Injection molding equipment for transistor processing and capable of automatically popping up and releasing mold

Abstract

The utility model discloses injection molding equipment for transistor processing capable of automatically popping up and withdrawing a mold, which relates to the technical field of transistor injection molding and comprises support frames, the inner walls of the two support frames are fixedly connected with the same workbench, the lower part and the top of the workbench are provided with the same injection molding component, and the injection molding component comprises a plurality of fixing pieces. The multiple fixing pieces are fixedly connected to the top of the workbench, heat dissipation assemblies are arranged on the two supporting frames correspondingly, a demolding module is arranged below the workbench, first round holes are formed in the multiple fixing pieces correspondingly, threaded rods are movably connected into the two opposite first round holes, and the threaded rods are movably connected into the two opposite first round holes correspondingly. And the same limiting rod is fixedly connected into the other two opposite round holes 1. The injection molding equipment capable of automatically popping up and demolding for transistor processing disclosed by the utility model has the technical effects that the next injection molding can be directly carried out after the injection molding of the equipment is finished, the mold does not need to be cooled and demolded, and the processing efficiency and convenience are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of transistor injection molding, in particular to an injection molding device for transistor processing with automatic ejection and mold removal. Background Art

[0002] A transistor generally refers to any single component based on semiconductor materials. Transistors have multiple functions, including detection, rectification, amplification, switching, voltage regulation, and signal modulation. Transistors can be used for a wide range of digital and analog functions. Transistors are one of the most critical components in modern electronics, and their widespread use stems from their ability to be mass-produced at extremely low unit cost. Transistors include diodes, triodes, field-effect transistors, and thyristors, all made from various semiconductor materials. Transistors can be packaged independently or as part of an integrated circuit (IC) that can contain 100 million or more transistors in a very small area.

[0003] In the prior art, after one injection molding is completed, general transistor processing injection molding equipment needs to wait for the mold to cool down and demold the transistor before the next injection molding can be carried out, which seriously affects the efficiency and convenience of the processing and is relatively inconvenient to use. Utility Model Content

[0004] The utility model discloses an injection molding device for transistor processing with automatic ejection and demoulding, aiming to solve the technical problem that after injection molding is completed, conventional injection molding devices for transistor processing need to wait for the mold to cool and be demoulded before the next injection molding can be carried out.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An injection molding device for transistor processing with automatic ejection and demolding, comprising a support frame, the inner walls of the two support frames are fixedly connected to the same workbench, and the same injection molding assembly is provided below and on the top of the workbench, the injection molding assembly comprises a plurality of fixing parts, and the plurality of fixing parts are fixedly connected to the top of the workbench, the two support frames are provided with a heat dissipation assembly, and a demolding module is provided below the workbench, a plurality of fixing parts are provided with a circular hole, and two of the relative circular holes are movably connected to a threaded rod, and the other two relative circular holes are fixedly connected to the same limiting rod, and the outer wall of the threaded rod is connected to two sliding mold plates by a thread, and the two sliding molds A plurality of mold grooves are provided on the plate at equal distances, and the two sliding mold plates slide on the outer wall of the limit rod. The top of the workbench is fixedly connected to a motor 1, and the motor 1 passes through a corresponding circular hole 1 and is connected to one end of the threaded rod through a coupling. The injection molding assembly includes a base, and the base is located below the workbench. The top of the base is fixedly connected to a hydraulic cylinder, and the driving end of the hydraulic cylinder is fixedly connected to an arm beam. A circular hole 2 is provided on the arm beam, and a connecting pipe is fixedly connected in the circular hole 2. The top of the connecting pipe is fixedly connected to a feed port, and the bottom of the connecting pipe is fixedly connected to an injection molding bin, and a plurality of circular holes 3 are provided at equal distances at the bottom of the injection molding bin, and injection molding heads are fixedly connected in the plurality of circular holes 3.

[0007] By setting up an injection molding component, the arm beam is adjusted to an appropriate position by a hydraulic cylinder, the injection molding chamber is pressed against the sliding mold plate, the rubber material is poured into the mold groove through the injection head through the feed port, and the height is raised by the hydraulic cylinder to separate the injection molding chamber from the sliding mold plate. The sliding mold plate is continued to move horizontally by rotating the threaded rod by the motor, so that the sliding mold plate moves to the bottom of the heat dissipation component. At the same time, the other sliding mold plate moves to the bottom of the injection molding chamber, and the next injection molding can be carried out directly without waiting for the mold to cool and demold, thereby improving the efficiency and convenience of the device processing.

