the second rotating component and is used to adsorb the chip;

[0009] A level is installed on the second rotating component and is used to detect the horizontality of the adsorption component.

[0010] Optionally, the first rotating assembly includes a first mounting seat, a first worm gear and a first worm, the first worm gear is rotatably mounted on the first mounting seat, the first worm gear is rotatably mounted on the first mounting seat and engages with the outer periphery of the first worm gear, and is also configured to drive the first worm gear to rotate around a first direction when rotating relative to the first mounting seat.

[0011] Optionally, the first mounting seat includes a mounting tube, an opening, an annular plate and a mounting shell, the opening is opened at one end of the mounting tube along the first direction, the annular plate is connected to one end of the mounting tube close to the opening, and the mounting shell is connected to the outer periphery of the mounting tube and is communicated with the mounting tube.

[0012] Optionally, the first mounting seat further includes a first scale, which is arranged on the annular plate; the first rotating assembly further includes a first pointer, which is arranged on the side of the first worm gear facing the annular plate and points to any first scale.

[0013] Optionally, the first mounting seat further includes a rotating shaft, which is connected to the mounting cylinder, passes through the first worm gear, and extends along the first direction.

[0014] Optionally, the second rotating assembly includes a second mounting seat, a rotating seat and an adjusting member. The second mounting seat is installed on the first rotating assembly and rotates around the first direction under the drive of the first rotating assembly. The rotating seat can be rotatably clamped to the second mounting seat. The adjusting member is installed between the second mounting seat and the rotating seat and is used to drive the rotating seat to rotate around the second direction.

[0015] Optionally, the adjusting member includes an arc-shaped rack and a second worm, the arc-shaped rack is clamped to the outer periphery of the rotating seat, the second worm is rotatably passed through the second mounting seat and engaged with the arc-shaped rack, and is also configured to drive the rotating seat to rotate around the second direction when rotating relative to the second mounting seat.

[0016] Optionally, the second mounting seat includes a first seat body, two plate bodies and two curved plates, the first seat body is installed on the first rotating assembly, the two plate bodies are respectively installed on both ends of the first seat body, and the two curved plates are respectively installed on the ends of the two plate bodies away from the first rotating assembly; the rotating seat includes a second seat body and two curved grooves, the second seat body can be rotatably installed on the first seat body, the two curved grooves are respectively opened at both ends of the second seat body, and are arranged one-to-one with the two curved plates, and the curved plates can be slidably engaged in the curved grooves.

[0017] Optionally, the second mounting seat further includes a second scale, which is provided on the first seat body; the rotating seat further includes a second pointer, which is provided on the second seat body and points to any second scale.

[0018] Optionally, a rack, a chip placement plate, a negative pressure chamber, a plurality of adsorption holes and a vacuum generator, the rack is installed on the second rotating assembly, the chip placement plate is installed on the rack, the negative pressure chamber is opened on the chip placement plate, a plurality of adsorption holes are opened on the chip placement plate and are connected to the negative pressure chamber, the vacuum generator is installed on the chip placement plate, and is configured to form a negative pressure in the negative pressure chamber when the chip is placed on the surface of the chip placement plate.

[0019] The chip fixture for automatic laser solder ball welding equipment provided by this application has the following beneficial effects:

[0020] The chip fixture for automatic laser solder ball welding equipment provided in this application uses a first rotating assembly and a second rotating assembly to ensure that the bubble level on the second rotating assembly and the bubble level on the linear module are consistent, based on the bubble level on the linear module, thereby maintaining the adsorption assembly and the linear module in parallel. When the welder moves relative to the chip, the distance between the welder and the chip remains consistent, which helps improve the solder ball welding quality. Furthermore, the chip can be adjusted to any position through the first and second rotating assemblies, which helps expand the applicability of the device and facilitates adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 A three-dimensional diagram of a chip fixture for automatic laser solder ball welding equipment provided in an embodiment of the present application;

[0023] Figure 2 A three-dimensional diagram of the internal structure of the first rotating assembly of a chip fixture for an automatic laser solder ball welding device provided in an embodiment of the present application;

[0024] Figure 3 A three-dimensional diagram of the internal structure of the second rotating assembly of a chip fixture for an automatic laser solder ball welding device provided in an embodiment of the present application;

[0025] Figure 4An exploded view of the adsorption component of a chip fixture for automatic laser solder ball welding equipment provided in an embodiment of the present application;

[0026] Figure 5 A plan view of the first placement plate of a chip fixture for automatic laser solder ball welding equipment provided in an embodiment of the present application.

