Semiconductor frame cleaning equipment

Abstract

The utility model relates to the technical field of semiconductor frame cleaning, in particular to semiconductor frame cleaning equipment which comprises a base, a water tank is arranged at the top of the base, and an ultrasonic motor is arranged in the water tank. A supporting frame is installed at the top of one side of the water tank, a linear motor is arranged on the side, close to the water tank, of the supporting frame in the length direction of the water tank, a sliding rail of the linear motor is fixed to the supporting frame, a mounting base is arranged on a sliding block of the linear motor, a driving motor is arranged on the mounting base and arranged in a motor box, and the driving motor is arranged in the motor box. And the motor box is fixed on the mounting seat. When the semiconductor frame cleaning equipment is used, the driving motor is connected with the placing basket through the universal joint, so that the placing basket can rotate in clean water or cleaning liquid and can also swing up and down in a reciprocating manner, and all positions of a semiconductor frame can be in full contact with flowing vacuum bubbles; the cleaning efficiency of the semiconductor frame is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor frame cleaning, in particular to a semiconductor frame cleaning device. Background Art

[0002] A semiconductor frame refers to a structural material that encapsulates semiconductor chips in a standardized shell and is used to support, fix and protect semiconductor chips. Its important role is to improve the reliability and stability of semiconductor devices and extend the service life of the devices.

[0003] In the production of semiconductor frames, in order to remove burrs and other irregular parts on the surface, they need to be polished and other operations to make the surface smooth so as not to scratch the chip or carrier board. However, some waste chips will still adhere to the surface of the semiconductor frame after polishing. At this time, the semiconductor frame needs to be cleaned. The existing semiconductor frame cleaning equipment is relatively simple, and most of them are cleaned by ultrasound. That is, the semiconductor frame is placed in a water tank. Under the action of ultrasound, moving vacuum bubbles are formed in clean water or cleaning liquid. When these bubbles are compressed and exploded, a strong shock wave is generated to flush away waste chips and stains. At the same time, the intense local stirring caused by cavitation also helps to disperse and peel off waste chips and stains.

[0004] However, in the above operation, since the semiconductor frame is only placed in clean water or cleaning liquid, the contact range between the semiconductor frame and the vacuum bubble is limited, and the vacuum bubbles contacted by different positions of the semiconductor frame are also different, which may cause uneven cleaning efficiency at different positions of the semiconductor frame, thereby reducing the overall cleaning efficiency of the semiconductor frame. Utility Model Content

[0005] The purpose of the utility model is to solve the above-mentioned shortcomings in the prior art and to propose a semiconductor frame cleaning device.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: a semiconductor frame cleaning device is designed, comprising a base, a water tank is provided on the top of the base, and an ultrasonic motor is provided in the water tank;

[0007] A support frame is installed on the top of one side of the water tank, and a linear motor is provided on the side of the support frame close to the water tank along the length direction of the water tank. The slide rail of the linear motor is fixed on the support frame, and a mounting seat is provided on the slider of the linear motor. A drive motor is provided on the mounting seat, and the drive motor is placed in a motor box, and the motor box is fixed on the mounting seat. A drive shaft is connected to the output end of the drive motor, and the drive shaft passes through the motor box and is rotatably connected to the motor box.

[0008] A universal joint is installed on the other end of the driving shaft, a connecting shaft is installed on the other end of the universal joint, and a placing basket is installed on the other end of the connecting shaft;

[0009] A pushing mechanism is provided below the universal joint, and the ends of the pushing mechanism are rotatably mounted in the U-shaped seats. One of the U-shaped seats is fixed on the mounting seat, and the other U-shaped seat is fixed on the sleeve, which is rotatably mounted on the connecting shaft.

[0010] Preferably, a control cabinet is installed on a side of the support frame away from the water tank, and a controller is provided in the control cabinet. The controller is respectively connected to the ultrasonic motor, the drive motor, the linear motor, and the pushing mechanism through wires.

[0011] Preferably, at least two partition plates are arranged at intervals inside the water tank, and the edges of the partition plates are fixed to the inner wall of the water tank to separate the water tank into multiple chambers, and a drain pipe is provided at the bottom of each chamber, and the drain pipe runs through the water tank;

[0012] At least one cross-flow fan is provided in one of the chambers at the end of the water tank, and a heating component is provided on the air outlet of the cross-flow fan, while ultrasonic motors are provided in the remaining chambers, wherein the cross-flow fans and heating components are connected to the controller through wires.

