Endoscope

Abstract

The utility model provides an endoscope capable of effectively utilizing the internal space of an insertion part. The insertion section (2) has: a support member (71) that supports the imaging optical system (70); an imaging element (72) supported by the support member (71); a first circuit board (73) facing an end surface (72B) of the imaging element (72); a second circuit board (74) disposed orthogonal to the first circuit board (73); a cable (75) connected to the second circuit board (74); a cover member (76); and a terminal member (78) having a hole portion (781) through which the support member (71) and the imaging optical system (70) are inserted, the support member (71) including a cylindrical portion (711) and a square tube portion (712), the cylindrical portion (711) being supported by the hole portion (781), a gap (CL) being provided between the terminal member (78) and the cover member (76), and the diameter of a circumscribed circle (712E) of the square tube portion (712) being equal to or greater than the outer diameter (Da) of the cylindrical portion (711).

Description

Technical Field

[0001] The utility model relates to an endoscope. Background Art

[0002] Patent document 1 describes a camera module comprising: a chip-size package having a plurality of connection pads arranged on the back side of a light-receiving portion of an image sensor; a circuit substrate having a plurality of connection electrodes electrically and mechanically connected via the connection pads and bumps of the chip-size package; and an underfill filling the gap between the chip-size package and the circuit substrate.

[0003] Patent document 2 describes a circuit substrate unit in which a first signal cable is connected to a group of solder pads on the front row side of the surface of the circuit substrate so that a camera element can be mounted on the surface, and the first signal cable connected to the group of solder pads on the front row side and extending toward the rear in the axial direction, and the second signal cable arranged in a vertical column with the first signal cable in the axial direction and connected to the group of solder pads on the rear row side are arranged to overlap in a direction perpendicular to the surface of the circuit substrate.

[0004] Patent document 3 describes an imaging device comprising: a solid-state imaging element; an objective lens unit for imaging a subject image on the solid-state imaging element; and a bracket for holding the solid-state imaging element and the objective lens unit. The imaging device abuts an area other than a light-receiving area that is approximately parallel to the light-receiving area of ​​the solid-state imaging element against the bracket, and the light-receiving area is arranged to be approximately perpendicular to the center of the optical axis of the objective lens unit.

[0005] Patent Document 1: Japanese Patent No. 6038424

[0006] Patent Document 2: Japanese Patent No. 6697244

[0007] Patent Document 3: Japanese Patent Application Laid-Open No. 2005-95432 Utility Model Content

[0008] The technology of the present invention provides an endoscope capable of effectively utilizing the internal space of an insertion portion.

[0009] An endoscope according to one embodiment of the present invention comprises an insertion portion which is inserted into a subject, the insertion portion having: an imaging optical system; a cylindrical supporting member which internally supports the imaging optical system; an imaging element which is arranged on the base end side of the insertion portion relative to the imaging optical system and is supported by the supporting member; a first circuit substrate which comprises a first substrate surface which is opposite to the base end side of the insertion portion in the imaging element and a second substrate surface which is on the side opposite to the first substrate surface, and is connected to the imaging element on the first substrate surface; a second circuit substrate which is arranged on the base end side of the insertion portion relative to the first circuit substrate, comprises a third substrate surface which intersects with the first substrate surface and a fourth substrate surface which is on the side opposite to the third substrate surface, and between the third substrate surface and the fourth substrate surface at least one of which is connected to the second substrate surface; a cable is connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate; a covering component covering a portion of the supporting component, the imaging element, the first circuit substrate, the second circuit substrate and the cable; and an end component having a hole portion for inserting the supporting component and the imaging optical system, the supporting component including a cylindrical portion supporting the imaging optical system and a square cylindrical portion supporting the imaging element, the cylindrical portion being supported by the hole portion of the end component, a gap being provided between the end component and the covering component or the square cylindrical portion of the supporting component, the covering component covering at least a portion of the square cylindrical portion, and the diameter of the circumscribed circle of the square cylindrical portion being greater than the outer diameter of the cylindrical portion.

[0010] An endoscope according to one embodiment of the present invention comprises an insertion portion which is inserted into a subject, the insertion portion comprising: an imaging optical system; a cylindrical support member which internally supports the imaging optical system; an imaging element which is arranged on the base end side of the insertion portion relative to the imaging optical system and is supported by the support member; a first circuit substrate which comprises a first substrate surface which is opposite to the base end side of the insertion portion in the imaging element and a second substrate surface which is opposite to the first substrate surface and is connected to the imaging element on the first substrate surface; a cable which is arranged on the base end side of the insertion portion relative to the first circuit substrate and is electrically connected to the first circuit substrate; and a covering member which covers one side of the supporting member. part, the above-mentioned camera element, the above-mentioned first circuit substrate and the above-mentioned cable; and an end component, having a hole portion for the above-mentioned supporting component and the above-mentioned camera optical system to be inserted, the above-mentioned supporting component includes a cylindrical portion for supporting the above-mentioned camera optical system and a square cylindrical portion for supporting the above-mentioned camera element, the above-mentioned cylindrical portion is supported by the above-mentioned hole portion of the above-mentioned end component, a gap is provided between the above-mentioned end component and the above-mentioned covering component or the above-mentioned square cylindrical portion of the above-mentioned supporting component, a plurality of terminals electrically connected to the above-mentioned camera element are provided on the above-mentioned first substrate surface, and when observed along the axial direction of the above-mentioned insertion portion, the total area of ​​the above-mentioned plurality of terminals is less than 30% of the area of ​​the end face on the end side of the above-mentioned insertion portion in the above-mentioned camera element.

[0011] Utility model effect

[0012] According to the technology of the present invention, the internal space of the insertion portion of the endoscope can be effectively utilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Schematic diagram showing an endoscope 1 as one embodiment of the technology of the present invention.

[0014] Figure 2 Yes Figure 1 FIG. 1 is a schematic cross-sectional view of the internal structure of the distal end portion 7 of the endoscope 1 .

[0015] Figure 3 It is along Figure 2 Schematic diagram of the cross section taken along line AA.