[0027] Among them, the reference numerals in the figures are:

[0028] 1. First rotating assembly; 11. First mounting seat; 111. Mounting cylinder; 112. Opening; 113. Annular plate; 114. Mounting housing; 115. First scale; 116. Rotating shaft; 12. First worm gear; 13. First worm; 14. First pointer;

[0029] 2. Second rotating assembly; 21. Second mounting seat; 211. First seat body; 212. Plate body; 213. Arc plate; 214. Second scale; 22. Rotating seat; 221. Second seat body; 222. Arc groove; 223. Second pointer; 23. Adjusting member; 231. Arc rack; 232. Second worm;

[0030] 3. Adsorption assembly; 31. Rack; 32. Chip placement plate; 321. First placement plate; 322. Second placement plate; 33. Negative pressure chamber; 34. Adsorption hole; 35. Vacuum generator; 36. Calibration bar; 361. First bar; 362. Second bar;

[0031] 4. Level. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0033] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0034] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0036] like Figures 1 to 5 As shown, an embodiment of the present application provides a chip fixture for automatic laser solder ball bonding equipment, comprising a first rotating assembly 1, a second rotating assembly 2, an adsorption assembly 3, and a level 4. The second rotating assembly 2 is mounted on the first rotating assembly 1 and rotates in a first direction driven by the first rotating assembly 1. The adsorption assembly 3 is mounted on the second rotating assembly 2 and rotates in a second direction driven by the second rotating assembly 2 and is used to adsorb chips. The level 4 is mounted on the second rotating assembly 2 and is used to detect the levelness of the adsorption assembly 3.

[0037] It should be noted that the first direction mentioned above and below refers to the bidirectional direction along its axis, specifically Figure 1 The second direction above and below refers to the bidirectional direction along its axis, specifically as Figure 1 The Y-axis shown in .

[0038] The working principle of this embodiment is as follows: It should be noted that a level 4 is also installed on the linear module. When using this device, based on the bubble position of the level 4 on the linear module, the staff member drives the second rotating assembly 2 to rotate in a first direction via the first rotating assembly 1. The level 4 rotates along with the second rotating assembly 2 in the first direction, thereby changing the circumferential position of the bubble in the level 4 on the second rotating assembly 2 until the circumferential position of the bubble in the level 4 on the second rotating assembly 2 is consistent with the circumferential position of the level 4 on the linear module. The staff member drives the level 4 to rotate in a second direction via the second rotating assembly 2, thereby changing the tilt angle of the bubble in the level 4 on the second rotating assembly 2 until the tilt angle of the bubble in the level 4 on the second rotating assembly 2 is consistent with the tilt angle of the bubble in the level 4 on the linear module.

[0039] The chip fixture of the automatic laser solder ball welding equipment provided in this application can, based on the bubble situation of the level 4 on the linear module, maintain the bubble situation of the level 4 on the second rotating component 2 consistent with the bubble situation of the level 4 on the linear module through the first rotating component 1 and the second rotating component 2, thereby maintaining the adsorption component 3 and the linear module in parallel. When the welder moves relative to the chip, the distance between the welder and the chip remains consistent at all times, which helps to improve the welding quality of the solder balls. In addition, the chip can be adjusted to any position through the first rotating component 1 and the second rotating component 2, which helps to expand the scope of application of the device and facilitates adjustment.

[0040] In one embodiment of the present application, see Figures 1 to 5 The first rotating component 1 includes a first mounting seat 11, a first worm gear 12 and a first worm 13. The first worm gear 12 is rotatably mounted on the first mounting seat 11. The first worm gear 13 is rotatably mounted on the first mounting seat 11 and engages with the outer periphery of the first worm gear 12. It is also configured to drive the first worm gear 12 to rotate around a first direction when rotating relative to the first mounting seat 11.