[0013] Preferably, a baffle with an end bent into an "L" shape is provided on the side of the sink away from the support frame, the baffle corresponds to the side of the sink, and a lifting mechanism is provided at both ends of the bottom of the baffle, the lifting mechanism is fixed on the base, and the top of the lifting mechanism is installed on the connecting seat, the connecting seat is fixed to the bottom of the baffle, the lifting mechanism is connected to the controller through a wire, and a cover is hinged on the top of the side of the baffle away from the support frame.

[0014] Preferably, the cover plate and the shield plate are both made of one of a transparent plastic plate, a transparent acrylic plate, and a transparent glass plate.

[0015] Preferably, a guide shaft is provided parallel to the lower side of the linear motor, and the ends of the guide shaft are mounted on a fixed seat, which is fixed to the support frame. A sliding sleeve is provided on the guide shaft, which is fixed to the mounting seat.

[0016] Preferably, the top of the support frame is tilted toward the sink, and a fixing frame is installed at the bottom of the support frame, the support frame is fixed to the side of the sink through the fixing frame, and a reinforcing plate is also provided at the bottom of the support frame, one side of the reinforcing plate is fixed to the support frame, and the other side of the reinforcing plate is fixed to the fixing frame.

[0017] The design scheme proposed by the utility model has the following beneficial effects during application:

[0018] 1. The semiconductor frame cleaning equipment connects the drive motor and the placement basket through a universal joint. Under the action of the drive motor and the propulsion mechanism, the placement basket can rotate in clean water or cleaning liquid and can also perform up and down reciprocating swing operations, so that each position of the semiconductor frame in the placement basket can fully contact with the flowing vacuum bubble, thereby improving the cleaning efficiency of the semiconductor frame.

[0019] 2. The semiconductor frame cleaning equipment allows the basket and the equipment connected to it to be concentrated on one side of the water tank by swinging the basket on the water tank, so that the other side of the water tank has a larger visual area, which is convenient for observing the cleaning condition of the semiconductor frame during cleaning without being blocked. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the utility model Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the structure of the utility model Figure 2 ;

[0022] Figure 3 This is a schematic diagram of the structure of the utility model Figure 3 ;

[0023] Figure 4 It is a side view of the utility model;

[0024] Figure 5 This is a schematic diagram of the placement basket structure of the present utility model.

[0025] In the figure: 1. Base; 2. Sink; 3. Partition plate; 4. Chamber; 5. Support frame; 6. Linear motor; 7. Mounting seat; 8. Motor box; 9. Drive motor; 10. Drive shaft; 11. Universal joint; 12. Connecting shaft; 13. Placement basket; 14. Pushing mechanism; 15. Sleeve; 16. U-shaped seat; 17. Sliding sleeve; 18. Guide shaft; 19. Fixed seat; 20. Reinforcement plate; 21. Drain pipe; 22. Control cabinet; 23. Shield; 24. Cover plate; 25. Lifting mechanism; 26. Connecting seat. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] Reference Figure 1-Figure 5 , a semiconductor frame cleaning device, comprising a base 1, a water tank 2 is provided on the top of the base 1, and an ultrasonic motor is provided in the water tank 2;

[0028] At least two partition plates 3 are arranged at intervals inside the water tank 2. The edges of the partition plates 3 are fixed to the inner wall of the water tank 2 to separate the water tank 2 into multiple chambers 4. A drain pipe 21 is provided at the bottom of each chamber 4. The drain pipe 21 runs through the water tank 2 to facilitate multiple cleaning of the semiconductor frame.

[0029] At least one cross-flow fan is provided in one of the chambers 4 located at the end of the water tank 2, and a heating component is provided on the air outlet of the cross-flow fan, while the remaining chambers 4 are all provided with ultrasonic motors. After cleaning is completed, the semiconductor frame can be dried; in actual use, the heating component is a heating wire or a heating rod, which can heat the air around the cross-flow fan and send the hot air forward under the blowing of the cross-flow fan.

[0030] When in use, a placement basket 13 is provided above one end of the water tank 2, and a connecting shaft 12 is installed on the top of the placement basket 13. The other end of the connecting shaft 12 is connected to the universal joint 11, and the other end of the universal joint 11 is installed on the drive shaft 10, so that the placement basket 13 has multi-angle deflection and offset capabilities in the chamber 4, and the other end of the drive shaft 10 is fixed to the output end of the drive motor 9 to provide power for the rotation of the placement basket 13 in the chamber 4, and the drive motor 9 is arranged in the motor box 8, and the motor box 8 is fixed on the mounting seat 7, and the mounting seat 7 is fixed on the slider of the linear motor 6, and the slide rail mounting seat support frame of the linear motor 6 5, the bottom of the support frame 5 is fixed to the side of the water tank 2. Under the operation of the linear motor 6, the placement basket 13 can be moved from one chamber 4 to another chamber 4, so that the placement basket 13 can be transferred. That is, during cleaning, clean water and cleaning liquid can be added to multiple chambers 4, so that the clean water and cleaning liquid used to clean the semiconductor frame can be automatically replaced until the liquid in a certain chamber 4 is clear. This can prevent the semiconductor frame from being repeatedly cleaned in one chamber 4. Due to excessive stains and waste in the liquid in the chamber 4, the semiconductor frame will come into contact with the floating stains and waste again after being taken out and adhere to the semiconductor frame;

