High-frequency heat sealing machine capable of adjusting level

Abstract

The utility model relates to the technical field of medical air cushion production, and particularly discloses a high-frequency heat sealing machine capable of adjusting levelness, which can be applied to the production of medical air cushions, two layers of film materials are firstly placed on a lower die holder, a first driving device drives a sliding block, the sliding block drives a lower polar plate, a first carrier plate and the lower die holder to move along the x direction, and the first carrier plate and the lower die holder move along the x direction. When the lower die base moves to the position below the upper die base, the lower pole plate and the upper pole plate generate high-frequency electromagnetic field energy to act on the two layers of membrane materials after being electrified, molecules on the surfaces can be strongly vibrated and rubbed, so that heat is generated, the membrane materials reach the melting point in a short time, then the upper die base is driven by a second driving device to move downwards in the z direction, and the membrane materials are pressed downwards through the upper die base. The two layers of film materials placed on the lower die base are connected in a heat sealing mode, and operation is easy; and a horizontal adjusting mechanism is further arranged, the levelness of an adjusting plate can be adjusted by adjusting bolt and nut adjusting pieces in four directions, and therefore the levelness of the lower end face of the upper die base is adjusted, and it is guaranteed that the heat sealing connection effect of the two layers of film materials is better.

Description

Technical Field

[0001] The utility model relates to the technical field of medical air cushion production, in particular to a high-frequency heat sealing machine with adjustable level. Background Art

[0002] A medical air cushion is a cushion that can be injected with air. It can be placed under the pressure areas of bedridden patients to relieve pressure, prevent pressure sores, promote blood circulation, relieve pain and promote sleep.

[0003] Medical air cushions are usually formed by heat-sealing film materials such as PVC film and rubber film. A high-frequency heat sealing machine is usually used for heat sealing connection. First, two layers of film are placed on the lower die base of the high-frequency heat sealing machine. When the upper and lower plates of the high-frequency heat sealing machine are energized, high-frequency energy is generated. The high-frequency energy is used to heat the two layers of film. The internal molecules of the two layers of film are excited and move at high speed, rubbing against each other to generate heat and melt. Then, the upper die base of the high-frequency heat sealing machine is used to press down to achieve the purpose of welding.

[0004] The high-frequency heat sealing machine in the existing technology usually has multiple pads for pressing the film on the lower mold base, so that the high-frequency heat sealing machine can form multiple heat-sealed connection areas in one heat sealing. In actual applications, due to reasons such as the imbalance of the upper mold base, it is easy to cause the heat sealing effect of the two film materials to be unsatisfactory.

[0005] Therefore, the existing technology still needs to be improved and developed. Utility Model Content

[0006] In view of the above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a high-frequency heat sealing machine with adjustable level to solve the problem that the high-frequency heat sealing machine in the prior art easily leads to unsatisfactory heat sealing effect of two film materials due to reasons such as imbalance of the upper mold base.

[0007] A high-frequency heat sealing machine with adjustable level, comprising:

[0008] Machine;

[0009] The conveying device includes a first driving device provided on the machine platform along the x-direction, a slider connected to the output end of the first driving device, a lower electrode plate fixed to the upper end of the slider, a first carrier plate fixed to the upper end of the lower electrode plate, and a lower mold base fixed to the upper end of the first carrier plate and used to place two layers of film materials;

[0010] The heat sealing device includes a column fixed on the machine platform, a top plate fixed on the column, a second driving device fixed to the top plate and drivable in the z direction, a second carrier connected to the output end of the second driving device, an adjustment plate fixed to the lower end of the second carrier, an upper electrode plate fixed to the lower end of the adjustment plate, and an upper mold base fixed to the lower end of the upper electrode plate, wherein the lower mold base can be moved along the x direction to below the upper mold base; the upper mold base can be moved downward along the z direction to heat-seal the two layers of film material placed on the lower mold base;

[0011] A horizontal adjustment mechanism includes a first connecting block fixed to the four sides of the second carrier plate, a second connecting block fixed to the four sides of the adjustment plate and corresponding to the position of the first connecting block, and a bolt and nut adjustment member for connecting the upper and lower first connecting blocks and the second connecting block.

[0012] Specifically, the high-frequency heat sealing machine further includes a power supply device, and the upper electrode plate and the lower electrode plate are both electrically connected to the power supply device.

