Efficient silicon wafer drying furnace structure
By setting up preheating channels before and after the silicon wafer drying furnace tunnel and using sealed doors to control heat loss, the problem of heat loss in the existing technology is solved, and efficient silicon wafer drying and energy saving effects are achieved.
Patent Information
- Application Number
- CN202422103468.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-08-29
AI Technical Summary
Existing silicon wafer drying furnaces suffer from severe heat loss at both ends of the tunnel, resulting in low drying efficiency, high costs, and large space occupation.
Preheating channel units are set at the front and rear ends of the drying furnace tunnel, and a sealed door is set between the preheating channel and the drying furnace tunnel. The silicon wafers are preheated through the preheating channel before being transported to ensure that heat is not lost.
It improves the drying efficiency of silicon wafers, saves energy consumption and reduces the space occupied by equipment.
Smart Images
Figure CN223376185U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer processing equipment, in particular to a high-efficiency silicon wafer drying furnace structure. Background Art
[0002] HIT solar cells are hybrid solar cells constructed using a crystalline silicon substrate and an amorphous silicon thin film. The so-called HIT (Heterojunction with Intrinsic Thinlayer) structure involves adding a layer of undoped (intrinsic) hydrogenated amorphous silicon thin film between the p-type hydrogenated amorphous silicon and n-type hydrogenated amorphous silicon and the n-type silicon substrate. HIT solar photovoltaic cells primarily utilize a silicon substrate upon which a high-bandgap silicon nanofilm is deposited. A transparent conductive film is then deposited on the surface, and a back-surface electric field is applied to the back surface. By optimizing the silicon surface structure, optical absorption losses in the transparent conductive oxide layer and a-Si layer can be reduced.
[0003] When preparing HIT solar photovoltaic cells, the surface of the silicon wafer needs to be dried after the conductive paste is printed. The current practice is to use a drying furnace for heating. The existing technology, application number: 2018206261189, is a plug-type silicon wafer drying furnace. The existing technology directly uses a chain-type conveying mechanism to send the silicon wafer into the tunnel for drying. There is no sealing device at both ends of the tunnel, which leads to excessive heat loss at the front and rear ends of the tunnel, which may affect the drying efficiency of the entire silicon wafer. Therefore, the length of the tunnel is lengthened to solve the problem, which results in high cost and large space occupation.
[0004] Therefore, it is necessary to design a high-efficiency silicon wafer drying furnace structure to solve the above problems. Utility Model Content
[0005] The purpose of the utility model is to provide a high-efficiency silicon wafer drying furnace structure to overcome the above-mentioned deficiencies in the current prior art.
[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0007] A high-efficiency silicon wafer drying furnace structure, which includes an equipment support, a drying furnace tunnel arranged on the equipment support, a conveying mechanism partially arranged inside the drying furnace tunnel and placed on the equipment support, and a hot air drying unit arranged on the drying furnace tunnel, characterized in that: preheating channel units are provided at the front and rear ends of the drying furnace tunnel; the preheating channel units are connected to the drying furnace tunnel, the preheating channel unit includes a preheating shell, an air outlet plate arranged inside the preheating shell, and an outer shell mounting plate arranged outside the preheating shell, and a hot air unit mounted on the outer shell mounting plate, sealing doors are provided at the front and rear outlets of the preheating shell, an electric linear drive module for controlling the opening and closing of the sealing door is provided on the preheating shell, and the sealing door is mounted on the electric linear drive module through a slider.
[0008] Preferably, the hot air unit includes an air inlet end arranged on the outer shell mounting plate and connected to the interior of the preheating shell, an air inlet pipe connected to the air inlet end, a heating device connected to the air inlet pipe, and a fan connected to the heating device through a pipeline.
[0009] Preferably, an air outlet pipe is provided at the other end of the housing mounting plate corresponding to the air outlet end.
[0010] Preferably, a plurality of groups of air outlet holes are evenly arranged on the air outlet plate.
[0011] The beneficial effect of the present invention is that the present technical solution sets preheating channels in front and behind the drying furnace tunnel, and at the same time sets a sealed door between the preheating channel and the drying furnace tunnel, so that they can be controlled separately. The preheating is first performed through the preheating channel, and then the silicon wafers are transported, thereby ensuring that the heat inside the drying furnace tunnel will not dissipate and the heat storage is guaranteed, thereby improving the overall drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a structural diagram of a high-efficiency silicon wafer drying furnace structure of the utility model;
[0013] Figure 2 This is a schematic diagram of a preheating channel unit of a high-efficiency silicon wafer drying furnace structure of the present invention;
[0014] Figure 3 This is a rear view of a preheating channel unit of a high-efficiency silicon wafer drying furnace structure of the present invention;
[0015] Figure 4 This is a partial enlarged view of the hot air unit of a high-efficiency silicon wafer drying furnace structure of the utility model;
[0016] In the figure: 2. Drying furnace tunnel; 4. Preheating channel unit; 41. Preheating shell; 42. Air outlet plate; 43. Shell mounting plate; 44. Hot air unit; 441. Air inlet end; 442. Air inlet pipe; 443. Heating device; 444. Air outlet pipe; 5. Sealing door; 6. Electric linear drive module; 7. Correction mechanism. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0018] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.
