Circuit board assembly and electric equipment

Abstract

The utility model discloses a circuit board assembly and electric equipment, and relates to the technical field of power electronics, the circuit board assembly comprises a circuit substrate and a detection chip, the circuit substrate is provided with multiple circuit layers arranged at intervals, and the multiple circuit layers comprise a circuit layer provided with a circuit to be detected; the detection chip and the circuit substrate are integrally arranged, and the detection chip is embedded in the circuit substrate and is used for detecting the current of the circuit to be detected; a connecting channel is arranged at the position, corresponding to the detection chip, of the circuit substrate, the connecting channel is connected with at least one of the multiple circuit layers, and the detection chip is used for being connected with a power supply and / or a signal source through the connecting channel. By providing a new scheme for realizing current detection, the structure is simplified, the occupied space of the whole structure is reduced, the detection precision is improved, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of power electronics technology, and in particular to a circuit board assembly and electrical equipment. Background Art

[0002] In the field of power electronics, current detection is generally performed through Hall detection schemes. There are two mainstream Hall detection schemes. One uses Figure 1 The magnetic core + Hall chip solution shown in FIG, but this solution will bring many problems such as the number of parts, large volume, high cost, and many manufacturing steps due to the use of the magnetic core; another solution is to use the magnetic core + Hall chip solution. Figure 2 The solution shown in the figure is to detect current by placing a Hall chip close to the copper busbar and combining it with an insulation design. However, this solution has problems such as complex insulation design, high difficulty in controlling the detection position accuracy, and high cost.

[0003] Based on this, the existing technology needs to propose a new solution for realizing current detection, which is used to improve detection accuracy and reduce costs while simplifying the structure and reducing the space occupied by the overall structure. Utility Model Content

[0004] The main purpose of this application is to propose a circuit board assembly and electrical equipment, aiming to simplify the structure, reduce the space occupied by the overall structure, and improve detection accuracy and reduce detection costs.

[0005] To achieve the above objectives, the present application proposes a circuit board assembly, comprising:

[0006] The circuit substrate comprises a plurality of circuit layers spaced apart from each other, wherein the plurality of circuit layers includes a circuit layer having a circuit to be tested;

[0007] A detection chip, the detection chip is integrally provided with the circuit substrate, the detection chip is embedded in the circuit substrate, and is used to detect the current of the circuit to be tested;

[0008] The circuit substrate is provided with a connection channel at a position corresponding to the detection chip, the connection channel is connected to at least one layer of the multi-layer circuit layer, and the detection chip is used to connect to a power supply and / or a signal source through the connection channel.

[0009] In one embodiment, the detection chip is provided with a connection side, an insulating layer is filled between any two adjacent circuit layers, and the connection channel passes through the insulating layer close to the connection side and is connected to the connection side.

[0010] In one embodiment, at least a portion of the multi-layer circuit layer is provided with a power circuit and / or a communication circuit, wherein the power circuit is used to connect to a power supply, and the communication circuit is used to connect to a signal source;

[0011] The detection chip is connected to the power supply circuit through a portion of the plurality of connection channels, and is connected to the communication circuit through other portions of the plurality of connection channels.

[0012] In one embodiment, the circuit board assembly further includes a conductive connector provided on the circuit to be tested;

[0013] The conductive connecting member is provided on the surface of the circuit substrate, and / or the conductive connecting member is embedded in the circuit substrate.

[0014] In one embodiment, the detection chip includes a chip body and a bracket, at least a portion of the chip body is embedded in the bracket, the bracket is embedded in the circuit substrate, and the chip body is provided with a connection side, which is exposed outside the bracket.

[0015] In one embodiment, the bracket is made of at least one metal plate selected from the group consisting of a copper substrate, an aluminum substrate, and a metal alloy substrate;

[0016] Alternatively, the bracket is made of at least one non-metallic plate selected from the group consisting of a ceramic plate, a plastic substrate, and a silicon substrate, and the non-metallic plate is covered with a conductive material for connecting to the detection chip.