[0041] With this arrangement, when a worker rotates the first worm 13, the chip can rotate about the first direction with the cooperation of the first worm wheel 12, and the tilt direction of the chip can be changed, so that the tilt direction of the chip and the tilt direction of the linear module remain consistent, making it easier for the chip and the linear module to remain parallel, thereby helping to improve the welding quality. Furthermore, through the first mounting seat 11, the first worm 13 can be limited so that the first worm 13 can only rotate relative to the first worm wheel 12, making it easier for the first worm 13 to drive the first worm wheel 12 to rotate, and making adjustment easier. In addition, the use of the first worm wheel 12 and the first worm 13 can achieve deceleration and torque increase, which helps to improve the adjustment accuracy of the first rotating assembly 1, makes it easier for the worker to drive the chip to rotate about the first direction, and helps to improve the convenience of use.

[0042] In one embodiment of this application, please refer to Figures 1 to 5 The first mounting seat 11 includes a mounting tube 111, an opening 112, an annular plate 113 and a mounting shell 114. The opening 112 is opened at one end of the mounting tube 111 along the first direction. The annular plate 113 is connected to one end of the mounting tube 111 close to the opening 112. The mounting shell 114 is connected to the outer periphery of the mounting tube 111 and is communicated with the mounting tube 111.

[0043] Such a configuration, using the mounting barrel 111 and the annular plate 113, can limit the first worm gear 12 so that the first worm gear 12 can only rotate in the first direction within the mounting barrel 111, which helps to improve the rotational stability of the first worm gear 12 and facilitates the first worm gear 12 to drive the chip to rotate in the first direction. The opening 112 can be used to avoid the second rotating assembly 2, facilitating the installation of the second rotating assembly 2 to the first worm gear 12. The mounting shell 114 is used to install the first worm 13, and can also limit the first worm 13 so that the first worm 13 is stably engaged with the outer periphery of the first worm gear 12. It also allows the first worm 13 to rotate only relative to the first worm gear 12, helping to improve the rotational stability of the first worm 13 and facilitates the first worm 13 to drive the first worm gear 12 to rotate in the first direction.

[0044] In one embodiment of the present application, see Figures 1 to 5 The first mounting seat 11 further includes a first scale 115 , which is disposed on the annular plate 113 . The first rotating assembly 1 further includes a first pointer 14 , which is disposed on a side of the first worm gear 12 facing the annular plate 113 and points to any first scale 115 .

[0045] With such a setting, the rotation angle of the first worm gear 12 can be visualized through the first scale 115 and the first pointer 14, which makes it easier for staff to intuitively understand the rotation angle of the first worm gear 12, thereby facilitating staff to adjust the tilt direction of the chip, which is convenient to adjust and helps to improve the convenience of use.

[0046] In one embodiment of the present application, see Figures 1 to 5 The first mounting seat 11 further includes a rotating shaft 116 , which is connected to the mounting cylinder 111 , passes through the first worm gear 12 , and extends along the first direction.

[0047] This arrangement, using the rotating shaft 116, can limit the first worm gear 12 so that it can rotate only in the first direction, thereby improving the rotational stability of the first worm gear 12 in the first direction. Furthermore, compared to a case where the rotating shaft 116 is not provided, this arrangement can prevent the first worm gear 12 from directly contacting the inner wall of the mounting barrel 111, thereby reducing the possibility of the first worm gear 12 getting stuck to a certain extent and further improving the rotational stability of the first worm gear 12 in the first direction.

[0048] Optionally, a bearing (not shown in the figures) is provided between the first worm gear 12 and the rotating shaft 116 .

[0049] With this arrangement, the bearing can prevent the first worm gear 12 from directly contacting the rotating shaft 116 , thereby facilitating the first worm gear 12 to rotate relative to the rotating shaft 116 and helping to improve the rotational stability of the first worm gear 12 in the first direction.