[0013] Specifically, a grounding module is provided between the machine and the upper electrode plate. The grounding module includes a conductive connecting plate electrically connected to the upper electrode plate, a conductive contact piece fixed to the lower end of the conductive connecting plate, and a grounding plate provided on the machine. The conductive contact piece can be moved downward along z until it abuts against the grounding plate.

[0014] Specifically, a height adjustment structure is provided between the conductive connecting plate and the upper electrode plate, and the height adjustment structure includes a mounting hole provided on the conductive connecting plate and extending along the z direction, and a bolt passing through the mounting hole and connected to the upper electrode plate.

[0015] Specifically, the grounding plate is connected to a grounding wire, and the conductive contact piece is a C-shaped metal contact piece with elasticity.

[0016] Specifically, the lower die base includes a tray, positioning pins provided on both sides of the tray along the x-direction, and a plurality of pads provided on the inner side of the tray and spaced apart along the x-direction.

[0017] Specifically, the top plate is provided with a plurality of reinforcing plates arranged along the x-direction and the y-direction.

[0018] Specifically, the first driving device is a screw module.

[0019] Specifically, the second driving device is a cylinder.

[0020] Beneficial effects of the utility model:

[0021] The high-frequency heat sealing machine of the present invention can be applied to the production of medical air cushions. First, two layers of film materials are placed on the lower mold base, and the slider is driven by the first driving device. The slider drives the lower electrode plate, the first carrier plate and the lower mold base to move along the x direction. When the lower mold base moves to the bottom of the upper mold base, the lower electrode plate and the upper electrode plate are energized to generate high-frequency electromagnetic field energy and act on the two layers of film materials. The molecules on the surface will be subjected to strong vibration and friction, thereby generating heat, so that the film material reaches the melting point in a short time, and then the upper mold base is driven to move downward along z by the second driving device. The two layers of film materials placed on the lower mold base are heat-sealed and connected by the downward pressure of the upper mold base, and the operation is simple. A horizontal adjustment mechanism is also provided. By adjusting the bolt and nut adjustment parts in four directions, the horizontality of the adjustment plate can be adjusted, thereby adjusting the horizontality of the lower end face of the upper mold base, ensuring a better heat-sealing connection effect of the two layers of film materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional diagram of a high-frequency heat sealing machine according to an embodiment of the present application;

[0023] Figure 2 for Figure 1 Enlarged view of part A;

[0024] Figure 3 A top view of a high-frequency heat sealing machine according to an embodiment of the present application;

[0025] Figure 4 for Figure 3 Cross-sectional view along line BB;

[0026] Figure 5 A three-dimensional diagram of a heat sealing device, a level adjustment mechanism, and a grounding module according to an embodiment of the present application;

[0027] Figure 6 This is a schematic diagram of the structure of the lower mold base of this application after placing two layers of membrane materials;

[0028] Figure 7 It is a schematic diagram of the structure after the two layers of membrane materials are heat-sealed.

[0029] The figures are marked as: machine 10, conveying device 20, first driving device 21, slider 22, lower electrode plate 23, first carrier plate 24, film material 70, lower mold base 25, heat sealing device 30, column 31, top plate 32, second driving device 33, second carrier plate 34, adjustment plate 35, upper electrode plate 36, upper mold base 37, horizontal adjustment mechanism 40, first connecting block 41, second connecting block 42, bolt and nut adjustment member 43, grounding module 50, conductive connecting plate 51, conductive contact member 52, grounding plate 53, height adjustment structure 60, mounting hole 61, bolt 62, tray 251, positioning pin 252, pad 253, reinforcement plate 38. DETAILED DESCRIPTION

[0030] The present invention provides a high-frequency heat sealer with adjustable level. To make the purpose, technical solution, and effects of the present invention more clear and explicit, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific examples described herein are only intended to explain the present invention and are not intended to limit the present invention.

[0031] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0032] like Figures 1 to 7 This embodiment discloses a high-frequency heat sealing machine with adjustable level, comprising:

[0033] Machine 10;

[0034] The conveying device 20 includes a first driving device 21 provided on the machine 10 along the x-direction, a slider 22 connected to the output end of the first driving device 21, a lower electrode plate 23 fixed to the upper end of the slider 22, a first carrier plate 24 fixed to the upper end of the lower electrode plate 23, and a lower mold base 25 fixed to the upper end of the first carrier plate 24 and used to place two layers of film material 70;

[0035] The heat sealing device 30 includes a column 31 fixed to the machine 10, a top plate 32 fixed to the column 31, a second drive device 33 fixed to the top plate 32 and drivable in the z direction, a second carrier plate 34 connected to the output end of the second drive device 33, an adjustment plate 35 fixed to the lower end of the second carrier plate 34, an upper plate 36 fixed to the lower end of the adjustment plate 35, and an upper mold base 37 fixed to the lower end of the upper plate 36. The lower mold base 25 can be moved along the x direction to below the upper mold base 37; the upper mold base 37 can be moved downward along the z direction to heat-seal the two layers of film 70 placed on the lower mold base 25.