[0017] In one embodiment, the detection chip includes any one of a Hall chip, a TMR chip, a GMR chip, and an AMR chip, or a combination of multiple thereof.

[0018] In one embodiment, a heat dissipation component is provided on the surface of the circuit substrate.

[0019] The present application also provides an electrical device, comprising the circuit board assembly described above.

[0020] In one embodiment, the electrical device further includes a heat sink, and the heat sink is disposed close to the circuit board assembly.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The technical solution of the present application realizes current detection and flow-through functions in different circuit layers by embedding a detection chip in the circuit substrate, thereby effectively optimizing the detection capability.

[0023] By setting a connection channel at the position of the corresponding detection chip, the detection chip used to detect the current of the circuit to be tested can be connected to the power supply and signal source through the connection channel, so as to avoid the problem of low detection accuracy due to the inability to determine the detection position and the inability to accurately detect the current of the circuit to be tested, and effectively optimize the current sampling capability; by effectively simplifying the overall structure and reducing the use of parts, it is also possible to reduce processing procedures and manufacturing steps, reduce the overall occupied space, and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of an existing circuit board assembly;

[0026] Figure 2 is a schematic diagram of another existing circuit board assembly;

[0027] Figure 3 A cross-sectional view of an embodiment of a circuit board assembly provided by the present application;

[0028] Figure 4 A cross-sectional view of another embodiment of a circuit board assembly provided by the present application;

[0029] Figure 5 A top view of an embodiment of a circuit board assembly provided by the present application.

[0030] Description of Figure Numbers:

[0031] 011, copper busbar under test; 012, magnetic core; 013, chip; 014, housing; 015, circuit board; 016, fixing parts;

[0032] 100, circuit substrate; 110, circuit layer; 111, circuit under test; 112, connecting circuit; 121, connecting channel; 122, insulating layer; 130, conductive connector; 140, silk screen layer;

[0033] 200, detection chip; 210, chip body; 220, bracket;

[0034] 300. Heat dissipation component.

[0035] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0036] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0037] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0038] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0039] In the field of power electronics, current detection is used to help achieve current control and protection. In general technology, current detection is performed through Hall detection solutions. However, the mainstream Hall detection solution requires a large number of components. Figure 1 The solution shown uses a magnetic core 012 + Hall chip. The chip 013 of this solution is generally located in the housing 014. In order to detect the copper busbar 011 to be tested, the circuit to be tested, and other test objects, a non-contact measurement is generally performed through the Hall chip 013. However, the chip 013 is generally fixed on the circuit board 015, and the circuit board 015 needs to be connected to the housing 014 through various fixing parts 016 and other components. The overall problem is that it takes up a lot of space, is costly, and has many manufacturing steps. Figure 2 The solution shown in the figure uses a Hall chip close to the copper busbar and an insulation design to detect current. The copper busbar 011 to be tested and the circuit to be tested are embedded in the housing. The chip 013 is generally fixed on the circuit board 015, and the circuit board 015 needs to be connected to the housing 014 through various components such as fixing parts 016. This solution has the problem of complex insulation design, and because it is impossible to grasp the detection position, it has the problems of low detection accuracy and high cost.

[0040] In order to simplify the structure, reduce the space occupied by the overall structure, improve the detection accuracy and reduce the detection cost, refer to Figures 3 to 5 , this application proposes a circuit board assembly and electrical equipment.

[0041] The circuit board assembly includes a circuit substrate 100 and a detection chip 200. The circuit substrate 100 has multiple circuit layers 110 spaced apart from each other, including a circuit layer 110 having a circuit under test 111. The detection chip 200 is integrally provided with the circuit substrate 100 and embedded in the circuit substrate 100 to detect the current of the circuit under test 111.

[0042] A connection channel 121 is provided at a position of the circuit substrate 100 corresponding to the detection chip 200 . The connection channel is connected to at least one layer of the multi-layer circuit layer. The detection chip 200 is used to connect to a power supply and / or signal source through the connection channel 121 .