[0050] In one embodiment of this application, please refer to Figures 1 to 5 The second rotating component 2 includes a second mounting seat 21, a rotating seat 22 and an adjusting member 23. The second mounting seat 21 is installed on the first rotating component 1 and rotates around the first direction under the drive of the first rotating component 1. The rotating seat 22 is rotatably clamped to the second mounting seat 21. The adjusting member 23 is installed between the second mounting seat 21 and the rotating seat 22 and is used to drive the rotating seat 22 to rotate around the second direction.

[0051] With this arrangement, the chip can be rotated about the second direction through the adjusting member 23, and the tilt angle of the chip can be changed, so that the tilt angle of the chip and the tilt angle of the linear module are kept consistent, which facilitates the chip and the linear module to remain parallel, thereby helping to improve the welding quality.

[0052] In one embodiment of the present application, see Figures 1 to 5 The adjusting member 23 includes an arc-shaped rack 231 and a second worm 232. The arc-shaped rack 231 is clamped on the outer periphery of the rotating seat 22. The second worm 232 is rotatably arranged on the second mounting seat 21 and engages with the arc-shaped rack 231. It is also configured to drive the rotating seat 22 to rotate around the second direction when rotating relative to the second mounting seat 21.

[0053] With this arrangement, when a worker rotates the second worm 232, the chip can rotate about the second direction with the cooperation of the arc-shaped rack 231, and the chip's tilt angle can be changed, so that the chip's tilt angle is consistent with the tilt angle of the linear module, making it easier for the chip and the linear module to remain parallel, thereby helping to improve welding quality. Furthermore, the second mounting base 21 can limit the second worm 232 so that the second worm 232 can only rotate relative to the arc-shaped rack 231, making it easier for the second worm 232 to drive the arc-shaped rack 231 to rotate, and making adjustment easier. In addition, the use of the arc-shaped rack 231 and the second worm 232 can achieve deceleration and torque increase, which helps to improve the adjustment accuracy of the second rotating assembly 2, making it easier for the worker to drive the chip to rotate about the second direction, and helping to improve ease of use.

[0054] In one embodiment of the present application, see Figures 1 to 5The second mounting base 21 includes a first base 211, two plates 212, and two curved plates 213. The first base 211 is mounted on the first rotating assembly 1. The two plates 212 are respectively mounted on both ends of the first base 211. The two curved plates 213 are respectively mounted on the ends of the two plates 212 away from the first rotating assembly 1. The rotating base 22 includes a second base 221 and two curved slots 222. The second base 221 is rotatably mounted on the first base 211. The two curved slots 222 are respectively provided at both ends of the second base 221 and correspond one-to-one with the two curved plates 213. The curved plates 213 are slidably engaged in the curved slots 222.

[0055] This arrangement utilizes the first base 211 for mounting the second worm 232 and also serves to positionally limit the second worm 232, allowing the second handle to stably engage the outer periphery of the arcuate rack 231. Furthermore, the second worm 232 can only rotate relative to the arcuate rack 231, thereby improving the rotational stability of the second worm 232 and facilitating the second worm 232 driving the rotation of the arcuate rack 231. The use of the arcuate plate 213 and arcuate groove 222 allows the second base 221 to rotate only in the second direction relative to the plate 212, that is, the second base 221 can only rotate relative to the first base 211, thereby improving the rotational stability of the second base 221 in the second direction.

[0056] In one embodiment of this application, please refer to Figures 1 to 5 The second mounting seat 21 further includes a second scale 214 , which is disposed on the first seat body 211 . The rotating seat 22 further includes a second pointer 223 , which is disposed on the second seat body 221 and points to any second scale 214 .

[0057] With such a configuration, the second scale 214 and the second pointer 223 can realize visualization of the rotation angle of the second seat body 221, so that the staff can intuitively understand the rotation angle of the second seat body 221, thereby facilitating the staff to adjust the tilt angle of the chip, which is convenient to adjust and helps to improve the convenience of use.