[0016] Figure 4 It is along Figure 2 Schematic cross-section diagram of the BB line.

[0017] Figure 5 This is a schematic diagram of the imaging element 72 as viewed from the distal end side along the axial direction.

[0018] Figure 6This is a schematic diagram of the imaging element 72 and the first circuit board 73 as viewed from the distal end side along the axial direction.

[0019] Figure 7 Yes Figure 2 Schematic diagram of a modified example of the BB cross section.

[0020] Figure 8 It is along Figure 2 Schematic cross-section diagram of the CC line.

[0021] Figure 9 is a schematic diagram showing a modified example of the covering member 76, which is similar to Figure 4 The corresponding figure.

[0022] Figure 10 1 is a schematic cross-sectional view showing a first modified example of the terminal portion 7 .

[0023] Figure 11 1 is a schematic cross-sectional view showing a second modified example of the terminal portion 7 .

[0024] Figure 12 1 is a schematic cross-sectional view showing a third modified example of the terminal portion 7 .

[0025] Figure 13 It is a schematic cross-sectional view showing a fourth modified example of the terminal portion 7 .

[0026] Explanation of symbols

[0027] 1-Endoscope, 2-Insertion portion, 3-Operating portion, 4-Universal cord, 5-Flexible portion, 6-Bending portion, 7-Tip portion, 8-9-Angled buttons, 10-Air and water supply buttons, 12-Disposal instrument inlet, 70-Imaging optical system, 70B-Lens frame, 71-Supporting member, 72-Imaging element, 72A, 72B, 712S-End faces, 72a-Peripheral area, 73-First circuit board, 73T, 73t, 74t-Terminals, 74-Second circuit board , 75-cable, 76-covering part, 76A, 711A, 712A-outer circumference, 76B, 711B-inner circumference, 77-exterior part, 78-end part, 711-cylindrical portion, 712-square cylindrical portion, 712B, 712a-recess, 712c-opening, 712D-bonding area, 712E-circumscribed circle, 731-first substrate surface, 732-second substrate surface, 741-third substrate surface, 742-fourth substrate surface, 781-hole portion. DETAILED DESCRIPTION

[0028] Figure 1 Schematic diagram showing an endoscope 1 as one embodiment of the technology of the present invention. Figure 1The endoscope 1 includes an elongated insertion portion 2 to be inserted into a subject, an operating portion 3 connected to the proximal end of the insertion portion 2 and used for holding and operating the endoscope 1, and a universal cord 4 for connecting the endoscope 1 to system components such as a light source device and a processor device (not shown). The endoscope 1 is not particularly limited and may be, for example, an upper endoscope for observing the stomach or duodenum, a lower endoscope (colonoscope) for observing the large intestine, or a bronchoscope.

[0029] The insertion section 2 consists of a flexible section 5, a bending section 6, and a distal section 7, which are connected in sequence from the base end to the distal end. The flexible section 5 is flexible and can bend in any direction along the insertion path of the insertion section 2. The operating section 3 is provided with angle buttons 8 and 9, a treatment instrument inlet 12, an air and water supply button 10, and a suction button 11.

[0030] The bending portion 6 can be bent in the vertical and horizontal directions by operating the angle knobs 8 and 9. Treatment instruments such as forceps are inserted through the treatment instrument inlet 12 and guided out through a forceps channel (not shown) provided in the distal end portion 7. Furthermore, the distal end portion 7 is provided with an observation window (not shown) for imaging the observed area within the body and an illumination window (not shown) for illuminating the observed area.

[0031] The insertion portion 2 is inserted into the subject by moving along its axial direction. By rotating the angle knobs 8 and 9 of the operating portion 3, the bending portion 6 of the insertion portion 2 is bent in the upward, downward, leftward, and rightward directions. As a result, the distal end 7 of the insertion portion 2 can be directed toward a desired direction within the body, and an observation image can be obtained through the observation window provided at the distal end 7. Hereinafter, the axial direction of the insertion portion 2 will be referred to as the axial direction. Furthermore, the side of the operating portion 3 in the axial direction will be referred to as the base end side, and the side of the distal end 7 in the axial direction will be referred to as the distal end side.

[0032] Figure 2 Yes Figure 1 FIG. 1 is a schematic cross-sectional view of the internal structure of the distal end portion 7 of the endoscope 1 shown.

[0033] like Figure 2 As shown, the distal end portion 7 includes a distal end member 78 disposed most distally and a cylindrical outer member 77 disposed more proximally than the distal end member 78. The distal end member 78 and the outer member 77 are cylindrical in shape, and internally house components required for imaging, a light guide, and a treatment instrument channel. The distal end member 78 has a cylindrical hole 781 extending from its proximal end surface to its distal end surface.

[0034] As the components required for imaging, the terminal portion 7 includes: an imaging optical system 70; a cylindrical supporting member 71 that internally supports the imaging optical system 70; an imaging element 72 that is arranged on the base end side relative to the imaging optical system 70 and is supported by the supporting member 71; a first circuit substrate 73; a second circuit substrate 74; a cable 75; and a covering member 76 that covers a portion of the supporting member 71, the imaging element 72, the first circuit substrate 73, the second circuit substrate 74 and the cable 75.

[0035] In the example shown in the figure, the imaging optical system 70 includes: a cylindrical lens frame 70B, the distal end of which is configured to have a larger diameter than the base end; and a lens group (four lenses 70A in the example shown in the figure) supported inside the lens frame 70B. Figure 2 ] shows the maximum diameter Db of the imaging optical system 70. In this specification, the maximum diameter Db is defined as the outer diameter of the imaging optical system 70.

[0036] The support member 71 includes a cylindrical portion 711 that internally supports the small-diameter portion of the lens frame 70B at the proximal end, and a rectangular cylindrical portion 712 that supports the imaging element 72. The cylindrical portion 711 is disposed closer to the distal end than the rectangular cylindrical portion 712.