[0031] Furthermore, a guide shaft 18 is provided parallel to the bottom of the linear motor 6, and the ends of the guide shaft 18 are mounted on a fixed seat 19, which is fixed to the support frame 5. A sliding sleeve 17 is provided on the guide shaft 18, and the sliding sleeve 17 is fixed to the mounting seat 7 to provide additional support for the mounting seat 7 in addition to the linear motor 6, so as to prevent the overall gravity of the basket 13 from being too large after the semiconductor frame is loaded, thereby causing pressure on the linear motor 6, thereby causing damage to the connection between the mounting seat 7 and the linear motor 6.

[0032] Specifically, during the cleaning process, a pushing mechanism 14 is provided below the universal joint 11, and the ends of the pushing mechanism 14 are rotatably mounted in the U-shaped seat 16, wherein one U-shaped seat 16 is fixed on the mounting seat 7, and the other U-shaped seat 16 is fixed on the sleeve 15, and the sleeve 15 is rotatably mounted on the connecting shaft 12. When the placement basket 13 rotates under the operation of the drive motor 9, the pushing mechanism 14 can push and pull the placement basket 13, thereby allowing the placement basket 13 to swing back and forth in the chamber 4, increasing the movement amplitude of the placement basket 13 in the chamber 4, and further improving the contact effect between the semiconductor frame and the vacuum bubble; in actual use, the pushing mechanism 14 is one of an electric push rod, a cylinder, and a hydraulic cylinder.

[0033] It should be noted that after the semiconductor frame is placed in the placement basket 13, a baffle 23 with an end bent into an "L" shape is provided on the side of the water tank 2 away from the support frame 5. The baffle 23 corresponds to the side of the water tank 2, and a lifting mechanism 25 is provided at both ends of the bottom of the baffle 23. The lifting mechanism 25 is fixed on the base 1, and the top of the lifting mechanism 25 is installed on the connecting seat 26. The connecting seat 26 is fixed to the bottom of the baffle 23. A cover 24 is hinged on the top of the side of the baffle 23 away from the support frame 5. In actual use, the lifting mechanism 25 is one of an electric push rod, an air cylinder, and a hydraulic cylinder. The lifting mechanism 25 will push the baffle 23 to rise, and then the cover 24 can be flipped to cover the top of the baffle 23, thereby blocking the space above the water tank 2 so that when the placement basket 13 rotates, the liquid in the chamber 4 will splash out.

[0034] The cover plate 24 and the shield plate 23 are both made of a transparent plastic plate, a transparent acrylic plate, or a transparent glass plate, and do not affect the staff's observation of the cleaning status of the semiconductor frame in the chamber 4 from the outside.

[0035] In order to ensure a better observation field of view during the entire cleaning process, the top of the support frame 5 is tilted toward the water tank 2, and a fixing frame is installed at the bottom of the support frame 5. The support frame 5 is fixed to the side of the water tank 2 through the fixing frame, so that the side of the water tank 2 away from the support frame 5 is open and unobstructed; wherein, a reinforcing plate 20 is also provided at the bottom of the support frame 5, one side of the reinforcing plate 20 is fixed to the support frame 5, and the other side of the reinforcing plate 20 is fixed to the fixing frame, thereby improving the supporting strength between the support frame 5 and the fixing frame.

[0036] Specifically, a control cabinet 22 is installed on the side of the support frame 5 away from the water tank 2. A controller is provided in the control cabinet 22. The controller is connected to the ultrasonic motor, the drive motor 9, the linear motor 6, the pushing mechanism 14, the cross flow fan, the heating component, and the lifting mechanism 25 through wires. In actual use, the controller is one of a PLC logic controller, a control host, and a control main board. When in use, the pushing mechanism 14 is first controlled to lift the placement basket 13 from the chamber 4, and then the linear motor 6 moves the placement basket 13 to the top of the chamber 4 away from the cross flow fan, and in addition to the chamber 4 equipped with the cross flow fan, the lifting mechanism 25 is connected to the ultrasonic motor 9, the linear motor 6, the pushing mechanism 14, the cross flow fan, the heating component, and the lifting mechanism 25. Add clean water or cleaning liquid to the remaining chambers 4, then take the semiconductor frame to be cleaned and place it in the placement basket 13, turn on the ultrasonic motor and then start the pushing mechanism 14 to place the placement basket 13 in the chamber 4, then start the drive motor 9 to let the placement basket 13 rotate continuously in the chamber 4, and swing up and down under the operation of the pushing mechanism 14. After waiting for a while, the pushing mechanism 14 will lift the placement basket 13 from the chamber 4 and move it to the adjacent chamber 4 for secondary cleaning under the action of the linear motor 6, until it is finally sent to the last chamber 4 for drying, and the overall cleaning operation of the semiconductor frame can be completed.