[0043] As will be understood, the circuit under test 111 refers to a circuit or other related circuit component that needs to be tested to verify whether its function and performance meet requirements. Specifically, it can be a specific integrated circuit, a signal path, a management unit, or other related electronic components and their connections. The circuit under test 111 can be located in at least one layer of a multi-layer circuit. Optionally, the surface of the circuit substrate 100 is further provided with a silk screen layer 140 or the like to help mark component position, orientation, pins, numbers, warning signs, etc.

[0044] Optionally, the connection channel 121 may be, but is not limited to, a via. The detection chip 200 is connected to the power supply and / or signal source via the connection channel 121. The provision of the connection channel 121 enables electrical connection and signal transmission. The detection chip is connected to the power supply and signal source via the connection channel 121 to achieve electrical interconnection such as power supply and signal input and output of the detection chip.

[0045] When the circuit board assembly of the present application itself is not provided with a power supply (and / or signal source), the detection chip 200 is used to connect to an external power supply (and / or an external signal source) through the connection channel 121; when the circuit board assembly of the present application itself is provided with a power supply (and / or a signal source), the detection chip 200 is used to connect to the power supply (and / or the signal source) provided in the circuit board assembly through the connection channel 121.

[0046] In the technical solution of the present application, by embedding the detection chip 200 in the circuit substrate 100, the current detection and flow functions are respectively realized in different circuit layers, which can effectively optimize the detection capability. By setting the connection channel 121 corresponding to the position of the detection chip 200, the detection chip 200 used to detect the current of the circuit under test 111 can be connected to the power supply and signal source through the connection channel 121, so as to avoid the problem of low detection accuracy due to the inability to determine the detection position and the inability to accurately detect the current of the circuit under test 111, thereby effectively optimizing the current adoption capability. Such a setting can also effectively simplify the overall structure and reduce the use of components, reduce the processing procedures and manufacturing steps by simplifying the structure, and reduce the overall occupied space and reduce costs by reducing the use of components.

[0047] Different from the related art, which requires additional components and the use of magnetic cores, which result in a large number of components, large volume, high cost, and many manufacturing steps, the present application can reduce the cost of current detection by reducing the use of magnetic cores, fixings, and other related components, and can also reduce the space occupied by the circuit board assembly and the size of the current detection. In addition, compared with the related art current detection solution without magnetic cores that requires additional insulation, the technical solution of the present application not only makes it easier to achieve insulation, positioning, and fixation between the detection chip 200 and the circuit layer 110, and between the circuit layer 110 and the circuit to be tested 111, but also further simplifies the overall structure of the circuit board assembly, improves the current detection accuracy, effectively reduces the space occupied by the circuit board assembly, and saves costs.

[0048] In an embodiment of the present application, the detection chip 200 is embedded in the circuit substrate 100. Optionally, the detection chip 200 is used to directly connect to the circuit to be tested 111 to realize current detection of the circuit to be tested 111; alternatively, a connection channel 121 such as a via can be set corresponding to the circuit to be tested 111, so that the detection chip 200 can realize current detection of the circuit to be tested 111 through the connection channel 121; alternatively, the current magnitude can be indirectly obtained by adopting a non-contact measurement method through the magnetic field generated by the circuit to be tested.

[0049] Optionally, the detection chip 200 may be, but is not limited to, a chip based on the principle of magnetic induction, and may specifically include any one or a combination of a Hall effect chip, a TMR chip, a GMR chip, or an AMR chip. Taking a Hall effect chip as an example, the Hall effect chip can be used to indirectly obtain the magnitude of the current through the magnetic field generated by the circuit to be detected, without requiring direct contact with the current being measured. This non-contact measurement method reduces power loss and heat generation in the circuit, and can improve the safety and reliability of the measurement.

