Semiconductor probe test equipment based on 3D scanning and printing

Abstract

The utility model discloses semiconductor probe testing equipment based on 3D scanning and printing, and belongs to the field of probe testing. The device comprises a first 3D scanning camera, a second 3D scanning camera, a computer, a printing device, a semiconductor tester and a probe station. The computer is connected with the first 3D scanning camera, the second 3D scanning camera, the printing equipment, the semiconductor tester and the probe station; the semiconductor tester is connected with the probe station; the first 3D scanning camera is arranged above the probe station; and the second 3D scanning camera is arranged below the probe station. The utility model provides a semiconductor probe test device based on 3D scanning and printing, which can be applied to performance parameter measurement and tracking of electronic components, is suitable for electrical test of desoldered devices, can keep the integrity of the original state of a sample, and reduces the complexity and error-prone property of manual operation.

Description

Technical Field

[0001] The utility model relates to a semiconductor probe testing device based on 3D scanning and printing, belonging to the field of probe testing. Background Art

[0002] With the advent of the intelligent electronics era, the application of electronic components is increasing, and failure analysis of these components is receiving increasing attention. Failed components require desoldering and electrical testing. Semiconductor testers are devices that can measure and track various device performance parameters. During testing, a test fixture is required to establish electrical connection with the device pins, allowing the performance parameters of each pin to be tested. Electronic components are secured using specialized standard fixtures based on their packaging.

[0003] With existing technology, after desoldering a device, some solder residue or deformation may remain on the pins, potentially causing them to mismatch with the test fixture. Manual repair is required to repair the residual solder or pin shape. Some devices have small pins or fragile materials, which can easily lead to more serious consequences such as pin damage or deformation, affecting subsequent testing and sample integrity. After placing the sample in the test fixture, the wiring harness connection must be manually changed, which is complex and prone to errors. Furthermore, specialized standard fixture bases are numerous and expensive. Utility Model Content

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing technology and provide a semiconductor probe testing equipment based on 3D scanning and printing, which can be used for measuring and tracking the performance parameters of electronic components, is suitable for electrical testing of devices after desoldering, can preserve the integrity of the original state of the sample, and reduce the complexity and error-proneness of manual operations.

[0005] In order to solve the above technical problems, the technical solution of the utility model is:

[0006] The utility model provides a semiconductor probe testing device based on 3D scanning and printing, which includes a first 3D scanning camera, a second 3D scanning camera, a computer, a printing device, a semiconductor tester and a probe station;

[0007] The computer is connected to the first 3D scanning camera, the second 3D scanning camera, the printing device, the semiconductor tester, and the probe station;

[0008] The semiconductor tester is connected to a probe station;

[0009] The first 3D scanning camera is arranged above the probe station;

[0010] The second 3D scanning camera is arranged below the probe station.

[0011] Furthermore, the first 3D scanning camera, the second 3D scanning camera, the printing device, the semiconductor tester, the probe station and the computer are connected via a data cable.

[0012] Furthermore, the probe station includes a test bench, a positioning column, a test carrier, a movable probe and a probe camera;

[0013] The positioning column is fixed above the test bench, the test carrier is placed above the test bench, the side wall of the test carrier is in contact with the positioning column, the positioning column is used to position the test carrier, and the test carrier is used to carry the sample to be tested;

[0014] The movable probe is arranged above the test carrier, and the movable probe is used to contact the pin of the sample to be tested;

[0015] The probe camera is used to capture a contact image between the movable probe and the pin of the sample to be tested.

[0016] Furthermore, the positioning column includes a first positioning component and a second positioning component, and an angle θ is set at the connection between the first positioning component and the second positioning component, and the angle θ is 90°.

[0017] Furthermore, the movable probe comprises a head and a body, and an angle α is provided at the connection between the head and the body. Furthermore, the test bench is made of a transparent material.