[0036] The horizontal adjustment mechanism 40 includes a first connecting block 41 fixed to the four sides of the second carrier plate 34, a second connecting block 42 fixed to the four sides of the adjustment plate 35 and corresponding to the position of the first connecting block 41, and a bolt and nut adjustment member 43 for connecting the upper and lower first connecting blocks 41 and the second connecting blocks 42.

[0037] The high-frequency heat sealing machine of this embodiment can be applied to the production of medical air cushions. First, two layers of film material 70 are placed on the lower mold base 25. The slider 22 is driven by the first driving device 21. The slider 22 drives the lower electrode 23, the first carrier plate 24 and the lower mold base 25 to move along the x direction. When the lower mold base 25 moves to the bottom of the upper mold base 37, the lower electrode 23 and the upper electrode 36 are energized to generate high-frequency electromagnetic field energy and act on the two layers of film material 70. The molecules on the surface will be subjected to strong vibration and friction, thereby generating heat, so that the film material 70 reaches the melting point in a short time. Then, the upper mold base 37 is driven to move downward along the z direction by the second driving device 33. The two layers of film material 70 placed on the lower mold base 25 are heat-sealed and connected by the downward pressure of the upper mold base 37. The operation is simple.

[0038] This embodiment is also provided with a horizontal adjustment mechanism 40. By adjusting the bolt and nut adjustment parts 43 in four directions, the horizontality of the adjustment plate 35 can be adjusted, thereby adjusting the horizontality of the lower end surface of the upper mold base 37 to ensure a better heat-sealing connection effect between the two layers of film material 70.

[0039] Furthermore, the high-frequency heat sealing machine also includes a power supply device (not shown), and the upper electrode plate 36 and the lower electrode plate 23 are electrically connected to the power supply device. The upper electrode plate 36 and the lower electrode plate 23 are powered by the power supply device, so that when the upper electrode plate 36 and the lower electrode plate 23 are energized, high-frequency electromagnetic field energy is generated and acts on the two layers of film material 70, thereby accelerating the hot melting efficiency of the two layers of film material 70.

[0040] Since the power supply device will output a higher voltage, the upper plate 36 and the lower plate 23 are prone to leakage during the welding process of the two layers of film material 70. For this reason, please refer to Figure 1 In this embodiment, a grounding module 50 is further provided between the machine 10 and the upper electrode plate 36. The grounding module 50 includes a conductive connecting plate 51 electrically connected to the upper electrode plate 36, a conductive contact member 52 fixed to the lower end of the conductive connecting plate 51, and a grounding plate 53 provided on the machine 10. The grounding plate 53 is connected to a grounding wire, and the conductive contact member 52 can move downward along z until it abuts against the grounding plate 53. When the upper electrode plate 36 is pressed downward, the conductive connecting plate 51 and the conductive contact member 52 will be driven downward, so that the conductive contact member 52 contacts the grounding plate 53. The grounding plate 53 is connected to the ground through the grounding wire, thereby forming a good grounding to avoid leakage.

[0041] Please refer to Figure 5 In this embodiment, a height adjustment structure 60 is provided between the conductive connecting plate 51 and the upper electrode plate 36. The height adjustment structure 60 includes a mounting hole 61 provided on the conductive connecting plate 51 and extending along the z-direction, and a bolt 62 connected to the upper electrode plate 36 after passing through the mounting hole 61. The height adjustment structure 60 is used to adjust the initial height of the conductive contact member 52 to adapt it to different application scenarios.

[0042] Please refer to Figure 5The conductive contact piece 52 is a C-shaped metal contact piece with elasticity. The C-shaped metal contact piece has better elastic recovery performance and better contact effect between the conductive contact piece 52 and the grounding plate 53.

[0043] Please refer to Figure 2 、 Figure 6 and Figure 7 The lower mold base 25 of this embodiment includes a tray 251, positioning pins 252 provided on both sides of the tray 251 along the x-direction, and a plurality of pads 253 provided on the inner side of the tray 251 and spaced apart along the x-direction. A plurality of pads 253 are provided for supporting the film material 70, so that two layers of film material 70 can be heat-sealed at one time to form a plurality of heat-sealed connection areas. When used as a medical air cushion subsequently, the cavity between the two layers of heat-sealed connection areas can be inflated to make it swell, thereby forming a medical air cushion with a multi-stage inflation structure.