[0008] In a preferred solution, the bottom inner walls of the two support frames are fixedly connected to two symmetrical mounting frames, and a plurality of mounting frames are provided with four circular holes, and a fixing rod is fixedly connected in the four circular holes, the outer walls of the two fixing rods on the same side are slidably connected to the same sliding rod, the outer walls of the two sliding rods are slidably connected to sliding parts, the bottoms of the two sliding parts are fixedly connected to fans, the two support frames are provided with five circular holes, and the two circular holes are fixedly connected to motor two, the output ends of the two motors two are connected to mounting parts through couplings, the inner walls of the two mounting parts are slidably connected to movable rods, one end of the two movable rods is movably connected to the corresponding sliding parts, and the outsides of the two movable rods are surrounded by springs.

[0009] By providing a heat dissipation component, the second rotating mounting part of the motor drives the movable rod to rotate, and the sliding part is made to slide on the sliding rod by using a spring, forcing the sliding rod to slide on the outer wall of the fixed rod, so that the fan can evenly dissipate heat to the sliding mold plate located below the heat dissipation component, thereby reducing the cooling time and improving the working efficiency of the device.

[0010] In a preferred embodiment, the mold stripping module comprises two symmetrical mounting plates. Both mounting plates are bolted to the bottom of the workbench. The tops of the two mounting plates are fixedly connected to electric telescopic rods, and the driving ends of the two electric telescopic rods are fixedly connected to the mold stripping plate. The workbench is provided with two mounting slots, and the two mold stripping plates slide into the corresponding mounting slots.

[0011] By providing a demolding module, after the sliding mold plate is cooled, the demolding plate is pushed by the electric telescopic rod to push out the transistor in the upper mold groove to achieve automatic demolding, which can improve the convenience of the device and work efficiency.

[0012] From the above, it can be seen that the automatic ejection and demolding injection molding equipment for transistor processing provided by the utility model has the technical effect of being able to directly carry out the next injection molding after the transistor processing injection molding equipment completes one injection molding, without having to wait for the mold to cool and demold, thereby improving the efficiency and convenience of processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of an injection molding device for transistor processing with automatic ejection and mold removal proposed by the utility model.

[0014] Figure 2 This is a schematic diagram of the structure of the injection molding component of an injection molding device for transistor processing with automatic ejection and mold removal proposed by the utility model.

[0015] Figure 3 This is a schematic structural diagram of a heat dissipation component of an injection molding device for transistor processing with automatic ejection and mold removal proposed by the utility model.

[0016] Figure 4 This is a structural schematic diagram of the demoulding module of an injection molding device for transistor processing with automatic ejection and demoulding proposed by the utility model.

[0017] In the accompanying drawings: 1. Support frame; 2. Workbench; 3. Injection molding assembly; 301. Base; 302. Hydraulic cylinder; 303. Arm beam; 304. Connecting pipe; 305. Injection molding chamber; 306. Injection molding head; 307. Feed inlet; 308. Limit rod; 309. Fixing part; 310. Motor 1; 311. Threaded rod; 312. Sliding mold plate; 4. Heat dissipation assembly; 401. Mounting frame; 402. Movable rod; 403. Mounting part; 404. Motor 2; 405. Sliding part; 406. Fan; 407. Sliding rod; 408. Fixing rod; 409. Spring; 5. De-molding module; 501. Mounting plate; 502. Electric telescopic rod; 503. De-molding plate. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] The utility model discloses an automatic ejection and demoulding transistor processing injection molding device, which is mainly used in the scenario where, after the existing device completes the injection molding, it is necessary to wait for the mold to cool down and demould the transistor before the next injection molding can be carried out.