[0019] Reference Figures 1 to 4 , a high-efficiency silicon wafer drying furnace structure, which includes an equipment support, a drying furnace tunnel 2 arranged on the equipment support, a conveying mechanism partially arranged inside the drying furnace tunnel and placed on the equipment support, and a hot air drying unit arranged on the drying furnace tunnel;
[0020] A preheating channel unit 4 is provided at the front and rear ends of the drying oven tunnel; the preheating channel unit is connected to the drying oven tunnel, and the preheating channel unit includes a preheating shell 41, an air outlet plate 42 disposed inside the preheating shell, and an outer shell mounting plate 43 disposed outside the preheating shell, and a hot air unit 44 mounted on the outer shell mounting plate;
[0021] The hot air unit 44 includes an air inlet 441 disposed on the housing mounting plate 43 and connected to the interior of the preheating housing 41, an air inlet pipe 442 connected to the air inlet, a heating device 443 connected to the air inlet pipe, and a fan connected to the heating device via a pipeline. To effectively circulate the internal air, an air outlet pipe 444 is provided at the other end of the housing mounting plate 43 corresponding to the air outlet.
[0022] In order to preheat the interior space evenly, a plurality of air outlet holes are evenly opened on the air outlet plate 42, so as to conveniently and effectively blow out the hot air evenly, thereby ensuring that the hot air in the entire interior space is evenly dispersed without generating temperature differences;
[0023] The gas is blown out by the fan and sent to the heating device 443 through the pipeline. After being heated by the heating device 443, it is blown into the air inlet pipe 443 and blown out from the outlet holes of the air outlet plate 42.
[0024] Sealed doors 5 are provided at the front and rear exits of the preheating housing 41. An electric linear drive module 6 for controlling the opening and closing of the sealed doors is provided on the preheating housing. The sealed doors are mounted on the electric linear drive module via a slider. The motor of the electric linear drive module drives the sealed doors to move, thereby realizing the opening and closing of the two ends of the preheating housing.
[0025] In order to maximize the coordination of the silicon wafers for drying, a correction mechanism 7 is provided on both sides of the preheating housing. The correction mechanism includes a push rod and a driving unit for driving the push rod. The push rods on both sides push the silicon wafers toward the middle to adjust the position of the silicon wafers.
[0026] In this embodiment, the preheating heating channel unit is heated separately by a heating device and separated from the drying furnace tunnel. A sealed door is provided between the two. The silicon wafers are transported in through a conveying mechanism. The sealed door on the outside is opened first. After the silicon wafers enter the preheating shell, the sealed door on the outside is closed. Then, the sealed door connected to the drying furnace tunnel is opened and the conveying mechanism continues to ensure that the internal heat will not be lost, thereby improving efficiency and saving energy consumption.
[0027] The benefit of the present invention is that the present technical solution sets preheating channels in front and behind the drying furnace tunnel, and sets a sealed door between the preheating channel and the drying furnace tunnel, so that they can be controlled separately. The preheating is first performed through the preheating channel, and then the silicon wafers are transported, thereby ensuring that the heat inside the drying furnace tunnel will not dissipate and the heat storage is guaranteed, thereby improving the overall drying efficiency.
[0028] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A high-efficiency silicon wafer drying furnace structure, comprising an equipment support, a drying furnace tunnel disposed on the equipment support, a conveying mechanism partially disposed within the drying furnace tunnel and placed on the equipment support, and a hot air drying unit disposed on the drying furnace tunnel, characterized in that: Preheating channel units are provided at the front and rear ends of the drying furnace tunnel; the preheating channel units are connected to the drying furnace tunnel, and the preheating channel units include a preheating shell, an air outlet plate placed inside the preheating shell, and an outer shell mounting plate arranged outside the preheating shell, and a hot air unit mounted on the outer shell mounting plate. Sealed doors are provided at the front and rear outlets of the preheating shell, and an electric linear drive module for controlling the opening and closing of the sealed door is provided on the preheating shell. The sealed door is mounted on the electric linear drive module through a slider.
2. The high-efficiency silicon wafer drying furnace structure according to claim 1, characterized in that: The hot air unit includes an air inlet end provided on the outer shell mounting plate and connected to the interior of the preheating shell, an air inlet pipe connected to the air inlet end, a heating device connected to the air inlet pipe, and a fan connected to the heating device through a pipeline.
3. The high-efficiency silicon wafer drying furnace structure according to claim 2, characterized in that: An air outlet pipe is provided at the other end of the housing mounting plate corresponding to the air outlet end.
4. The high-efficiency silicon wafer drying furnace structure according to claim 2, characterized in that: The air outlet plate is evenly provided with a plurality of groups of air outlet holes.