[0037] Figure 3 It is along Figure 2 AA line cut through the cross section. Figure 3 In FIG, the imaging optical system 70 and the terminal member 78 are omitted from illustration.

[0038] like Figure 3 As shown, the cylindrical portion 711 has an outer peripheral surface 711A, whose cross section perpendicular to the axial direction is circular, and an inner peripheral surface 711B, whose cross section perpendicular to the axial direction is circular. The small diameter portion of the base end side of the lens frame 70B constituting the imaging optical system 70 is supported on the inner peripheral surface 711B. Figure 2 ] shows the outer diameter Df of the portion of the imaging optical system 70 supported by the inner peripheral surface 711B (the small diameter portion of the lens frame 70B).

[0039] like Figure 2 As shown, the portion of the imaging optical system 70 that is outside the support member 71 and the cylindrical portion 711 of the support member 71 are inserted into the hole 781 of the terminal member 78, and the cylindrical portion 711 is supported on the inner circumference of the hole 781. The outer diameter Da of the cylindrical portion 711 ( Figure 3 The diameter of the outer peripheral surface 711A is Figure 2 ) is larger than the maximum diameter Db of the imaging optical system 70. Thus, the imaging optical system 70 is configured not to be directly supported by the hole portion 781 of the terminal member 78.

[0040] The supporting methods of the cylindrical portion 711 and the hole portion 781, and the supporting methods of the camera optical system 70 and the cylindrical portion 711 are not particularly limited. For example, any one of fitting, bonding, and screw fixing, or a combination of two or more of these supporting methods can be adopted.

[0041] Figure 4 It is along Figure 2 Schematic diagram of the cross section taken along line BB. Figure 4 In FIG, the imaging optical system 70 and the terminal component 78 are omitted. Figure 3 and Figure 4 As shown, the cross section of the outer peripheral surface 712A of the square tube portion 712 perpendicular to the axial direction is a polygon with a shape larger than a quadrilateral (in Figure 3 and Figure 4 In the example, the four corners of the square are chamfered into an octagon.) Alternatively, the outer peripheral surface 712A may be a polygon having four or more sides, with the corners chamfered into a curved shape (R-shape) rather than a straight shape.

[0042] like Figure 4 As shown, a rectangular plate-shaped recess 712B is provided on the end surface on the base end side of the square tube portion 712. An opening 712C communicating with the internal space SP of the cylindrical portion 711 is formed on the bottom surface of the recess 712B.

[0043] Figure 5 The image pickup element 72 is a schematic diagram of the image pickup element 72 viewed from the end side along the axial direction. The image pickup element 72 is a component formed by packaging a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. Figure 5 As shown in FIG, the image pickup element 72 is rectangular when viewed along the axial direction. Figure 4 In the recessed portion 712B shown, the imaging element 72 is supported by the square cylindrical portion 712 .

[0044] like Figure 4 As shown, a bonding area 712D (the area between the single-dot dashed rectangular frame in the figure and the outer peripheral edge of the recess 712B) for bonding the imaging element 72 is provided on the bottom surface of the recess 712B. The imaging element 72 is supported by the square tube portion 712 by being bonded to the recess 712B in the bonding area 712D. The imaging element 72 can also be supported by the square tube portion 712 by being fitted into the recess 712B. The imaging element 72 can be fitted into the recess 712B and further supported by the square tube portion 712 by being bonded to the bonding area 712D. The imaging element 72 can also be supported by the square tube portion 712 by having its side surface bonded to the side wall of the recess 712B.

[0045] The peripheral area 72a (refer to FIG. Figure 5 )and Figure 4 From the viewpoint of reducing the diameter of the insertion portion 2 and increasing the light receiving area of ​​the imaging element 72, the area of ​​the peripheral region 72a is preferably 50% or less of the area of ​​the end face 72A.

[0046] like Figure 2 As shown, the first circuit substrate 73 includes a first substrate surface 731 opposite to the end surface 72B on the base end side of the imaging element 72 and a second substrate surface 732 on the side opposite to the first substrate surface 731 (base end side), and is connected to the imaging element 72 on the first substrate surface 731. The first circuit substrate 73 is a rigid substrate having a bending rigidity greater than that of the imaging element 72, for example, in the form of a plate with a plurality of wirings stacked from the first substrate surface 731 toward the second substrate surface 732 via an insulating layer. For example, a ceramic substrate, a glass substrate, or a silicon substrate is used for the first circuit substrate 73. The first circuit substrate 73 is in a state where the first substrate surface 731 and the second substrate surface 732 intersect in the axial direction (in the Figure 2 In the example, it is configured in a state perpendicular to the axial direction).

[0047] A plurality of terminals are two-dimensionally arranged on the end surface 72B of the imaging element 72. Furthermore, terminals 73T corresponding to the plurality of terminals of the imaging element 72 are two-dimensionally arranged on the first substrate surface 731 of the first circuit substrate 73 (see FIG. Figure 6 ). Furthermore, each terminal on the end surface 72B of the imaging element 72 is electrically and mechanically connected to the corresponding terminal 73T on the first substrate surface 731 of the first circuit substrate 73 via the solder balls H. To ensure these connections are secure, an underfill is preferably provided between the imaging element 72 and the first circuit substrate 73.

[0048] Figure 6 This is a schematic diagram of the imaging element 72 and the first circuit substrate 73 as viewed from the end side along the axial direction. A plurality of (35 in the example shown in the figure) terminals 73T are arranged two-dimensionally on the first substrate surface 731 of the first circuit substrate 73. As an example, the total area of ​​the plurality of terminals 73T when viewed along the axial direction is less than 30% of the area of ​​the end surface 72A on the end side of the imaging element 72. This prevents the circuit formed on the first circuit substrate 73 from becoming complicated. When the total area of ​​the plurality of terminals 73T exceeds 30% of the area of ​​the end surface 72A of the imaging element 72, the mechanical connection between the imaging element 72 and the first circuit substrate 73 can be made more secure.

[0049] exist Figure 672X of the long side of the imaging element 72, 73X of the length of two of the four sides of the first circuit substrate 73 along the long side, 72Y of the short side of the imaging element 72, and 73Y of the length of two of the four sides of the first circuit substrate 73 along the short side.