[0050] In one embodiment, the detection chip 200 is provided with a connection side, an insulating layer 122 is filled between any two adjacent circuit layers 110 , and the connection channel 121 passes through the insulating layer close to the connection side and is connected to the connection side.

[0051] The design of the insulating layer 122 can achieve insulation between multiple circuit layers 110. The connection channel 121 passes through the insulating layer close to the connection side and is connected to the connection side, which can reduce the overall occupied space. Specifically, corresponding to the position of the detection chip 200, through holes, buried vias, blind holes, and other vias or other channel structures can be set as connection channels 121 on at least one circuit layer 110 close to the detection chip 200. Through the setting of the connection channel 121, not only can the detection chip 200 be connected to the power supply, signal source, etc., to achieve electrical interconnection such as power supply and signal input and output of the detection chip; it can also achieve electrical connection between different layers of circuit layers 110. In addition, when the circuit board assembly is also specially provided with circuit layers such as power supply layer and ground layer, these power supply layers, ground layers, etc. can also be connected through the setting of the connection channel 121, so that the power supply is more stable and noise and interference are reduced. In the present application, the connection channel 121 can be set as a through hole, a buried hole, a blind hole, etc. The setting of the connection channel 121 such as a through hole can also play a heat dissipation role, and is used to transfer the heat of the detection chip 200, etc. to the heat dissipation layer, the radiator or other heat dissipation components 300 and the external environment, so as to reduce the overall temperature of the circuit board assembly and ensure the long-term stable operation of the equipment.

[0052] The multi-layer circuit layer 110 includes connection circuits 112 such as a power supply circuit and a power supply circuit.

[0053] Specifically, at least a portion of the multilayer circuit layer 110 is provided with a power circuit and a communication circuit. The power circuit is used to connect to a power supply, and the communication circuit is used to connect to a signal source. The detection chip 200 is connected to the power circuit through some of the multiple connection channels 121 to achieve connection to the power supply. The detection signal is connected to the communication circuit through other portions of the multiple connection channels 121 to achieve connection to an external signal source.

[0054] It is understood that at least part of the multi-layer circuit layer 110 is provided with a power supply circuit and a communication circuit, that is, the multi-layer circuit layer includes at least a circuit layer provided with a power supply circuit and a circuit layer provided with a communication circuit, and the circuit layer provided with a power supply circuit and the circuit layer provided with a communication circuit can optionally be the same circuit layer or different circuit layers, that is, the power supply circuit and the communication circuit can optionally be provided on the same circuit layer or on different circuit layers; the specific configuration can be based on actual conditions and is not limited here. In addition, when the circuit board assembly of the present application itself is provided with a power supply or a signal source, the detection chip 200 can be connected to the power supply circuit through part of the multiple connection channels 121 to achieve connection with the power supply provided on the circuit board assembly; the detection chip 200 can also be connected to the communication circuit through other parts of the multiple connection channels 121 to achieve connection with the signal source provided on the circuit board assembly. It is used to provide the necessary current and voltage to the detection chip 200 through the power supply to ensure that its internal circuit can operate normally; and to realize the communication connection between the detection chip 200 and the signal source through the communication circuit to send and receive signals. These signals can be voltage, current or other electrical parameters, or control signals or other communication signals. The specific settings can be based on actual conditions and are not limited here.

[0055] In the embodiments of the present application, due to the different sizes of the measured currents, in order to assist the current flow and improve the conductive effect, a single-layer or multi-layer circuit layer 110 can be used for current flow; and / or, a conductive connector 130 can be affixed to the surface of the circuit substrate 100 of the circuit board assembly; and / or, a conductive connector 130 can be embedded in the inner layer of the circuit substrate 100.

[0056] Specifically, the circuit board assembly further includes a conductive connector 130 disposed on the circuit to be tested. In the embodiment of the present application, the conductive connector 130 is disposed on the surface of the circuit substrate 100 and / or the conductive connector 130 is embedded in the circuit substrate 100.