[0058] In one embodiment of the present application, see Figures 1 to 5 , a rack 31, a chip placement plate 32, a negative pressure chamber 33, multiple adsorption holes 34 and a vacuum generator 35, the rack 31 is installed on the second rotating component 2, the chip placement plate 32 is installed on the rack 31, the negative pressure chamber 33 is opened on the chip placement plate 32, multiple adsorption holes 34 are opened on the chip placement plate 32, and are connected to the negative pressure chamber 33, the vacuum generator 35 is installed on the chip placement plate 32, and is configured to form a negative pressure in the negative pressure chamber 33 when the chip is placed on the surface of the chip placement plate 32.

[0059] It should be noted here that due to the warping of some chip surfaces, in the actual welding process, the chip is directly placed on the surface of the chip placement plate 32, and there is a large deviation in the distance between different positions of the chip and the welder, which can easily lead to poor welding quality.

[0060] With this arrangement, after a chip is placed on the surface of the chip placement plate 32, a vacuum generator 35 generates a negative pressure within the negative pressure chamber 33. This negative pressure acts on the chip through the multiple suction holes 34, firmly securing the chip to the surface of the chip placement plate 32. This flattens the chip, facilitating soldering of solder balls onto the chip surface by the soldering machine, and improving soldering quality.

[0061] Optionally, multiple negative pressure chambers 33 and vacuum generators 35 are provided. The chip placement plate 32 includes a first placement plate 321 and at least one second placement plate 322. The at least one second placement plate 322 is clamped to the first placement plate 321 and encloses the first placement plate 321 to form multiple negative pressure chambers 33.

[0062] With such an arrangement, during the actual welding process, a corresponding number of negative pressure chambers 33 and vacuum generators 35 are selected according to the chip size, so that the chip size and the size formed by the combination of multiple negative pressure chambers 33 are roughly consistent. Compared with the related art, it is easier for the negative pressure chamber 33 to fix the chip, preventing the situation where the adsorption area of ​​the negative pressure chamber 33 is too small, which makes the chip easy to loosen, and can also prevent the situation where the adsorption area of ​​the negative pressure chamber 33 is too large, which leads to increased energy consumption. In addition, it can be applied to chips of different sizes, which helps to improve the scope of application of the device. The first placement plate 321 and the second placement plate 322 can be enclosed to form a negative pressure chamber 33, ensuring that the chip can be adsorbed on the surface of the first placement plate 321. In addition, the first placement plate 321 and the second placement plate 322 adopt a detachable connection design, which is convenient for maintenance and replacement, and helps to improve the convenience of use.

[0063] Optionally, the chip fixture further includes a correction bar 36, which is mounted on the chip placement plate 32. The correction bar 36 includes a first bar 361 and a second bar 362, wherein the first bar 361 is mounted on the chip placement plate 32 and the second bar 362 is connected to one end of the first bar 361.

[0064] With such a setting, a correction bar 36 is used. After the chip is placed on the surface of the chip placement plate 32, the chip can be limited from two different directions through the correction bar 36. With the cooperation of the negative pressure chamber 33, the chip can be moved to the bottom of the welder according to a predetermined posture. The limiting effect is good, which facilitates welding by the welder and helps to further improve the welding quality.

[0065] The one or more embodiments of this application are intended to encompass all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this application should be included in the scope of protection of this application.

Claims

1. A chip fixture for automatic laser solder ball welding equipment, characterized in that: include: A first rotating assembly (1); a second rotating assembly (2), the second rotating assembly (2) being mounted on the first rotating assembly (1) and being driven by the first rotating assembly (1) to rotate in a first direction; an adsorption component (3), the adsorption component (3) being mounted on the second rotating component (2), and being driven by the second rotating component (2) to rotate about a second direction, and being used for adsorbing a chip; A level (4), the level (4) being mounted on the second rotating assembly (2) and used to detect the horizontality of the adsorption assembly (3).

2. The chip fixture for automatic laser solder ball welding equipment according to claim 1, characterized in that: The first rotating assembly (1) comprises a first mounting seat (11), a first worm gear (12) and a first worm (13), wherein the first worm gear (12) is rotatably mounted on the first mounting seat (11), and the first worm gear (13) is rotatably mounted on the first mounting seat (11) and meshes with the outer periphery of the first worm gear (12), and is further configured to drive the first worm gear (12) to rotate about a first direction when rotating relative to the first mounting seat (11).