[0037] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor frame cleaning device, characterized in that: The invention comprises a base (1), a water tank (2) is arranged on the top of the base (1), and an ultrasonic motor is arranged in the water tank (2); A support frame (5) is installed on the top of one side of the water tank (2), and a linear motor (6) is provided on the side of the support frame (5) close to the water tank (2) along the length direction of the water tank (2). The slide rail of the linear motor (6) is fixed on the support frame (5), and a mounting seat (7) is provided on the slider of the linear motor (6). A driving motor (9) is provided on the mounting seat (7). The driving motor (9) is placed in a motor box (8), and the motor box (8) is fixed on the mounting seat (7). A driving shaft (10) is connected to the output end of the driving motor (9), and the driving shaft (10) passes through the motor box (8) and is rotatably connected to the motor box (8). A universal joint (11) is installed on the other end of the driving shaft (10), a connecting shaft (12) is installed on the other end of the universal joint (11), and a placement basket (13) is installed on the other end of the connecting shaft (12); A pushing mechanism (14) is provided below the universal joint (11). The ends of the pushing mechanism (14) are rotatably mounted in U-shaped seats (16). One U-shaped seat (16) is fixed on the mounting seat (7), while the other U-shaped seat (16) is fixed on the sleeve (15). The sleeve (15) is rotatably mounted on the connecting shaft (12).

2. The semiconductor frame cleaning device according to claim 1, characterized in that: A control cabinet (22) is installed on a side of the support frame (5) away from the water tank (2). A controller is provided in the control cabinet (22). The controller is connected to the ultrasonic motor, the drive motor (9), the linear motor (6), and the pushing mechanism (14) through wires.

3. The semiconductor frame cleaning device according to claim 2, characterized in that: At least two partition plates (3) are arranged at intervals within the water tank (2), and the edges of the partition plates (3) are fixed to the inner wall of the water tank (2) to separate the water tank (2) into a plurality of chambers (4). A drainage pipe (21) is provided at the bottom of each chamber (4), and the drainage pipe (21) is provided through the water tank (2); At least one cross-flow fan is provided in one of the chambers (4) located at the end of the water tank (2), and a heating component is provided on the air outlet of the cross-flow fan, while ultrasonic motors are provided in the remaining chambers (4), wherein the cross-flow fans and the heating components are connected to the controller via wires.

4. The semiconductor frame cleaning device according to claim 2, characterized in that: A shield plate (23) with an end bent into an L-shape is provided on a side of the water tank (2) away from the support frame (5). The shield plate (23) corresponds to the side of the water tank (2). A lifting mechanism (25) is provided at both ends of the bottom of the shield plate (23). The lifting mechanism (25) is fixed on the base (1). The top of the lifting mechanism (25) is installed on a connecting seat (26). The connecting seat (26) is fixed to the bottom of the shield plate (23). The lifting mechanism (25) is connected to a controller via a wire. A cover plate (24) is hingedly connected to the top of the side of the shield plate (23) away from the support frame (5).

5. The semiconductor frame cleaning device according to claim 4, characterized in that: The cover plate (24) and the shield plate (23) are each one of a transparent plastic plate, a transparent acrylic plate, and a transparent glass plate.

6. The semiconductor frame cleaning device according to claim 1, characterized in that: A guide shaft (18) is provided parallel to the lower side of the linear motor (6), and the ends of the guide shaft (18) are mounted on a fixed seat (19). The fixed seat (19) is fixed to the support frame (5). A sliding sleeve (17) is sleeved on the guide shaft (18), and the sliding sleeve (17) is fixed to the mounting seat (7).

7. The semiconductor frame cleaning device according to claim 1, characterized in that: The top of the support frame (5) is tilted toward the water tank (2), and a fixing frame is installed at the bottom of the support frame (5). The support frame (5) is fixed to the side of the water tank (2) through the fixing frame. A reinforcing plate (20) is also provided at the bottom of the support frame (5), one side of the reinforcing plate (20) is fixed to the support frame (5), and the other side of the reinforcing plate (20) is fixed to the fixing frame.

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