[0018] By adopting the above-mentioned technical solution, the present invention can obtain three-dimensional data of the sample to be tested by respectively placing a first 3D scanning camera and a second 3D scanning camera above and below the probe station. By connecting a 3D printer to a computer, a test vehicle can be printed based on the data. Even if the pins of the device have residual solder or are deformed after desoldering, the sample to be tested can still be matched with the test vehicle, effectively reducing the risk of further damage or deformation of the pins, helping to preserve the integrity of the sample's original state and reducing the complexity and error-proneness of manual operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a functional block diagram of the semiconductor probe testing equipment based on 3D scanning and printing of the present invention;

[0020] Figure 2 This is a front view of the probe station of the present invention;

[0021] Figure 3 A top view of the probe station of the present invention;

[0022] Figure 4 is a cross-sectional view of the test vehicle of the present invention;

[0023] Figure 5 A top view of the test vehicle of the present invention;

[0024] Figure 6 This is a top view of the 3D scanning test bench of the present invention. DETAILED DESCRIPTION

[0025] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.

[0026] like Figure 1 As shown, this embodiment provides a semiconductor probe testing device based on 3D scanning and printing, which includes a first 3D scanning camera, a second 3D scanning camera, a computer, a printing device, a semiconductor tester and a probe station;

[0027] The first 3D scanning camera, the second 3D scanning camera, the printing device, the semiconductor tester, the probe station and the computer are connected via data cables, and the computer can obtain data from the other parts and can also transmit data to the other parts;

[0028] The semiconductor tester is connected to the probe station. The semiconductor tester includes a power supply, which is connected to the probe station through wires to achieve electrical connection between the power supply and the probe station.

[0029] The first 3D scanning camera is arranged above the probe station;

[0030] The second 3D scanning camera is arranged below the probe station.

[0031] like Figure 1 As shown, the probe station of this embodiment includes a test platform 1 , a positioning column 2 , a test carrier 3 , a movable probe 4 and a probe camera 5 .

[0032] like Figure 2 As shown, the positioning column 2 is fixed above the test table 1 to facilitate positioning of the sample to be tested. The test carrier 3 is placed above the test table 1, and the side wall of the test carrier 3 is in contact with the positioning column 2. The positioning column 2 is used to position the test carrier 3, and the test carrier 3 is used to carry the sample to be tested 6;

[0033] The movable probe 4 is arranged above the test carrier 3 and is used to contact the pins of the sample to be tested 6;

[0034] The probe camera 5 is used to capture the contact image between the movable probe 4 and the pin of the sample to be tested 6 to determine whether the contact effect is good.

[0035] like Figure 3As shown, the positioning column 2 includes a first positioning component 21 and a second positioning component 22 . An angle θ is set at the connection between the first positioning component 21 and the second positioning component 22 , and the angle θ is 90°.

[0036] In this embodiment, the test bench 1 is made of transparent material, which facilitates the first 3D scanning camera and the second 3D scanning camera to obtain three-dimensional data of the sample 6 to be tested. Figure 6 As shown, the side wall of the sample to be tested 6 is fitted with the positioning column 2. The positioning column 2 is used to position the sample to be tested 6. The first 3D scanning camera and the second 3D scanning camera are controlled to move up and down by mechanical bearings to scan and obtain three-dimensional data of the sample to be tested 6, and transmit it to the computer through a data cable.

[0037] like Figure 4 As shown in the figure, based on the three-dimensional data of the sample, the height difference h between the bottom of the package of the sample 6 to be tested and the lowest point of the pin can be obtained, and the original data of the height of the test vehicle h can be obtained. On the basis of the original data of the height of the test vehicle h, a is added, and a is 1~3mm to obtain the height data of the test vehicle 3. Figure 5 As shown, based on the three-dimensional data of the sample, the XY direction data of the sample are increased by a, where a is 1~3mm, to obtain the XY direction data of the test vehicle 3.