3. The chip fixture for automatic laser solder ball welding equipment according to claim 2, characterized in that: The first mounting seat (11) comprises a mounting tube (111), an opening (112), an annular plate (113) and a mounting shell (114), wherein the opening (112) is provided at one end of the mounting tube (111) along a first direction, the annular plate (113) is connected to one end of the mounting tube (111) close to the opening (112), and the mounting shell (114) is connected to the outer periphery of the mounting tube (111) and is in communication with the mounting tube (111).

4. The chip fixture for automatic laser solder ball welding equipment according to claim 3, characterized in that: The first mounting seat (11) further includes a first scale (115), and the first scale (115) is arranged on the annular plate (113); the first rotating assembly (1) further includes a first pointer (14), and the first pointer (14) is arranged on a side of the first worm gear (12) facing the annular plate (113) and points to any first scale (115).

5. The chip fixture for automatic laser solder ball welding equipment according to claim 4, characterized in that: The first mounting seat (11) further includes a rotating shaft (116), the rotating shaft (116) being connected to the mounting cylinder (111), passing through the first worm gear (12), and extending along a first direction.

6. The chip fixture for automatic laser solder ball welding equipment according to claim 1, characterized in that: The second rotating assembly (2) comprises a second mounting seat (21), a rotating seat (22) and an adjusting member (23); the second mounting seat (21) is mounted on the first rotating assembly (1) and rotates around a first direction under the drive of the first rotating assembly (1); the rotating seat (22) is rotatably engaged with the second mounting seat (21); the adjusting member (23) is mounted between the second mounting seat (21) and the rotating seat (22) and is used to drive the rotating seat (22) to rotate around a second direction.

7. The chip fixture for automatic laser solder ball welding equipment according to claim 6, characterized in that: The adjusting member (23) comprises an arc-shaped rack (231) and a second worm (232), wherein the arc-shaped rack (231) is clamped to the outer periphery of the rotating seat (22), and the second worm (232) is rotatably arranged in the second mounting seat (21) and meshed with the arc-shaped rack (231), and is further configured to drive the rotating seat (22) to rotate around a second direction when rotating relative to the second mounting seat (21).

8. The chip fixture for automatic laser solder ball welding equipment according to claim 6, characterized in that: The second mounting seat (21) includes a first seat body (211), two plate bodies (212) and two arc-shaped plates (213), wherein the first seat body (211) is mounted on the first rotating assembly (1), the two plate bodies (212) are respectively mounted on the two ends of the first seat body (211), and the two arc-shaped plates (213) are respectively mounted on one end of the two plate bodies (212) away from the first rotating assembly (1); the rotating seat (22) includes a second seat body (221) and two arc-shaped grooves (222), wherein the second seat body (221) is rotatably mounted on the first seat body (211), the two arc-shaped grooves (222) are respectively opened at the two ends of the second seat body (221) and are arranged one-to-one corresponding to the two arc-shaped plates (213), and the arc-shaped plates (213) are slidably engaged in the arc-shaped grooves (222).

9. The chip fixture for automatic laser solder ball welding equipment according to claim 8, characterized in that: The second mounting seat (21) further includes a second scale (214), and the second scale (214) is arranged on the first seat body (211); the rotating seat (22) further includes a second pointer (223), and the second pointer (223) is arranged on the second seat body (221) and points to any second scale (214).

10. The chip fixture for automatic laser solder ball welding equipment according to claim 1, characterized in that: A frame (31), a chip placement plate (32), a negative pressure chamber (33), a plurality of adsorption holes (34) and a vacuum generator (35), wherein the frame (31) is mounted on the second rotating assembly (2), the chip placement plate (32) is mounted on the frame (31), the negative pressure chamber (33) is opened on the chip placement plate (32), the plurality of adsorption holes (34) are opened on the chip placement plate (32) and are connected to the negative pressure chamber (33), and the vacuum generator (35) is mounted on the chip placement plate (32) and is configured to form a negative pressure in the negative pressure chamber (33) when a chip is placed on the surface of the chip placement plate (32).

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