[0020] Reference Figure 1-Figure 4, an injection molding device for transistor processing with automatic ejection and mold removal, comprising a support frame 1, the inner walls of the two support frames 1 are fixedly connected to the same workbench 2, and the same injection molding component 3 is arranged below and on the top of the workbench 2, the injection molding component 3 includes a plurality of fixing parts 309, and the plurality of fixing parts 309 are fixedly connected to the top of the workbench 2, a heat dissipation component 4 is arranged on the two support frames 1, and a mold removal module 5 is arranged below the workbench 2, a plurality of fixing parts 309 are each provided with a circular hole 1, and two of the opposite circular holes 1 are movably connected with a threaded rod 311, and the other two opposite circular holes 1 are fixedly connected with the same limiting rod 308, the outer wall of the threaded rod 311 is connected to two sliding mold plates 312 by threading, and the two sliding mold plates 312 are evenly spaced with a plurality of mold grooves, and the two sliding mold plates 312 slide on the outer wall of the limiting rod 308, and the top of the workbench 2 is fixedly connected to a motor 1 310, and the motor 1 310 is connected to the threaded rod 311 through the corresponding circular hole 1 through a coupling. At one end of the rod 311, the injection molding assembly 3 includes a base 301, and the base 301 is located below the workbench 2. The top of the base 301 is fixedly connected to a hydraulic cylinder 302, and the driving end of the hydraulic cylinder 302 is fixedly connected to an arm beam 303. A circular hole 2 is provided on the arm beam 303, and a connecting pipe 304 is fixedly connected inside the circular hole 2. The top of the connecting pipe 304 is fixedly connected to a feed port 307, and the bottom of the connecting pipe 304 is fixedly connected to an injection molding bin 305, and the bottom of the injection molding bin 305 is provided with multiple holes equidistantly. There are three circular holes, and injection heads 306 are fixedly connected to the multiple circular holes. During the use of the device, the injection molding component 3 is provided. After one injection molding is completed, the motor 310 rotates the threaded rod 311 to drive the sliding mold plate 312 to move horizontally, so that the sliding mold plate 312 moves to the bottom of the heat dissipation component 4. At the same time, the other sliding mold plate 312 moves to the bottom of the injection molding chamber 305, and the next injection molding can be carried out directly without waiting for the mold to cool and demold, thereby improving the efficiency and convenience of the device processing.

[0021] Reference Figure 1 and Figure 3In a preferred embodiment, the bottom inner walls of the two support frames 1 are fixedly connected to two mutually symmetrical mounting frames 401, and a plurality of mounting frames 401 are provided with four circular holes, and a fixing rod 408 is fixedly connected in the four circular holes. The outer walls of the two fixing rods 408 on the same side are slidably connected to the same sliding rod 407, and the outer walls of the two sliding rods 407 are slidably connected to the sliding members 405. The bottoms of the two sliding members 405 are fixedly connected to the fans 406. The two support frames 1 are provided with five circular holes, and the two circular holes are fixedly connected to the two motors 404. The output ends of the two motors 404 are connected through The coupling is connected to a mounting part 403, and the inner walls of the two mounting parts 403 are slidably connected to movable rods 402. One end of the two movable rods 402 is movably connected to the corresponding sliding parts 405. The outside of the two movable rods 402 is surrounded by springs 409. During the use of the device, a heat dissipation component 4 is provided, and the movable rod 402 is rotated by the motor 2 404, so that the sliding part 405 slides on the sliding rod 407, driving the sliding rod 407 to slide on the outer wall of the fixed rod 408, so that the fan 406 can evenly dissipate heat to the sliding mold plate 312 located below the heat dissipation component 4, thereby reducing the cooling time and improving the working efficiency of the device.

[0022] Reference Figure 1 and Figure 4 In a preferred embodiment, the demolding module 5 includes two symmetrical mounting plates 501. Both mounting plates 501 are bolted to the bottom of the workbench 2. The tops of the two mounting plates 501 are fixedly connected to electric telescopic rods 502. The driving ends of the two electric telescopic rods 502 are fixedly connected to demolding plates 503. The workbench 2 is provided with two mounting slots, and the two demolding plates 503 slide in the corresponding mounting slots. During use of the device, the demolding module 5 is provided. After the sliding mold plate 312 has cooled, the electric telescopic rods 502 push the demolding plates 503 to push out the transistor in the upper mold slot, thereby achieving automatic demolding, which can improve the convenience of the device and work efficiency.

[0023] Working principle: Start the hydraulic cylinder 302 to drive the arm beam 303 to adjust to the appropriate position, and make the injection chamber 305 close to the sliding mold plate 312. The rubber material is poured into the mold groove through the injection head 306 through the feed port 307. After the injection is completed, start the hydraulic cylinder 302 to raise the height, so that the injection chamber 305 is separated from the sliding mold plate 312. Then start the motor 310 to rotate the threaded rod 311 to drive the sliding mold plate 312 to move horizontally, so that the sliding mold plate 312 moves to the bottom of the heat dissipation component 4. At the same time, the other sliding mold plate 312 moves to The next injection molding is carried out below the injection molding chamber 305; the second motor 404 is started to rotate the mounting part 403, driving the movable rod 402 to rotate, and the sliding part 405 is made to slide on the sliding rod 407 by means of the spring 409, forcing the sliding rod 407 to slide on the outer wall of the fixed rod 408, so that the fan 406 evenly dissipates the heat of the sliding mold plate 312 located below the heat dissipation component 4; after the cooling of the sliding mold plate 312 is completed, the ejection mold plate 503 is pushed by the electric telescopic rod 502 to push out the transistor in the upper mold slot to realize automatic ejection.