[0050] When viewed along the axial direction, the size of the first circuit board 73 is larger than the size of the imaging element 72. The fact that the first circuit board 73 is larger than the size of the imaging element 72 means that the length 73X is larger than the length 72X and the length 73Y is larger than the length 72Y; the length 73X is the same as the length 72X and the length 73Y is larger than the length 72Y; or the length 73X is larger than the length 72X and the length 73Y is the same as the length 72Y.

[0051] exist Figure 6 In the example, the length 73X is greater than the length 72X and the length 73Y is greater than the length 72Y. When viewed along the axial direction, the entire imaging element 72 overlaps with the first circuit board 73.

[0052] Furthermore, when viewed along the axial direction, the size of the first circuit substrate 73 is larger than Figure 2 The dimensions of the first circuit board 73 referred to here are the length 73X and the length 73Y.

[0053] exist Figure 3 FIG. 7 shows a circumscribed circle 712E of the outer peripheral surface 712A of the square tube portion 712. Figure 3 As shown, the diameter of the circumscribed circle 712E is larger than the outer diameter Da of the cylindrical portion 711 ( Figure 3 The diameter of the outer peripheral surface 711A is Figure 2 ). However, if Figure 7 As shown, the diameter of the circumscribed circle 712E may be the same as the outer diameter of the cylindrical portion 711 . Figure 7 Yes Figure 2 Schematic diagram of a modified example of the BB cross section.

[0054] The second circuit board 74 is provided on the base end side relative to the first circuit board 73 and includes a second circuit board 74 intersecting with the first board surface 731 (at Figure 2 In the example, the third substrate surface 741 (orthogonal) and the fourth substrate surface 742 (on the side opposite to the third substrate surface 741) are perpendicular to each other. Figure 2 In the example, the substrate surface is perpendicular to the first substrate surface 731).

[0055] The second circuit substrate 74 is connected to the second substrate surface 732 of the first circuit substrate 73 on its third substrate surface 741 and fourth substrate surface 742, respectively. The second circuit substrate 74 is a rigid substrate having a greater flexural rigidity than the imaging element 72, and is, for example, in the form of a plate with a plurality of wirings stacked via an insulating layer from the third substrate surface 741 toward the fourth substrate surface 742. For example, a ceramic substrate, a glass substrate, or a silicon substrate is used for the second circuit substrate 74.

[0056] A plurality of terminals 73t are provided on the second substrate surface 732 of the first circuit substrate 73. Furthermore, terminals 74t are provided on the third and fourth substrate surfaces 741, 742 of the second circuit substrate 74. The terminals 73t and 74t are electrically and mechanically connected by solder Hb.

[0057] Terminals (not shown) electrically connected to the terminals 74t are provided on the third board surface 741 of the second circuit board 74, and wiring is connected to these terminals. Terminals (not shown) electrically connected to the terminals 74t are provided on the fourth board surface 742 of the second circuit board 74, and wiring is connected to these terminals. The wiring connected to the terminals on the third and fourth board surfaces 741, 742 are bundled to form a cable 75, which extends to the universal cord 4.

[0058] Alternatively, the second circuit board 74 may be connected to the second board surface 732 of the first circuit board 73 only on one of the third board surface 741 and the fourth board surface 742. Furthermore, the second circuit board 74 may be connected to the cable 75 only on one of the third board surface 741 and the fourth board surface 742.

[0059] At least one of the length 73X and the length 73Y of the first circuit board 73 may be equal to the axial length 74L of the second circuit board 74 (the length along the direction of the third board surface 741 and the fourth board surface 742). Figure 2 ), but preferably they are different. For example, when length 74L is greater than at least one of length 73X and length 73Y, connection of cable 75 to second circuit board 74 is facilitated. Furthermore, when length 74L is less than at least one of length 73X and length 73Y, the position of second circuit board 74 relative to first circuit board 73 can be easily stabilized.

[0060] The thickness 73D of the first circuit board 73 (refer to Figure 2 ) and the thickness 74D of the second circuit substrate 74 (reference Figure 2) can be the same, but are preferably different. For example, by having thickness 74D of second circuit board 74 be smaller than thickness 73D of first circuit board 73, the space around second circuit board 74 can be effectively utilized. Furthermore, when thickness 74D of second circuit board 74 is greater than thickness 73D of first circuit board 73, the rigidity of the connection between first circuit board 73 and second circuit board 74 can be increased, thereby improving durability.

[0061] Figure 8 It is along Figure 2 Schematic diagram of the cross section cut along the CC line. Figure 8 As shown, the second circuit board 74 is arranged approximately in the center of the first circuit board 73 along the short side of the imaging element 72. This arrangement is not limited to this; for example, the second circuit board 74 may be arranged at one end of the first circuit board 73 along the short side of the imaging element 72.

[0062] like Figure 4 and Figure 8 As shown in FIG. 1 , for example, the covering member 76 is in the shape of a square tube with a cross section perpendicular to the axial direction being a square frame. The covering member 76 is made of metal, for example. Figure 2 As shown, the cover member 76 surrounds and covers the square tube portion 712 , the imaging element 72 , the first circuit board 73 , the second circuit board 74 , and the cable 75 in the support member 71 .

[0063] like Figure 4 As shown, the inner circumferential surface 76B of the covering member 76 is in direct or indirect contact with the outer circumferential surface 712A of the square cylindrical portion 712. For example, by fitting the square cylindrical portion 712 into the interior of the covering member 76, the outer circumferential surface 712A and the inner circumferential surface 76B can be configured to be in direct contact. Alternatively, a configuration can be configured in which the outer circumferential surface 712A of the square cylindrical portion 712 is bonded to the inner circumferential surface 76B via an adhesive, thereby indirectly contacting the outer circumferential surface 712A and the inner circumferential surface 76B. In this manner, by directly or indirectly contacting the outer circumferential surface 712A of the square cylindrical portion 712 with the inner circumferential surface 76B of the covering member 76, the square cylindrical portion 712 can be reinforced.