[0038] In this embodiment, the printing device uses a K1C printer from Chuangxiang 3D. It can heat the antistatic plastic material to form the test vehicle 3 according to the 3D printing data of the test vehicle transmitted by the computer, and print the test vehicle 3. The test vehicle 3 can be made of materials such as PMMA and ABS doped with antistatic components.

[0039] During testing, the sample 6 to be tested is placed in the test carrier 3 , and the side wall of the test carrier 3 containing the sample 6 to be tested is fitted with the positioning posts 2 .

[0040] like Figure 2 As shown, the movable probe 4 includes a head 41 and a body 42. The connection between the head 41 and the body 42 is set at an angle α, which is 120° to 180°. This makes it easier for the probe camera 5 to view the needle insertion effect of the movable probe 4. The movable probe 4 can move in the XYZ directions. In this embodiment, the movable probe 4 can be made of gold, copper, tungsten, or alloys.

[0041] The semiconductor tester is used to supply power to the sample 6 to be tested and perform testing to obtain an electrical curve of the sample.

[0042] The working principle of this utility model is as follows:

[0043] Using the first and second 3D scanning cameras positioned above and below the probe station, three-dimensional data of the sample 6 is acquired and transmitted to a computer. A 3D printer then prints the test vehicle 3 using the data. The sample 6 is placed in the test vehicle 3, and the movable probe 4 is brought into contact with the pins of the sample 6. Finally, a semiconductor tester is used to perform the test, obtaining the sample's electrical curve and completing the test.

[0044] When there is residual solder or deformation on the pins of the device after desoldering, the sample 6 to be tested can still be matched with the test carrier 3, which effectively reduces the risk of more serious damage or deformation of the pins, is conducive to preserving the integrity of the original state of the sample, and reduces the complexity and error-proneness of manual operations. It can be applied to the measurement and tracking of performance parameters of electronic components and is suitable for electrical testing of devices after desoldering.

[0045] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor probe testing device based on 3D scanning and printing, characterized in that: It includes a first 3D scanning camera, a second 3D scanning camera, a computer, a printing device, a semiconductor tester and a probe station; The computer is connected to the first 3D scanning camera, the second 3D scanning camera, the printing device, the semiconductor tester, and the probe station; The semiconductor tester is connected to a probe station; The first 3D scanning camera is arranged above the probe station; The second 3D scanning camera is arranged below the probe station.

2. The semiconductor probe testing equipment based on 3D scanning and printing according to claim 1, characterized in that: The first 3D scanning camera, the second 3D scanning camera, the printing device, the semiconductor tester, the probe station and the computer are connected via data cables.

3. The semiconductor probe testing equipment based on 3D scanning and printing according to claim 1, characterized in that: The probe station comprises a test station (1), a positioning column (2), a test carrier (3), a movable probe (4) and a probe camera (5); The positioning column (2) is fixed above the test bench (1), the test carrier (3) is placed above the test bench (1), the side wall of the test carrier (3) is in contact with the positioning column (2), the positioning column (2) is used to position the test carrier (3), and the test carrier (3) is used to carry the sample to be tested (6); The movable probe (4) is arranged above the test carrier (3), and the movable probe (4) is used to contact the pin of the sample to be tested (6); The probe camera (5) is used to capture a contact image between the movable probe (4) and the pin of the sample to be tested (6).

4. The semiconductor probe testing equipment based on 3D scanning and printing according to claim 3, characterized in that: The positioning column (2) comprises a first positioning component (21) and a second positioning component (22), and an angle θ is provided at a connection between the first positioning component (21) and the second positioning component (22), and the angle θ is 90°.

5. The semiconductor probe testing equipment based on 3D scanning and printing according to claim 3, characterized in that: The movable probe (4) comprises a head (41) and a body (42), and an angle α is provided at the connection between the head (41) and the body (42).

6. The semiconductor probe testing equipment based on 3D scanning and printing according to claim 3, characterized in that: The test bench (1) is made of transparent material.

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