[0024] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. The replacements described may be partial structures, devices, or method steps, or they may be complete technical solutions. Any equivalent replacements or modifications based on the technical solution and the concept of the present invention shall be covered by the scope of protection of the present invention.

Claims

1. An automatic ejection and demoulding transistor injection molding device, comprising a support frame (1), characterized in that: The inner walls of the two support frames (1) are fixedly connected to a same workbench (2), and a same injection molding assembly (3) is provided below and on the top of the workbench (2), the injection molding assembly (3) comprises a plurality of fixing members (309), and the plurality of fixing members (309) are all fixedly connected to the top of the workbench (2), a heat dissipation assembly (4) is provided on both support frames (1), and a demoulding module (5) is provided below the workbench (2).

2. The automatic ejection and mold removal injection molding equipment for transistor processing according to claim 1, characterized in that: A plurality of the fixing members (309) are each provided with a circular hole, and threaded rods (311) are movably connected in two of the opposite circular holes, and a same limiting rod (308) is fixedly connected in the other two opposite circular holes. The outer wall of the threaded rod (311) is connected to two sliding mold plates (312) through threads, and a plurality of mold grooves are evenly spaced on the two sliding mold plates (312). Both sliding mold plates (312) slide on the outer wall of the limiting rod (308). A motor (310) is fixedly connected to the top of the workbench (2), and the motor (310) passes through the corresponding circular hole and is connected to one end of the threaded rod (311) through a coupling.

3. The automatic ejection and mold removal transistor injection molding equipment according to claim 2, characterized in that: The injection molding assembly (3) comprises a base (301), and the base (301) is located below the workbench (2); the top of the base (301) is fixedly connected to a hydraulic cylinder (302); the driving end of the hydraulic cylinder (302) is fixedly connected to an arm beam (303); a second circular hole is provided on the arm beam (303); a connecting pipe (304) is fixedly connected in the second circular hole; and a feed port (307) is fixedly connected to the top of the connecting pipe (304).

4. The transistor processing injection molding equipment with automatic ejection and mold removal according to claim 3, characterized in that: The bottom of the connecting pipe (304) is fixedly connected to an injection molding chamber (305), and a plurality of circular holes (3) are equidistantly provided at the bottom of the injection molding chamber (305), and an injection molding head (306) is fixedly connected to each of the plurality of circular holes (3).

5. The transistor processing injection molding equipment with automatic ejection and mold removal according to claim 1, characterized in that: The inner walls of the bottoms of the two support frames (1) are fixedly connected to two mutually symmetrical mounting frames (401), and four circular holes are provided on the plurality of mounting frames (401), and a fixing rod (408) is fixedly connected in the plurality of circular holes. The outer walls of the two fixing rods (408) on the same side are slidably connected to the same sliding rod (407), and the outer walls of the two sliding rods (407) are slidably connected to a sliding member (405), and the bottoms of the two sliding members (405) are fixedly connected to a fan (406).

6. The automatic ejection and mold removal injection molding equipment for transistor processing according to claim 5, characterized in that: The two support frames (1) are each provided with a circular hole five, and the two circular holes five are fixedly connected to the two motors (404), the output ends of the two motors (404) are connected to the mounting parts (403) through couplings, the inner walls of the two mounting parts (403) are slidably connected to the movable rods (402), one end of the two movable rods (402) is movably connected to the corresponding sliding parts (405), and the outside of the two movable rods (402) is surrounded by a spring (409).

7. The automatic ejection and mold removal injection molding equipment for transistor processing according to claim 1, characterized in that: The mold removal module (5) comprises two mutually symmetrical mounting plates (501). The two mounting plates (501) are both connected to the bottom of the workbench (2) by bolts. The tops of the two mounting plates (501) are both fixedly connected to electric telescopic rods (502). The driving ends of the two electric telescopic rods (502) are both fixedly connected to a mold removal plate (503). The workbench (2) is provided with two mounting slots, and the two mold removal plates (503) are both slidable in the corresponding mounting slots.

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