[0064] like Figure 8As shown, the inner circumferential surface 76B of the cover member 76 is in direct or indirect contact with each of the four side surfaces of the first circuit board 73. For example, by fitting the first circuit board 73 into the interior of the cover member 76, a structure can be provided in which the side surfaces of the first circuit board 73 are in direct contact with the inner circumferential surface 76B. Alternatively, by bonding the side surfaces of the first circuit board 73 to the inner circumferential surface 76B with an adhesive, a structure can be provided in which the side surfaces of the first circuit board 73 are in indirect contact with the inner circumferential surface 76B. In this way, by directly or indirectly contacting the side surfaces of the first circuit board 73 with the inner circumferential surface 76B of the cover member 76, the first circuit board 73 can be secured.

[0065] In addition, Figure 6 When the length 73X shown is the same as the length 72X, the inner peripheral surface 76B of the cover member 76 is in direct or indirect contact with the two side surfaces of the first circuit board 73 (the side surfaces along the long sides of the imaging element 72). Figure 6 When length 73Y and length 72Y are the same, inner peripheral surface 76B of cover member 76 is in direct or indirect contact with two side surfaces of first circuit board 73 (side surfaces along the short sides of imaging element 72). Even in this case, first circuit board 73 can be reinforced.

[0066] exist Figure 4 The outer diameter Dc of the covering member 76 is shown in FIG. The outer diameter Dc is larger than the maximum diameter Db of the imaging optical system 70 (refer to FIG. Figure 2 ). In addition, the circumscribed circle 712E of the square tube portion 712 (refer to Figure 3 ) is larger than the outer diameter Da of the cylindrical portion 711. As a result, Figure 2 As shown, a gap CL is provided between the cover member 76 and the square tube portion 712 and the terminal member 78 .

[0067] Figure 9 is a schematic diagram showing a modified example of the covering member 76, which is similar to Figure 4 The corresponding figure. Figure 9 As shown, the cross-sectional shape of the outer peripheral surface 76A of the covering member 76 may be circular instead of rectangular.

[0068] For example, the distal end portion 7 of the endoscope 1 constructed as described above is manufactured as follows. First, an assembly is manufactured, in which the support member 71, the imaging element 72, the first circuit board 73, the second circuit board 74, the cable 75, and the cover member 76 are assembled. Next, the imaging optical system 70 is inserted through the cylindrical portion 711 of the support member 71 of this assembly. The optical position of the imaging element 72 and the imaging optical system 70 is adjusted using the image captured by the imaging element 72, and the imaging optical system 70 is fixed to the cylindrical portion 711. Next, the assembly in which the imaging optical system 70 is fixed is inserted through the hole 781 of the distal end member 78. With the distal end surface of the imaging optical system 70 aligned with the distal end surface of the distal end member 78, the cylindrical portion 711 and the distal end member 78 are fixed.

[0069] The optical positions of the imaging element 72 and the imaging optical system 70 may deviate due to assembly errors of the components or individual differences between the imaging element 72 and the imaging optical system 70. Figure 2 In the embodiment, if the imaging optical system 70 is positioned closer to the imaging element 72, the cylindrical portion 711 and the terminal member 78 need to be fixed with the cover member 76 and the end surface of the square cylindrical portion 712 on the terminal side closer to the terminal member 78. Since the gap CL is provided in the terminal portion 7, even if there is a deviation in the optical position of the imaging element 72 and the imaging optical system 70, the terminal surface of the imaging optical system 70 and the terminal surface of the terminal member 78 can be aligned.

[0070] Furthermore, in the endoscope 1, the outer peripheral surface 712A of the square cylindrical portion 712 contacts the inner peripheral surface 76B of the cover member 76. This protects the unit comprising the support member 71, the imaging element 72, the first circuit board 73, the second circuit board 74, and the cable 75, thereby improving durability. The interior of the support member 71 is filled with an adhesive such as an insulating epoxy resin to ensure watertightness around the imaging element 72 and the like.

[0071] Furthermore, in the endoscope 1, the side surface of the first circuit board 73 contacts the inner circumferential surface 76B of the cover member 76. Furthermore, the imaging element 72 does not contact the cover member 76. Therefore, the imaging element 72 between the support member 71 and the first circuit board 73 can be more securely protected. In particular, when the total area of ​​the plurality of terminals 73T is less than 30% of the area of ​​the end surface 72A of the imaging element 72, the mechanical connection strength between the imaging element 72 and the first circuit board 73 is reduced, thereby enhancing the protective effect of the contact between the cylindrical portion 712 and the first circuit board 73 and the cover member 76. Furthermore, when the area of ​​the peripheral region 72a of the imaging element 72 is less than 50% of the area of ​​the end surface 72A, the mechanical connection strength between the imaging element 72 and the cylindrical portion 712 is reduced, thereby enhancing the protective effect of the contact between the cylindrical portion 712 and the cover member 76.

[0072] Furthermore, in the endoscope 1, the covering member 76 covers the entire second circuit board 74. Therefore, even if the strength of the second circuit board 74 is reduced, such as when the length 74L of the second circuit board 74 is large or the thickness 74D of the second circuit board 74 is small, the covering member 76 can reinforce the second circuit board 74.

[0073] Figure 10 : is a schematic cross-sectional view showing a first modified example of the terminal portion 7. Figure 10 In, with Figure 2 The difference lies in that the outer diameter Da of the cylindrical portion 711 is the same as the diameter of the circumscribed circle 712E of the square cylindrical portion 712 , and the imaging element 72 is supported by an end surface 712S on the base end side of the square cylindrical portion 712 .

[0074] exist Figure 10 In the modified example shown, the thickness of the square tube portion 712 is thin, so the imaging element 72 is supported by the end surface 712S on the base end side of the square tube portion 712. For example, the imaging element 72 is bonded to the end surface 712S on the base end side of the square tube portion 712 by an adhesive. Figure 10 In the modified example shown, a gap CL is provided between the cover member 76 and the terminal member 78. Figure 10 In the modified example shown, Figure 2 Compared with the structure of FIG, the outer diameter of the covering member 76 can be reduced, so the diameter of the insertion portion 2 can be reduced.