[0044] Since the top plate 32 bears a large load, in order to avoid deformation of the top plate 32, please refer to Figure 5 In this embodiment, the top plate 32 is provided with a plurality of reinforcing plates 38 arranged along the x-direction and the y-direction.

[0045] Furthermore, the first driving device 21 is a screw module, which has high working precision and small error, and can meet the demand for high-precision control of stroke.

[0046] Furthermore, the second driving device 33 is a cylinder, which has a simple structure and relatively low maintenance cost, thereby reducing the possibility of failure.

[0047] The above specifically describes the preferred embodiments of the present invention, but the present invention is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A high-frequency heat sealing machine with adjustable level, characterized in that: include: Machine (10); A conveying device (20) comprises a first driving device (21) provided on the machine (10) along the x-direction, a slider (22) connected to the output end of the first driving device (21), a lower electrode plate (23) fixed to the upper end of the slider (22), a first carrier plate (24) fixed to the upper end of the lower electrode plate (23), and a lower mold base (25) fixed to the upper end of the first carrier plate (24) and used for placing two layers of film materials (70); A heat sealing device (30) comprises a column (31) fixed on the machine (10), a top plate (32) fixed on the column (31), a second driving device (33) fixed on the top plate (32) and drivable in the z direction, a second carrier (34) connected to the output end of the second driving device (33), an adjustment plate (35) fixed to the lower end of the second carrier (34), an upper electrode plate (36) fixed to the lower end of the adjustment plate (35), and an upper mold base (37) fixed to the lower end of the upper electrode plate (36); the lower mold base (25) can be moved along x to below the upper mold base (37); the upper mold base (37) can be moved downward along z to heat-seal the two layers of the film material (70) placed on the lower mold base (25); A horizontal adjustment mechanism (40) includes a first connecting block (41) fixed to the four sides of the second carrier plate (34), a second connecting block (42) fixed to the four sides of the adjustment plate (35) and corresponding to the position of the first connecting block (41), and a bolt and nut adjustment member (43) for connecting the upper and lower first connecting blocks (41) and the second connecting blocks (42).

2. The high-frequency heat sealing machine with adjustable level according to claim 1, characterized in that: The high-frequency heat sealing machine further comprises a power supply device, and the upper electrode plate (36) and the lower electrode plate (23) are both electrically connected to the power supply device.

3. The high-frequency heat sealing machine with adjustable level according to claim 2, characterized in that: A grounding module (50) is further provided between the machine (10) and the upper electrode plate (36), wherein the grounding module (50) comprises a conductive connecting plate (51) electrically connected to the upper electrode plate (36), a conductive contact member (52) fixed to the lower end of the conductive connecting plate (51), and a grounding plate (53) provided on the machine (10), wherein the conductive contact member (52) can be moved downward along z until it contacts the grounding plate (53).

4. The high-frequency heat sealing machine with adjustable level according to claim 3, characterized in that: A height adjustment structure (60) is provided between the conductive connecting plate (51) and the upper electrode plate (36), and the height adjustment structure (60) includes a mounting hole (61) provided on the conductive connecting plate (51) and extending along the z-direction, and a bolt (62) passing through the mounting hole (61) and connected to the upper electrode plate (36).

5. The high-frequency heat sealing machine with adjustable level according to claim 3, characterized in that: The grounding plate (53) is connected to a grounding wire, and the conductive contact piece (52) is a C-shaped metal contact piece with elasticity.

6. The high-frequency heat sealing machine with adjustable level according to claim 1, characterized in that: The lower die base (25) comprises a tray (251), positioning pins (252) provided on both sides of the tray (251) along the x-direction, and a plurality of pads (253) provided on the inner side of the tray (251) and spaced apart along the x-direction.

7. The high-frequency heat sealing machine with adjustable level according to claim 1, characterized in that: The top plate (32) is provided with a plurality of reinforcing plates (38) arranged along the x-direction and the y-direction.

8. The high-frequency heat sealing machine with adjustable level according to claim 1, characterized in that: The first driving device (21) is a screw module.

9. The high-frequency heat sealing machine with adjustable level according to claim 1, characterized in that: The second driving device (33) is a cylinder.

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