[0057] The conductive connector 130 may be, but is not limited to, a copper sheet, a copper busbar, an aluminum busbar, a conductive plastic, or graphene, and is used to effectively conduct current, assist in current flow, improve conductivity, and enhance heat dissipation. The conductive connector 130 is connected to the circuit layer 110 on the circuit substrate 100, and can improve the ability to carry large currents, circulate current, and enhance heat dissipation. Taking the copper busbar as an example, copper, as an excellent conductive material, has low resistance, low temperature rise, and corrosion resistance. Using a copper busbar can effectively transmit current, reduce the risk of current overload and short circuit, ensure stable current transmission, and reduce interference from environmental factors.

[0058] In some embodiments of the present application, the detection chip 200 may include only the chip body 210 , or include the chip body 210 and the bracket 220 .

[0059] When the detection chip 200 does not include the bracket 220, the chip body 210 can be directly embedded in the circuit substrate 100 and arranged on any layer of the multi-layer circuit layer 110 according to actual needs. The connection side of the chip body 210 is connected to the power supply and / or signal source through the connection channel 121.

[0060] When the detection chip 200 also includes a bracket 220, the chip body 210 and the bracket 220 are embedded in the circuit substrate 100 as a whole. At least part of the chip body 210 is embedded in the bracket 220, and the bracket is embedded in the circuit substrate 100 and is provided on any layer of the multi-layer circuit layer 110 according to actual needs. The chip body 210 is provided with a connection side, and the connection side is exposed outside the bracket 220. The connection side exposed outside the bracket 220 is connected to the power supply and / or signal source through the connection channel 121. The chip body 210 can be connected to the bracket 220 by, but not limited to, welding, sintering, bonding, etc., to construct the detection chip of the present application. The specific connection method between the chip body 210 and the bracket 220 can be set according to the actual situation and is not limited here.

[0061] The detection chip 200 is directly embedded in the circuit substrate 100. Compared to chip modules that require pre-packaged design, it does not require a chip plastic encapsulation process. This can reduce the space occupied by the detection chip and reduce environmental pollution caused by the plastic encapsulation process, thereby achieving environmental protection. In the embodiment of the present application, the resin material of the insulating layer 122 is used to insulate the chip body 210 (or the chip body 210 embedded in the bracket 220) from the other circuit layers 110, and to fix the position of the detection chip. The overall structural stability and reliability of the circuit board assembly are relatively good.

[0062] In one embodiment, the bracket 220 is formed of at least one of a copper substrate, an aluminum substrate, and a metal alloy substrate. By using a metal plate made of a material with good thermal conductivity, the heat generated by the chip body 210 during operation can be effectively conducted away, maintaining the chip body 210 at a suitable operating temperature, thereby improving the chip's stability and extending its service life.

[0063] In another embodiment, the bracket 220 is formed of at least one non-metallic plate selected from the group consisting of a ceramic plate, a plastic substrate, and a silicon substrate, and is coated with a conductive material for connection to the detection chip 200. Using a non-metallic plate coated with a conductive material as the bracket 220 allows the conductive material to provide the necessary electrical connection and thermal conductivity. The non-metallic plate has excellent insulation properties, and its material properties make the overall structure more lightweight and reduce costs.

[0064] The bracket 220 is made of a metal plate or a non-metallic plate covered with a conductive material, so that the bracket 220 serves as an electrical connection, providing the necessary electrical connection for the chip body 210. The bracket 220 also provides sufficient mechanical strength to protect the chip from physical damage. In applications involving high-power chips or other scenarios, the bracket 220 can also help dissipate heat from the chip and achieve electromagnetic shielding to prevent external signals from interfering with chip performance.

[0065] Reference Figure 4 In one embodiment, a heat dissipation assembly 300 is provided on the surface of the circuit substrate 100. The heat dissipation assembly 300 can promptly dissipate the heat generated by the electrical equipment during operation, prevent heat damage to the circuit, improve safety and equipment stability, and extend the service life of electronic components.