[0075] exist Figure 10 In the modified example shown, it is preferable that the side surface of the imaging element 72 does not contact the cover member 76. This prevents the force from the cover member 76 from directly acting on the imaging element 72.

[0076] Figure 11 : is a schematic cross-sectional view showing a second modified example of the terminal portion 7. Figure 11 In, with Figure 2 The difference is that a recess 712a is added to the end portion of the base end side and the outer peripheral side of the square tube portion 712, and the distal end portion of the covering member 76 is in direct or indirect contact with the recess 712a. Figure 11 In the modified example shown, the covering member 76 covers a portion of the square tube portion 712, and there is no gap between the covering member 76 and the end member 78, but a gap CL is provided between the square tube portion 712 and the end member 78. Figure 11 The modified example shown is Figure 2 Compared with the structure shown, the outer diameter of the covering member 76 can be reduced, so the diameter of the terminal end portion 7 can be reduced.

[0077] Figure 12: is a schematic cross-sectional view showing a third modified example of the terminal portion 7. Figure 12 In, with Figure 2 The difference is that a recess 712a is added to the end of the base end side and the outer peripheral side of the square tube part 712, the terminal end of the covering member 76 is in direct or indirect contact with the recess 712a, and the imaging element 72 is supported by the end surface 712S on the base end side of the square tube part 712. Figure 12 In the modified example shown, there is no gap between the cover member 76 and the end member 78, but a gap CL is provided between the square tube portion 712 and the end member 78. Figure 12 The modified example shown is Figure 2 Compared with the structure shown, the diameter of the terminal end portion 7 can be reduced.

[0078] Figure 13 : is a schematic cross-sectional view showing a fourth modified example of the terminal portion 7. Figure 13 In, with Figure 2 The difference is that the recess 712B formed in the square tube portion 712 is formed deeper, and the imaging element 72, the first circuit substrate 73 and the second circuit substrate 74 are moved toward the end side. Figure 13 In the illustrated modification, the distance Lb between the proximal end surface 712S of the support member 71 and the first substrate surface 731 of the first circuit board 73 is smaller than the distance La between the imaging element 72 and the first substrate surface 731 (in other words, the thickness of the solder ball H). This configuration can prevent the adhesive from peeling off when, for example, the end surface 712S of the rectangular cylindrical portion 712 is bonded to the first substrate surface 731 with an adhesive.

[0079] In the configuration example of the terminal portion 7 described above, the second circuit board 74 is not essential and may be deleted. In this case, the terminal 73t of the first circuit board 73 is configured to be connected to the cable 75.

[0080] As described above, this specification includes at least the following matters: In the following, components corresponding to the above-described embodiment are shown in parentheses, but the present invention is not limited thereto. (1)

[0082] An endoscope includes an insertion portion (insertion portion 2) to be inserted into a subject.

[0083] The insert portion has:

[0084] Imaging optical system (imaging optical system 70);

[0085] A cylindrical support member (support member 71) internally supports the imaging optical system;

[0086] an imaging element (imaging element 72) provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member;

[0087] a first circuit substrate (first circuit substrate 73) including a first substrate surface (first substrate surface 731) facing the surface (end surface 72B) on the proximal end side of the insertion portion of the imaging element and a second substrate surface (second substrate surface 732) on the opposite side of the first substrate surface, and connected to the imaging element on the first substrate surface;

[0088] a second circuit substrate (second circuit substrate 74) provided on the proximal end side of the insertion portion relative to the first circuit substrate, comprising a third substrate surface (third substrate surface 741) intersecting the first substrate surface and a fourth substrate surface (fourth substrate surface 742) on the opposite side of the third substrate surface, with at least one of the third substrate surface and the fourth substrate surface being connected to the second substrate surface;

[0089] a cable (cable 75) connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate;

[0090] a covering member (covering member 76) that covers a portion of the supporting member, the imaging element, the first circuit substrate, the second circuit substrate, and the cable; and

[0091] The terminal member (terminal member 78) has a hole portion (hole portion 781) for inserting the above-mentioned supporting member and the above-mentioned imaging optical system.

[0092] The support member includes a cylindrical portion (cylindrical portion 711) supporting the imaging optical system and a square cylindrical portion (square cylindrical portion 712) supporting the imaging element.

[0093] The cylindrical portion is supported by the hole portion of the terminal member.

[0094] A gap (gap CL) is provided between the terminal member and the square tube portion of the cover member or the support member.

[0095] The covering member covers at least a portion of the square tube portion.

[0096] The diameter of the circumscribed circle of the square cylindrical portion (circumscribed circle 712E) is equal to or larger than the outer diameter (outer diameter Da) of the cylindrical portion. (2)

[0098] The endoscope according to (1), wherein

[0099] The outer diameter (maximum diameter Db) of the imaging optical system is smaller than the outer diameter (outer diameter Da) of the cylindrical portion. (3)

[0101] The endoscope according to (1) or (2), wherein:

[0102] The imaging element is supported by the end surface (end surface 712S) on the proximal end side of the insertion portion in the support member.

[0103] The side surface of the first circuit substrate is in direct or indirect contact with the covering member. (4)

[0105] The endoscope according to (1) or (2), wherein:

[0106] When viewed in the axial direction of the insertion portion, the dimensions of the first circuit board (length 73X and length 73Y) are larger than the dimension (outer diameter Df) of a portion of the imaging optical system supported by the support member. (5)

[0108] The endoscope according to (4), wherein

[0109] The side surface of the first circuit substrate is in direct or indirect contact with the cover member. (6)

[0111] The endoscope according to (1) or (2), wherein:

[0112] When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than that of the imaging element. (7)

[0114] The endoscope according to (6), wherein

[0115] The side surface of the first circuit substrate is in direct or indirect contact with the covering member. (8)

[0117] The endoscope according to (1) or (2), wherein:

[0118] The distance (distance Lb) between the end surface (end surface 712S) on the proximal side of the insertion portion of the support member and the first substrate surface of the first circuit substrate is smaller than the distance (distance La) between the imaging element and the first substrate surface. (9)

[0120] The endoscope according to (1) or (2), wherein:

[0121] When viewed along the axial direction of the insertion portion, the outer diameter (outer diameter Dc) of the covering member is larger than the outer diameter (maximum diameter Db) of the imaging optical system. (10)

[0123] The endoscope according to (1) or (2), wherein:

[0124] The thickness of the first circuit board (thickness 73D) is different from the thickness of the second circuit board (thickness 74D). (11)

[0126] The endoscope according to (10), wherein

[0127] The thickness of the second circuit substrate is smaller than the thickness of the first circuit substrate. (12)

[0129] The endoscope according to (1) or (2), wherein:

[0130] The first length (at least one of length 73X and length 74X) of the first circuit substrate along the first substrate surface and the second substrate surface is different from the second length (length 74L) of the second circuit substrate along the third substrate surface and the fourth substrate surface. (13)

[0132] The endoscope according to (12), wherein

[0133] The second length is greater than the first length. (14)

[0135] The endoscope according to (1) or (2), wherein:

[0136] A plurality of terminals (terminals 73T) electrically connected to the imaging element are provided on the first substrate surface.

[0137] When viewed along the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface (end surface 72A) on the distal end side of the insertion portion in the imaging element. (15)

[0139] The endoscope according to (1) or (2), wherein:

[0140] The imaging element is supported by the supporting member by bonding.

[0141] The area of ​​the region (peripheral region 72a) of the imaging element that is bonded to the support member is 50% or less of the area of ​​the end surface (end surface 72A) of the imaging element on the distal end side of the insertion portion. (16)

[0143] An endoscope includes an insertion portion (insertion portion 2) to be inserted into a subject.

[0144] The insert portion has:

[0145] Imaging optical system (imaging optical system 70);

[0146] A cylindrical support member (support member 71) internally supports the imaging optical system;

[0147] an imaging element (imaging element 72) provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member;

[0148] a first circuit substrate (first circuit substrate 73) including a first substrate surface (first substrate surface 731) facing the surface (end surface 72B) on the proximal end side of the insertion portion of the imaging element and a second substrate surface (second substrate surface 732) on the opposite side of the first substrate surface, and connected to the imaging element on the first substrate surface;

[0149] a cable (cable 75) provided on the proximal end side of the insertion portion relative to the first circuit substrate and electrically connected to the first circuit substrate;

[0150] a covering member (covering member 76) covering a portion of the supporting member, the imaging element, the first circuit substrate, and the cable; and

[0151] The terminal member (terminal member 78) has a hole portion (hole portion 781) for inserting the above-mentioned supporting member and the above-mentioned imaging optical system.

[0152] The support member includes a cylindrical portion (cylindrical portion 711) supporting the imaging optical system and a square cylindrical portion (square cylindrical portion 712) supporting the imaging element.

[0153] The cylindrical portion is supported by the hole portion of the terminal member.

[0154] A gap (gap CL) is provided between the terminal member and the square tube portion of the cover member or the support member.

[0155] A plurality of terminals (terminals 73T) electrically connected to the imaging element are provided on the first substrate surface.

[0156] When viewed along the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface (end surface 72A) on the distal end side of the insertion portion in the imaging element. (17)

[0158] The endoscope according to (16), wherein

[0159] The imaging element is supported by the supporting member by bonding.

[0160] The area of ​​the region (peripheral region 72a) of the imaging element that is bonded to the support member is 50% or less of the area of ​​the end surface (end surface 72A) of the imaging element on the distal end side of the insertion portion. (18)

[0162] The endoscope according to (16) or (17), comprising:

[0163] The second circuit substrate (second circuit substrate 74) is provided on the proximal end side of the insertion portion relative to the first circuit substrate, and includes a third substrate surface (third substrate surface 741) intersecting the first substrate surface and a fourth substrate surface (fourth substrate surface 742) on the opposite side of the third substrate surface. The second substrate surface is connected to at least one of the third substrate surface and the fourth substrate surface.

[0164] The cable is connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate.

[0165] The covering member covers a portion of the supporting member, the imaging element, the first circuit board, the second circuit board, and the cable. (19)

[0167] The endoscope according to (18), wherein

[0168] The covering member covers at least a portion of the square tube portion. (20)

[0170] The endoscope according to (19), wherein

[0171] The diameter of the circumscribed circle of the square cylindrical portion (circumscribed circle 712E) is equal to or larger than the outer diameter (outer diameter Da) of the cylindrical portion. (twenty one)

[0173] The endoscope according to (20), wherein

[0174] The outer diameter (maximum diameter Db) of the imaging optical system is smaller than the outer diameter (outer diameter Da) of the cylindrical portion. (twenty two)

[0176] The endoscope according to (18), wherein

[0177] The imaging element is supported by the end surface (end surface 712S) on the proximal end side of the insertion portion in the support member.