[0066] Optionally, the heat dissipation component 300 can be, but is not limited to, a thermally conductive material (thermal adhesive, thermal pad or thermal paste, etc.), a heat sink (heat dissipation fins, etc., which dissipates heat by increasing the surface area of ​​the heat sink), a radiator (a fan, a heat pipe, other air cooling devices, liquid cooling devices, etc.), a heat dissipation substrate (aluminum substrate, copper substrate, etc.), a microchannel (heat dissipation holes provided on the circuit substrate 100, etc.). The aforementioned heat dissipation components 300 can be used alone or in combination to meet the heat dissipation requirements of different circuit boards.

[0067] The present application also proposes an electrical device, which includes a circuit board assembly as described in the above embodiment. The specific structure of the circuit board assembly refers to the above embodiment. Since the electrical device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0068] In one embodiment, the electrical device further includes a heat sink disposed proximate to the circuit board assembly. The heat sink may be, but is not limited to, disposed on any surface of the circuit board assembly, on any side of the circuit board assembly, or at any location proximate to the circuit board assembly. The heat sink may be integrally connected to the circuit board assembly; it may also be provided as an additional structure on, outside, or at any other location proximate to the circuit board assembly, without limitation herein.

[0069] The above description is merely an exemplary embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural transformation made using the contents of the present application specification and drawings under the technical concept of the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A circuit board assembly, characterized in that: include: The circuit substrate comprises a plurality of circuit layers spaced apart from each other, wherein the plurality of circuit layers includes a circuit layer having a circuit to be tested; A detection chip, the detection chip is integrally provided with the circuit substrate, the detection chip is embedded in the circuit substrate, and is used to detect the current of the circuit to be tested; The circuit substrate is provided with a connection channel at a position corresponding to the detection chip, the connection channel is connected to at least one layer of the multi-layer circuit layer, and the detection chip is used to connect to a power supply and / or a signal source through the connection channel.

2. The circuit board assembly according to claim 1, wherein: The detection chip is provided with a connection side, an insulating layer is filled between any two adjacent circuit layers, and the connection channel passes through the insulating layer close to the connection side and is connected to the connection side.

3. The circuit board assembly according to claim 1, wherein: At least part of the multi-layer circuit layer is provided with a power circuit and / or a communication circuit, wherein the power circuit is used to connect to a power supply, and the communication circuit is used to connect to a signal source; The detection chip is connected to the power supply circuit through a portion of the plurality of connection channels, and is connected to the communication circuit through other portions of the plurality of connection channels.

4. The circuit board assembly according to claim 1, wherein: The circuit board assembly further includes a conductive connector provided on the circuit to be tested; The conductive connecting member is provided on the surface of the circuit substrate, and / or the conductive connecting member is embedded in the circuit substrate.

5. The circuit board assembly according to claim 1, wherein: The detection chip includes a chip body and a bracket. At least a portion of the chip body is embedded in the bracket. The bracket is embedded in the circuit substrate. The chip body is provided with a connection side, and the connection side is exposed outside the bracket.

6. The circuit board assembly according to claim 5, wherein: The bracket is made of at least one metal plate selected from the group consisting of a copper base plate, an aluminum base plate, and a metal alloy base plate; Alternatively, the bracket is made of at least one non-metallic plate selected from the group consisting of a ceramic plate, a plastic substrate, and a silicon substrate, and the non-metallic plate is covered with a conductive material for connecting to the detection chip.

7. The circuit board assembly according to claim 1, wherein: The detection chip includes any one of a Hall chip, a TMR chip, a GMR chip, and an AMR chip, or a combination of multiple thereof.

8. The circuit board assembly according to any one of claims 1 to 7, wherein: A heat dissipation component is provided on the surface of the circuit substrate.

9. An electrical device, characterized in that: The circuit board assembly comprises the circuit board assembly according to any one of claims 1 to 8.

10. The electrical equipment according to claim 9, characterized in that: The electrical device further includes a radiator, which is arranged close to the circuit board assembly.

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