[0178] The side surface of the first circuit substrate is in direct or indirect contact with the covering member. (twenty three)

[0180] The endoscope according to (18), wherein

[0181] When viewed in the axial direction of the insertion portion, the dimensions of the first circuit board (length 73X and length 73Y) are larger than the dimension (outer diameter Df) of a portion of the imaging optical system supported by the support member. (twenty four)

[0183] The endoscope according to (23), wherein

[0184] The side surface of the first circuit substrate is in direct or indirect contact with the covering member. (25)

[0186] The endoscope according to (18), wherein

[0187] When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than that of the imaging element. (26)

[0189] The endoscope according to (25), wherein

[0190] The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

Claims

1. An endoscope, characterized in that: It has an insertion portion to be inserted into a subject, The insert portion has: Camera optical system; a cylindrical supporting member that internally supports the imaging optical system; an imaging element provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member; a first circuit substrate including a first substrate surface facing the proximal end side of the insertion portion of the imaging element and a second substrate surface opposite to the first substrate surface, and connected to the imaging element on the first substrate surface; a second circuit substrate, provided on the proximal end side of the insertion portion relative to the first circuit substrate, including a third substrate surface intersecting the first substrate surface and a fourth substrate surface on the side opposite to the third substrate surface, and connected to the second substrate surface on at least one of the third substrate surface and the fourth substrate surface; a cable connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate; a covering member that covers a portion of the supporting member, the imaging element, the first circuit substrate, the second circuit substrate, and the cable; and The terminal member has a hole portion through which the supporting member and the imaging optical system are inserted. The support member includes a cylindrical portion for supporting the imaging optical system and a square cylindrical portion for supporting the imaging element. The cylindrical portion is supported by the hole portion of the terminal member, A gap is provided between the terminal member and the square tube portion of the covering member or the supporting member. The covering member covers at least a portion of the square tube portion. The diameter of the circumscribed circle of the square cylindrical portion is equal to or larger than the outer diameter of the cylindrical portion.

2. The endoscope according to claim 1, wherein The outer diameter of the imaging optical system is smaller than the outer diameter of the cylindrical portion.

3. The endoscope according to claim 1 or 2, wherein: The imaging element is supported by an end surface of the support member on the proximal end side of the insertion portion. The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

4. The endoscope according to claim 1 or 2, wherein: When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than a size of a portion of the imaging optical system supported by the support member.

5. The endoscope according to claim 4, wherein: The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

6. The endoscope according to claim 1 or 2, wherein: When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than that of the imaging element.

7. The endoscope according to claim 6, wherein: The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

8. The endoscope according to claim 1 or 2, wherein: A distance between an end surface on the proximal end side of the insertion portion of the support member and the first substrate surface of the first circuit substrate is smaller than a distance between the imaging element and the first substrate surface.

9. The endoscope according to claim 1 or 2, wherein: When viewed along the axial direction of the insertion portion, the outer diameter of the covering member is larger than the outer diameter of the imaging optical system.

10. The endoscope according to claim 1 or 2, wherein: The thickness of the first circuit substrate is different from the thickness of the second circuit substrate.

11. The endoscope according to claim 10, wherein: The thickness of the second circuit substrate is smaller than the thickness of the first circuit substrate.

12. The endoscope according to claim 1 or 2, wherein: A first length of the first circuit board along the first and second substrate surfaces is different from a second length of the second circuit board along the third and fourth substrate surfaces.

13. The endoscope according to claim 12, wherein: The second length is greater than the first length.

14. The endoscope according to claim 1 or 2, wherein: A plurality of terminals electrically connected to the imaging element are provided on the first substrate surface. When viewed along the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface on the distal end side of the insertion portion in the imaging element.

15. The endoscope according to claim 1 or 2, wherein: The imaging element is supported by the supporting member by bonding, The area of ​​a region of the imaging element that is bonded to the support member is 50% or less of the area of ​​an end surface on the distal end side of the insertion portion of the imaging element.

16. An endoscope, characterized in that: It has an insertion portion to be inserted into a subject, The insert portion has: Camera optical system; a cylindrical supporting member that internally supports the imaging optical system; an imaging element provided on the proximal end side of the insertion portion relative to the imaging optical system and supported by the supporting member; a first circuit substrate including a first substrate surface facing the proximal end side of the insertion portion of the imaging element and a second substrate surface opposite to the first substrate surface, and connected to the imaging element on the first substrate surface; a cable provided on a proximal end side of the insertion portion relative to the first circuit substrate and electrically connected to the first circuit substrate; a covering member that covers a portion of the supporting member, the imaging element, the first circuit substrate, and the cable; and The terminal member has a hole portion through which the supporting member and the imaging optical system are inserted. The support member includes a cylindrical portion for supporting the imaging optical system and a square cylindrical portion for supporting the imaging element. The cylindrical portion is supported by the hole portion of the terminal member, A gap is provided between the terminal member and the square tube portion of the covering member or the supporting member. A plurality of terminals electrically connected to the imaging element are provided on the first substrate surface. When viewed along the axial direction of the insertion portion, the total area of ​​the plurality of terminals is 30% or less of the area of ​​an end surface on the distal end side of the insertion portion in the imaging element.

17. The endoscope according to claim 16, wherein: The imaging element is supported by the supporting member by bonding, The area of ​​a region of the imaging element that is bonded to the support member is 50% or less of the area of ​​an end surface on the distal end side of the insertion portion of the imaging element.

18. The endoscope according to claim 16 or 17, comprising: a second circuit substrate, provided on the proximal end side of the insertion portion relative to the first circuit substrate, including a third substrate surface intersecting the first substrate surface and a fourth substrate surface on the side opposite to the third substrate surface, and connected to the second substrate surface on at least one of the third substrate surface and the fourth substrate surface; The cable is connected to at least one of the third substrate surface and the fourth substrate surface of the second circuit substrate. The covering member covers a portion of the supporting member, the imaging element, the first circuit board, the second circuit board, and the cable.

19. The endoscope according to claim 18, wherein The covering member covers at least a portion of the square tube portion.

20. The endoscope according to claim 19, wherein The diameter of the circumscribed circle of the square cylindrical portion is equal to or larger than the outer diameter of the cylindrical portion.

21. The endoscope according to claim 20, wherein The outer diameter of the imaging optical system is smaller than the outer diameter of the cylindrical portion.

22. The endoscope according to claim 18, wherein The imaging element is supported by an end surface of the support member on the proximal end side of the insertion portion. The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

23. The endoscope according to claim 18, wherein When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than a size of a portion of the imaging optical system supported by the support member.

24. The endoscope according to claim 23, wherein The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

25. The endoscope according to claim 18, wherein When viewed along the axial direction of the insertion portion, the first circuit board has a size larger than that of the imaging element.

26. The endoscope according to claim 25, wherein The side surface of the first circuit substrate is in direct or indirect contact with the covering member.

Images